Switch heat dissipation structure

Abstract

This utility model discloses a heat dissipation structure for a power switch, including a casing, a finned heat sink, and heat pipes. The casing has ventilation windows. The finned heat sink is located inside the casing, with at least a portion of it exposed through the ventilation windows. The heat pipes are located inside the casing and in thermal contact with the finned heat sink, absorbing heat from a heat source within the casing and transferring it to the finned heat sink. The finned heat sink extends along the length or width of the casing to form a rectangular structure. The heat pipes extend in the same direction as the finned heat sink and are filled with a cooling medium. One end of the heat pipe has a heat-absorbing section for thermal contact with a heat source, and the portion of the heat pipe other than the heat-absorbing section is a condensation section for heat exchange with the finned heat sink. This utility model's heat dissipation structure, by employing a fanless passive cooling method combining heat pipes and a large-area finned heat sink, achieves quiet operation of the device, making it suitable for deployment in noise-sensitive environments such as offices and medical facilities, and offering higher reliability.

Description

Technical Field

[0001] This utility model relates to switch equipment, and more particularly to a heat dissipation structure for a switch. Background Technology

[0002] With the rapid development of electronic technology, the integration and operating frequency of electronic products are constantly increasing, and their power consumption and heat generation are also increasing significantly. In particular, for core chips such as central processing units (CPUs) and double data rate memory (DDR) in network switches, servers and other equipment, the heat generated under high load has become a key bottleneck affecting product performance and stability.

[0003] To address the aforementioned heat dissipation issues, existing switches generally employ active cooling solutions, which involve installing fans inside the chassis to expel heat through forced convection. However, this fan-based active cooling method has significant drawbacks. First, fans generate considerable operating noise at high speeds, making electronic products using this cooling solution unsuitable for environments requiring quiet, such as offices, medical facilities, or homes. Second, as a mechanical moving part, the fan's airflow ducts and blades easily accumulate dust, reducing cooling efficiency over time and requiring regular cleaning and maintenance, increasing operating costs. More seriously, the fan's mechanical structure poses a reliability risk; if it malfunctions and stops rotating, the chip temperature will rise sharply, easily causing overheating and damage to the device, severely impacting product reliability and lifespan. Utility Model Content

[0004] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the purpose of this invention is to propose a heat dissipation structure for a power switch.

[0005] To achieve the above objectives, the heat dissipation structure of the switch according to an embodiment of the present invention includes:

[0006] The housing is provided with heat dissipation windows;

[0007] A finned heat sink, wherein the finned heat sink is disposed within the housing and the finned heat sink is at least partially exposed in the heat dissipation window;

[0008] A heat pipe is disposed inside the casing and in thermal contact with the finned heat sink to absorb heat from the heat source inside the casing and transfer it to the finned heat sink for heat dissipation.

[0009] The finned heat sink extends along the length or width of the casing to form a rectangular structure. The heat pipe extends in the same direction as the finned heat sink and is filled with a cooling medium. One end of the heat pipe has a heat-absorbing section for thermal contact with the heat source. The part of the heat pipe other than the heat-absorbing section is a condensation section for heat exchange with the finned heat sink.

[0010] The heat dissipation structure for a switch provided in this embodiment of the invention effectively overcomes the shortcomings of traditional fan-based cooling methods by employing a fanless passive cooling approach that combines heat pipes with a large-area finned heat sink. Firstly, by eliminating the fan, a primary source of noise, this heat dissipation structure achieves near-silent operation (fanless noise), greatly expanding its application scenarios and enabling deployment in noise-sensitive environments such as offices, medical facilities, and homes. Secondly, the fanless design significantly reduces dust adsorption and accumulation caused by forced airflow, ensuring long-term stable heat dissipation efficiency and eliminating the need for regular cleaning and maintenance, thereby reducing user maintenance costs. Furthermore, the absence of a fan significantly improves the overall reliability and lifespan of the switch.

[0011] In addition, the heat dissipation structure of the switch according to the above embodiments of the present invention may also have the following additional technical features:

[0012] According to one embodiment of the present invention, the finned heat sink includes:

[0013] A heat sink includes a bottom wall and two side walls connected to both sides of the bottom wall in the width direction. The bottom wall and the side walls extend along the length / width direction of the housing, and the two side walls and the bottom wall define an upward-opening heat dissipation cavity.

[0014] Multiple heat dissipation fins are disposed within the heat dissipation cavity and are spaced apart along the width direction of the bottom wall;

[0015] The heat pipe is located below the heat sink and is in thermal contact with the bottom wall.

