A high-temperature combined heating plate

Abstract

This utility model discloses a high-temperature combined heating plate, including a heating element for heating, a high thermal conductivity element disposed on the upper part of the heating element, and a heat insulation element disposed on the lower part of the heating element; the high thermal conductivity element includes a copper thermally conductive layer and a high thermal conductivity insulating layer disposed between the heating element and the copper thermally conductive layer; the heat insulation element includes a base plate and a bottom pad disposed between the heating element and the base plate. This heating plate has the advantages of uniform plate surface temperature, fast heat transfer speed, and high heating temperature, which can greatly improve heating efficiency.

Description

Technical Field

[0001] This utility model relates to the field of home appliance technology, specifically to a high-temperature combined heating plate. Background Technology

[0002] An electric hot pot is a kitchen appliance that uses electricity to cook food. It has a long lifespan and is fully functional. The heating plate is an indispensable part of the electric hot pot, mainly heating the cookware through contact with it. Current heating plates typically use a modular design, which suffers from slow heat transfer and low heating efficiency. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned problems and provide a high-temperature combined heating plate. This heating plate has the advantages of uniform plate surface temperature, fast heat transfer speed and high heating temperature, which can greatly improve heating efficiency.

[0004] The objective of this utility model is achieved through the following technical solution:

[0005] A high-temperature combined heating plate includes a heating element for generating heat, a high thermal conductivity element disposed on the upper part of the heating element, and a heat insulation element disposed on the lower part of the heating element; the high thermal conductivity element includes a copper thermal conductivity layer and a high thermal conductivity insulating layer disposed between the heating element and the copper thermal conductivity layer; the heat insulation element includes a base plate and a bottom pad disposed between the heating element and the base plate.

[0006] The working principle of the above-mentioned high-temperature combined heating plate is as follows:

[0007] The copper heat-conducting layer is made of copper, and the high thermal conductivity insulation layer can maintain high thermal conductivity while also providing insulation, enabling the upper part of the heating element to achieve insulation and high thermal conductivity. The lower part of the heating element achieves insulation and heat insulation through the double structure of the bottom pad and the base plate. When working, the heating element generates heat, and the heat generated is conducted to the high thermal conductivity insulation layer. The high thermal conductivity insulation layer can quickly conduct heat to the copper heat-conducting layer, achieving ultra-high temperature cooking. The copper heat-conducting layer can raise the temperature to over 600℃, enabling rapid heating of cookware, especially non-metallic cookware.

[0008] In a preferred embodiment of this invention, the surface of the copper thermally conductive layer is coated with a high-emissivity coating. The copper thermally conductive layer can withstand high temperatures and has good thermal conductivity, solving the problem of heating at temperatures exceeding 600°C. The high-emissivity coating further enhances heat transfer performance.

[0009] Preferably, the high thermal conductivity insulating layer is an iron plate enamel layer, which includes an iron plate and an enamel layer disposed on the iron plate. In the above structure, the iron plate has a high thermal conductivity, which can improve the heat conduction effect, and the enamel layer has a good insulating effect. The above structure solves the insulation performance requirements while maintaining high thermal conductivity.

[0010] Preferably, the high thermal conductivity insulating layer is a micro-arc oxidation titanium plate, which includes a titanium alloy plate and a micro-arc oxidation layer disposed on the titanium alloy plate. In the above structure, a titanium alloy plate is used, and a micro-arc oxidation is performed on its surface to form a micro-arc oxidation layer. The titanium alloy plate has fast thermal conductivity, and the micro-arc oxidation layer can play a good insulating role. The above structure solves the insulation performance requirements while maintaining high thermal conductivity.

[0011] Preferably, the high thermal conductivity insulating layer is an alumina ceramic plate. In the above structure, the alumina ceramic plate has fast thermal conductivity and can also provide insulation. The above structure solves the insulation performance requirements while maintaining high thermal conductivity.

