A heating structure that can induce surface charges

Abstract

This utility model relates to a heating structure, specifically a heating structure capable of discharging surface charge. It includes a substrate, a conductive heating layer attached to a heating surface e of the substrate, and a heating region a formed by the attachment of the conductive heating layer. A conductive protective layer is provided between the outer contour edge of the heating region a and the outer contour edge of the heating surface e. The conductive protective layer is electrically connected to an external electrical control device to form a power circuit. The conductive protective layer includes a conductive extension structure, and the conductive heating layer has a clearance region b into which the conductive extension structure extends. This utility model provides a conductive protective layer on the surface of the substrate. When the substrate is heated, causing surface charge to accumulate, the surface charge can be discharged to the external electrical control device through the conductive extension structure of the conductive protective layer. Surface charge appearing around the heating region can be more easily conducted away through the conductive extension structure, reducing the safety hazards caused by surface charge during the heating process and improving the safety of the electric heating product.

Description

Technical Field

[0001] This utility model relates to a heating structure, specifically a heating structure capable of discharging surface charge. Background Technology

[0002] In daily life, electric stoves, tea stoves, heat-insulating mats, grill pans, health pots, formula makers, rice cookers, electric cooking pots, electric stew pots, electric medicine pots, electric kettles, etc. are all common electric heating appliances with various functions and uses. Electric heating devices are usually used when heating. There are also many electric heating devices on the market. Common electric heating devices generally have a heating source for heating (such as a kettle heating base) and a heated object for heating (such as a kettle containing water). They are also very convenient for instant heating.

[0003] However, in actual use, the heating source usually comes into direct contact with the object being heated to conduct heat and achieve the heating effect. Some existing electric heating appliances use microcrystalline glass as the base structure and place the heating source on the microcrystalline glass. When the microcrystalline glass is heated to a certain temperature, static electricity and other charges may be generated and accumulated on its surface. Under such circumstances, continued use of the product may pose certain electric heating safety hazards. Utility Model Content

[0004] Regarding the aforementioned issue that existing electric heating appliances using microcrystalline glass may have surface charges on their surfaces during heating, potentially posing a safety hazard, the technical solution adopted by this utility model to solve this problem is: A heating structure capable of discharging surface charge includes a substrate for supporting a heated object. A conductive heating layer is attached to the heating surface e of the substrate. The attachment position of the conductive heating layer forms a heating region a. A conductive protective layer is provided between the outer contour edge of the heating region a and the outer contour edge of the heating surface e. The conductive protective layer is electrically connected to an external electrical control device for triggering power-off protection to form a power-on circuit. The conductive protective layer includes a conductive extension structure for discharging surface charge, and the conductive heating layer has an open area b into which the conductive extension structure extends.

[0005] As described above, in a heating structure capable of exporting surface charge, the conductive protective layer and the conductive heating layer are separated by a gap, and the conductive extension structure extends from the conductive protective layer toward the interior of the vacant region b.

[0006] As described above, a heating structure capable of exporting surface charge has an empty region b having a region port c and a region end d. The region port c communicates with the region end d. The region port c is located at the outer contour edge of the heating region a. The region end d is located on the side of the empty region b away from the region port c. The conductive extension structure passes through the region port c and extends to a position close to the region end d.

[0007] As described above, a heating structure capable of exporting surface charge includes a conductive heating layer for electrically heated conditions. The heating layer includes a first electrode and a second electrode that are independently disposed. The region port c is located at one of the first electrode and the second electrode, and the region end d is located at the other of the first electrode and the second electrode. Alternatively, the clearing area b may be located between the first electrode and the second electrode.

[0008] As described above, in a heating structure capable of exporting surface charge, the conductive protective layer has a first endpoint and a second endpoint that are independently disposed thereon, and the conductive layer of the conductive protective layer surrounds the conductive heating layer and is connected to the first endpoint and the second endpoint respectively.