[0016] According to one embodiment of the present invention, the bottom wall has a downwardly protruding heat-conducting platform in the middle of its width direction, the heat-conducting platform extends along the length direction of the bottom wall, and the heat pipe is in thermal contact with the heat-conducting platform.

[0017] According to one embodiment of the present invention, the heat-conducting platform is provided with a receiving portion adapted to the heat pipe; at least a portion of the heat pipe is received in the receiving portion to contact the heat-conducting platform.

[0018] According to one embodiment of the present invention, the receiving portion is a groove provided on the surface of the heat-conducting stage.

[0019] According to one embodiment of the present invention, the heat pipe has an arc-shaped top surface and a flat bottom surface, the arc-shaped top surface is in contact with the inner wall of the groove, and the flat bottom surface is at least partially in contact with the heat source inside the housing.

[0020] According to one embodiment of the present invention, the receiving portion is a through hole extending from one end of the heat-conducting platform to the other end, the heat pipe is inserted into the through hole, and the heat-absorbing section of the heat pipe is at least partially exposed outside the heat-conducting platform.

[0021] According to one embodiment of the present invention, the housing includes:

[0022] The bottom shell has slots on both sides, which are adapted to the cross-section of the heat sink. One end of the heat sink is engaged in the slot on one side of the bottom shell, and the other end of the heat sink is engaged in the slot on the other side of the bottom shell.

[0023] The front shell is detachably connected to the bottom shell, and the heat dissipation window is provided on the front shell to expose at least the top and end surfaces of the heat dissipation fins.

[0024] According to one embodiment of the present utility model, the top surface of the sidewall is provided with a plurality of first through holes, the plurality of first through holes being spaced apart along the length direction of the sidewall, the top surface of the face shell is provided with a plurality of second through holes, the plurality of second through holes corresponding one-to-one with the plurality of first through holes, and the bottom shell is provided with a plurality of threaded holes.

[0025] The housing also includes multiple fastening threaded parts, each of which corresponds to one of the multiple first through holes. Each fastening threaded part passes through the second through hole and the first through hole and is threadedly connected to the corresponding threaded hole to fix the front shell, heat sink and bottom shell relatively.

[0026] According to one embodiment of the present invention, the heat-absorbing section is provided with a heat-conducting pad for thermal contact with the heat source inside the housing.

[0027] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a cross-sectional view of the heat dissipation structure of the switch according to an embodiment of this utility model;

[0030] Figure 2 This is an exploded view of the heat dissipation structure of the switch according to an embodiment of this utility model;

[0031] Figure 3 This is a detailed exploded view of the heat dissipation structure of the switch according to an embodiment of this utility model;

[0032] Figure 4 This is an exploded view of the heat dissipation structure of the switch in an embodiment of this utility model;

[0033] Figure 5 This is a side view of a portion of the heat dissipation structure of the switch according to an embodiment of the present utility model;

[0034] Figure 6 This is an exploded view of the finned heat sink and heat pipe in the heat dissipation structure of the switch according to an embodiment of this utility model;

[0035] Figure label:

[0036] 10. Housing;

[0037] 101. Bottom shell;

[0038] 102. Face shell;

[0039] H10, ventilation window;

[0040] H101, checkpoint;

[0041] 11. Circuit board;

[0042] 111. Heat source;

[0043] 20. Finned radiator;

[0044] 201. Heat sink;

[0045] 201a, bottom wall;

[0046] 201b, sidewall;

[0047] 201c, heat conduction stage;

[0048] 202. Heat dissipation fins;

[0049] 203. Fastening threaded parts;

[0050] H20, groove;

[0051] 30. Heat pipe;

[0052] S301, Rounded top surface;

[0053] S302, Flat bottom surface;

[0054] 31. Thermal pads.

[0055] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0056] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0057] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0059] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0060] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0061] The heat dissipation structure of the switch according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0062] Reference Figures 1 to 5 As shown, the heat dissipation structure for a network switch provided according to this embodiment is applied inside a network switch. High-heat-generating core electronic components, such as a central processing unit (CPU) or double data rate memory (DDR), are soldered onto the circuit board 11 inside the switch. These components are the main heat sources 111 in this embodiment. The heat dissipation structure includes a housing 10, a finned heat sink 20, and heat pipes 30.

