Differential matching structure

Abstract

The utility model provides a kind of differential matching structure, it includes substrate, balun formed in the substrate, first capacitor, second capacitor, third capacitor and inductance;The balun includes first primary coil, second primary coil and the secondary coil respectively coupled with the first primary coil and the second primary coil;The substrate includes first metal layer, first dielectric layer, second metal layer, second dielectric layer, third metal layer, third dielectric layer, fourth metal layer, fourth dielectric layer, fifth metal layer, fifth dielectric layer and sixth metal layer are stacked in turn.The differential matching structure of the utility model can satisfy the wideband matching of 5-7GHz in Wifi7 technology.

Description

Technical Field

[0001] This utility model relates to the field of communication technology, and in particular to a differential matching structure. Background Technology

[0002] Wireless Fidelity (wifi) is a wireless network technology that transmits data via radio waves. It is commonly used in network connection scenarios such as homes, offices, and public places.

[0003] With the continuous development of Wi-Fi technology, the demand for throughput in Wi-Fi communication is also increasing, and improving signal bandwidth can effectively improve data throughput. Currently, the frequency band of Wi-Fi 7 technology has been expanded from 5.1GHz to 7.125GHz. Due to the rapid expansion of the frequency band in Wi-Fi 7 technology, the existing differential matching structure can no longer meet the frequency band matching requirements of 5-7GHz.

[0004] Therefore, there is an urgent need for a new differential matching structure to meet the wideband matching requirements of 5-7GHz in Wi-Fi 7 technology. Utility Model Content

[0005] To address the shortcomings of the existing technologies, this invention proposes a new differential matching structure to solve the problem that the existing differential matching structures can no longer meet the frequency band matching requirements of 5-7GHz.

[0006] To solve the above-mentioned technical problems, this utility model provides a differential matching structure, which includes a substrate, a balun formed on the substrate, a first capacitor, a second capacitor, a third capacitor, and an inductor.

[0007] The balun includes a first primary coil, a second primary coil, and secondary coils coupled to the first primary coil and the second primary coil, respectively. A first terminal of the first primary coil serves as a first input terminal of the differential matching structure. A first terminal of the second primary coil is connected to a second terminal of the first primary coil, and the second terminal of the second primary coil serves as a second input terminal of the differential matching structure. A first terminal of a first capacitor is connected to a second terminal of the first primary coil, and the second terminal of the first capacitor is grounded. A first terminal of a second capacitor is connected to a first terminal of the secondary coil, and the second terminal of the second capacitor is grounded. A first terminal of a third capacitor is connected to a second terminal of the secondary coil, and the second terminal of the third capacitor is grounded. A first terminal of an inductor is connected to a second terminal of the secondary coil, and the second terminal of the inductor serves as an output terminal of the differential matching structure.

[0008] The substrate includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, a fourth metal layer, a fourth dielectric layer, a fifth metal layer, a fifth dielectric layer, and a sixth metal layer stacked sequentially; the thicknesses of the first metal layer, the second metal layer, the third metal layer, the fourth metal layer, the fifth metal layer, and the sixth metal layer are all 15±20% μm, and the thicknesses of the first dielectric layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, and the fifth dielectric layer are all 25±20% μm;

[0009] The first metal layer includes an input port line of the balun formed by winding one turn of wire, with the two ends of the input port line serving as the first input terminal and the second input terminal of the differential matching structure, respectively. The second metal layer includes a first primary coil formed by winding one turn of wire, a second primary coil formed by extending from one end of the first primary coil and winding half a turn of wire, and a secondary coil formed by extending after winding half a turn of wire. The secondary coil is spaced apart from the first primary coil and the second primary coil and is coupled to them. The third metal layer includes a first bridge wire and a second bridge wire formed at intervals. The two ends of the first bridge wire are respectively connected to the end of the first primary coil and one end of the secondary coil, and the two ends of the second bridge wire are respectively connected to the first end of the second primary coil and the first end of the second capacitor. The input port line, the first primary coil, the second primary coil, the secondary coil, the first bridge wire, and the second bridge wire constitute the balun.