[0009] As described above, in a heating structure capable of exporting surface charge, the first endpoint is located between the second endpoint and the conductive heating layer, the conductive layer extends from the first endpoint and passes through the region between the second endpoint and the conductive heating layer, and surrounds the periphery of the conductive heating layer to the second endpoint.

[0010] The heating structure for exporting surface charge as described above further includes a temperature control probe for temperature control. The heating surface e is provided with a heat-conducting element for contacting the conductive heating layer to conduct heat. The probe end of the temperature control probe contacts the surface of the heat-conducting element.

[0011] As described above, in a heating structure capable of discharging surface charge, a heat insulation element for preventing heat loss is mounted on the outside of the heat-conducting element, and the heat insulation element has a mounting cavity for accommodating the heat-conducting element. The heat insulation component has a detection hole for the temperature control detection component to pass through. The temperature control detection component can be one of an NTC temperature sensor, a thermocouple sensor, a PTD temperature sensor, an infrared temperature sensor, or a semiconductor temperature sensor. An insulating component or an insulating coating is also provided between the heat-conducting component and the conductive heating layer.

[0012] As described above, in a heating structure capable of exporting surface charge, the energizing circuit is connected in series with at least one passive electronic component connected to the conductive protective layer.

[0013] In the heating structure described above that can export surface charge, the passive electronic component has a grounded connection terminal.

[0014] As described above, in a heating structure capable of exporting surface charge, the substrate is a microcrystalline glass material, and / or the heating layer of the conductive heating layer is formed by one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene material, carbon paste material, rare earth resistive material, or electronic resistive paste, to form a planar heating layer structure.

[0015] The beneficial effects of this utility model are as follows: This invention features a conductive protective layer on the surface of a substrate. When the substrate is heated, resulting in surface charges, these charges can be discharged to an external electrical control device via the conductive extension structure of the conductive protective layer. The conductive extension structure extends into the vacant area of ​​the conductive heating layer, further reducing the distance between the heating area and the heating area. Surface charges appearing around the heating area can be more easily conducted away via the conductive extension structure, reducing the safety hazards caused by surface charges during the heating process and improving the safety of the electric heating product. Attached Figure Description

[0016] Figure 1 A three-dimensional analysis of a heating structure capable of discharging surface charge according to this utility model. Figure 1 .

[0017] Figure 2 A three-dimensional analysis of a heating structure capable of discharging surface charge according to this utility model. Figure 2 .

[0018] Figure 3 A three-dimensional analysis of a heating structure capable of discharging surface charge according to this utility model. Figure 3 .

[0019] Figure 4 A front view of the heating surface e of this utility model. Figure 1 .

[0020] Figure 5 A front view of the heating surface e of this utility model. Figure 2 .

[0021] Figure 6 A front view of the heating surface e of this utility model. Figure 3 .

[0022] Figure 7 This is a schematic diagram of the power-on circuit of this utility model. Detailed Implementation

[0023] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings. The described embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0025] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0026] Example 1 Figure 4 This embodiment provides a heating structure capable of discharging surface charge, including a substrate 1 for supporting a heated object. A conductive heating layer 2 is attached to the heating surface e of the substrate 1. The attachment position of the conductive heating layer 2 forms a heating region a. A conductive protective layer 3 is provided between the outer contour edge of the heating region a and the outer contour edge of the heating surface e. The conductive protective layer 3 is electrically connected to an external electrical control device h for triggering power-off protection to form an electrical circuit. The conductive protective layer 3 includes a conductive extension structure 31 for discharging surface charge. The conductive heating layer 2 has an open area b into which the conductive extension structure 31 extends.

