A master device

Abstract

The application discloses a master control device and belongs to the field of device heat dissipation technology. The master control device comprises a box body, a mainboard, a fan and a radiator. The box body has a cavity, an air inlet hole and an air outlet hole. The cavity is in communication with the outside of the box body through the air inlet hole and the air outlet hole. The mainboard is arranged in the cavity. The fan is arranged in the cavity. The fan and the mainboard have a heat dissipation gap therebetween. The radiator is arranged in the cavity and is attached to the mainboard. The fan has an air suction port and an air exhaust port. The air inlet hole, the heat dissipation gap, the air suction port, the air exhaust port, the air outlet hole are sequentially communicated to form a heat dissipation channel. The radiator is arranged in the heat dissipation channel and is located between the air exhaust port and the air outlet hole. The application can improve the heat dissipation efficiency of the master control device and guarantee the normal operation of the master control device.

Description

Technical Field

[0001] This application relates to the field of equipment heat dissipation technology, and more particularly to a main control device. Background Technology

[0002] In the field of smart wearable devices, smart glasses, as a product with great potential, are gradually entering people's lives. Currently, most smart glasses on the market require an external main control device during use. The main control device is responsible for performing complex information and data processing tasks and transmitting the processed image information to the smart glasses for display.

[0003] However, existing main control equipment undertakes heavy computational tasks with an extremely high computational load, inevitably generating a large amount of heat during operation. If this heat cannot be dissipated effectively and in a timely manner, it will seriously affect the performance and stability of the main control equipment, and may even lead to equipment damage. Currently, the heat dissipation devices of main control equipment are poorly designed and have low heat dissipation efficiency, further affecting the normal operation of the main control equipment. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a master control device that can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solution: On the one hand, a main control device is provided, including: The box body has a cavity, an air inlet, and an air outlet; the cavity is connected to the outside of the box body through the air inlet and the air outlet; The motherboard is located within the cavity; A fan is disposed within the cavity; a heat dissipation gap exists between the fan and the motherboard. as well as A heat sink is disposed within the cavity and is attached to the motherboard. The fan has an air intake and an air exhaust. The air inlet, the heat dissipation gap, the air intake, the air exhaust, and the air outlet are connected in sequence to form a heat dissipation channel. The heat sink is located in the heat dissipation channel and between the air exhaust and the air outlet.

[0006] Preferably, the motherboard has a chip, and the heat sink abuts against the chip to improve the chip's heat dissipation efficiency.

[0007] Preferably, the main control device further includes a first thermal pad, a second thermal pad, and a heat-dissipating plate sandwiched between the first thermal pad and the second thermal pad; the heat sink abuts against the first thermal pad, and the second thermal pad abuts against the chip, thereby improving the efficiency of heat conduction.

[0008] Preferably, the heat exchange plate is provided with air supply holes, the air intake of the fan is located at the air supply holes, and the air inlet, the air supply holes, and the air intake are connected in sequence, so that the air intake of the fan can carry away the heat on the motherboard through the air supply holes.

[0009] Preferably, the main control device further includes a heat insulation plate; the heat equalization plate is installed on the inner wall of the cavity through connecting fasteners and the heat insulation plate, so as to avoid the box temperature from being too high and causing burns to the user.

[0010] Preferably, the motherboard has a first width and a second width that are perpendicular to each other, and the fan and the heat sink are both located between the air inlet and the air outlet, and the fan and the heat sink are arranged sequentially along the direction of the first width; The air inlet holes are multiple and arranged at intervals along the direction of the second width, and the air outlet holes are multiple and arranged at intervals along the direction of the second width, thereby improving heat dissipation efficiency and effect.

[0011] Preferably, the air intake faces the motherboard and the air exhaust faces the heat sink, thereby improving heat dissipation efficiency.