[0063] Specifically, the housing 10 is provided with a heat dissipation window H10. This heat dissipation window H10 can be designed as a rectangular window, its main purpose being to allow free natural convection of air inside and outside the housing 10. In this embodiment, the heat dissipation window H10 is located on the top surface and / or side surface of the housing 10 to utilize the physical law of hot air rising naturally, thereby improving heat dissipation efficiency.

[0064] A finned heatsink 20 is disposed within the casing 10, and at least partially exposed within the heat dissipation window H10. The finned heatsink 20 extends along the length or width of the casing 10 to form a rectangular structure. That is, the finned heatsink 20 forms a large-sized rectangular heat dissipation module. At least a portion of the finned heatsink 20 is exposed within the heat dissipation window H10, allowing it to directly contact the low-temperature ambient air outside the casing 10 for efficient heat exchange. For example, the finned heatsink 20 is made of materials such as aluminum alloy or copper.

[0065] A heat pipe 30 is disposed within the casing 10 and in thermal contact with the finned heat sink 20. It absorbs heat from the heat source 111 within the casing 10 and transfers it to the finned heat sink 20 for heat dissipation. The heat pipe 30 extends in the same direction as the finned heat sink 20 and is filled with a cooling medium. One end of the heat pipe 30 has a heat-absorbing section for thermal contact with the heat source 111, and the portion of the heat pipe 30 excluding the heat-absorbing section is a condensation section for heat exchange with the finned heat sink 20. For example, the heat pipe 30 is typically made of copper, which has excellent thermal conductivity.

[0066] In other words, the interior of heat pipe 30 is evacuated and filled with a suitable amount of cooling medium, such as deionized water or other low-boiling-point liquids. The overall orientation of heat pipe 30 is consistent with the extension direction of finned heat sink 20. One end of heat pipe 30 serves as a heat absorption section, which can achieve thermal contact by tightly bonding with heat source 111 (e.g., the surface of CPU chip) through a high thermal conductivity interface material (such as thermal grease). Thermal contact in this application refers to the ability of heat to be transferred between the two components after contact. The remaining portion of heat pipe 30, excluding the heat absorption section, is defined as a condensation section, which is in thermal contact with finned heat sink 20.

[0067] In practical applications, when this heat dissipation structure is used in a switch, when the heat source 111 (such as the CPU) inside the switch starts working and generates heat, the heat generated is rapidly transferred to the heat absorption section of the heat pipe 30, which is in close contact with it. The cooling medium inside the heat absorption section, after absorbing heat, rapidly boils and evaporates into a high-temperature, high-pressure gaseous medium. Because the pressure of the gaseous medium is much higher than that of the condensation section, the vapor flows at high speed along the inner cavity of the heat pipe 30 to the lower-temperature condensation section. In the condensation section, the gaseous medium comes into contact with the cooler finned heat sink 20 and condenses, releasing a large amount of latent heat absorbed during evaporation. This latent heat is then conducted to the finned heat sink 20 through the pipe wall of the heat pipe 30. Finally, the heat covering the large surface area of ​​the finned heat sink 20 is dissipated into the surrounding ambient air through the heat dissipation window H10 on the casing 10 via natural convection and thermal radiation. At the same time, the condensed liquid working fluid will automatically flow back to the heat absorption section by the capillary force generated by the capillary structure of the inner wall of the heat pipe 30, thus completing a complete phase change heat transfer cycle without any external power.

[0068] According to the heat dissipation structure of the switch provided in this embodiment, the fanless passive heat dissipation method, which combines heat pipes 30 and large-area finned heat sinks 20, effectively overcomes the defects of traditional fan-based heat dissipation methods. Firstly, by eliminating the fan, a major noise source, this heat dissipation structure achieves near-silent operation (fanless noise), greatly expanding its application scenarios and enabling deployment in noise-sensitive office, medical, and home environments. Secondly, the fanless design significantly reduces dust adsorption and accumulation caused by forced airflow, ensuring long-term stable heat dissipation efficiency and eliminating the need for regular cleaning and maintenance, thereby reducing user maintenance costs. Furthermore, the absence of a fan significantly improves the overall reliability and lifespan of the switch.

[0069] Reference Figures 3 to 5 As shown, in some embodiments of this utility model, the finned heat sink 20 includes a heat sink 201 and a plurality of heat sink fins 202. The heat sink 201 includes a bottom wall 201a and two side walls 201b connected to both sides of the bottom wall 201a in the width direction. Preferably, the heat sink 201 is integrally formed by processes such as aluminum extrusion or copper extrusion to ensure the integrity of its structure and excellent thermal conductivity continuity.