[0027] Specifically, in this embodiment, the substrate 1 is used to support and contact the heated object in the heating structure. The substrate 1 can be made of a hard and brittle material, preferably microcrystalline glass, which has good structural stability and is not easily deformed or bent, allowing the user to stably place the heated object for subsequent heating. The substrate 1 is independently provided with a heating surface e for attaching the conductive heating layer 2 and a supporting surface f for contacting the heated object. The supporting surface f is located on one side plane of the substrate near the top. The heating material of the conductive heating layer 2 uses nano-semiconductor metal oxide as the conductive heating material. The nano-semiconductor metal oxide can be tin, antimony, nickel, or ammonium. The nanoparticles are made of one or more of the following materials: zinc, titanium, indium, etc. During fabrication, the nano-semiconductor metal oxides can be attached to the surface of the substrate 1 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The thickness of the conductive heating layer is less than 1 mm. The conductive heating layer 2 is located on the heating surface e near the bottom of the substrate. The conductive heating layer 2 is connected to an external power source to form the first power-conducting circuit, also known as the heating circuit j. After power is applied, the conductive heating layer 2 on the heating surface e can generate heat and conduct the heat through the substrate to the supporting surface f, thereby raising the temperature of the heated object. Specifically, in this embodiment, the conductive material of the conductive protective layer 3 can be attached to the surface of the substrate by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, etc. The area where the conductive material is attached is the conductive area. On this basis, the heating area e and the conductive area are not connected or overlapped, and they are independent of each other. The conductive area surrounds the outer space of the heating area. The conductive protective layer 3 and the conductive heating layer 2 are spaced apart, that is, they are not connected or in contact with each other, so as to avoid mutual influence after the conductive protective layer 3 and the conductive heating layer 2 come into contact. The conductive protective layer 3 is electrically connected to the external electrical control device h used to trigger power-off protection to form a second power-on circuit, also known as the protection circuit k. The electrical control device h controls the on and off of the heating circuit j. When the substrate 1 is damaged, the conductive protective layer 3 is disconnected, which causes the protection circuit k to be disconnected, thereby triggering the external electrical control device h to disconnect the heating circuit j, so that the conductive heating layer 2 stops heating.

[0028] To better address the potential safety hazard caused by surface charges on the substrate 1 during heating, the conductive protective layer 3 includes a conductive extension structure 31 for discharging surface charges. The conductive extension structure 31 extends from the conductive protective layer 3 toward the interior of the conductive heating layer 2. The interior of the conductive heating layer 2 has a recessed area b into which the conductive extension structure 31 extends. After the conductive extension structure 31 extends into the recessed area b, it forms a wire-like structure similar to a lead wire, leading out from the recessed area b to the conductive protective layer 3. When the substrate 1 is heated, resulting in surface charges, the surface charges can be discharged to the external electrical control device h through the conductive extension structure 31 of the conductive protective layer 3. Surface charges appearing around the heating area e can be more easily conducted away through the conductive extension structure 31, reducing the safety hazard caused by charges during the heating process and improving the safety of the electric heating product.

[0029] Furthermore, in some embodiments, the conductive protective layer 3 and the conductive heating layer 2 are separated by a gap to avoid the heating circuit j and the protective circuit k being misconnected and affecting each other's functions. The conductive extension structure 31 extends from the conductive protective layer 3 toward the interior of the vacant area b, forming a wire-like structure similar to a lead wire leading out from the vacant area b to the conductive protective layer 3. When the substrate 1 is heated and a surface charge appears, the surface charge can be discharged to the external electrical control device h through the conductive extension structure 31 of the conductive protective layer 3. The charge appearing around the heating area e can be more easily conducted away through the conductive extension structure 31, thereby reducing the safety hazards caused by surface charge during the heating process and improving the safety of the electric heating product.

[0030] Furthermore, in some embodiments, the evacuation region b has a region port c and a region end d. The region port c connects to the region end d in a straight line or a curved trajectory. The region port c is located at the outer contour edge of the heating region a, and the region end d is located on the side of the evacuation region b away from the region port c. The conductive extension structure 31 passes through the region port c and extends to a position close to the region end d. With such a region design, the position of the evacuation region b can be extended and expanded as much as possible within the heating region e, thereby increasing the arrangement space of the conductive extension structure 31 in the evacuation region b and expanding the range of surface charge that can be discharged.