[0012] Preferably, the heat sink includes a plurality of heat sinks arranged at intervals in sequence, with a flow channel formed between any two adjacent heat sinks. One end of each flow channel is connected to the exhaust port of the fan, and the other end of each flow channel is connected to the air outlet of the housing, thereby improving heat dissipation efficiency.

[0013] Preferably, the housing includes a first housing and a second housing; the first housing and the second housing are snapped together to form the cavity, and the air inlet and the air outlet are both located on the first housing, which facilitates the installation and positioning of the fan, motherboard and heat sink.

[0014] Preferably, the outer side of the box is provided with a control area, which is equipped with buttons and / or a touchpad to facilitate information processing between the main control device and devices such as smart glasses.

[0015] The beneficial effects of this application are as follows: The main control device of this application arranges the fan and the motherboard at intervals, so that the air entering from outside the box flows between the fan's air intake and the motherboard, thereby carrying away the heat of the motherboard and achieving the first cooling of the motherboard. Then, the heat conduction of the heat sink is used to conduct heat to the motherboard. Finally, the air is blown to the heat sink through the fan's exhaust port, so that the heat sink's heat flows out of the box from the exhaust port, achieving the second cooling of the motherboard. Through the above-mentioned two cooling processes, this application greatly improves the heat dissipation efficiency, thereby ensuring that the main control device can operate normally. Attached Figure Description

[0016] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0017] Figure 1 A structural schematic diagram of the main control device from one perspective; Figure 2 A structural schematic diagram of the main control equipment from another perspective; Figure 3 A half-sectional view of the main control equipment; Figure 4 A partial sectional view of the main control equipment; Figure 5 An exploded view of the main control equipment.

[0018] Explanation of reference numerals in the attached figures: 11. Housing; 12. Motherboard; 13. Fan; 14. Heat sink; 15. Heat dissipation gap; 16. First thermal pad; 17. Second thermal pad; 18. Heat distribution plate; 19. Heat insulation plate; 20. Button; 21. Touchpad; 22. Battery; 111. First housing; 112. Second housing; 113. Cavity; 114. Air inlet; 115. Air outlet; 116. Control area; 121. Chip; 131. Air intake; 132. Air exhaust; 181. Air supply hole. Detailed Implementation

[0019] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "fixed," "linked," "communicated," "abutting," "clamping," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations (or steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but it may also have additional steps not included in the figures. The process may correspond to a method, function, procedure, subroutine, subroutine, etc.

[0023] Unless otherwise stated or defined, the term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0024] In the field of smart wearable devices, smart glasses, as a product with great potential, are gradually entering people's lives. Currently, in order to make smart glasses smaller and more portable, most existing smart glasses on the market only integrate display functions. Although they can present information to users to a certain extent, they lack independent information processing capabilities. This means that during use, smart glasses must be connected to an external main control device, which relies on the main control device to complete complex information data processing tasks and transmit the processed image information to the smart glasses for display.

[0025] However, existing main control devices bear heavy computational tasks with extremely high computational loads, inevitably generating a large amount of heat during operation. If this heat cannot be dissipated effectively and in a timely manner, it will seriously affect the performance and stability of the main control device, and may even lead to equipment damage. Therefore, main control devices usually require built-in heat dissipation devices, which generally use a combination of cooling fans and heat sinks.

[0026] However, current main control devices have significant shortcomings in their heat dissipation design. Their heatsinks are attached to the motherboard, and a fan is used to blow air onto the heatsink to cool the motherboard. This cooling method is inefficient, resulting in unsatisfactory heat dissipation. Under prolonged high-load operation, the internal temperature of the main control device continuously rises, affecting the normal operation of the device, reducing its lifespan and reliability, and becoming a key issue restricting the performance improvement and widespread application of smart glasses and related main control devices.

[0027] To address the aforementioned issues, this application's main control device achieves secondary cooling by rationally arranging the installation positions between the fan, heat sink, and motherboard, significantly improving the heat dissipation efficiency of the main control device, ensuring its normal operation, and enhancing its service life and reliability.

