Reinforcing plate, flexible wiring board, and electronic device

Abstract

The utility model discloses a kind of reinforcing plate, flexible circuit board and electronic equipment, it is related to electronic equipment technical field, the reinforcing plate includes first skeleton layer and substrate layer, first skeleton layer includes first warp skeleton line and first weft skeleton line, first warp skeleton line and first weft skeleton line are at angle distribution and interweave into net structure;Substrate layer is covered in first warp skeleton line and first weft skeleton line, and the extension direction of first warp skeleton line and the extension direction of first weft skeleton line are all with the side edge extension direction of substrate layer at angle, to make first warp skeleton line and first weft skeleton line all with the stress direction applied along the side edge of substrate layer at angle.Compared with prior art, the reinforcing plate and flexible circuit board provided by the utility model embodiment, can reduce warping, bowing and other deformation problems, ensure the normal function and service life of FPC, improve the quality of pasting piece.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and more specifically, to a reinforcing plate, a flexible circuit board, and an electronic device. Background Technology

[0002] FPC (Flexible Printed Circuit) is inherently difficult to mount or support due to its flexibility. However, it can be locally hardened by bonding FR4 reinforcing plates (Flame Retardant 4) to facilitate mounting and other applications. FR4 reinforcing plates are typically composed of fiberglass cloth and epoxy resin. A single-layer mesh reinforcement skeleton is formed by orthogonal weaving of warp (vertical longitudinal) and weft (horizontal transverse) fiberglass yarns. Liquid epoxy resin is then uniformly filled into the fiber gaps through a vacuum impregnation process. After hot-pressing and curing, the resin forms a three-dimensional cross-linked network structure, solidifying the fiber skeleton into a whole.

[0003] In practical applications, when using large-area FR4 reinforcing material in flexible printed circuit (FPC) components, the material's thermomechanical properties and structural mechanics, especially in rectangular reinforcing boards with an aspect ratio > 3:1, can easily lead to three typical deformation failure modes: Z-axis bowing and XY-plane warping. These problems directly affect the normal function and lifespan of the FPC; for example, warping can impact the quality of surface mount technology (SMT). Utility Model Content

[0004] The purpose of this invention is to provide a reinforcing plate and a flexible circuit board that can reduce deformation problems such as warping and buckling, ensure the normal function and service life of the FPC, and improve the quality of component placement.

[0005] The embodiments of this utility model are implemented as follows: In one aspect, an embodiment of the present invention provides a reinforcing plate, comprising: The first skeleton layer includes a first longitudinal skeleton line and a first latitudinal skeleton line, wherein the first longitudinal skeleton line and the first latitudinal skeleton line are distributed at an angle and interwoven into a mesh structure. A substrate layer covers the first warp skeleton line and the first weft skeleton line, and the extension directions of the first warp skeleton line and the first weft skeleton line are both at an angle to the side extension direction of the substrate layer, so that the first warp skeleton line and the first weft skeleton line are both at an angle to the stress direction applied along the side of the substrate layer.

[0006] In some preferred embodiments, the angle between the extension direction of the first meridional skeleton line and the side extension direction of the substrate layer is between 40° and 50°. And / or, the angle between the extension direction of the first latitudinal skeleton line and the side extension direction of the substrate layer is between 40° and 50°.

[0007] In some preferred embodiments, the first warp skeleton line and the first weft skeleton line interweave to form a rhomboid mesh structure.

[0008] In some preferred embodiments, the reinforcing plate further includes at least one second skeleton layer, the second skeleton layer and the first skeleton layer are stacked, and the substrate layer covers both the first skeleton layer and the second skeleton layer.

[0009] In some preferred embodiments, the second skeleton layer includes a second warp skeleton line and a second weft skeleton line, which are interwoven to form a mesh structure.

[0010] In some preferred embodiments, the extension direction of the second warp skeleton line is parallel or perpendicular to the side extension direction of the substrate layer, and the extension direction of the second weft skeleton line is perpendicular to the extension direction of the second warp skeleton line.

[0011] In some preferred embodiments, the angle between the extension direction of the second meridional skeleton line and the side extension direction of the substrate layer is between 40° and 50°. And / or, the angle between the extension direction of the second latitudinal skeleton line and the side extension direction of the substrate layer is between 40° and 50°.