[0031] Furthermore, in some embodiments, the conductive heating layer 2 includes a heating layer 21 for electrically heated material. The heating layer 21 is a layer on which the heating material of the conductive heating layer 2 is laid. The heating layer 21 can be formed into a planar heating layer for conductive heating by using one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene material, carbon paste material, rare earth resistive material, electronic resistive paste, etc. Preferably, the heating layer 21 uses nano-semiconductor metal oxide as the conductive heating material, and the thickness of the heating layer 21 is less than 1 mm. The nano-semiconductor metal oxide can be one or a combination of multiple materials such as tin, antimony, nickel, ammonium, zinc, titanium, and indium. During fabrication, nano-semiconductor metal oxide particles can be attached to the surface of the substrate 1 by physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), magnetron sputtering, or other methods. The heating layer 21 includes a first electrode 22 and a second electrode 23 that are independently disposed on both sides of the heating layer 21 to facilitate the connection of an external power source to heat the heating layer 21. Preferably, the first electrode 22 and the second electrode 23 can also use silver paste as a conductive material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the substrate 1, which facilitates processing and production.

[0032] Furthermore, in some embodiments, the region port c is located at one of the first electrode 22 and the second electrode 23, the region end d is located at the other of the first electrode 22 and the second electrode 23, or the clearance region b is located between the first electrode and the second electrode.

[0033] Optionally, Figure 4 This embodiment illustrates one partitioning method, where region port c is located at the first electrode 22 and region end d is located at the second electrode 23, allowing the open area b to extend from the first electrode 22 to the second electrode 23, forming a region division that penetrates the heating layer 21. The second electrode 23 is divided into two electrode ends, and the heating layer 21 is divided into two heating zones, allowing the heating circuit j to form a circuit connection structure with the two heating zones connected in parallel. The conductive extension structure 31 extends from between the two electrode ends of the second electrode 23 into the open area b. During heating, the surface charge generated at the heating zone positions on both sides of the open area b can be uniformly conducted away through the conductive extension structure 31 located in the open area b. In the parallel state, the connection of one of the parallel heating circuits can be controlled by an external electrical control device, and the position of the heating zone can be adjusted according to the user's needs.

[0034] Optionally, Figure 5This embodiment illustrates a two-partition configuration, with the open area b located between the first electrode 22 and the second electrode 23. This configuration avoids separating the electrode positions, but the heating layer 21 is still divided into two heating partitions. The two heating partitions are connected to each other via a transfer electrode 24, so that the heating circuit j forms a circuit connection structure in series between the two heating partitions. The conductive extension structure 31 extends into the open area b of the two heating partitions. During heating, the surface charge generated at the heating partition positions on both sides of the open area b can be uniformly conducted away through the conductive extension structure 31 located in the open area b.

[0035] Optionally, Figure 6 This embodiment illustrates a three-partition configuration. The heating layer 21 can be divided into several heating zones, which are connected by a transition electrode 24. The first electrode 22 is located on the side of the heating layer 21 where the heating circuit j is connected, and the second electrode 23 is located on the side of the heating layer 21 where the heating circuit j is output. The several heating zones surround and enclose to form a central open area b. The area port c is located between the first electrode 22 and the second electrode 23, and the area end d is located on the side of the open area b away from the area port c. The conductive extension structure 31 extends toward the position close to the area end d, forming a lead structure located within the enclosure of the heating zones. During heating, the surface charge generated at the heating zone positions around the open area b can be uniformly conducted away through the conductive extension structure 31 located within the open area b.

[0036] Optionally, Figure 4 The fourth circuit connection method of this embodiment is shown. When the heating layer 21 is divided into two heating zones, the second electrode 23 is divided into two electrode terminals. If the heating circuit is input from one of the second electrodes 23 and output from the other second electrode 23, that is, the first electrode 22 is not connected to any circuit and only acts as a transfer electrode, the heating circuit can also form a circuit structure of two heating zones connected in series to implement the heating effect.

