Electronic device

Abstract

The application relates to the technical field of SIM card protection of electronic equipment, in particular to electronic equipment, which comprises an equipment body and a card seat, wherein the card seat comprises a card slot used for accommodating a SIM card; the equipment body comprises a jack, a first grounding part and a second grounding part, the entrance of the card slot faces the jack, and the first grounding part, the second grounding part and the entrance of the card slot are arranged in sequence along the insertion direction of the SIM card. The application can improve the electrostatic protection performance.

Description

Technical Field

[0001] This application relates to the field of SIM card protection technology for electronic devices, and particularly to electronic devices. Background Technology

[0002] An electronic device is a product that uses a recognizable SIM card to access a network and achieve communication.

[0003] In related technologies, SIM cards are easily damaged by static electricity inside electronic devices, causing the electronic devices to lose their communication function. Utility Model Content

[0004] In view of this, this application provides an electronic device to improve its electrostatic discharge protection performance.

[0005] Specifically, the following technical solutions are included:

[0006] This application provides an electronic device, which includes a device body and a card slot, wherein...

[0007] The card holder includes a card slot for accommodating a SIM card;

[0008] The device body includes a socket, a first grounding part and a second grounding part, the entrance of the card slot faces the socket, and the first grounding part, the second grounding part and the entrance of the card slot are arranged sequentially along the insertion direction of the SIM card.

[0009] With the above arrangement, the card slot accommodates the SIM card, enabling communication functions. The first and second grounding parts discharge static electricity entering the card slot from the slot's entrance, preventing damage to the SIM card due to electrostatic discharge. Simultaneously, the first and second grounding parts increase the likelihood of electrostatic grounding, thus improving the electrostatic protection performance of the electronic device.

[0010] In some embodiments of this application, the device body includes a mid-frame, the jack extends through the mid-frame along the insertion direction of the SIM card, and the wall of the jack has the first grounding portion.

[0011] With the above arrangement, the jack allows the card tray and SIM card to pass through and enter the interior of the electronic device. Placing the first grounding part on the wall of the jack helps to attract static electricity entering the electronic device from the jack, thereby dissipating the static electricity.

[0012] In some embodiments of this application, the middle frame includes a conductive portion and an insulating portion, the insulating portion having the socket, the insulating portion covering at least a portion of the outer surface of the conductive portion, and a portion of the first grounding portion exposed in the insulating portion and connected to the conductive portion.

[0013] With the above arrangement, the insulating part wraps around at least a portion of the outer surface of the conductive part, which can separate the conductive part from the outside world while optimizing the appearance of the mid-frame. The conductive part generally has high structural strength, which can improve the structural performance of the mid-frame. At the same time, the conductive part can introduce static electricity received by the first grounding part, thereby causing the wall-mounted SIM card to be damaged.

[0014] In some embodiments of this application, the first grounding portion and a portion of the insulating portion are located on the same side of the conductive portion, wherein the insulating portion covers the conductive portion and is connected to the sidewall of the first grounding portion.

[0015] With the above arrangement, the insulation part can reduce the interference of the conductive part on the signal of the electronic device, and at the same time, it helps to prevent static electricity from being directly transmitted to the user through the middle frame, which helps to improve the electrostatic protection effect of the electronic device.

[0016] In some embodiments of this application, the conductive portion is integrally formed with the first grounding portion.

[0017] With the above arrangement, the assembly difficulty of the conductive part and the first grounding part is reduced, and at the same time, the conductive part and the first grounding part can maintain a sufficiently high connection performance to improve the static discharge effect of the first grounding part.

[0018] In some embodiments of this application, the width of the first grounding portion is greater than 0.57 mm.

[0019] With the above arrangement, since components such as antennas are generally arranged on the middle frame, these components need to generate and receive signals. Therefore, the first grounding part in the above range helps to reduce the interference signals generated by static electricity, which would reduce the communication performance.

[0020] In some embodiments of this application, the device body includes a small board located on one side of the card holder and electrically connected to the card holder, the small board having a second grounding portion.