[0010] Preferably, the input port line has a line width of 150±20%um and an inner diameter of 340±20%um; both ends of the input port line are metal blocks, and the length of the metal blocks is 240±20%um and the width of the metal blocks is 120±20%um.

[0011] Preferably, the inner diameter of the first primary coil is 340±20% μm; the wire diameters of the first primary coil, the second primary coil, and the secondary coil are 60±20% μm; and the distance between each pair of the secondary coil, the first primary coil, and the second primary coil is 30±20% μm.

[0012] Preferably, the wire diameters of the first bridging wire and the second bridging wire are 60±20% μm.

[0013] Preferably, the first metal layer further includes a first electrode plate formed at a distance from the input port line; the second metal layer further includes output traces formed at a distance from the first primary coil, the second primary coil, and the secondary coil; the third metal layer further includes a second electrode plate formed at a distance from the first bridge wire and the second bridge wire; the output traces are respectively connected to the first electrode plate and the second electrode plate, and the first electrode plate, the output traces, and the second electrode plate constitute the third capacitor.

[0014] Preferably, the substrate further includes a grounding hole extending therethrough; the first capacitor, the second capacitor, and the third capacitor are respectively grounded through the grounding hole.

[0015] Compared with the prior art, the differential matching structure of this utility model limits the structure and thickness of the substrate, and limits the formation of a balun, a first capacitor, an inductor, a second capacitor, a third capacitor, and an inductor on the substrate, and also limits the connection method of each device, so that the differential matching structure can meet the 5-7GHz broadband matching in Wi-Fi 7 technology. Attached Figure Description

[0016] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description in conjunction with the following drawings. In the drawings:

[0017] Figure 1 A schematic diagram of the differential matching structure provided in this embodiment of the utility model;

[0018] Figure 2 A schematic diagram of the substrate stacking in the differential matching structure provided in this embodiment of the utility model;

[0019] Figure 3 This is a perspective view of the metal layer after removing the dielectric layer from the substrate in the differential matching structure provided in this embodiment of the utility model.

[0020] Figure 4 A planar schematic diagram of the input port line in the differential matching structure provided in this embodiment of the utility model;

[0021] Figure 5 A planar schematic diagram of the first primary coil, the second primary coil, and the secondary coil in the differential matching structure provided in this embodiment of the utility model;

[0022] Figure 6 A planar schematic diagram of the first bridge connection and the second bridge connection in the differential matching structure provided in the embodiment of this utility model;

[0023] Figure 7A schematic diagram of the grounding hole of the substrate in the differential matching structure provided in this embodiment of the utility model;

[0024] Figure 8 Simulation diagram of the matching insertion loss of the differential matching structure provided in the embodiment of this utility model;

[0025] Figure 9 A simulation diagram of the input return loss of the differential matching structure provided in this embodiment of the utility model;

[0026] Figure 10 A simulation diagram of the output return loss of the differential matching structure provided in this embodiment of the utility model;

[0027] Figure 11 Simulation diagram of the differential matching structure provided in this embodiment of the utility model after reducing the insertion loss by 20%;

[0028] Figure 12 Simulation diagram of the differential matching structure provided in this embodiment of the utility model after the input return loss is reduced by 20%;

[0029] Figure 13 Simulation diagram of the differential matching structure provided in this embodiment of the utility model after reducing the output return loss by 20%;

[0030] Figure 14 Simulation diagram of the differential matching structure provided in this embodiment of the utility model after the matching insertion loss is increased by 20%;

[0031] Figure 15 Simulation diagram of the differential matching structure provided in this embodiment of the utility model after the input return loss is increased by 20%;

[0032] Figure 16 The simulation diagram shows the output return loss of the differential matching structure provided in this embodiment of the utility model after +20%. Detailed Implementation

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] This utility model embodiment provides a differential matching structure 100, combined with Figures 1 to 7 As shown, it includes a substrate 1, a balun 2 formed on the substrate 1, a first capacitor C1, a second capacitor C2, a third capacitor C3, and an inductor L.

