An SFP test board

Abstract

The utility model relates to a kind of SFP test board, multiple socket pins of gold finger socket are one-to-one corresponding welding with multiple second soldering points on empty PCB board, and multiple first soldering points for being used to with gold finger socket electric connection corresponding welding have row female of test board body, multiple jack holes corresponding row female are equipped with multiple row pin soldering holes on empty PCB board, and row pin is welded in each row pin soldering hole, multiple second soldering points are one-to-one corresponding connection with multiple row pin soldering holes by in-buried line of empty PCB board, to make gold finger socket pass through empty PCB board, row pin and row female and test board body electric connection.Set gold finger socket on empty PCB board, make empty PCB board pass through row pin and row female and test board body movable insertion, when gold finger socket is replaced after being damaged multiple times, even if soldering point on empty PCB board falls off, just need to replace new empty PCB board and row pin, test board body cannot be damaged, electronic component on test board body can still continue to use, improve economic benefit.

Description

Technical Field

[0001] This utility model relates to the field of SFP debugging and testing technology, and in particular to an SFP test board. Background Technology

[0002] SFP test boards are used during the commissioning and testing of SFPs in the production process. During use, the gold finger sockets on SFP test boards are easily damaged due to repeated insertions and removals, requiring periodic replacement. However, existing SFP test boards have their gold finger sockets directly soldered onto the SFP test board (e.g., ...). Figure 6 As shown, excessive replacement of the gold finger socket can cause the gold finger socket pads on the SFP test board to fall off, thus rendering the entire SFP test board unusable. All electronic components on the SFP test board will also be rendered unusable, resulting in waste. Utility Model Content

[0003] The purpose of this invention is to provide an SFP test board that solves the aforementioned problems in the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: An SFP test board includes a test board body, female headers, pin headers, a blank PCB board, and gold finger sockets. Multiple socket pins of the gold finger sockets are soldered one-to-one with multiple second solder points on the blank PCB board. Multiple female headers are soldered to multiple first solder points on the test board body for electrical connection with the gold finger sockets. Multiple pin header holes are provided on the blank PCB board corresponding to multiple sockets of the female headers, with pins soldered into each pin header hole. Multiple second solder points are connected one-to-one to multiple pin header holes via embedded wires within the blank PCB board, enabling the gold finger sockets to be electrically connected to the test board body via the blank PCB board, pin headers, and female headers.

[0005] The beneficial effects of this utility model are: by setting the gold finger socket on the empty PCB board, the empty PCB board is movably connected to the test board body through pin headers and socket headers. When the gold finger socket is replaced multiple times due to damage, even if the solder joints on the empty PCB board fall off, only a new empty PCB board and pin headers need to be replaced, without damaging the test board body. The electronic components on the test board body can still be used, thus improving economic efficiency.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, two rows of pin header solder holes are symmetrically arranged on both sides of the empty PCB board, and corresponding pin headers are set. Two rows of first solder points are set on the test board body corresponding to the pin headers, and corresponding female headers are set.

[0008] The further beneficial effect of adopting the above is that the empty PCB board is connected to the two rows of pins on the test board body through the two rows of pins on both sides, which improves the stability of the empty PCB board insertion and installation. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the test board body structure of an SFP test board according to the present invention; Figure 2 This is a schematic diagram of the empty PCB board structure of an SFP test board according to the present invention; Figure 3 This is a wiring diagram of the test board body of an SFP test board according to this utility model; Figure 4 This is a wiring diagram of an empty PCB board for an SFP test board according to this utility model; Figure 5 This is a physical image of an SFP test board according to the present invention; Figure 6 This is a physical image of existing technology.

[0010] The attached diagram lists the components represented by each number as follows: 1. Test board body; 11. First solder joint; 12. Transmitter negative connector; 13. Transmitter positive connector; 14. Receiver positive connector; 15. Receiver negative connector; 2. Female connector; 21. Socket; 3. Empty PCB board; 31. Pin header solder hole; 32. Second solder joint; 4. Pin header; 5. Gold finger socket; 51. Socket pin. Detailed Implementation

[0011] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0012] Example 1 like Figures 1 to 4As shown, an SFP test board includes a test board body 1, female headers 2, pin headers 4, a blank PCB board 3, and a gold finger socket 5. Multiple socket pins 51 of the gold finger socket 5 are soldered one-to-one with multiple second solder points 32 on the blank PCB board 3. Multiple first solder points 11 on the test board body 1, used for electrical connection with the gold finger socket 5, are correspondingly soldered with female headers 2. Multiple pin header holes 31 are provided on the blank PCB board 3 corresponding to multiple sockets 21 of the female headers 2. Each pin header hole 31 is soldered with a pin header 4. Multiple second solder points 32 are connected one-to-one with multiple pin header holes 31 via embedded wires within the blank PCB board 3, so that the gold finger socket 5 is electrically connected to the test board body 1 through the blank PCB board 3, pin headers 4, and female headers 2. The gold finger socket 5 is placed on the empty PCB board 3. The empty PCB board 3 is movably connected to the test board body 1 through the pin header 4 and the female header 2. When the gold finger socket 5 is replaced multiple times due to damage, even if the solder joints on the empty PCB board 3 fall off, only a new empty PCB board 3 and pin header 4 need to be replaced. The test board body 1 will not be damaged, and the electronic components on the test board body 1 can still be used, thus improving economic efficiency.