[0012] In some preferred embodiments, the reinforcing plate further includes an interpenetrating skeleton layer embedded in the substrate layer, the interpenetrating skeleton layer being disposed between the first skeleton layer and the second skeleton layer; And / or, the interpenetrating skeleton layer is disposed between adjacent second skeleton layers.

[0013] In some preferred embodiments, the interpenetrating skeleton layer includes a plurality of structural support portions, one end of each structural support portion being connected to the second skeleton layer, the other end of each structural support portion being connected to the first skeleton layer or an adjacent second skeleton layer, and each structural support portion being inclined relative to the second skeleton layer.

[0014] Secondly, this utility model embodiment provides a flexible circuit board, including a circuit board body and the aforementioned reinforcing plate, wherein the reinforcing plate is disposed in a local area of ​​the circuit board body.

[0015] The beneficial effects of this utility model embodiment include: The reinforcing plate and flexible circuit board provided in this embodiment of the invention consist of a first skeleton layer formed by first warp skeleton lines and first weft skeleton lines distributed at an angle and interwoven, with a substrate layer covering the first warp skeleton lines and the first weft skeleton lines to fix the first skeleton layer. Furthermore, since the stress direction of the reinforcing plate is usually along the side of the substrate layer, and the extension directions of the first warp skeleton lines and the first weft skeleton lines are both set at an angle to the side extension direction of the substrate layer, the first warp skeleton lines and the first weft skeleton lines are also set at an angle to the stress direction applied along the side of the substrate layer. This disrupts the stress transmission path and reduces deformation. Compared to the prior art, the reinforcing plate and flexible circuit board provided in this embodiment of the invention can reduce warping, buckling, and other deformation problems, ensuring the normal function and service life of the FPC and improving the quality of component placement. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A front view of the first type of reinforcing plate provided in this embodiment of the utility model; Figure 2 A top view of the first type of reinforcing plate provided in this embodiment of the utility model; Figure 3 A front view of the second type of reinforcing plate provided in an embodiment of this utility model; Figure 4 for Figure 3 A schematic diagram of the first type of cross-section at point AA; Figure 5 for Figure 3 A schematic diagram of the second cross-section at point AA; Figure 6a A front view of the third type of reinforcing plate provided in this utility model embodiment, where the second skeleton layer is a single layer; Figure 6b A front view of the third type of reinforcing plate provided in this utility model embodiment, where the second skeleton layer is a double layer; Figure 7 This is a schematic diagram of the structure of the flexible circuit board provided in an embodiment of the present invention.

[0018] icon: 100 - Reinforcing plate; 110 - First skeleton layer; 111 - First warp skeleton line; 113 - First weft skeleton line; 130 - Substrate layer; 150 - Second skeleton layer; 151 - Second warp skeleton line; 153 - Second weft skeleton line; 170 - Interlaced skeleton layer; 171 - Structural support; 200 - Flexible circuit board; 210 - Circuit board body. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] As disclosed in the background art, the existing FR4 reinforcing plate on the FPC is usually composed of glass fiber cloth and epoxy resin. It uses warp (vertical longitudinal) and weft (horizontal transverse) glass fiber yarns to form a single-layer mesh reinforcing skeleton through an orthogonal weaving process. That is, the glass fiber yarns are woven in a plain weave of 0° / 90° orthogonal to form a glass fiber skeleton. Then, liquid epoxy resin is uniformly filled into the fiber gaps through a vacuum impregnation process. After hot pressing and curing, the resin forms a three-dimensional cross-linked network structure, which solidifies the fiber skeleton into a whole.

[0026] When large-area FR4 reinforcing material is used in flexible printed circuit (FPC) components, it is affected by both the thermomechanical properties of the material and the structural mechanics, especially in rectangular reinforcing plates with an aspect ratio > 3:1, which are prone to three typical deformation failure modes: bowing in the Z-axis direction and warping in the XY plane.

[0027] The investigation revealed that the outer edge of the existing FR4 reinforcing plate is always parallel to the weave direction of the fiberglass cloth. When warping or buckling stress occurs, it is mainly because the fiberglass direction coincides with the principal stress direction, resulting in insufficient stress resistance and making warping or buckling easy. Furthermore, as the structural skeleton, the weave shape, distribution, and arrangement of the fiberglass all affect the overall structural strength of the reinforcing plate.