[0037] The balun 2 includes a first primary coil 21, a second primary coil 22, and a secondary coil 23 coupled to the first primary coil 21 and the second primary coil 22, respectively.

[0038] The first end of the first primary coil 21 serves as the first input terminal of the differential matching structure 100, and the first end of the second primary coil 22 is connected to the second end of the first primary coil 21. The second end of the second primary coil 22 serves as the second input terminal of the differential matching structure 100.

[0039] The first terminal of the first capacitor C1 is connected to the second terminal of the first primary coil 21, and the second terminal of the first capacitor C1 is grounded.

[0040] The first terminal of the second capacitor C2 is connected to the first terminal of the secondary coil 23, and the second terminal of the second capacitor C2 is grounded.

[0041] In this embodiment, the capacitance values ​​of the first capacitor C1 and the second capacitor C2 are both 0.2pF.

[0042] The first terminal of the third capacitor C3 is connected to the second terminal of the secondary coil 23, and the second terminal of the third capacitor C3 is grounded.

[0043] The first end of the inductor L is connected to the second end of the secondary coil 23, and the second end of the inductor L serves as the output of the differential matching structure 100.

[0044] The substrate 1 includes a first metal layer metal1, a first dielectric layer 11, a second metal layer metal2, a second dielectric layer 12, a third metal layer metal3, a third dielectric layer 13, a fourth metal layer metal4, a fourth dielectric layer 14, a fifth metal layer metal5, a fifth dielectric layer 15, and a sixth metal layer metal6 stacked sequentially.

[0045] The thicknesses of the first metal layer metal1, the second metal layer metal2, the third metal layer metal3, the fourth metal layer metal4, the fifth metal layer metal5, and the sixth metal layer metal6 are 15±20%um, and the metal used is copper; the thicknesses of the first dielectric layer 11, the second dielectric layer 12, the third dielectric layer 13, the fourth dielectric layer 14, and the fifth dielectric layer 15 are 25±20%um, and the material used is E705G from Hitachi Chemical.

[0046] like Figure 7 As shown, the substrate 1 also includes a grounding hole that penetrates it, which is equivalent to the grounding hole being formed on the first metal layer metal1, the first dielectric layer 11, the second metal layer metal2, the second dielectric layer 12, the third metal layer metal3, the third dielectric layer 13, the fourth metal layer metal4, the fourth dielectric layer 14, the fifth metal layer metal5, the fifth dielectric layer 15 and the sixth metal layer metal6; the first capacitor C1, the second capacitor C2 and the third capacitor C3 are respectively grounded through the grounding hole.

[0047] The first metal layer metal1 includes an input port line 24 of a balun 2 formed by winding one loop of wire. The two ends of the input port line 24 serve as the first input terminal and the second input terminal of the differential matching structure 100, respectively.

[0048] The input port line 24 has a line width of 150±20%um and an inner diameter of 340±20%um. The two ends of the input port line 24 are metal blocks with a length of 240±20%um and a width of 120±20%um.

[0049] The second metal layer metal2 includes a first primary coil 21 formed by winding one turn of wire, a second primary coil 22 formed by extending from one end of the first primary coil 21 and winding half a turn of wire, and a secondary coil 23 formed by extending after winding half a turn of wire. The secondary coil 23 is respectively arranged at intervals with the first primary coil 21 and the second primary coil 22 and is coupled to them.

[0050] The inner diameter of the first primary coil 21 is 340±20%um; the wire diameters of the first primary coil 21, the second primary coil 22, and the secondary coil 23 are 60±20%um; the distance between each pair of the secondary coil 23, the first primary coil 21, and the second primary coil 22 is 30±20%um.

[0051] The third metal layer metal3 includes a first bridge wire 25 and a second bridge wire 26 formed at intervals; the two ends of the first bridge wire 25 are respectively connected to the end of the first primary coil 21 and one end of the secondary coil 23, and the two ends of the second bridge wire 26 are respectively connected to the first end of the second primary coil 22 and the first end of the second capacitor C2; the input port line 24, the first primary coil 21, the second primary coil 22, the secondary coil 23, the first bridge wire 25 and the second bridge wire 26 form a balun 2.