[0021] With the above arrangement, the small board can supply power to the SIM card in the card slot and enable the transmission of communication signals. The small board also discharges static electricity from the middle frame through the second grounding part, which also helps to improve the structural compactness of the electronic device.

[0022] In some embodiments of this application, the small board includes a ground layer and an insulating layer, the ground layer and the insulating layer are stacked together, the insulating layer includes a cutout area, and at least a portion of the ground layer is exposed in the cutout area to form the second ground portion.

[0023] With the above arrangement, the grounding layer can serve as a discharge point for various currents on the small board. The insulating layer allows different solder joints of the grounding layer to be electrically connected to the card slot individually while maintaining relative insulation. The cutout area, by exposing the grounding layer, can improve the attraction of static electricity, thereby reducing the risk of static electricity entering the card slot and damaging the SIM card. In addition, the second grounding part formed by the cutout area and the grounding layer can share the grounding layer with other solder joints on the small board, thus improving the compactness of the small board.

[0024] In some embodiments of this application, at least one discharge tip is provided at the edge of the hollowed-out area.

[0025] By arranging the discharge tip as described above, its ability to attract static electricity can be enhanced, thereby improving the electrostatic protection performance of electronic devices.

[0026] In some embodiments of this application, the cutout area is located on the central axis of the slot.

[0027] With the above arrangement, the electrostatic attraction of the hollow area to both sides of the card slot is the same, which helps to improve the uniform distribution of the electrostatic attraction of the hollow area to different positions of the card holder.

[0028] The beneficial effects of the technical solution provided in this application embodiment include at least the following: the card slot accommodates the SIM card, enabling communication functions. The first grounding part and the second grounding part can discharge static electricity entering the card slot from the slot entrance, thus preventing the SIM card from being damaged by static electricity. Simultaneously, the first grounding part and the second grounding part can increase the possibility of static grounding, thereby improving the electrostatic protection performance of electronic devices. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 A partial cross-sectional view of an electronic device provided in an embodiment of this application;

[0031] Figure 2 This is a front view of an electronic device provided in an embodiment of this application.

[0032] The reference numerals in the figure indicate:

[0033] 1. Equipment body; 11. First grounding part; 12. Second grounding part; 13. Middle frame; 131. Conductive part; 132. Insulating part; 14. Small plate; 141. Grounding layer; 142. Insulating layer; 1421. Hollowed-out area; 14211. Discharge tip; 101. Socket;

[0034] 2. Card holder; 201. Card slot.

[0035] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the embodiments of this application, directional terms such as "upper," "lower," and "side" are generally used in the following ways: Figure 1 The relative positions shown are based on the given information, and these directional terms are used only to more clearly describe the relationships between structures, not to describe absolute positions. Positions may change when the product is placed in different orientations; for example, "up" and "down" may be interchanged.

[0038] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.

[0039] To make the technical solutions and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0040] This application provides an electronic device, such as... Figure 1 As shown, the electronic device includes a device body 1 and a card slot 2, wherein,

[0041] Card holder 2 includes card slot 101, which is used to accommodate SIM cards;

[0042] The device body 1 includes a socket, a first grounding part 11 and a second grounding part 12. The entrance of the card slot 101 faces the socket. The first grounding part 11, the second grounding part 12 and the entrance of the card slot 101 are arranged sequentially along the insertion direction of the SIM card.

[0043] With the above arrangement, the card holder 2 accommodates the SIM card via the card slot 101, enabling communication functions. The first grounding part 11 and the second grounding part 12 can discharge static electricity entering the card slot 101 from the entrance, thus preventing the SIM card from being damaged by electrostatic discharge. At the same time, the first grounding part 11 and the second grounding part 12 can increase the possibility of electrostatic grounding, which helps to improve the electrostatic protection performance of electronic devices.

