Transducer assembly, earphone and earphone system

Abstract

This application discloses a transducer assembly, an earphone, and an earphone system. The transducer assembly includes a mounting member, a first speaker, a first circuit board, and a second speaker. The mounting member includes a mounting body. In the thickness direction of the transducer assembly, the mounting body includes a first surface and a second surface facing away from each other. The first speaker is mounted on the mounting member and protrudes towards the side containing the first surface. The first circuit board is mounted on the first surface, and the first speaker and the first circuit board are spaced apart. The second speaker is mounted on the mounting member and protrudes towards the side containing the second surface. In a projection plane perpendicular to the thickness direction, the projection of the first speaker and the projection of the second speaker at least partially overlap, and / or, the projection of the first circuit board and the projection of the second speaker at least partially overlap. This at least partial overlap of the projections of the first and second speakers saves space in the transducer assembly in a plane perpendicular to the thickness direction, which is beneficial for miniaturization of the transducer assembly.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more specifically, to a transducer, headphones, and headphone system. Background Technology

[0002] With continuous breakthroughs in electronic product technology and the fast-paced changes in living environments, people's functional demands for headphones are constantly increasing, especially the demand for headphone sound quality. However, to ensure sound quality, the speakers inside the headphones need to maintain a certain size, which encroaches on the installation space of other components inside the headphones, making it difficult to miniaturize them. Utility Model Content

[0003] This application provides a transducer, headphones, and headphone system to solve at least one of the aforementioned technical problems.

[0004] The transducer assembly provided in this application is used for headphones. The transducer assembly includes a mounting member, a first speaker, a first circuit board, and a second speaker. The mounting member includes a mounting body. In the thickness direction of the transducer assembly, the mounting body includes a first surface and a second surface facing away from each other. The first speaker is mounted on the mounting member and protrudes toward the side containing the first surface. The first circuit board is mounted on the first surface, and the first speaker and the first circuit board are spaced apart. The second speaker is mounted on the mounting member and protrudes toward the side containing the second surface. Wherein, in a projection plane perpendicular to the thickness direction, the projection of the first speaker and the projection of the second speaker at least partially overlap, and / or, the projection of the first circuit board and the projection of the second speaker at least partially overlap.

[0005] In some embodiments, in a projection plane perpendicular to the thickness direction, the projection of the second speaker includes the projection of the first speaker and the projection of the first circuit board, the projection of the first circuit board at least partially surrounding the projection of the first speaker.

[0006] In some embodiments, the mounting member has a mounting notch, and the transducer assembly further includes a second circuit board. The second circuit board is at least partially housed within the mounting notch, and the second speaker is electrically connected to the first circuit board via the second circuit board. In a projection plane perpendicular to the thickness direction, the projections of the first circuit board, the mounting notch, and the second circuit board at least partially overlap.

[0007] In some embodiments, the transducer assembly further includes a housing and a third speaker. The mounting member is connected to the inner wall of the housing. The mounting member, the first speaker, the second speaker, and the first circuit board are housed within the housing. The third speaker is mounted in the receiving cavity, and in a projection plane perpendicular to the thickness direction, the projection of the third speaker at least partially overlaps with that of the second speaker, and / or, the projection of the third speaker at least partially overlaps with that of the first speaker.

[0008] In some embodiments, the mounting body includes a first region and a second region that are in contact with each other. The first region is provided with a first mounting hole that penetrates the first surface and the second surface. The first speaker is at least partially accommodated in the first mounting hole, and the first circuit board is mounted in the second region.

[0009] In some embodiments, the mounting member further includes a first extension wall. The first extension wall is disposed in the first region, extends from the first surface in a direction away from the first surface, and surrounds to form a second mounting hole. The second mounting hole communicates with the first mounting hole, and the inner dimension of the second mounting hole is larger than the inner dimension of the first mounting hole to form a first stepped surface. The first speaker is supported on the first stepped surface, and the first extension wall is used to limit the position of the first speaker.

[0010] In some embodiments, the first extension wall is provided with a positioning groove, the positioning groove communicates with the second mounting hole and forms a second stepped surface between the positioning groove and the second mounting hole, the second stepped surface is closer to the top surface of the first extension wall away from the second surface than the first stepped surface, the first loudspeaker includes a loudspeaker body and a positioning member connected to the loudspeaker body, the loudspeaker body is supported on the first stepped surface, the positioning member is supported on the second stepped surface and accommodated in the positioning groove.