[0052] The wire diameter of the first bridge connection 25 and the second bridge connection 26 is 60±20%um.

[0053] The first metal layer metal1 also includes a first electrode plate formed at intervals from the input port line 24; the second metal layer metal2 also includes output traces formed at intervals from the first primary coil 21, the second primary coil 22 and the secondary coil 23 respectively; the third metal layer metal3 also includes a second electrode plate formed at intervals from the first bridge line 25 and the second bridge line 26 respectively; the output traces are connected to the first electrode plate and the second electrode plate respectively, and the first electrode plate, the output traces and the second electrode plate form a third capacitor C3.

[0054] The first and second plates are the positive and negative plates, respectively.

[0055] The positive and negative plates of the first capacitor C1 are formed on the first metal layer metal1 and the second metal layer metal2, respectively, and are electrically connected through a metal via penetrating the dielectric layer between them; the positive and negative plates of the second capacitor C2 are formed on the first metal layer metal1 and the second metal layer metal2, respectively, and are electrically connected through a metal via penetrating the dielectric layer between them; the first coil and the second coil of the inductor L are formed on the third metal layer metal3 and the fourth metal layer metal4, respectively, and are electrically connected through a metal via penetrating the dielectric layer between them; the output terminal of the differential matching structure 100 is formed on the first metal layer metal1.

[0056] The above-mentioned balun 2, first capacitor C1, inductor L, second capacitor C2, third capacitor C3, inductor L, and the output terminal of differential matching structure 100 are formed in structures of different metal layers, and are electrically connected through metal vias penetrating the dielectric layers between them; the secondary coil 23 is wound half a turn and then extended to the regions of the second capacitor C2 and the third capacitor C3 to achieve electrical connection. Figure 3 As shown, there are three grounding holes, which are indicated by "GND". There are four metal vias that penetrate the second dielectric layer 12, which are indicated by "vla23". There are also two metal vias that penetrate the first dielectric layer 11 and the second dielectric layer 12, which are indicated by "vla123". There is also one metal via that penetrates the third dielectric layer 13, which is indicated by "vla34".

[0057] In this embodiment, the thicknesses of the first metal layer metal1, the second metal layer metal2, the third metal layer metal3, the fourth metal layer metal4, the fifth metal layer metal5, and the sixth metal layer metal6 are all 15 μm; the thicknesses of the first dielectric layer 11, the second dielectric layer 12, the third dielectric layer 13, the fourth dielectric layer 14, and the fifth dielectric layer 15 are all 25 μm; the linewidth of the input port line 24 is 150 μm, and the inner diameter of the input port line 24 is 340 μm; both ends of the input port line 24 are metal blocks, with a length of 240 μm and a width of 120 μm. The inner diameter of the first primary coil 21 is 340 μm; the wire diameters of the first primary coil 21, the second primary coil 22, and the secondary coil 23 are 60 μm; the distance between each pair of the secondary coil 23, the first primary coil 21, and the second primary coil 22 is 30 μm; and the wire diameters of the first bridging wire 25 and the second bridging wire 26 are 60 μm.

[0058] Combination Figures 8 to 10 As shown, in this embodiment, the matching insertion loss in the 5-7GHz frequency band of the differential matching structure 100 is only 0.5dB, and both the input return loss and output return loss are less than -14dB. Simulation diagrams of the matching insertion loss, input return loss, and output return loss after reducing the above parameters by 20% are shown below. Figures 11 to 13 As shown; simulation graphs of matching insertion loss, input return loss, and output return loss after all the above parameters are increased by 20% are shown below. Figures 14 to 16 As shown.