[0037] Example 2 Figure 7This embodiment provides a heating structure capable of discharging surface charge. The conductive protective layer 3 is a conductive material formed on the substrate 1 circumferentially around the heating area e by means of coating, film, or adhesion. It is a conductive open ring structure with non-overlapping endpoints. The thickness of the conductive protective layer 3 is less than 1 mm. The conductive protective layer 3 has independently set first endpoint 32 and second endpoint 33, forming a gap g between the first endpoint 32 and the second endpoint 33. The size of the gap g determines the separation distance between the first endpoint 32 and the second endpoint 33. The gap g is provided to prevent short circuit of the protective circuit k under normal conditions. The first endpoint 32 is used for the connection of the protective circuit k, and the second endpoint 33 is used for the connection of the protective circuit k. The conductive layer 34 of the conductive protective layer 3 surrounds the conductive heating layer 2 and connects to the first endpoint 32 and the second endpoint 33 respectively. The conductive layer 34 of the conductive protective layer 3 can be made of a material with good conductivity, such as gold, silver, copper, aluminum, or tin. In this application, the conductive layer 34 is laid with silver paste made of silver material. Silver paste has high conductivity, which can effectively conduct current and reduce power loss. Moreover, silver paste is easy to form on the surface of the substrate, which is convenient for processing and production. In use, the conductive protective layer 3 can be electrically connected to the external electrical control device h used to trigger power-off protection to form a power-on circuit, also known as the protection circuit k. The external electrical control device h controls the on / off of the heating circuit j. The external electrical control device h can determine whether the substrate 1 has been damaged or broken by detecting the integrity of the protection circuit k in real time. When the substrate 1 is intact, the protection circuit k is conducting and is in normal use. When the substrate 1 is damaged or broken, the conductive protective layer 3 is simultaneously disconnected due to the damage to the substrate 1, causing the protection circuit k to disconnect. Alternatively, if the heating circuit is disconnected and there is no current output, it can be determined that the use is abnormal. At this time, the electrical control device h disconnects the heating circuit j, so that the conductive heating layer 2 is disconnected from the external power supply, achieving the protective effect of stopping heating.

[0038] Furthermore, in some embodiments, the second energized circuit (i.e., the protection circuit k) is connected in series with at least one passive electronic component 8 connected to the conductive protective layer 3. The passive electronic component 8 consumes the surface charge energy discharged from the substrate 1, so as not to affect the overall electric heating safety. The passive electronic component 8 can be any type of circuit device such as a resistor, capacitor, or inductor. Furthermore, in some embodiments, based on the passive electronic component 8 connected in series in the second power circuit (i.e., protection circuit k), the passive electronic component 8 can also extend a connection terminal for grounding. The charge is consumed by the passive electronic component 8 and then grounded to conduct away the surface charge generated from the substrate 1 so as not to affect the overall electric heating safety.

[0039] Furthermore, in some embodiments, Figures 4 to 6As shown, the first endpoint 32 is located between the second endpoint 33 and the conductive heating layer 2. The conductive layer 34 extends from the first endpoint 32 and passes through the area between the second endpoint 33 and the conductive heating layer 2, and surrounds the conductive heating layer 2 to connect to the second endpoint 33. The structure of the surrounding conductive heating layer 2 is adopted, so that the conductive layer 34 can form a protective ring structure without obvious gaps to the outside. There is no longer a straight or nearly straight through gap between the outer edge of the heating surface e and the outer edge of the conductive heating layer 2. This avoids the situation where the damage or breakage path avoids the conductive protective layer 3 when the substrate 1 is damaged or broken, thus preventing the power-off protection from being triggered. This effectively avoids the problem of the breakage path avoiding the conductive protective layer 3, and ensures that when the substrate 1 is damaged or broken, the conductive protective layer 3 can be disconnected to trigger the protection circuit k to disconnect and achieve power-off protection.