[0011] In some embodiments, the mounting member further includes a second extension wall. The second extension wall extends from the second surface in a direction away from the second surface to form a mounting cavity, in which the second speaker is at least partially received, and the second extension wall serves to limit the position of the second speaker.

[0012] The headphones provided in this application include the transducer component described in any of the above embodiments.

[0013] The headphone system provided in this application includes the headphone and charging device described in any of the above embodiments, wherein the charging device is used to charge the headphone.

[0014] In the transducer, earphone, and earphone system of this application, the projection of the first speaker and the projection of the second speaker at least partially overlap, which can save space of the transducer in the plane perpendicular to the thickness direction while ensuring the size of the first and second speakers. The projection of the first circuit board and the projection of the second speaker at least partially overlap, which can also save space of the transducer in the plane perpendicular to the thickness direction, making the transducer layout compact, reducing the footprint of the transducer, and facilitating the miniaturization of the transducer.

[0015] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0017] Figure 1 This is a three-dimensional structural diagram of a headphone system according to certain embodiments of this application;

[0018] Figure 2 yes Figure 1 A three-dimensional structural diagram of the headphone system shown;

[0019] Figure 3 yes Figure 2 A plan view of some components of the transducer assembly in the headphones shown;

[0020] Figure 4 yes Figure 2 An exploded three-dimensional diagram of the transducer assembly in the headphones shown.

[0021] Figure 5 yes Figure 2 The diagram shows a cross-sectional view of the headphones.

[0022] Explanation of key component symbols:

[0023] Headphone system 10000; Headphone 1000; Charging device 3000; Transducer assembly 100; Ear hook assembly 300; Ear hook 310; Power supply component 330; Housing 10; Base 11; Cover 13; Mounting component 30; Mounting body 31; First surface 301; First zone 311; Second zone 313; Second surface 303; First mounting hole 315; First extension wall 33; Second mounting hole 331; First stepped surface 333; Positioning groove 335; Second extension wall 35; Mounting notch 351; Mounting cavity 353; First circuit board 40; First speaker 50; Second circuit board 60; First speaker body 51; Positioning component 53; Second speaker 70; Second speaker body 71; Loading part 73; Third speaker 80; Electrical connector 90. Detailed Implementation

[0024] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting the embodiments of this application.

[0025] In the description of this application, it should be understood that the terms "thickness," "upper," "top," "bottom," "inner," "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly. In one example, they can be a fixed connection, a detachable connection, or an integral connection; they can be a mechanical connection, an electrical connection, or a connection that allows communication between them; they can be a direct connection or an indirect connection through an intermediate medium; they can be the internal connection of two elements or the interaction between two elements.

[0027] With the continuous breakthroughs in electronic product technology and the fast-paced changes in living environments, people's functional demands for headphones are constantly increasing, especially the demand for superior sound quality. However, to ensure sound quality, the speaker inside the headphones needs to maintain a certain size, which encroaches on the installation space of other components inside the headphones, making it difficult to miniaturize them. To solve the above problems, this application provides a transducer assembly 100 (… Figure 2 , Figure 4 and Figure 5 (as shown), headphones 1000 ( Figure 2 (as shown) and headphone system 10000 ( Figure 1 (As shown).

[0028] Please see Figure 1 The headphone system 10000 provided in this application includes a headphone 1000 and a charging device 3000. The charging device 3000 is used to charge the headphone 1000.

[0029] It is understood that the charging device 3000 is a device in the headphone system 10000 used to charge or store the headphones 1000. For example, when the headphones 1000 are low on power or not needed, the user can place them in the charging device 3000. The headphones 1000 can be worn on the user's ears and can be used with devices such as mobile phones, computers, smart wearable devices (such as smartwatches, smart bracelets, smart glasses, and smart helmets), head-mounted displays, and virtual reality devices. In some embodiments of this application, the headphones 1000 may include, but are not limited to, ear-hook headphones.

[0030] Since the headphone system 10000 in this embodiment includes a headphone 1000, it is understood that the headphone system 10000 includes at least the same beneficial effects as the headphone 1000. Therefore, for the beneficial effects of the headphone system 10000, please refer to the beneficial effects of the headphone 1000 described below.

[0031] In some embodiments of this application, the earphone 1000 can be worn on the user's ear and can be used in conjunction with devices such as mobile phones, computers, smart wearable devices (such as smartwatches, smart bracelets, smart glasses and smart helmets), head-mounted displays and virtual reality devices.