[0059] Compared with the prior art, the differential matching structure 100 of this embodiment defines the structure and thickness of the substrate 1, and defines the balun 2, the first capacitor C1, the inductor L, the second capacitor C2, the third capacitor C3 and the inductor L formed on the substrate 1, and defines the connection method of each device, so that the differential matching structure 100 can meet the 5-7GHz broadband matching in Wifi7 technology.

[0060] It should be noted that the various embodiments described above with reference to the accompanying drawings are only illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be covered within the scope of the present invention. Furthermore, unless the context otherwise requires, singular terms include plural forms, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A differential matching structure, characterized by, The differential matching structure includes a substrate, a balun formed on the substrate, a first capacitor, a second capacitor, a third capacitor, and an inductor. The balun includes a first primary coil, a second primary coil, and secondary coils coupled to the first primary coil and the second primary coil, respectively. A first terminal of the first primary coil serves as a first input terminal of the differential matching structure. A first terminal of the second primary coil is connected to a second terminal of the first primary coil, and the second terminal of the second primary coil serves as a second input terminal of the differential matching structure. A first terminal of a first capacitor is connected to a second terminal of the first primary coil, and the second terminal of the first capacitor is grounded. A first terminal of a second capacitor is connected to a first terminal of the secondary coil, and the second terminal of the second capacitor is grounded. A first terminal of a third capacitor is connected to a second terminal of the secondary coil, and the second terminal of the third capacitor is grounded. A first terminal of an inductor is connected to a second terminal of the secondary coil, and the second terminal of the inductor serves as an output terminal of the differential matching structure. The substrate includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, a fourth metal layer, a fourth dielectric layer, a fifth metal layer, a fifth dielectric layer, and a sixth metal layer stacked sequentially; the thicknesses of the first metal layer, the second metal layer, the third metal layer, the fourth metal layer, the fifth metal layer, and the sixth metal layer are all 15±20% μm, and the thicknesses of the first dielectric layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, and the fifth dielectric layer are all 25±20% μm; The first metal layer includes an input port line of the balun formed by winding one turn of wire, with the two ends of the input port line serving as the first input terminal and the second input terminal of the differential matching structure, respectively. The second metal layer includes a first primary coil formed by winding one turn of wire, a second primary coil formed by extending from one end of the first primary coil and winding half a turn of wire, and a secondary coil formed by extending after winding half a turn of wire. The secondary coil is spaced apart from the first primary coil and the second primary coil and is coupled to them. The third metal layer includes a first bridge wire and a second bridge wire formed at intervals. The two ends of the first bridge wire are respectively connected to the end of the first primary coil and one end of the secondary coil, and the two ends of the second bridge wire are respectively connected to the first end of the second primary coil and the first end of the second capacitor. The input port line, the first primary coil, the second primary coil, the secondary coil, the first bridge wire, and the second bridge wire constitute the balun.

2. The differential matching structure of claim 1, wherein, The input port line has a line width of 150±20%um and an inner diameter of 340±20%um. The two ends of the input port line are metal blocks with a length of 240±20%um and a width of 120±20%um.

3. The differential matching structure as described in claim 2, characterized in that, The inner diameter of the first primary coil is 340±20%um; the wire diameters of the first primary coil, the second primary coil, and the secondary coil are 60±20%um; and the distance between each pair of the secondary coil, the first primary coil, and the second primary coil is 30±20%um.

4. The differential matching structure of claim 3, wherein, The wire diameter of the first bridge wire and the second bridge wire is 60±20%um.

5. The differential matching structure according to any one of claims 1 to 4, wherein, The first metal layer further includes a first electrode plate formed at a distance from the input port line; the second metal layer further includes output traces formed at a distance from the first primary coil, the second primary coil, and the secondary coil; the third metal layer further includes a second electrode plate formed at a distance from the first bridge wire and the second bridge wire; the output traces are respectively connected to the first electrode plate and the second electrode plate, and the first electrode plate, the output traces, and the second electrode plate constitute the third capacitor.

6. The differential matching structure of claim 1, wherein, The substrate also includes a grounding hole extending through it; the first capacitor, the second capacitor, and the third capacitor are respectively grounded through the grounding hole.

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