[0044] In this embodiment, although the attraction of static electricity to the SIM card, the first grounding part 11, and the second grounding part 12 differs, this attraction does not determine the direction of the static electricity, but only has a certain degree of influence. By arranging the first grounding part 11 and the second grounding part 12 in the direction of movement of static electricity entering the card slot 101, the probability of the SIM card being damaged by electrostatic discharge can be reduced, thereby improving the electrostatic protection performance of the electronic device.

[0045] In the embodiments of this application, the electronic device can be a mobile phone, tablet computer, laptop computer, or other products.

[0046] In this embodiment, the first grounding portion 11 and the second grounding portion 12 can be made of a material that attracts static electricity, thereby completing the discharge.

[0047] In some embodiments of this application, such as Figure 1 As shown, the device body 1 includes a middle frame 13, and the SIM card insertion hole extends through the middle frame 13 along the insertion direction of the SIM card. The wall of the SIM card insertion hole has a first grounding portion 11.

[0048] With the above arrangement, the jack allows the card tray and SIM card to pass through and enter the interior of the electronic device. Placing the first grounding part 11 on the wall of the jack facilitates the attraction of static electricity entering the electronic device from the jack by the first grounding part 11, thereby dissipating the static electricity.

[0049] In some embodiments of this application, such as Figure 1 As shown, the middle frame 13 includes a conductive part 131 and an insulating part 132. The insulating part 132 has a socket and is wrapped around at least a portion of the outer surface of the conductive part 131. A portion of the first grounding part 11 is exposed in the insulating part 132 and connected to the conductive part 131.

[0050] With the above arrangement, the insulating part 132 wraps around at least a portion of the outer surface of the conductive part 131, which can separate the conductive part 131 from the outside world while optimizing the appearance of the middle frame 13. The conductive part 131 generally has high structural strength, which can improve the structural performance of the middle frame 13. At the same time, the conductive part 131 can introduce the static electricity received by the first grounding part 11, thereby causing the wall SIM card to be broken down.

[0051] In this embodiment, the conductive part 131 can be a structure made of conductive metal material, and the insulating part 132 can be a structure made of plastic or other materials with poor conductivity than the conductive part 131.

[0052] In this embodiment, the insulating part 132 may only cover the surface where the first grounding part 11 of the insulating part 132 is located, or it may cover all surfaces of the conductive part 131.

[0053] In some embodiments of this application, such as Figure 1 As shown, the first grounding portion 11 and a portion of the insulating portion 132 are located on the same side of the conductive portion 131, wherein the insulating portion 132 covers the conductive portion 131 and is connected to the sidewall of the first grounding portion 11.

[0054] With the above arrangement, the insulating part 132 can reduce the interference of the conductive part 131 on the signal of the electronic device, and at the same time, it helps to prevent static electricity from being directly transmitted to the user through the middle frame 13, which helps to improve the electrostatic protection effect of the electronic device.

[0055] In some embodiments of this application, the conductive portion 131 is integrally formed with the first ground portion 11.

[0056] With the above arrangement, the assembly difficulty of the conductive part 131 and the first grounding part 11 is reduced, and the conductive part 131 and the first grounding part 11 can maintain a sufficiently high connection performance to improve the static discharge effect of the first grounding part 11.

[0057] In some embodiments of this application, the width of the first grounding portion 11 is greater than 0.57 mm.

[0058] With the above arrangement, since components such as antennas are generally arranged on the middle frame 13, these components need to generate and receive signals. Therefore, the first grounding part 11 in the above range is beneficial to reduce the interference signals generated when passing through static electricity, thereby reducing the communication performance.

[0059] In the embodiments of this application, the width of the first grounding portion 11 can be 0.57mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, or other values ​​greater than 0.57mm.

[0060] In some embodiments of this application, such as Figure 1 As shown, the device body 1 includes a small board 14, which is located on one side of the card holder 2 and is electrically connected to the card holder 2. The small board 14 has a second grounding part 12.

[0061] With the above arrangement, the small board 14 can supply power to the SIM card in the card slot 2 and realize the transmission of communication signals. The small board 14, through the second grounding part 12, can discharge static electricity on the middle frame 13, which also helps to improve the structural compactness of the electronic device.