[0032] Specifically, in some embodiments, the earphone 1000 includes air-conduction earphones and bone-conduction earphones. Air-conduction earphones, also known as air-conduction headphones, are earphones 1000 that transmit sound waves through air vibrations. Bone-conduction earphones, also known as bone-conduction headphones, are earphones 1000 that convert sound waves into different mechanical vibrations and transmit them through the skull, bony labyrinth, inner ear lymph, cochlea, and auditory center. It should be noted that the user's ear includes the external auditory canal, concha, cymba conchae, triangular fossa, helix, and antitragus. The concha, cymba conchae, and triangular fossa have a certain depth and volume in three-dimensional space. The external auditory canal is a curved tube extending medially from the external auditory meatus deep within the concha to the tympanic membrane.

[0033] In one example, when the earphone 1000 is a bone conduction earphone, the transducer 100 is configured to be located on the front side of the ear when the earphone 1000 is worn, in which case the transducer 100 does not obstruct the external auditory canal. In another example, when the earphone 1000 is an air conduction earphone, the transducer 100 is configured to at least partially extend into at least one part of the concha, cymba conchae, and triangular fossa when the earphone 1000 is worn, i.e., an in-ear earphone 1000. In yet another example, when the earphone 1000 is an air conduction earphone 1000, the transducer 100 is configured to be spaced from and aligned with the ear canal when the earphone 1000 is worn, i.e., an open-ear (OWS) earphone 1000.

[0034] Please see Figure 1 and Figure 2 For example, this application describes the headphone 1000 as an open-back headphone 1000. The headphone 1000 includes a transducer assembly 100 and an ear hook assembly 300.

[0035] The transducer component 100 is a structure in the headphones 1000 used to enable the user to hear sound. That is, the transducer component 100 is a structure in the headphones 1000 capable of converting electrical signals into sound waves, and its performance directly determines the sound quality of the headphones 1000. Specifically, the headphones 1000 includes one transducer component 100; or, the headphones 1000 includes two transducer components 100. For example, in the case of open-back headphones, one headphone 1000 includes one transducer component 100.

[0036] The ear hook assembly 300 includes an ear hook 310 and a power supply component 330, which is disposed within the ear hook 310. The power supply component 330 can be a rechargeable battery, including but not limited to lithium-ion batteries, nickel-metal hydride batteries, and nickel-cadmium batteries. The ear hook 310 may contain an elastic conductive element, through which the power supply component 330 can be electrically connected to the transducer assembly 100 to supply power to the transducer assembly 100. The elastic conductive element can be spring steel, titanium wire, etc., and this application does not impose any limitations. When the user wears the headphones 1000, the ear hook assembly 300 is positioned at the junction of the auricle and the head, ensuring that the headphones 1000 will not slip during use. The transducer assembly 100 is located near the outer side of the ear canal but does not block the ear canal, maintaining a certain distance from it, allowing sound wave signals to enter the ear canal after being transmitted from the transducer assembly 100.

[0037] When the Headphone 1000 is an open-back headphone, it does not block the ear canal, and sound signals can flow freely inside and outside the Headphone 1000, avoiding safety hazards caused by isolating ambient sound.

[0038] Please see Figure 4 and Figure 5 The transducer assembly 100 includes a housing 10. It is understood that the housing 10 is a structure within the transducer assembly 100 used to house other components of the transducer assembly 100 (such as the first speaker 50, the second speaker 70, and the third speaker 80, as described below). The housing 10 is made of materials including, but not limited to, plastic, aluminum alloy, copper, iron, steel, and carbon fiber composite materials. For example, the housing 10 is made of plastic, which makes the transducer assembly 100 lighter, reduces its weight, and improves the wearing comfort of the headphones 1000.

[0039] In some embodiments, the housing 10 can be a single-piece structure, meaning it is manufactured using an integral molding process. This improves the structural stability of the housing 10 and ensures the normal operation of the transducer assembly 100. In other embodiments, the housing 10 can be a split structure. For example, the housing 10 may include a base 11 and a cover 13, which are two different structures connected to form a receiving cavity. The first through hole and the second through hole can both be provided on the base 11. In some embodiments, the base 11 and the cover 13 can be detachably connected, including but not limited to snap-fit ​​connections or bolt connections. In other embodiments, the base 11 and the cover 13 can be non-detachably connected, including but not limited to bonding or welding.