[0028] Therefore, in order to solve the deformation problem of FR4 reinforced type FPC, such as warping and buckling, this utility model provides a novel reinforcing plate, flexible circuit board and electronic device. The structure and working principle of the reinforcing plate are described in detail below.

[0029] See Figure 1 and Figure 2 This utility model embodiment provides a reinforcing plate 100, which can disrupt the stress transmission path, reduce deformation problems such as warping and buckling, and at the same time enhance stress resistance, ensure the normal function and service life of FPC, and improve the quality of component mounting.

[0030] The reinforcing plate 100 provided in this embodiment of the present invention includes a first skeleton layer 110 and a substrate layer 130. The first skeleton layer 110 includes a first warp skeleton line 111 and a first weft skeleton line 113. The first warp skeleton line 111 and the first weft skeleton line 113 are distributed at an angle and interwoven into a mesh structure. The substrate layer 130 covers the first warp skeleton line 111 and the first weft skeleton line 113. The extension direction of the first warp skeleton line 111 and the extension direction of the first weft skeleton line 113 are both at an angle to the side extension direction of the substrate layer 130, so that the first warp skeleton line 111 and the first weft skeleton line 113 are both at an angle to the stress direction applied along the side of the substrate layer 130.

[0031] It should be noted that the first skeleton layer 110 is made of fiberglass cloth, and the first warp skeleton line 111 and the first weft skeleton line 113 are both fiberglass yarns. The terms "warp" and "weft" here refer only to their different extension directions and are not intended to define their actual direction. Furthermore, the first warp skeleton line 111 consists of multiple inclined and parallel yarns, and the first weft skeleton line consists of multiple inclined and parallel yarns, forming a mesh structure through an inclined weaving process. The substrate layer 130 is made of epoxy resin, completely encapsulating the first skeleton layer 110 and forming the external structure of the reinforcing plate 100. The sides of the substrate layer 130 are the sides of the reinforcing plate 100. Compared to the plain weave method in conventional technology (i.e., the yarn direction is parallel to the side direction), since the stress direction of the reinforcing plate 100 is usually the side direction of the substrate layer 130, and the extension directions of the first warp skeleton line 111 and the first weft skeleton line 113 are both set at an angle to the side extension direction of the substrate layer 130, the first warp skeleton line 111 and the first weft skeleton line 113 are both set at an angle to the stress direction applied along the side of the substrate layer 130. This can disrupt the stress transmission path, thereby reducing the generation of deformation. Therefore, it can reduce deformation problems such as warping and buckling, ensure the normal function and service life of the FPC, and improve the quality of the mounting.

[0032] It is worth noting that the reinforcing plate 100 here can be approximately rectangular, having a long side and a short side. The length of the long side is greater than or equal to the length of the short side, preferably the ratio of the long side to the short side is greater than 3. In this embodiment, the side of the substrate layer 130 refers to the long side of the reinforcing plate 100. Furthermore, the angle distribution between the first warp skeleton line 111 and the first weft skeleton line 113 mentioned in this embodiment refers to the acute angle distribution between the extension direction of the first warp skeleton line 111 and the extension direction of the first weft skeleton line 113.

[0033] Please continue reading Figure 2 , Figure 2The arrows indicate the principal stress directions. In some embodiments, the angle between the extension direction of the first warp skeleton line 111 and the lateral extension direction of the substrate layer 130 is between 40° and 50°. For example, the angle between the extension direction of the first warp skeleton line 111 and the lateral extension direction of the substrate layer 130 is any value between 40°, 45°, or 50°. Alternatively, the angle between the extension direction of the first weft skeleton line 113 and the lateral extension direction of the substrate layer 130 is between 40° and 50°. For example, the angle between the extension direction of the first weft skeleton line 113 and the lateral extension direction of the substrate layer 130 is any value between 40°, 45°, or 50°. Of course, the angles between the extension directions of the first longitudinal skeleton line 111 and the first latitudinal skeleton line 113 and the side extension direction of the substrate layer 130 can both be between 40° and 50°, and the angle between the extension direction of the first longitudinal skeleton line 111 and the side extension direction of the substrate layer 130 is different from the angle between the extension direction of the first latitudinal skeleton line 113 and the side extension direction of the substrate layer 130.