[0070] Both the bottom wall 201a and the side wall 201b extend along the length / width direction of the housing 10, and the two side walls 201b and the bottom wall 201a define an upward-facing heat dissipation cavity. The heat sink 201 has a U-shaped cross-section.

[0071] Multiple heat dissipation fins 202 are disposed within the heat dissipation cavity and spaced apart along the width direction of the bottom wall 201a. This creates parallel, vertical airflow channels between the heat dissipation fins 202. The heat dissipation fins 202 employ a thin sheet structure with a large surface area, and their height can be approximately equal to the height of the side wall 201b of the heat sink 201, ensuring that the entire heat dissipation structure can be accommodated inside the housing 10.

[0072] The heat pipe 30 is located below the heat sink 201 and is in thermal contact with the bottom wall 201a, ensuring that the heat transferred from the heat pipe 30 can be transferred to the bottom wall 201a of the heat sink 201.

[0073] In practical applications, when heat is conducted from the heat pipe 30 to the bottom wall 201a of the heat sink 201, the heat quickly diffuses along the bottom wall 201a and simultaneously to the side walls 201b and the multiple heat dissipation fins 202 connected to the bottom wall 201a. The heat dissipation fins 202 and the side walls 201b together heat the air inside the heat dissipation cavity. The heated air density decreases and it naturally floats upward. Due to the presence of the two side walls 201b, the lateral flow of air is effectively constrained, and the heated air is guided to form a concentrated, vertically upward, stable airflow, thereby creating a chimney effect inside the heat dissipation cavity. The rising hot airflow accelerates the removal of heat from the surface of the heat dissipation fins 202, while simultaneously drawing in cooler external air from below and sides of the heat dissipation cavity, forming a continuous and efficient natural convection circulation.

[0074] By employing the aforementioned structure combining the heat sink 201 with the heat dissipation fins 202, its U-shaped heat dissipation cavity effectively gathers and guides heated air upwards, generating a significant chimney effect. This greatly enhances the intensity and efficiency of natural convection, enabling excellent heat dissipation performance even without a fan. Furthermore, placing multiple heat dissipation fins 202 inside the heat dissipation cavity not only effectively utilizes the cavity space to maximize the heat dissipation surface area, but the sidewall 201b also provides effective structural support and physical protection for the heat dissipation fins 202, preventing bending and deformation. In addition, the heat pipes 30 are arranged at the bottom of the heat sink 201, ensuring that heat can be evenly introduced into the entire finned heat sink 20 from the center. This allows the bottom wall 201a, sidewall 201b, and all heat dissipation fins 202 to participate in heat exchange, optimizing heat distribution and improving the overall utilization efficiency of the heat sink.

[0075] Reference Figure 3 and Figure 5 As shown, in some embodiments of this utility model, the bottom wall 201a has a downwardly protruding heat-conducting platform 201c in the middle of its width direction. The heat-conducting platform 201c extends along the length direction of the bottom wall 201a, and the heat pipe 30 is in thermal contact with the heat-conducting platform 201c.

[0076] When the heat released from the condensation section of the heat pipe 30 is transferred to the heat conduction platform 201c, the platform, with its concentrated and relatively thick cross-section, can quickly absorb the high heat flux density transferred from the heat pipe 30. Subsequently, the heat is conducted vertically and horizontally around the heat conduction platform 201c. Vertically, it is conducted over the shortest distance to the bottom wall 201a of the heat sink 201, and then to the multiple heat dissipation fins 202 above the bottom wall 201a. Horizontally, it is conducted along the bottom wall 201a to the side walls 201b on both sides. This heat conduction method centered on the heat conduction platform 201c ensures that heat can be more quickly and evenly diffused to all locations of the finned heat sink 20, including each heat dissipation fin 202, the bottom wall 201a, and the side walls 201b, thus fully utilizing the surface area of ​​the entire heat sink for efficient external heat dissipation.

[0077] Reference Figure 6 As shown, in one embodiment of the present invention, the heat-conducting stage 201c is provided with a receiving portion adapted to the heat pipe 30; at least a portion of the heat pipe 30 is received in the receiving portion to contact the heat-conducting stage 201c.