[0062] In some embodiments of this application, such as Figure 1 and Figure 2 As shown, the small board 14 includes a grounding layer 141 and an insulating layer 142. The grounding layer 141 and the insulating layer 142 are stacked. The insulating layer 142 includes a hollow area 1421. At least a portion of the grounding layer 141 is exposed in the hollow area 1421 to form a second grounding portion 12.

[0063] With the above arrangement, the grounding layer 141 can serve as a discharge point for various currents on the small board 14. The insulating layer 142 facilitates the individual electrical connection of different solder joints of the grounding layer 141 to the card holder 2 while maintaining relative insulation. The cutout area 1421, by exposing the grounding layer 141, can improve the attraction of static electricity, thereby reducing the risk of static electricity entering the card slot 101 and damaging the SIM card. In addition, the second grounding portion 12 formed by the cutout area 1421 and the grounding layer 141 can share the grounding layer 141 with other solder joints on the small board 14, thereby improving the compactness of the small board 14.

[0064] In some embodiments of this application, such as Figure 2 As shown, at least one discharge tip 14211 is provided on the edge of the hollow area 1421.

[0065] With the above arrangement, the discharge tip 14211 can improve its ability to attract static electricity, thereby improving the electrostatic protection performance of electronic devices.

[0066] In this embodiment, the number of discharge tips 14211 can be three, and the three discharge tips 14211 make the hollow area 1421 form a triangle.

[0067] In some embodiments of this application, such as Figure 2 As shown, the hollow area 1421 is located on the central axis of the slot 101.

[0068] With the above arrangement, the electrostatic attraction of the hollow area 1421 to both sides of the card slot 101 is the same, which is beneficial to improve the uniform distribution of the electrostatic attraction of the hollow area 1421 to different positions of the card holder 2.

[0069] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0070] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0071] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. An electronic device, comprising: The electronic device includes a device body (1) and a card slot (2), wherein, The card holder (2) includes a card slot (201) for accommodating a SIM card; The device body (1) includes a socket (101), a first grounding part (11) and a second grounding part (12). The entrance of the card slot (201) faces the socket (101). The first grounding part (11), the second grounding part (12) and the entrance of the card slot (201) are arranged sequentially along the insertion direction of the SIM card.

2. The electronic device of claim 1, wherein, The device body (1) includes a middle frame (13), the socket (101) extends through the middle frame (13) along the insertion direction of the SIM card, and the wall of the socket (101) has the first grounding portion (11).

3. The electronic device of claim 2, wherein, The middle frame (13) includes a conductive part (131) and an insulating part (132). The insulating part (132) has the socket (101). The insulating part (132) wraps around at least a portion of the outer surface of the conductive part (131). A portion of the first grounding part (11) is exposed in the insulating part (132) and connected to the conductive part (131).

4. The electronic device of claim 3, wherein, The first grounding portion (11) and a portion of the insulating portion (132) are located on the same side of the conductive portion (131), wherein the insulating portion (132) covers the conductive portion (131) and is connected to the sidewall of the first grounding portion (11).

5. The electronic device of claim 3, wherein, The conductive part (131) is integrally formed with the first grounding part (11).

6. The electronic device of claim 1, wherein, The width of the first grounding part (11) is greater than 0.57 mm.

7. The electronic device of claim 1, wherein, The device body (1) includes a small plate (14), which is located on one side of the card holder (2) and is electrically connected to the card holder (2). The small plate (14) has a second grounding part (12).

8. The electronic device of claim 7, wherein, The small plate (14) includes a grounding layer (141) and an insulating layer (142). The grounding layer (141) and the insulating layer (142) are stacked together. The insulating layer (142) includes a hollow area (1421). At least a portion of the grounding layer (141) is exposed in the hollow area (1421) to form the second grounding portion (12).

9. The electronic device of claim 8, wherein, At least one discharge tip (14211) is provided on the edge of the hollow area (1421).

10. The electronic device of claim 9, wherein, The hollow area (1421) is located on the central axis of the slot (201).

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