[0034] Furthermore, in this embodiment, the angle between the extension direction of the first warp skeleton line 111 and the side extension direction of the substrate layer 130 can be 50°, the angle between the extension direction of the first weft skeleton line 113 and the side extension direction of the substrate layer 130 is 50°, and the angle between the first warp skeleton line 111 and the first weft skeleton line 113 is 80°. Of course, the limitation on the extension direction of the first weft skeleton line 113 and the first warp skeleton line 111 here is only for illustrative purposes and does not constitute a limitation.

[0035] In some embodiments, the first warp skeleton line 111 and the first weft skeleton line 113 interweave to form a rhombic mesh structure. Specifically, multiple first warp skeleton lines 111 and multiple first weft skeleton lines 113 are uniformly interwoven to form multiple rhombuses. These multiple rhombuses are then spliced ​​together to form a rhombic mesh structure. This rhombic mesh structure ensures that the multiple first warp skeleton lines 111 and multiple first weft skeleton lines 113 are evenly distributed, thereby forming a rhombic mesh structure with uniform density and ensuring consistent structural strength throughout.

[0036] See Figure 3 and Figure 4In some embodiments, the reinforcing plate 100 further includes at least one second skeleton layer 150, which is stacked with the first skeleton layer 110. The substrate layer 130 simultaneously covers the first skeleton layer 110 and the second skeleton layer 150. Specifically, the second skeleton layer 150 can be one layer or multiple layers. The second skeleton layer 150 can be stacked on the first skeleton layer 110 to form a multi-layer skeleton structure. In this embodiment, a single second skeleton layer 150 is used as an example for illustration.

[0037] Furthermore, the second skeleton layer 150 includes a second warp skeleton line 151 and a second weft skeleton line 153, which are interwoven to form a mesh structure. Specifically, there are multiple second warp skeleton lines 151 and multiple weft skeleton lines 153, which are interwoven using a weaving process to form a mesh structure.

[0038] It should be noted that the second skeleton layer 150 can also be made of fiberglass cloth. The second warp skeleton line 151 and the second weft skeleton line 153 are both fiberglass yarns. The second warp skeleton line 151 consists of multiple yarns arranged at an angle and parallel to each other, and the second weft skeleton line consists of multiple yarns arranged at an angle and parallel to each other, forming a mesh structure through an inclined weaving process. Furthermore, the substrate layer 130 can completely cover the first skeleton layer 110 and the second skeleton layer 150. By providing at least one second skeleton layer 150, the traditional single-layer fiberglass cloth can be improved into a double-layer or multi-layer composite structure, thereby forming a multi-layer fiber network inside the reinforcing plate 100, thus enhancing the internal rigidity and support of the reinforcing plate 100.

[0039] Please see Figure 4 In some embodiments, the extension direction of the second warp skeleton line 151 is parallel or perpendicular to the side extension direction of the substrate layer 130, and the extension direction of the second weft skeleton line 153 is perpendicular to the extension direction of the second warp skeleton line 151. Specifically, the distribution of glass fiber yarns in the second skeleton layer 150 differs from that in the first skeleton layer 110. The extension direction of the second warp skeleton line 151 can be parallel to the side of the substrate layer 130 (with an angle of 0°), while the extension direction of the second weft skeleton line 153 is perpendicular to the side of the substrate layer 130 (with an angle of 90°), thereby forming an orthogonal mesh structure.

[0040] It is worth noting that the second skeleton layer 150, which is composed of the second warp skeleton line 151 and the second weft skeleton line 153 with orthogonal mesh distribution, and the first skeleton layer 110, which is composed of the first warp skeleton line 111 and the first weft skeleton line 113 with twill weave, can contain a double or multi-layer composite structure with orthogonal and twill weave, and has better internal rigidity support.