[0078] For example, the receiving portion is a groove H20 provided on the surface of the heat-conducting platform 201c. During assembly, the heat pipe 30 is directly pressed into or embedded into the groove H20 to form a large-area fit. Alternatively, the receiving portion is a through hole extending from one end of the heat-conducting platform 201c to the other end. The heat pipe 30 passes through the through hole, and the heat-absorbing section of the heat pipe 30 is at least partially exposed outside the heat-conducting platform 201c. During assembly, the heat pipe 30 is inserted from one end of the through hole until it completely passes through the entire heat-conducting platform 201c. In this way, the entire outer surface of the heat pipe 30 achieves 360-degree contact with the inner wall of the through hole of the heat-conducting platform 201c, forming a maximized contact area.

[0079] By providing a receiving portion on the heat-conducting platform 201c, which can be either a groove H20 or a through hole, the contact area between the heat pipe 30 and the heat sink 201 is optimized. Compared to simple planar contact, the groove H20 provides a semi-enclosed contact, while the through hole achieves a full-enclosed contact, resulting in higher heat transfer efficiency and ensuring the performance of passive heat dissipation. Furthermore, it greatly enhances the stability and reliability of the structure, ensuring a stable and reliable positional relationship between the heat pipe 30 and the heat-conducting platform 201c, effectively preventing displacement or loosening of the heat pipe 30 when the equipment is subjected to vibration or impact, thus guaranteeing long-term, stable heat dissipation performance.

[0080] Preferably, when the receiving part adopts the structure of the groove H20, the heat pipe 30 has an arc-shaped top surface S301 and a flat bottom surface S302. The arc-shaped top surface S301 is in contact with the inner wall of the groove H20, and the flat bottom surface S302 is at least partially in contact with the heat source 111 inside the housing 10. In this way, by utilizing the contact between the arc-shaped top surface S301 and the arc-shaped inner wall of the groove, the contact area between the two can be increased, thereby further improving the efficiency of heat transfer.

[0081] Reference Figures 2 to 3 As shown, in one embodiment of the present invention, the housing 10 includes a bottom shell 101 and a front shell 102. The bottom shell 101 has a latch H101 on each side. The latch H101 is adapted to the cross-section of the heat sink 201. One end of the heat sink 201 is latched in the latch H101 on one side of the bottom shell 101, and the other end of the heat sink 201 is latched in the latch H101 on the other side of the bottom shell 101.

[0082] The front shell 102 is detachably connected to the bottom shell 101. The heat dissipation window H10 is provided on the front shell 102 to expose at least the top and end faces of the heat dissipation fins 202. When the front shell 102 is closed on the bottom shell 101, the heat dissipation window H10 is aligned with the heat dissipation fins 202 below, exposing a large area of ​​the heat dissipation fins 202, such as the top and end faces. This allows the rising hot airflow generated by the chimney effect to be discharged from the casing 10 more smoothly. At the same time, it allows external cold air to enter the airflow channel between the heat dissipation fins 202 from both ends, further enhancing the air convection effect.

[0083] In this embodiment, the assembly process is greatly simplified and production efficiency is improved by adopting the housing 10 structure and the snap-fit ​​installation structure. Meanwhile, the finned heat sink 20 spans across the bottom shell 101, acting like a reinforcing beam, effectively enhancing the structural strength of the housing 10 and making the product more robust and durable. Furthermore, the heat dissipation windows H10 on the front shell 102, corresponding to the heat dissipation fins 202, provide a path for the exhaust of hot air and the intake of cool air, further improving the efficiency of natural convection and ensuring excellent heat dissipation performance.

[0084] Reference Figures 1 to 3 As shown, in one embodiment of the present invention, the top surface of the side wall 201b is provided with a plurality of first through holes, the plurality of first through holes being spaced apart along the length direction of the side wall 201b, the top surface of the face shell 102 is provided with a plurality of second through holes, the plurality of second through holes corresponding one-to-one with the plurality of first through holes, and the bottom shell 101 is provided with a plurality of threaded holes.

[0085] The housing 10 also includes a plurality of fastening threaded parts 203, each of which corresponds to a plurality of first through holes. Each of the fastening threaded parts 203 passes through the second through hole and the first through hole and is threadedly connected to the corresponding threaded hole to fix the front shell 102, the heat sink 201 and the bottom shell 101 relative to each other.

[0086] Through the aforementioned fastening method, the finned heat sink 20 is integrated into the structural reinforcement of the casing, thereby improving the mechanical strength and structural rigidity of the entire casing 10. This effectively resists external impacts, vibrations, or pressures, preventing deformation of the casing 10 and providing better physical protection for the internal circuit board 11 and electronic components. Simultaneously, the connection method ensures long-term positional stability between the components.