[0013] Example 2 This example is a further improvement on Example 1, as detailed below: The empty PCB board 3 has two rows of pin header holes 31 symmetrically arranged on both sides, and corresponding pin headers 4 are provided. The test board body 1 has two rows of first solder points 11 corresponding to the pin headers 4, and corresponding female headers 2 are provided. The empty PCB board 3 is inserted into the two rows of female headers 2 on the test board body 1 through the two rows of pin headers 4 on its two sides, which improves the stability of the insertion and installation of the empty PCB board 3.

[0014] Example 3 This embodiment is a further improvement on embodiment 2, as detailed below: The transmitting end of the test board body 1 includes a negative transmitting connector 12 and a positive transmitting connector 13, and the receiving end of the test board body 1 includes a positive receiving connector 14 and a negative receiving connector 15. The negative transmitting connector 12 and the positive transmitting connector 13 are electrically connected to two solder points of a row of first solder points 11, and the positive receiving connector 14 and the negative receiving connector 15 are electrically connected to two solder points of another row of first solder points 11. Assigning the transmitting end and the receiving end to a row of first solder points 11 respectively improves the clarity of the wiring.

[0015] Example 4 This embodiment is a further improvement on embodiment 3, as detailed below: The transmitting end negative connector 12, transmitting end positive connector 13, receiving end positive connector 14, and receiving end negative connector 15 are positioned above the first solder joint 11. The transmitting end negative connector 12 and transmitting end positive connector 13 are electrically connected to the two solder joints at the upper end of one row of first solder joints 11, and the receiving end positive connector 14 and receiving end negative connector 15 are electrically connected to the two solder joints at the upper end of another row of first solder joints 11 (e.g., ...). Figure 3 (As shown). The transmitting end negative connector 12, transmitting end positive connector 13, receiving end positive connector 14, and receiving end negative connector 15 are positioned close to the first solder joint 11 and electrically connected to the nearest solder joint of the first solder joint 11, simplifying the wiring of the test board body 1. In specific implementation, the upper row of socket pins 51 in the gold finger socket 5 that mate with the transmitting end negative connector 12, transmitting end positive connector 13, receiving end positive connector 14, and receiving end negative connector 15 are also positioned close to the upper end of the empty PCB board 3 and electrically connected to the four solder joints at the upper end of the two rows of pin header holes 31 on the empty PCB board 3 (e.g., ...). Figure 4 As shown), simplify the wiring of the empty PCB board 3.

[0016] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An SFP test board, characterized in that, The test board includes a test board body (1), a female connector (2), a pin header (4), a blank PCB board (3), and a gold finger socket (5). The multiple socket pins (51) of the gold finger socket (5) are soldered one-to-one with the multiple second solder points (32) on the blank PCB board (3). The test board body (1) is soldered with the female connector (2) with the multiple first solder points (11) for electrical connection with the gold finger socket (5). The blank PCB board (3) is provided with multiple pin header solder holes (31) corresponding to the multiple sockets (21) of the female connector (2). The pin header (4) is soldered in each pin header solder hole (31). The multiple second solder points (32) are connected one-to-one with the multiple pin header solder holes (31) through the embedded wires in the blank PCB board (3), so that the gold finger socket (5) is electrically connected to the test board body (1) through the blank PCB board (3), the pin header (4), and the female connector (2).

2. The SFP test board of claim 1, wherein, The empty PCB board (3) has two rows of pin solder holes (31) symmetrically arranged on both sides, and the pins (4) are arranged accordingly. The test board body (1) has two rows of first solder points (11) corresponding to the pins (4), and the pins (2) are arranged accordingly.

3. The SFP test board of claim 2, wherein, The transmitting end of the test board body (1) includes a transmitting end negative connector (12) and a transmitting end positive connector (13), and the receiving end of the test board body (1) includes a receiving end positive connector (14) and a receiving end negative connector (15); the transmitting end negative connector (12) and the transmitting end positive connector (13) are electrically connected to two solder joints of a row of first solder joints (11), and the receiving end positive connector (14) and the receiving end negative connector (15) are electrically connected to two solder joints of another row of first solder joints (11).

4. The SFP test board of claim 3, wherein, The transmitting end negative terminal connector (12), the transmitting end positive terminal connector (13), the receiving end positive terminal connector (14), and the receiving end negative terminal connector (15) are disposed above the first solder joint (11). The transmitting end negative terminal connector (12) and the transmitting end positive terminal connector (13) are electrically connected to two solder joints at the upper end of one row of the first solder joints (11), and the receiving end positive terminal connector (14) and the receiving end negative terminal connector (15) are electrically connected to two solder joints at the upper end of another row of the first solder joints (11).

Images