[0040] Since the earphone 1000 in this embodiment includes a transducer component 100, it is understood that the earphone 1000 has at least the same beneficial effects as the transducer component 100. Therefore, for the beneficial effects of the earphone 1000, please refer to the beneficial effects of the transducer component 100 described below.

[0041] Please see Figure 2 , Figure 4 and Figure 5 The transducer assembly 100 provided in this application is used in an earphone 1000. The transducer assembly 100 includes a mounting member 30, a first circuit board 40, a first speaker 50, and a second speaker 70. The mounting member 30 includes a mounting body 31. In the thickness direction Z of the transducer assembly 100, the mounting body 31 includes a first surface 301 and a second surface 303 facing away from each other. The first speaker 50 is mounted on the mounting member 30 and protrudes toward the side where the first surface 301 is located. The first circuit board 40 is mounted on the first surface 301, and the first speaker 50 and the first circuit board 40 are spaced apart. The second speaker 70 is mounted on the mounting member 30 and protrudes toward the side where the second surface 303 is located. Wherein, in a projection plane perpendicular to the thickness direction Z, the projection of the first speaker 50 and the projection of the second speaker 70 at least partially coincide, and / or, the projection of the first circuit board 40 and the projection of the second speaker 70 at least partially coincide.

[0042] Specifically, the mounting component 30 is used to mount the first circuit board 40, the first speaker 50, and the second speaker 70. The transducer assembly 100 has a length direction of X, a width direction of Y, and a thickness direction of Z. The length direction X, width direction Y, and thickness direction Z are all perpendicular to each other. In the thickness direction Z, the side facing the first surface 301 is designated Z1, and the side facing the second surface 303 is designated Z2.

[0043] The first loudspeaker 50 is an electroacoustic device in the transducer assembly 100 used to convert electrical signals into audio signals. Exemplarily, the first loudspeaker 50 can use an energized element to drive a diaphragm to generate mechanical vibration, thereby pushing the surrounding air and causing fluctuations in the air medium, thus achieving an "electro-mechanical-sound" conversion. In some embodiments of this application, the first loudspeaker 50 can be a moving-coil loudspeaker, used to output a first audio signal to the outside of the transducer assembly 100. The first loudspeaker 50 is mounted on the mounting member 30, which can be mounted on the first surface 301 or, as described below, accommodated in the first mounting hole 315. When the first loudspeaker 50 is mounted on the mounting member 30, at least a portion of the first loudspeaker 50 protrudes in the Z1 direction.

[0044] The second loudspeaker 70 is an electroacoustic device in the transducer assembly 100 used to convert electrical signals into audio signals. Exemplarily, the second loudspeaker 70 can use an energized element to drive a diaphragm to generate mechanical vibration, which in turn pushes the surrounding air, causing fluctuations in the air medium, thereby achieving an "electro-mechanical-sound" conversion. In some embodiments of this application, the second loudspeaker 70 can be a moving-coil loudspeaker, used to output a second audio signal, which can be transmitted outside the housing 10. The second loudspeaker 70 is mounted on the mounting member 30, either on the second surface 303 or, as described later, housed in the mounting cavity 353. When the second loudspeaker 70 is mounted on the mounting member 30, at least a portion of the second loudspeaker 70 protrudes in the Z2 direction. The second loudspeaker 70 includes a second speaker body 71 and a mounting portion 73, with the second speaker body 71 connected to the mounting portion 73. It should be noted that, in some embodiments, the second speaker body 71 may include a diaphragm, a voice coil, and a magnet, etc. The loading part 73 is connected to the outer periphery of the second speaker body 71 and is used to mount the second speaker body 71 onto the mounting member 30.

[0045] The first circuit board 40 is mounted on the first surface 301 of the mounting body 31. The first circuit board 40 may be entirely mounted on the first surface 301, or at least partially mounted on the first surface 301; this is not limited to this. The first circuit board 40 and the mounting body 31 can be joined together using a detachable connection method, including but not limited to snap-fit ​​connections or threaded connections. In another example, the first circuit board 40 and the mounting body 31 can be joined together using a non-detachable connection method, including but not limited to adhesive bonding or soldering.