[0012] Preferably, the heating component includes a thermally conductive insulator and a heating wire disposed on the thermally conductive insulator, wherein the thermally conductive insulator has a plate-like structure. With this structure, the thermally conductive insulator can serve to mount the heating wire, which generates heat. When energized, the heating wire produces high temperatures, which are then conducted to the high thermal conductivity insulating layer. The high thermal conductivity insulating layer can then rapidly conduct the temperature to the copper thermally conductive layer.

[0013] Preferably, there are two thermally conductive insulators, which are arranged symmetrically; the heating wire is wound sequentially around the two thermally conductive insulators. Using two thermally conductive insulators increases the winding distance of the heating wire, thereby improving the heating effect.

[0014] Preferably, the thermally conductive insulator has multiple open slots on both sides, and the heating wire is sequentially wound around the open slots on both sides of the thermally conductive insulator. In the above structure, the heating wire is wound in a spiral-like manner, and the heating wire is in close contact with the thermally conductive insulator. The open slots can position the heating wire, ensuring stable winding. Moreover, arranging the heating wire in this manner can improve the uniformity of heating, thereby improving the overall temperature uniformity of the high-temperature combined heating plate, so that the temperature difference on the surface of the high-temperature combined heating plate is within 10°C.

[0015] Preferably, the thermally conductive insulator is a synthetic mica board.

[0016] Preferably, the structure of the thermally conductive insulator is the same as that of the high thermal conductivity insulating layer. This ensures the insulation effect between the upper and lower layers after the heating wire is wound, while also maintaining high thermal conductivity and improving heat transfer efficiency.

[0017] Preferably, the heating element is a single-layer heating element located between a high thermal conductivity insulating layer and a bottom pad.

[0018] Preferably, the base plate is a frame structure, having multiple radially extending ribs and multiple circumferentially extending ribs; the radially extending ribs are distributed along the circumferential direction, and the circumferentially extending ribs are distributed along the radial direction. In the above structure, the frame structure formed by the radial and circumferential ribs can improve the strength of the base plate, thereby maintaining the overall rigidity of the heating plate.

[0019] Preferably, the base plate adopts a one-piece molded structure. By directly molding the raw materials of the base plate to form a one-piece structure, the number of parts can be reduced and the structure simplified. Furthermore, the base plate is provided with a grounding structure, which is integrally molded with the base plate, further reducing the number of parts, simplifying the structure, and lowering costs.

[0020] Preferably, the bottom pad is an insulating and heat-resistant pad. The bottom pad is made of an insulating and heat-resistant material, such as mica. That is, the insulating and heat-resistant pad is a mica board, which can block heat from being transferred to the bottom of the heating plate (i.e., the base plate) and maintain the rigidity of the base plate material from being affected by high temperature.

[0021] Preferably, the surface of the base plate is coated with a layer of heat-insulating paint to achieve the heat insulation effect of the base plate.

[0022] Preferably, the outer edge of the base plate has a downwardly extending outer extension, and the inner edge of the base plate has a downwardly extending inner extension; the lower end of the outer sidewall of the copper heat-conducting layer has an inwardly and upwardly bent outer bend, and the lower end of the inner sidewall of the copper heat-conducting layer has an outwardly and upwardly bent inner bend; the outer extension extends into the outer bend, and the inner extension extends into the inner bend. In the above structure, both the outer bend and the inner bend are riveted structures. The extension is covered and fastened by the bend, achieving a riveting effect, which can improve the stability of the connection between the base plate and the copper heat-conducting layer.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] 1. The high-temperature combined heating plate of this utility model has a high thermal conductivity insulation layer that can maintain high thermal conductivity while also providing insulation. The heat generated by the heating element can be quickly conducted to the copper thermal conductive layer through the high thermal conductivity insulation layer. The copper thermal conductive layer is made of copper material, which can raise the temperature to over 600℃, giving the heating plate the advantages of fast heat transfer and high heating temperature, which can greatly improve heating efficiency.