[0040] Example 3 Figures 1 to 3 This embodiment illustrates a heating structure capable of discharging surface charge, further comprising a temperature control probe 4 for temperature control. The heating surface e is provided with a heat-conducting element 5 for contacting the conductive heating layer 2 to conduct heat. The probe end of the temperature control probe 4 contacts the surface of the heat-conducting element 5. The heating structure includes a component housing 100 for mounting the substrate 1, the temperature control probe 4, and the heat-conducting element 5. In use, the object to be heated is placed on the supporting surface f of the substrate. After the conductive heating layer 2 of the substrate 1 is powered on, it begins to heat up, with a portion of the heat conducted from the conductive heating layer 2 towards the object to be heated on the supporting surface f. Another portion of the heat is conducted from the conductive heating layer 2 toward the heat-conducting component 5 on the side of the heating surface e. After being heated, the heat-conducting component 5 diffuses the heat to the position where it contacts the substrate 1. When the heat diffuses beyond the range of the conductive heating layer 2, it can achieve the effect of balancing the temperature of the heating area in the position of the substrate where the conductive heating layer 2 is not attached. This allows the position of the substrate 1 where the conductive heating layer 2 is not attached to also be heated and heated, avoiding different temperature zones between the area of ​​the substrate 1 where the conductive heating layer 2 is not attached and the area where the conductive heating layer 2 is attached. This further improves the heating efficiency and heating quality, and the heated object can be heated evenly, making it convenient for users to use. The temperature control probe 4 is installed on the component housing 100 and its probe end contacts the surface of the heat-conducting component 5. The temperature control probe 4 is electrically connected to the heating circuit k between the conductive heating layer 2 and the external power supply. Through the direct contact of the temperature control probe 4 with the heat-conducting component 5, the temperature rise of the heat-conducting component is detected in real time, so as to control the temperature rise of the conductive heating layer 2 by adjusting the circuit.

[0041] Furthermore, in some embodiments, such as Figure 1 As shown, the substrate can adopt a rectangular flat plate structure, which is suitable for heating some square or rectangular structures to meet the heating needs of products with different shapes and structures.

[0042] Furthermore, in some embodiments, such as Figure 2 As shown, the substrate 1 can adopt a disc-shaped flat plate structure, which is suitable for heating some rotating structures (such as kettles, cups, tea sets, pots, etc.).

[0043] Furthermore, in some embodiments, a heat insulation element 6 for blocking heat loss is installed on the outside of the heat-conducting element 5. The heat insulation element 6 has a mounting cavity 61 for accommodating the heat-conducting element 5. When heating, the heat emitted by the conductive heating layer 2 is blocked by the heat insulation element 6, and the heat is retained in the sealed space between the substrate 1 and the heat insulation element 6. After being absorbed by the heat-conducting element, this heat is transferred to the contact area of ​​the heat-conducting element 5 covering the substrate 1, compensating the temperature of the area outside the heating area e of the substrate 1 or the load contact area, so that the entire substrate 1 can obtain a uniform heating temperature, balance the overall temperature rise, and achieve the effect of uniform heating and uniform heat distribution.

[0044] Furthermore, in some embodiments, the heat insulation component 6 has a detection hole 62 for the temperature control detection component 4 to pass through. The number of detection holes 62 can be arranged according to the actual number of temperature control detection components 4 installed. The temperature control detection component 4 can be one of NTC temperature sensor, thermocouple sensor, PTD temperature sensor, infrared temperature sensor, or semiconductor temperature sensor. Preferably, at least two types of temperature control detection components 4 are used to detect the surface of the heat-conducting component 5, which further ensures the accuracy of the detected heating temperature and can also avoid the failure of a single temperature control detection component 4, thus affecting the actual use and making it convenient for users.

[0045] Furthermore, in some embodiments, an insulating element 7 or an insulating coating is provided between the heat-conducting element 5 and the conductive heating layer 2 to prevent the heat-conducting element 5 from affecting the use of the conductive heating layer 2. The insulating element 7 is preferably made of one or more inorganic materials such as mica sheets, oxides, nitrides, glass, ceramics, and silicates. The insulating coating is preferably composed of one or more inorganic materials such as mica sheets, oxides, nitrides, glass, ceramics, and silicates.