[0046] The first circuit board 40 is electrically connected to the first speaker 50 and the second speaker 70. The first circuit board 40 can transmit electrical signals to the first speaker 50 and the second speaker 70 to drive them to produce sound, and can also receive feedback signals from the first speaker 50 and the second speaker 70. The first speaker 50 and the first circuit board 40 are spaced apart, that is, in the projection plane perpendicular to the thickness direction Z, the projections of the first speaker 50 and the first circuit board 40 do not intersect. This lack of intersection can be due to the first speaker 50 and the first circuit board 40 being spaced apart and opposite each other, or the first speaker 50 partially surrounding the first circuit board 40, or the first speaker 50 completely surrounding the first circuit board 40, or the first circuit board 40 partially surrounding the first speaker 50, or the first circuit board 40 completely surrounding the first speaker 50, etc. The projections of the first speaker 50 and the second speaker 70 at least partially overlap, which can be achieved by stacking or partially stacking the first speaker 50 and the second speaker 70 in the thickness direction Z. The first speaker 50 and the second speaker 70 can be spaced apart or in contact.

[0047] In the transducer assembly 100 of this application, the projection of the first speaker 50 and the projection of the second speaker 70 at least partially overlap, which can save space of the transducer assembly 100 in the plane perpendicular to the thickness direction Z (i.e., the XY plane). The projection of the first circuit board 40 and the projection of the second speaker 70 at least partially overlap, which can also save space of the transducer assembly 100 in the plane perpendicular to the thickness direction Z (i.e., the XY plane). This makes the transducer assembly 100 compact in layout, reduces the floor area of ​​the transducer assembly 100, and is conducive to the miniaturization of the transducer assembly 100.

[0048] Please see Figure 4 and Figure 5 In some embodiments, in a projection plane perpendicular to the thickness direction Z, the projection of the second speaker 70 includes the projection of the first speaker 50 and the projection of the first circuit board 40, the projection of the first circuit board 40 at least partially surrounding the projection of the first speaker 50.

[0049] Specifically, the projection of the second speaker 70 includes the projection of the first speaker 50 and the projection of the first circuit board 40. Therefore, in the length direction X, the overall size of the first speaker 50, the first circuit board 40, and the second speaker 70 is the size of the second speaker 70. In the width direction Y, the overall size of the first speaker 50, the first circuit board 40, and the second speaker 70 is the size of the second speaker 70. Within the XY projection plane, the overall area of ​​the first speaker 50, the first circuit board 40, and the second speaker 70 is the area of ​​the second speaker 70. This further reduces the space occupied by the first speaker 50, the first circuit board 40, and the second speaker 70 in the XY plane. On the XY projection plane, the first speaker 50 and the first circuit board 40 are located within the outer contour of the second speaker 70. The second speaker 70 can be a solid structure or a hollow structure, as long as the outer contour of the second speaker 70 within the XY projection plane surrounds the first speaker 50 and the first circuit board 40.

[0050] The projection of the first circuit board 40 at least partially surrounds the projection of the first speaker 50. On the one hand, this can shorten the electrical connection distance between the first circuit board 40 and the first speaker 50, reduce the difficulty of electrical connection between the first circuit board 40 and the first speaker 50, and on the other hand, reduce the length of the electrical connector 90 (e.g., a metal sheet) when the first circuit board 40 and the first speaker 50 need to be connected by an electrical connector 90, thus ensuring that the structure of the first circuit board 40 and the first speaker 50 is compact.

[0051] Please see Figure 2 , Figure 4 and Figure 5 In some embodiments, the mounting member 30 is provided with a mounting notch 351, and the transducer assembly 100 further includes a second circuit board 60. The second circuit board 60 is at least partially accommodated in the mounting notch 351, and the second speaker 70 is electrically connected to the first circuit board 40 through the second circuit board 60. In a projection plane perpendicular to the thickness direction Z, the projections of the first circuit board 40, the mounting notch 351, and the second circuit board 60 at least partially overlap.

[0052] Specifically, the mounting notch 351 is used to accommodate the second circuit board 60. Exemplarily, the second circuit board 60 is a flexible circuit board capable of changing its shape to adapt to the layout of the transducer assembly 100. In the longitudinal direction X, the first speaker 50 and the second circuit board 60 are located on opposite sides of the first circuit board 40. The mounting notch 351 is located on the side of the mounting member 30 closest to the second circuit board 60. The second circuit board 60 is at least partially accommodated in the mounting notch 351. This reduces the area occupied by the second circuit board 60 in the XY plane and allows the second circuit board 60 to be closer to the mounting member 30, and thus closer to the first circuit board 40 and the second speaker 70 mounted on the mounting member 30. This facilitates the electrical connection between the second circuit board 60 and the first circuit board 40 and the second speaker 70, reduces the length of the second circuit board 60, and thus reduces the cost of the transducer assembly 100. Furthermore, at least a portion of the second speaker 70 is exposed in the mounting notch 351, allowing the second circuit board 60 to be electrically connected to the second speaker 70 after extending into the mounting notch 351. Within the XY projection plane, the projections of the first circuit board 40, the mounting notch 351, and the second circuit board 60 at least partially overlap, which can reduce the space occupied by the first circuit board 40, the mounting notch 351, and the second circuit board 60 in the XY plane.