[0025] 2. The high-temperature combined heating plate of this utility model achieves upper insulation and high thermal conductivity of the heating component by setting a high thermal conductivity insulation layer and a copper thermal conductivity layer; and achieves lower insulation and heat insulation of the heating component by setting a bottom pad and a bottom plate. This forms an upward high-efficiency heat transfer heating system with heating efficiency exceeding that of existing heating technologies, such as heating tube electric heating plates, IH heating technology, and electric ceramic stove heating.

[0026] 3. In the high-temperature combined heating plate of this utility model, the heating wire is wound in a spiral manner, the heating wire is attached to the thermally conductive insulator, and the open groove can play a positioning role for the heating wire, ensuring the stable winding of the heating wire. Moreover, the arrangement of the heating wire in the above manner can improve the heating uniformity, thereby improving the overall temperature uniformity of the high-temperature combined heating plate. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of a high-temperature combined heating plate according to the present invention.

[0028] Figure 2 This is a three-dimensional structural diagram of a high-temperature combined heating plate of this utility model from another perspective.

[0029] Figure 3 This is a cross-sectional view of a high-temperature combined heating plate according to the present invention.

[0030] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0031] Figure 5 This is an exploded view of a high-temperature combined heating plate according to the present invention.

[0032] Figure 6 This is a three-dimensional structural diagram of the heating component in this utility model.

[0033] Figure 7 This is a three-dimensional structural diagram of the thermally conductive insulator in this utility model.

[0034] Figure 8 This is a three-dimensional structural diagram of the base plate in this utility model.

[0035] Figure 9 This is a partial cross-sectional view of the base plate and copper heat-conducting layer in this utility model. Detailed Implementation

[0036] To enable those skilled in the art to fully understand the technical solution of this utility model, the present utility model will be further described below in conjunction with the embodiments and accompanying drawings, but the implementation of this utility model is not limited thereto.

[0037] Example 1

[0038] See Figures 1-9 This embodiment discloses a high-temperature combined heating plate, including a heating element 3 for heating, a high thermal conductivity component disposed on the upper part of the heating element 3, and a heat insulation component disposed on the lower part of the heating element 3. The high thermal conductivity component includes a copper thermal conductivity layer 5 and a high thermal conductivity insulating layer 4 disposed between the heating element 3 and the copper thermal conductivity layer 5. The heat insulation component includes a base plate 1 and a bottom pad 2 disposed between the heating element 3 and the base plate 1. The base plate 1, bottom pad 2, heating element 3, high thermal conductivity insulating layer 4, and copper thermal conductivity layer 5 are arranged sequentially from bottom to top. The copper thermal conductivity layer 5 is made of copper, which can increase the temperature of the heating plate to over 600 degrees Celsius. After the base plate 1 is connected to the copper thermal conductivity layer 5, a cavity 6 is formed in the middle. The bottom pad 2, heating element 3, and high thermal conductivity insulating layer 4 are located in the cavity 6. The high-temperature combined heating plate is an annular heating plate with a central through hole.

[0039] See Figures 1-5 The surface of the copper thermally conductive layer 5 is coated with a high-emissivity coating. The copper thermally conductive layer can withstand high temperatures and has good thermal conductivity, solving the problem of heating at temperatures exceeding 600℃. The high-emissivity coating can improve heat transfer performance. The high-emissivity coating material can be one of the following: alumina (Al2O3)-based ceramics, silicon dioxide (SiO2)-based ceramics, silicon carbide (SiC), silicon nitride (Si3N4)-based ceramics, alumina / silicon dioxide nanocomposite coatings, reduced graphene oxide (rGO) composite coatings, zirconium oxide (ZrO2)-based ceramics, or nano-alumina coatings.

[0040] See Figures 1-5 The high thermal conductivity insulating layer 4 is bonded to the copper thermal conductivity layer 5. The high thermal conductivity insulating layer 4 is an iron plate enamel layer, which includes an iron plate and an enamel layer disposed on the iron plate. In the above structure, an enamel material is coated on the iron plate to form an enamel layer. The iron plate has a high thermal conductivity, which can improve the heat conduction effect. The enamel layer has a good insulation effect. The existing high thermal conductivity insulating layer 4 uses mica board, which has good insulation performance but poor thermal conductivity. The structure of this embodiment solves the insulation performance requirements while maintaining high thermal conductivity.