[0041] See Figure 5 In some embodiments, the angle between the extending direction of the second warp skeleton line 151 and the lateral extending direction of the substrate layer 130 is between 40° and 50°. For example, the angle between the extending direction of the second warp skeleton line 151 and the lateral extending direction of the substrate layer 130 is any value among 40°, 45°, or 50°, or any value between adjacent values. Alternatively, the angle between the extending direction of the second weft skeleton line 153 and the lateral extending direction of the substrate layer 130 is between 40° and 50°. For example, the angle between the extending direction of the second weft skeleton line 153 and the lateral extending direction of the substrate layer 130 is any value among 40°, 45°, or 50°, or any value between adjacent values. Of course, the angle between the extension direction of the second longitudinal skeleton line 151 and the extension direction of the second latitudinal skeleton line 153 and the side extension direction of the substrate layer 130 can both be between 40° and 50°, and the angle between the extension direction of the second longitudinal skeleton line 151 and the side extension direction of the substrate layer 130 is different from the angle between the extension direction of the second latitudinal skeleton line 153 and the side extension direction of the substrate layer 130.

[0042] Furthermore, the yarn distribution of the first skeleton layer 110 and the second skeleton layer 150 can be the same, that is, the angle between the extension direction of the second warp skeleton line 151 and the lateral extension direction of the substrate layer 130 can also be 50°, the angle between the extension direction of the second weft skeleton line 153 and the lateral extension direction of the substrate layer 130 can be 50°, and the angle between the second warp skeleton line 151 and the second weft skeleton line 153 can be 80°. Of course, the limitation on the extension direction of the second weft skeleton line 153 and the second warp skeleton line 151 here is only for illustrative purposes and does not serve as a limitation.

[0043] It should be noted that the first skeleton layer 110 and the second skeleton layer 150, which are both twill woven, can be woven in advance and then covered by the substrate layer 130, which simplifies the preparation process and technology, and can also further improve its stress resistance and reduce deformation, thereby further reducing warping, bowing and other deformation problems.

[0044] See Figure 6aIn some embodiments, the reinforcing plate 100 further includes an interpenetrating skeleton layer 170 embedded in the substrate layer 130. When the second skeleton layer 150 is a single layer, the interpenetrating skeleton layer 170 is disposed between the first skeleton layer 110 and the second skeleton layer 150. When the second skeleton layer 150 is multi-layered, the interpenetrating skeleton layer 170 can be disposed between the first skeleton layer 110 and the second skeleton layer 150, between adjacent second skeleton layers 150, or both. Specifically, the interpenetrating skeleton layer 170 is disposed on at least one side of the second skeleton layer 150 and extends to the first skeleton layer 110 or an adjacent second skeleton layer 150. Specifically, when the second skeleton layer 150 is a single-layer structure, the interpenetrating skeleton layer 170 is disposed between the second skeleton layer 150 and the first skeleton layer 110. This embodiment uses a single-layer second skeleton layer 150 as an example. By providing the interpenetrating skeleton layer 170, a three-dimensional interwoven structure can be achieved simultaneously with the double-layered glass fiber cloth, further improving the overall structural strength and stress resistance.

[0045] See Figure 6b When the second skeleton layer 150 is a multi-layer structure, for example, when the second skeleton layer 150 is two layers, the interpenetrating skeleton layer 170 is provided between the first skeleton layer 110 and the second skeleton layer 150, and between adjacent second skeleton layers 150.

[0046] Please continue reading Figure 6a Furthermore, the interpenetrating skeleton layer 170 includes a plurality of structural support portions 171, one end of each structural support portion 171 being connected to the second skeleton layer 150, and the other end being connected to the first skeleton layer 110 or an adjacent second skeleton layer 150, and each structural support portion 171 is inclined relative to the second skeleton layer 150. Specifically, the structural support portion 171 may be columnar, thereby serving as an intermediate support.

[0047] In some preferred embodiments, the interpenetrating skeleton layer 170 includes multiple structural support cone structures, which are evenly distributed between the first skeleton layer 110 and the second skeleton layer 150. Each structural support cone structure includes 3-4 structural support parts 171. The bottom ends of the 3-4 structural support parts 171 are all connected to the same intersection of the first longitudinal skeleton line 111 and the first latitudinal skeleton line 113 in the first skeleton layer 110. The top ends of the 3-4 structural support parts 171 are all connected to 3 or 4 intersections of the second longitudinal skeleton line 151 and the second latitudinal skeleton line 153 in the second skeleton layer 150, thereby forming an inverted triangular cone or an inverted quadrangular cone structure. This better releases the stress on the first skeleton layer 110 or the second skeleton layer 150 while connecting the first skeleton layer 110 and the second skeleton layer 150.