[0053] Please see Figure 3 , Figure 4 and Figure 5 In some embodiments, the transducer assembly 100 further includes a housing 10 and a third speaker 80. A mounting member 30 is connected to the inner wall of the housing 10. The mounting member 30, the first speaker 50, the second speaker 70, and the first circuit board 40 are housed within the housing 10. The third speaker 80 is mounted in a receiving cavity, and in a projection plane perpendicular to the thickness direction Z, the projections of the third speaker 80 and the second speaker 70 at least partially overlap, and / or, the projections of the third speaker 80 and the first speaker 50 at least partially overlap.

[0054] Specifically, the third speaker 80 is an electroacoustic device in the transducer assembly 100 used to convert electrical signals into audio signals. The third speaker 80 is electrically connected to the first circuit board 40 via the second circuit board 60. In some embodiments of this application, the third speaker 80 can be a moving iron speaker (or an electrodynamic speaker), and the first speaker 50 and the second speaker 70 can be moving coil speakers. The third speaker 80 is used to output a third audio signal, and the first through hole is used to allow the third audio signal to be transmitted to the outside of the housing 10. The frequencies of the first audio signal and / or the second audio signal are different from the frequency of the third audio signal. That is, the operating frequency bands of the first speaker 50 and / or the second speaker 70 are different from the operating frequency band of the third speaker 80. Furthermore, by stacking three speakers (i.e., the first speaker 50, the second speaker 70, and the third speaker 80) inside the housing 10, the three speakers can cooperate to output at least two audio signals of different frequencies when the transducer assembly 100 is working, thereby making the frequency response range of the headphones 1000 wider, improving the sound quality of the headphones 1000, and meeting the user's usage needs. It is understood that the frequencies of the first, second, and third audio signals may partially overlap or not overlap at all; the frequency of the third audio signal may be the same as or different from the frequency of the second audio signal, and this application does not impose any limitations. Furthermore, when the first speaker 50, the second speaker 70, and the third speaker 80 operate simultaneously, the transducer 100 can balance the sound quality of high-frequency signals and the sound quality of mid-to-low-frequency signals, thereby effectively improving the sound quality of the transducer 100 and meeting the user's needs. In some embodiments, the first audio signal is a high-frequency signal, and the second and third audio signals are both mid-to-low-frequency signals. For example, the frequency of the high-frequency signal can be from 4000Hz to 20000Hz, and the frequency of the mid-to-low-frequency signal can be from 200Hz to 4000Hz.

[0055] It is understandable that the sound-producing advantage of balanced armature loudspeakers lies in the high frequencies, while the sound-producing advantage of dynamic loudspeakers lies in the mid and low frequencies. Therefore, when the first loudspeaker 50 is a balanced armature loudspeaker, and the second loudspeaker 70 and the third loudspeaker 80 are both dynamic loudspeakers, the first loudspeaker 50 can output high-frequency signals without needing to consider the sound quality of other frequency bands (such as mid and low frequencies), and the second loudspeaker 70 and the third loudspeaker 80 can output mid and low-frequency signals without needing to consider the sound quality of other frequency bands (such as high frequencies). This allows the three loudspeakers to leverage their respective audio advantages, achieving better sound output and improving the sound quality of the transducer 100.

[0056] The projections of the third speaker 80 and the second speaker 70 at least partially overlap, and / or the projections of the third speaker 80 and the first speaker 50 at least partially overlap, which can reduce the space occupied by the third speaker 80 and the second speaker 70 in the XY plane. In this application, the projection of the third speaker 80 is covered by the projection of the second speaker 70, which can further reduce the space occupied by the third speaker 80 and the second speaker 70 in the XY plane.

[0057] Please see Figure 4 and Figure 5 In some embodiments, the mounting body 31 includes a first region 311 and a second region 313 that are connected to each other. The first region 311 is provided with a first mounting hole 315 that penetrates the first surface 301 and the second surface 303. The first speaker 50 is at least partially accommodated in the first mounting hole 315, and the first circuit board 40 is mounted in the second region 313.