[0041] See Figures 1-7 The heating component 3 includes a thermally conductive insulator 3-1 and a heating wire 3-2 disposed on the thermally conductive insulator 3-1. The thermally conductive insulator 3-1 has a plate-like structure. With the above structure, the thermally conductive insulator 3-1 can serve to mount the heating wire 3-2. The heating wire 3-2 is used for heating. When energized, the heating wire 3-2 generates high temperature, which is conducted to the high thermal conductivity insulation layer 4. The high thermal conductivity insulation layer 4 can quickly conduct the temperature to the copper thermally conductive layer 5.

[0042] See Figures 1-7The thermally conductive insulator 3-1 is provided in pairs and is arranged symmetrically. The heating wire 3-2 is wound sequentially around the two thermally conductive insulators 3-1. Using two thermally conductive insulators 3-1 increases the winding distance of the heating wire 3-2, thereby improving the heating effect. One heating wire 3-2 is first wound around one thermally conductive insulator 3-1, and then around the other thermally conductive insulator 3-1.

[0043] See Figures 1-7 The thermally conductive insulator 3-1 has multiple open slots 3-11 on both sides, and the heating wire 3-2 is wound sequentially around the open slots 3-11 on both sides of the thermally conductive insulator 3-1. In the above structure, the heating wire 3-2 is wound in a spiral-like manner, and the heating wire 3-2 is in close contact with the thermally conductive insulator 3-1. The open slots 3-11 can position the heating wire 3-2, ensuring that the heating wire 3-2 is wound stably. Moreover, arranging the heating wire 3-2 in the above manner can improve the heating uniformity, thereby improving the overall temperature uniformity of the high-temperature combined heating plate, so that the temperature difference on the surface of the high-temperature combined heating plate is within 10℃.

[0044] See Figures 1-7 Each thermally conductive insulator 3-1 is provided with a terminal 3-3, and the two ends of the heating wire 3-2 are respectively installed on two terminals 3-3. The base plate 1 is provided with multiple support columns 7, which serve to support and install the heating plate.

[0045] See Figures 1-7 The structure (composition) of the thermally conductive insulator 3-1 is the same as that of the high thermal conductivity insulation layer 4, but the shape is different. That is, the thermally conductive insulator 3-1 also includes an iron plate and an enamel layer disposed on the iron plate; it can ensure the insulation effect between the upper and lower layers after the heating wire 3-2 is wound, while ensuring high thermal conductivity and improving heat transfer efficiency.

[0046] See Figures 1-9 The base plate 1 is a frame structure, and has multiple radially extending radial stiffeners 1-1 and multiple circumferentially extending circumferential stiffeners 1-2. The radial stiffeners 1-1 are distributed along the circumferential direction, and the circumferential stiffeners 1-2 are distributed along the radial direction. In the above structure, the frame structure formed by the radial stiffeners 1-1 and the circumferential stiffeners 1-2 can improve the strength of the base plate 1, thereby maintaining the overall rigidity of the heating plate.

[0047] See Figures 1-9The base plate 1 adopts a one-piece molding structure. By directly molding the raw material of the base plate 1 to form a one-piece structure, the number of parts can be reduced and the structure can be simplified. Furthermore, the base plate 1 is provided with a grounding structure, which is integrally molded with the base plate 1, further reducing the number of parts, simplifying the structure, and lowering costs.

[0048] See Figures 1-9 The bottom pad 2 is an insulating and heat-resistant pad. The bottom pad 2 is made of insulating and heat-resistant materials, such as mica. That is, the insulating and heat-resistant pad is a mica board, which can block the heat from being transferred to the bottom of the heating plate (i.e., the bottom plate 1) and maintain the rigidity of the bottom plate 1 material from being affected by high temperature. The insulating and heat-resistant pad can be a structure formed by combining mica sheets and high heat-insulating materials. The high heat-insulating material can be one of ceramic fiber, aluminosilicate fiber, zirconia fiber, graphite material, alumina fiber paper, nano aerogel felt, or porous vacuum silicon wafer.