[0048] It should be noted that the second skeleton layer 150 here can be an orthogonal mesh structure. The structural support cone structure can include four structural support parts 171. The tops of the four structural support parts 171 are respectively connected to the four vertices of the orthogonal mesh, and the bottoms of the four structural support parts 171 are simultaneously connected to the same intersection of the first warp skeleton line 111 and the first weft skeleton line 113 in the first skeleton layer 110, thus forming an inverted quadrangular pyramid structure. This achieves a three-dimensional multi-directional interweaving method, realizing a three-dimensional six-directional interlaced weaving structure of multi-layer glass fiber cloth. This structure forms a spatial six-directional (X / Y / Z axis and diagonal direction) continuous fiber reinforcement network through the cross-layer interweaving of orthogonal and oblique fibers, generating a self-locking effect in the interlayer interface region, thereby enhancing stress resistance.

[0049] In other preferred embodiments of this invention, both the first skeleton layer 110 and the second skeleton layer 150 may adopt a twill weave structure, that is, the first warp skeleton line 111 in the first skeleton layer 110 corresponds to the second warp skeleton line 151 in the second skeleton layer 150, and the first weft skeleton line 113 in the first skeleton layer 110 corresponds to the second weft skeleton line 153 in the second skeleton layer 150. Multiple structural support portions 171 may include first support columns and second support columns. Multiple second support columns are serratedly distributed between the first weft skeleton line 113 and the second weft skeleton line 153, and multiple first support columns are serratedly distributed between the first warp skeleton line 111 and the second warp skeleton line 151. This can also form a multi-directional continuous fiber reinforcement network, generating a self-locking effect in the interlayer interface region, thereby enhancing stress resistance.

[0050] See Figure 7 This utility model embodiment also provides a flexible circuit board 200, including a circuit board body 210 and the aforementioned reinforcing plate 100. The reinforcing plate 100 includes a first skeleton layer 110 and a substrate layer 130. The first skeleton layer 110 includes a first warp skeleton line 111 and a first weft skeleton line 113. The first warp skeleton line 111 and the first weft skeleton line 113 are distributed at an angle and interwoven into a mesh structure. The substrate layer 130 covers the first warp skeleton line 111 and the first weft skeleton line 113, and the extension direction of the first warp skeleton line 111 and the extension direction of the first weft skeleton line 113 are both at an angle to the side extension direction of the substrate layer 130, so that the first warp skeleton line 111 and the first weft skeleton line 113 are both at an angle to the stress direction applied along the side of the substrate layer 130. A reinforcing plate 100 is provided in a local area of ​​the circuit board body 210, wherein the substrate layer 130 of the reinforcing plate 100 is attached to the surface of the circuit board body 210, thereby achieving circuit reinforcement.

[0051] This utility model embodiment also provides an electronic device, including the aforementioned flexible circuit board 200. The flexible circuit board includes a circuit board body 210 and the aforementioned reinforcing plate 100. The reinforcing plate 100 includes a first skeleton layer 110 and a substrate layer 130. The first skeleton layer 110 includes a first warp skeleton line 111 and a first weft skeleton line 113. The first warp skeleton line 111 and the first weft skeleton line 113 are distributed at an angle and interwoven into a mesh structure. The substrate layer 130 covers the first warp skeleton line 111 and the first weft skeleton line 113, and the extension direction of the first warp skeleton line 111 and the extension direction of the first weft skeleton line 113 are both at an angle to the side extension direction of the substrate layer 130, so that the first warp skeleton line 111 and the first weft skeleton line 113 are both at an angle to the stress direction applied along the side of the substrate layer 130. A reinforcing plate 100 is provided in a local area of ​​the circuit board body 210, wherein the substrate layer 130 of the reinforcing plate 100 is attached to the surface of the circuit board body 210, thereby achieving circuit reinforcement. Specifically, the electronic device can be a mobile phone, tablet computer or other electronic handheld device, or a power supply device such as a battery.