[0058] Specifically, the first speaker 50 is located in the first zone 311, while the first circuit board 40 is mounted in the second zone 313. The first zone 311 and the second zone 313 can also be used to mount other components. The first speaker 50 and the first circuit board 40 are located in two different zones and are spaced apart, which effectively reduces electromagnetic interference between the first speaker 50 and the first circuit board 40.

[0059] The first mounting hole 315 is used to accommodate the first speaker 50. Within the XY projection plane, the cross-sectional shape of the first mounting hole 315 can be rectangular, circular, or other shapes. Exemplarily, the shape and size of the first mounting hole 315 match the outer contour of the first speaker 50, thereby ensuring a close fit between the first speaker 50 and the inner wall of the first mounting hole 315. This further enhances the fixation and support of the first mounting hole 315 for the first speaker 50, ensuring a stable installation of the first speaker 50 and preventing it from easily shifting or loosening. The first mounting hole 315 also has a positioning effect, facilitating the location of the first speaker 50's installation position. Since the first speaker 50 is housed in the first mounting hole 315, the first speaker 50 and the mounting member 30 partially overlap in the thickness direction Z. The first speaker 50 can be embedded in the first mounting hole 315, partially overlapping with the mounting member 30 in the thickness direction Z, thereby saving space in the transducer assembly 100 in the thickness direction Z.

[0060] Please see Figure 4 and Figure 5In some embodiments, the mounting member 30 further includes a first extension wall 33. The first extension wall 33 is disposed in the first region 311, extends from the first surface 301 in a direction away from the first surface 301, and surrounds to form a second mounting hole 331. The second mounting hole 331 communicates with the first mounting hole 315, and the inner dimension of the second mounting hole 331 is larger than the inner dimension of the first mounting hole 315 to form a first stepped surface 333. The first speaker 50 is supported on the first stepped surface 333, and the first extension wall 33 is used to limit the position of the first speaker 50.

[0061] Specifically, a first extension wall 33 is disposed in the first region 311 and surrounds it to form a second mounting hole 331. The second mounting hole 331 communicates with the first mounting hole 315, and the first mounting hole 315 and the second mounting hole 331 are used to mount the first speaker 50. The first extension wall 33 can limit the position of the first speaker 50, restricting the movement of the first speaker 50 in the XY plane. The first speaker 50 is supported by a first stepped surface 333. The first stepped surface 333 can support the first speaker 50 and also limit the depth of the first speaker 50 inserted into the first mounting hole 315 in the thickness direction Z. That is, the first stepped surface 333 can limit the movement distance of the first speaker 50 in the Z2 direction, avoiding damage to the first speaker 50 due to excessive pressing or contact with the second speaker 70 located below the first speaker 50.

[0062] Please see Figure 3 In some embodiments, the first extension wall 33 is provided with a positioning groove 335, which communicates with the second mounting hole 331 and forms a second step surface between the positioning groove 335 and the second mounting hole 331. The second step surface is closer to the top surface of the first extension wall 33 away from the second surface 303 than the first step surface 333. The first speaker 50 includes a first speaker body 51 and a positioning member 53 connected to the first speaker body 51. The first speaker body 51 is supported on the first step surface 333, and the positioning member 53 is supported on the second step surface and accommodated in the positioning groove 335.

[0063] Specifically, there can be one or more positioning grooves 335, which is not limited in this application. The shape and depth of the multiple positioning grooves 335 can be different, which is not limited here. For example, in this application, there is one positioning groove 335, which is located on the side wall of the second mounting hole. The positioning groove 335 communicates with the second mounting hole 331 and together with the second mounting hole 331, forms a second stepped surface. The positioning groove 335 cooperates with the positioning member 53 on the first speaker 50, which serves as a foolproof function and restricts the rotation of the first speaker 50 within the first mounting hole 315 and / or the second mounting hole 331, further securing the installation of the first speaker 50 and preventing the first speaker 50 from shifting or loosening.

[0064] Please see Figure 4 and Figure 5 In some embodiments, the mounting member 30 further includes a second extension wall 35. The second extension wall 35 extends from the second surface 303 in a direction away from the second surface 303 to form a mounting cavity 353, in which the second speaker 70 is at least partially accommodated, and the second extension wall 35 is used to limit the second speaker 70.