[0049] See Figures 1-9 The surface of the base plate 1 is coated with a layer of heat-insulating paint to achieve a heat-insulating effect. The heat-insulating paint layer is made of hollow alumina spheres and has good heat-insulating properties.

[0050] See Figures 1-9 Both the base plate 1 and the copper heat-conducting layer 5 are annular. The outer edge of the base plate 1 has a downwardly extending outer extension 1-3, and the inner edge of the base plate 1 has a downwardly extending inner extension 1-4. The lower end of the outer sidewall of the copper heat-conducting layer 5 has an inwardly and upwardly bent outer bending portion 5-1, and the lower end of the inner sidewall of the copper heat-conducting layer 5 has an outwardly and upwardly bent inner bending portion 5-2. The outer extension 1-3 extends into the outer bending portion 5-1, and the inner extension 1-4 extends into the inner bending portion 5-2. In the above structure, both the outer bending portion 5-1 and the inner bending portion 5-2 are riveted structures. The extension portions are covered and fastened by the bending portions to achieve a riveting effect, which can improve the stability of the connection between the base plate 1 and the copper heat-conducting layer 5.

[0051] See Figures 1-9 The base plate 1 has radial protrusions that form radial reinforcing ribs 1-1; the base plate 1 also has circumferential protrusions that form circumferential reinforcing ribs 1-2. The radial reinforcing ribs 1-1 extend radially, and multiple radial reinforcing ribs 1-1 are distributed circumferentially, forming a radial skeleton. There are at least three radial reinforcing ribs 1-1 to ensure radial rigidity. The number of circumferential reinforcing ribs 1-2 is at least one, and together with the flange structure formed by the outer extension 1-3 and the inner extension 1-4, the circumferential rigidity is addressed, making the base plate 1 structure very stable.

[0052] See Figures 1-9 The working principle of the above-mentioned high-temperature combined heating plate is as follows:

[0053] The copper heat-conducting layer 5 is made of copper, and the high thermal conductivity insulation layer 4 can maintain high thermal conductivity while also providing insulation, so that the upper part of the heating element 3 achieves insulation and high thermal conductivity. The lower part of the heating element 3 achieves insulation and heat insulation through the double structure of the bottom pad 2 and the bottom plate 1. When working, the heating element 3 generates heat, and the heat generated is conducted to the high thermal conductivity insulation layer 4. The high thermal conductivity insulation layer 4 can quickly conduct heat to the copper heat-conducting layer 5 to achieve ultra-high temperature cooking. The copper heat-conducting layer 5 can raise the temperature to over 600℃, enabling rapid heating of cookware, especially non-metallic cookware.

[0054] Example 2

[0055] See Figures 1-5 In this embodiment, the other structures are the same as in Embodiment 1, except that the high thermal conductivity insulating layer 4 is a micro-arc oxidation titanium plate. The micro-arc oxidation titanium plate includes a titanium alloy plate and a micro-arc oxidation layer disposed on the titanium alloy plate. In the above structure, a titanium alloy plate is used, and a micro-arc oxidation is performed on its surface to form a micro-arc oxidation layer. The titanium alloy plate has fast thermal conductivity, and the micro-arc oxidation layer can play a good insulating role. The above structure solves the insulation performance requirements while maintaining high thermal conductivity.

[0056] The structure (composition) of the thermally conductive insulator 3-1 is the same as that of the high thermal conductivity insulating layer 4, but their shapes are different.

[0057] Example 3

[0058] See Figures 1-5 In this embodiment, the other structures are the same as in Embodiment 1, except that the high thermal conductivity insulating layer 4 is an alumina ceramic plate. In the above structure, the alumina ceramic plate has fast thermal conductivity and also provides insulation, thus addressing the insulation performance requirements while maintaining high thermal conductivity.

[0059] The structure (composition) of the thermally conductive insulator 3-1 is the same as that of the high thermal conductivity insulating layer 4, but their shapes are different.