[0046] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heating structure capable of inducing surface electric charges, comprising a base (1) for carrying a heated object, a conductive heating layer (2) being attached to a heating surface e of the base (1), characterized in that: The attachment position of the conductive heating layer (2) forms a heating area a, and a conductive protective layer (3) is provided between the outer contour edge of the heating area a and the outer contour edge of the heating surface e. The conductive protective layer (3) is electrically connected to an external electrical control device for triggering power-off protection to form a power-on circuit. The conductive protective layer (3) includes a conductive extension structure (31) for discharging surface charge, and the conductive heating layer (2) has an open area b into which the conductive extension structure (31) extends.

2. A surface charge extractable heating structure as claimed in claim 1, characterized in that: The conductive protective layer (3) and the conductive heating layer (2) are separated by a gap, and the conductive extension structure (31) extends from the conductive protective layer (3) toward the interior of the open area b.

3. A surface charge extractable heating structure as claimed in claim 2, wherein: The evacuation area b has a region port c and a region end d. The region port c is connected to the region end d. The region port c is located at the outer contour edge of the heating area a. The region end d is located on the side of the evacuation area b away from the region port c. The conductive extension structure (31) passes through the region port c and extends to a position close to the region end d.

4. A surface charge extractable heating structure as claimed in claim 3, wherein: The conductive heating layer (2) includes a heating layer (21) for heating by electricity. The heating layer (21) includes a first electrode (22) and a second electrode (23) that are respectively and independently arranged. The region port c is located at one of the first electrode (22) and the second electrode (23), and the region end d is located at the other of the first electrode (22) and the second electrode (23). Alternatively, the clearing area b may be located between the first electrode (22) and the second electrode (23).

5. A surface charge extractable heating structure as defined in claim 1, wherein: The conductive protective layer (3) has a first endpoint (32) and a second endpoint (33) that are independently provided. The conductive layer (34) of the conductive protective layer (3) surrounds the conductive heating layer (2) and connects the first endpoint (32) and the second endpoint (33) respectively.

6. The heating structure capable of exporting surface charge as described in claim 5, characterized in that: The first endpoint (32) is located between the second endpoint (33) and the conductive heating layer (2). The conductive layer (34) extends from the first endpoint (32) and passes through the area between the second endpoint (33) and the conductive heating layer (2), and surrounds the conductive heating layer (2) to the second endpoint (33).

7. A surface charge extractable heating structure as defined in claim 1, wherein: It also includes a temperature control probe (4) for temperature control, and the heating surface e is provided with a heat-conducting component (5) for contacting the conductive heating layer (2) to conduct heat, and the probe end of the temperature control probe (4) contacts the surface of the heat-conducting component (5).

8. A surface charge extractable heating structure as claimed in claim 7, characterized in that: A heat insulation component (6) for blocking heat loss is installed on the outside of the heat-conducting component (5), and the heat insulation component (6) has a mounting cavity (61) for accommodating the heat-conducting component (5). The heat insulation component (6) has a detection hole (62) through which the temperature control detection component (4) passes. The temperature control detection component (4) can be one of an NTC temperature sensor, a thermocouple sensor, a PTD temperature sensor, an infrared temperature sensor, or a semiconductor temperature sensor. An insulating component (7) or an insulating coating is also provided between the heat-conducting component (5) and the conductive heating layer (2).

9. A surface charge extractable heating structure as claimed in any one of claims 1 to 8, wherein: The energized circuit is connected in series with at least one passive electronic component (8) that is connected to the conductive protective layer (3).

10. A surface charge extractable heating structure as claimed in claim 9, wherein: The passive electronic component (8) has a connection terminal for grounding.

11. A surface charge extractable heating structure as claimed in any one of claims 1 to 8, wherein: The substrate (1) is a microcrystalline glass material, and / or the heating layer (21) of the conductive heating layer (2) is formed by one of the following materials: nano metal oxide, nano semiconductor metal oxide, graphene material, carbon paste material, rare earth resistive material, and electronic resistive paste to form a planar heating layer structure.

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