[0065] Specifically, the second extension wall 35 surrounds the mounting body 31 and extends in the Z2 direction to form a mounting cavity 353. The mounting cavity 353 is used to accommodate the second speaker 70. In the XY projection plane, the cross-sectional shape of the mounting cavity 353 can be rectangular, circular, or other shapes. Exemplarily, the shape and size of the mounting cavity 353 match the outer contour of the second speaker 70, thereby ensuring that the second speaker 70 and the inner wall of the mounting cavity 353 fit together, further improving the fixation and support of the mounting cavity 353 for the second speaker 70, making the second speaker 70 less prone to displacement, and avoiding displacement or loosening. The mounting cavity 353 also has a positioning effect, facilitating the installation of the second speaker 70. The second speaker 70 is housed in the mounting cavity 353, therefore, the second speaker 70 and the mounting member 30 partially overlap in the thickness direction Z. The second speaker 70 can be embedded in the mounting cavity 353 and partially overlap with the mounting member 30 in the thickness direction Z, thereby saving space in the thickness direction Z of the transducer assembly 100, which is beneficial to the thinning of the transducer assembly 100.

[0066] In the description of this specification, the references to terms such as "some embodiments," "in one example," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0067] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A transducing assembly for a headphone, comprising: The transducer assembly includes: The mounting component includes a mounting body, wherein, in the thickness direction of the transducer assembly, the mounting body includes a first surface and a second surface facing away from each other. A first loudspeaker is mounted on the mounting member and protrudes toward the side where the first surface is located; A first circuit board is mounted on the first surface, and the first speaker is spaced apart from the first circuit board; and A second speaker is mounted on the mounting member and protrudes toward the side where the second surface is located, wherein, in a projection plane perpendicular to the thickness direction, the projection of the first speaker and the projection of the second speaker at least partially overlap, and / or, the projection of the first circuit board and the projection of the second speaker at least partially overlap.

2. The transduction assembly of claim 1, wherein, In a projection plane perpendicular to the thickness direction, the projection of the second speaker includes the projection of the first speaker and the projection of the first circuit board, the projection of the first circuit board at least partially surrounding the projection of the first speaker.

3. The transduction assembly of claim 1, wherein, The mounting component has an installation notch, and the transducer assembly further includes: A second circuit board, at least partially housed within the mounting notch, and a second speaker electrically connected to the first circuit board via the second circuit board, wherein the projections of the first circuit board, the mounting notch, and the second circuit board at least partially overlap in a projection plane perpendicular to the thickness direction.

4. The transduction assembly of claim 1, wherein, The transducer assembly further includes: A housing, wherein the mounting member is connected to the inner wall of the housing, and the mounting member, the first speaker, the second speaker, and the first circuit board are housed within the housing; and A third speaker is mounted in the accommodating cavity, and in a projection plane perpendicular to the thickness direction, the projection of the third speaker at least partially overlaps with that of the second speaker, and / or the projection of the third speaker at least partially overlaps with that of the first speaker.

5. The transduction assembly of claim 1, wherein, The mounting body includes a first area and a second area that are connected to each other. The first area is provided with a first mounting hole that penetrates the first surface and the second surface. The first speaker is at least partially accommodated in the first mounting hole, and the first circuit board is mounted in the second area.

6. The transduction assembly of claim 5, wherein, The mounting component also includes: A first extension wall is disposed in the first area. The first extension wall extends from the first surface in a direction away from the first surface and surrounds it to form a second mounting hole. The second mounting hole communicates with the first mounting hole. The inner dimension of the second mounting hole is larger than the inner dimension of the first mounting hole to form a first stepped surface. The first speaker is supported on the first stepped surface. The first extension wall is used to limit the position of the first speaker.

7. The transduction assembly of claim 6, wherein, The first extension wall is provided with a positioning groove, which communicates with the second mounting hole and forms a second step surface between the positioning groove and the second mounting hole. The second step surface is closer to the top surface of the first extension wall away from the second surface than the first step surface. The first speaker includes a speaker body and a positioning member connected to the speaker body. The speaker body is supported on the first step surface, and the positioning member is supported on the second step surface and accommodated in the positioning groove.

8. The transduction assembly of claim 1, wherein, The mounting component also includes: A second extension wall extends from the second surface in a direction away from the second surface to form a mounting cavity, in which the second speaker is at least partially housed, and the second extension wall is used to limit the position of the second speaker.

9. An earphone, characterized by include: The transducer assembly according to any one of claims 1-8.

10. An earphone system, characterized by include: The headphones as described in claim 9; and A charging device for charging the earphones.

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