[0087] Reference Figure 1 , Figures 3 to 5 As shown, in some embodiments of this utility model, a thermally conductive pad 31 is attached to the heat-absorbing section for thermal contact with the heat source 111 inside the housing 10. This thermally conductive pad 31 is a flexible material with good thermal conductivity, such as a composite material with silicone as the base material and filled with thermally conductive ceramic powder.

[0088] By introducing the thermally conductive pad 31 as a thermal interface material, when the heat dissipation structure is installed and fixed, the installation pressure will cause the soft thermally conductive pad 31 to undergo slight deformation, thereby filling the gap between the heat source 111 and the heat absorption section on the heat pipe 30, ensuring that heat can be transferred to the heat pipe 30 quickly and efficiently, and improving the heat transfer efficiency.

[0089] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0090] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation structure for a switch, characterized by comprising: include: The housing is provided with heat dissipation windows; A finned heat sink, wherein the finned heat sink is disposed within the housing and the finned heat sink is at least partially exposed in the heat dissipation window; A heat pipe is disposed inside the casing and in thermal contact with the finned heat sink to absorb heat from the heat source inside the casing and transfer it to the finned heat sink for heat dissipation. The finned heat sink extends along the length or width of the casing to form a rectangular structure. The heat pipe extends in the same direction as the finned heat sink and is filled with a cooling medium. One end of the heat pipe has a heat-absorbing section for thermal contact with the heat source. The part of the heat pipe other than the heat-absorbing section is a condensation section for heat exchange with the finned heat sink.

2. The switch heat sink structure of claim 1, wherein, The finned heat sink includes: A heat sink includes a bottom wall and two side walls connected to both sides of the bottom wall in the width direction. The bottom wall and the side walls extend along the length / width direction of the housing, and the two side walls and the bottom wall define an upward-opening heat dissipation cavity. Multiple heat dissipation fins are disposed within the heat dissipation cavity and are spaced apart along the width direction of the bottom wall; The heat pipe is located below the heat sink and is in thermal contact with the bottom wall.

3. The switch heat sink structure of claim 2, wherein, The bottom wall has a downwardly protruding heat-conducting platform in the middle of its width direction, the heat-conducting platform extends along the length direction of the bottom wall, and the heat pipe is in thermal contact with the heat-conducting platform.

4. The heat dissipation structure for a switch according to claim 3, characterized in that, The heat-conducting platform is provided with a receiving portion adapted to the heat pipe; at least a portion of the heat pipe is housed in the receiving portion to contact the heat-conducting platform.

5. The switch heat sink structure of claim 4, wherein, The receiving portion is a groove provided on the surface of the heat-conducting platform.

6. The switch heat sink structure of claim 5, wherein, The heat pipe has an arc-shaped top surface and a flat bottom surface. The arc-shaped top surface fits into the inner wall of the groove, and the flat bottom surface is at least partially in contact with the heat source inside the housing.

7. The switch heat dissipation structure of claim 4, wherein, The receiving portion is a through hole extending from one end of the heat-conducting platform to the other end, the heat pipe is inserted through the through hole, and the heat-absorbing section of the heat pipe is at least partially exposed outside the heat-conducting platform.

8. The switch heat sink structure of claim 2, wherein, The housing includes: The bottom shell has slots on both sides, which are adapted to the cross-section of the heat sink. One end of the heat sink is engaged in the slot on one side of the bottom shell, and the other end of the heat sink is engaged in the slot on the other side of the bottom shell. The front shell is detachably connected to the bottom shell, and the heat dissipation window is provided on the front shell to expose at least the top and end surfaces of the heat dissipation fins.

9. The heat dissipation structure for a switch according to claim 8, characterized in that, The top surface of the sidewall is provided with a plurality of first through holes, which are spaced apart along the length of the sidewall. The top surface of the face shell is provided with a plurality of second through holes, which correspond one-to-one with the plurality of first through holes. The bottom shell is provided with a plurality of threaded holes. The housing also includes multiple fastening threaded parts, each of which corresponds to one of the multiple first through holes. Each fastening threaded part passes through the second through hole and the first through hole and is threadedly connected to the corresponding threaded hole to fix the front shell, heat sink and bottom shell relatively.

10. The switch heat sink structure of claim 1, wherein, The heat-absorbing section is fitted with a thermally conductive pad for thermal contact with the heat source inside the casing.

Images