[0060] Example 4

[0061] See Figures 1-5 In this embodiment, the other structures are the same as in Embodiment 1, except that the high thermal conductivity insulating layer 4 is a synthetic mica board. The structure (composition) of the thermally conductive insulator 3-1 is the same as that of the high thermal conductivity insulating layer 4, but the shape is different.

[0062] Example 5

[0063] See Figures 1-5The other structures in this embodiment are the same as in embodiment 1, except that the material of the high thermal conductivity insulating layer 4 can be one of ceramic-based flexible composite materials, alumina (Al2O3) / polymer composite materials, silicon nitride (Si3N4) / fiber composite materials, carbon nanotube / polymer composite materials, and graphene composite materials.

[0064] Example 6

[0065] The other structures in this embodiment are the same as in Embodiment 1, except that the heating component 3 is a single-layer heating element located between the high thermal conductivity insulation layer and the bottom pad. The heating element is a plate-shaped heating element, which is a heating element cut into a specific shape from a resistive heating sheet. The purpose is to achieve uniform heating.

[0066] The above are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above content. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A high-temperature combined heating plate, characterized in that, It includes a heating element for generating heat, a high thermal conductivity element disposed on the upper part of the heating element, and a heat insulation element disposed on the lower part of the heating element; the high thermal conductivity element includes a copper thermal conductivity layer and a high thermal conductivity insulating layer disposed between the heating element and the copper thermal conductivity layer; the heat insulation element includes a base plate and a bottom pad disposed between the heating element and the base plate.

2. The high-temperature combined heating plate according to claim 1, characterized in that, The surface of the copper thermal conductive layer is coated with a high emissivity coating.

3. The high-temperature combined heating plate according to claim 1, characterized in that, The high thermal conductivity insulating layer is one of an iron plate enamel layer, a micro-arc titanium oxide plate, and an alumina ceramic plate. The iron plate enamel layer includes an iron plate and an enamel layer disposed on the iron plate. The micro-arc titanium oxide plate includes a titanium alloy plate and a micro-arc oxidation layer disposed on the titanium alloy plate.

4. A high-temperature combined heating plate according to any one of claims 1-3, characterized in that, The heating component includes a thermally conductive insulator and a heating wire disposed on the thermally conductive insulator; there are two thermally conductive insulators, which are arranged symmetrically; the heating wire is wound around the two thermally conductive insulators in sequence; multiple opening slots are provided on both sides of the thermally conductive insulator, and the heating wire is wound around the opening slots on both sides of the thermally conductive insulator in sequence.

5. A high-temperature combined heating plate according to claim 4, characterized in that, The thermally conductive insulator is a synthetic mica board.

6. A high-temperature combined heating plate according to claim 4, characterized in that, The structure of the thermally conductive insulator is the same as that of the high thermal conductivity insulation layer.

7. A high-temperature combined heating plate according to any one of claims 1-3, characterized in that, The heating element is a single-layer heating element located between a high thermal conductivity insulation layer and a bottom pad.

8. A high-temperature combined heating plate according to claim 1, characterized in that, The base plate is a frame structure, and the base plate has a plurality of radial reinforcing ribs extending in the radial direction and a plurality of circumferential reinforcing ribs extending in the circumferential direction; the plurality of radial reinforcing ribs are distributed in the circumferential direction, and the plurality of circumferential reinforcing ribs are distributed in the radial direction.

9. A high-temperature combined heating plate according to claim 1, characterized in that, The bottom pad is an insulating and heat-resistant pad, and the surface of the bottom plate is coated with a layer of heat-insulating coating.

10. A high-temperature combined heating plate according to claim 1 or 8, characterized in that, The outer edge of the base plate has a downwardly extending outer extension, and the inner edge of the base plate has a downwardly extending inner extension; the lower end of the outer sidewall of the copper heat-conducting layer has an inwardly and upwardly bent outer bend, and the lower end of the inner sidewall of the copper heat-conducting layer has an outwardly and upwardly bent inner bend; the outer extension extends into the outer bend, and the inner extension extends into the inner bend.

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