[0052] In summary, the reinforcing plate 100, flexible circuit board 200, and electronic device provided by this embodiment of the present invention are formed by a first skeleton layer 110 with first warp skeleton lines 111 and first weft skeleton lines 113 distributed at an angle and interwoven to form a mesh. The substrate layer 130 covers the first warp skeleton lines 111 and the first weft skeleton lines 113, thereby fixing the first skeleton layer 110. Furthermore, since the force direction of the reinforcing plate 100 is usually the side direction of the substrate layer 130, and the extension directions of the first warp skeleton lines 111 and the first weft skeleton lines 113 are both set at an angle to the side extension direction of the substrate layer 130, the first warp skeleton lines 111 and the first weft skeleton lines 113 are both set at an angle to the stress direction applied along the side of the substrate layer 130. This disrupts the stress transmission path, thereby reducing deformation and thus reducing warping, buckling, and other deformation problems, ensuring the normal function and service life of the FPC, and improving the quality of component placement. The second skeleton layer 150 transforms the traditional single-layer fiberglass cloth into a double-layer or multi-layer composite structure, forming a multi-layer fiber network within the reinforcing plate 100 and enhancing its internal rigidity. Furthermore, the interpenetrating skeleton layer 170 creates a self-locking effect at the interlayer interface, thereby increasing stress resistance.

[0053] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A reinforcing plate characterized by, include: The first skeleton layer (110) includes a first longitudinal skeleton line (111) and a first latitudinal skeleton line (113), which are distributed at an angle and interwoven into a mesh structure. A substrate layer (130) covers the first warp skeleton line (111) and the first weft skeleton line (113), and the extension direction of the first warp skeleton line (111) and the extension direction of the first weft skeleton line (113) are both at an angle to the side extension direction of the substrate layer (130), so that the first warp skeleton line (111) and the first weft skeleton line (113) are both at an angle to the stress direction applied along the side of the substrate layer (130).

2. The reinforcing plate according to claim 1, characterized by The angle between the extension direction of the first meridional skeleton line (111) and the side extension direction of the substrate layer (130) is between 40° and 50°. And / or, the angle between the extension direction of the first latitudinal skeleton line (113) and the side extension direction of the substrate layer (130) is between 40° and 50°.

3. The reinforcing plate according to claim 2, characterized in that The first longitudinal skeleton line (111) and the first latitudinal skeleton line (113) interweave to form a rhomboid mesh structure.

4. The reinforcing plate according to claim 1, characterized by The reinforcing plate further includes at least one second skeleton layer (150), the second skeleton layer (150) and the first skeleton layer (110) are stacked, and the substrate layer (130) covers both the first skeleton layer (110) and the second skeleton layer (150).

5. The reinforcing plate according to claim 4, characterized in that The second skeleton layer (150) includes a second longitudinal skeleton line (151) and a second latitudinal skeleton line (153), which are interwoven into a mesh structure.

6. The reinforcing plate according to claim 5, characterized in that The extension direction of the second warp skeleton line (151) is parallel or perpendicular to the side extension direction of the substrate layer (130), and the extension direction of the second weft skeleton line (153) is perpendicular to the extension direction of the second warp skeleton line (151).

7. The reinforcing plate according to claim 5, characterized in that, The angle between the extension direction of the second meridional skeleton line (151) and the side extension direction of the substrate layer (130) is between 40° and 50°. And / or, the angle between the extension direction of the second latitudinal skeleton line (153) and the side extension direction of the substrate layer (130) is between 40° and 50°.

8. A reinforcing panel according to any one of claims 4 to 7, characterised in that, The reinforcing plate also includes an interpenetrating skeleton layer (170) embedded in the substrate layer (130), the interpenetrating skeleton layer (170) being disposed between the first skeleton layer (110) and the second skeleton layer (150); And / or, the interpenetrating skeleton layer (170) is disposed between adjacent second skeleton layers (150).

9. The reinforcing plate according to claim 8, characterized in that The interpenetrating skeleton layer (170) includes a plurality of structural support parts (171), one end of each structural support part (171) is connected to the second skeleton layer (150), and the other end of each structural support part (171) is connected to the first skeleton layer (110) or the adjacent second skeleton layer (150), and each structural support part (171) is inclined relative to the second skeleton layer (150).

10. A flexible wiring board, characterized by, It includes a circuit board body (210) and a reinforcing plate as described in any one of claims 1-9, wherein the reinforcing plate is provided in a partial area of ​​the circuit board body (210).

11. An electronic device, comprising: Including the flexible circuit board as described in claim 10.

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