[0028] For ease of description, the up and down directions mentioned below are... Figure 3 Its vertical direction is consistent with the horizontal direction or the direction of the first width mentioned below. Figure 3 Its left and right directions are consistent, and the direction of the second width mentioned below is the same as... Figure 3 Their projection directions are consistent.

[0029] like Figures 1 to 5 As shown, this embodiment provides a main control device, which is mainly used for electrical connection with smart glasses. The main control device can perform information data processing and send image information to the smart glasses.

[0030] The main control unit includes a housing 11, a motherboard 12, a fan 13, and a heat sink 14. The motherboard 12 is a circuit board (PCB) integrating various electronic components for information and data processing. By electrically connecting the circuit board to the glasses, information data and image information can be sent to the smart glasses. The electrical connection between the motherboard 12 and the glasses can be a wired connection or a wireless communication connection such as Bluetooth. The fan 13, also known as a blower, provides power for airflow. The heat sink 14 has excellent heat conduction performance, enabling rapid heat transfer from the motherboard 12 and the electronic components on it.

[0031] The housing 11 has a cavity 113, an air inlet 114, and an air outlet 115. The cavity 113 is connected to the outside of the housing 11 through the air inlet 114 and the air outlet 115. The housing 11 is square, and the motherboard 12, fan 13, and heat sink 14 are all located inside the cavity 113 of the housing 11. Under the action of the fan 13, cool air from outside the housing 11 enters the cavity 113 through the air inlet 114. The cool air absorbs the heat inside the cavity 113 and is then discharged to the outside of the housing 11 through the air outlet 115, achieving circulating cooling and heat dissipation.

[0032] When the fan 13, motherboard 12, and heat sink 14 of this application are installed, the fan 13 and motherboard 12 are arranged at intervals, so that there is a heat dissipation gap 15 between the fan 13 and the motherboard 12. The heat sink 14 is attached to the motherboard 12, so that the heat generated by the motherboard 12 and the electronic components on it can be transferred to the heat sink 14.

[0033] The fan 13 has an air intake 131 and an exhaust 132. Cool air enters the fan 13 through the air intake 131 and is then exhausted through the exhaust 132. The air inlet 114, the heat dissipation gap 15, the air intake 131, the exhaust 132, and the air outlet 115 are sequentially connected to form a heat dissipation channel, allowing air to flow along the channel. The radiator 14 is located within the heat dissipation channel, between the exhaust 132 and the air outlet 115.

[0034] Thus, the air inlet 114, heat dissipation gap 15, and air intake 131 of this application are sequentially connected, allowing cold air from outside the housing 11 to enter the cavity 113 through the air inlet 114, then enter the heat dissipation gap 15, and then enter the fan 13 through the air intake 131. During this process, the air intake 131 of the fan 13 can carry away the heat on the motherboard 12, achieving the first cooling of the motherboard 12. Since some heat on the motherboard 12 is still transferred to the heat sink 14, the air entering the fan 13 is blown onto the heat sink 14 through the exhaust 132 of the fan 13, allowing the air to carry away the heat on the heat sink 14 and be discharged through the air outlet 115, achieving the second cooling of the motherboard 12. After the above-mentioned two cooling processes, the main control device of this embodiment greatly improves the heat dissipation efficiency, ensures the normal operation of the main control device, and improves the service life and reliability of the main control device.

[0035] In one embodiment, the motherboard 12 has a chip 121, and a heat sink 14 abuts against the chip 121. The chip 121 mainly undertakes heavy computing tasks, with a huge amount of computing power and greater heat generation than other electronic components. Therefore, it is necessary to abut the heat sink 14 against the chip 121 to improve the heat dissipation efficiency of the chip 121.

[0036] Furthermore, the main control device also includes a first thermal pad 16, a second thermal pad 17, and a heat-dampening plate 18 sandwiched between the first thermal pad 16 and the second thermal pad 17. The heat sink 14 abuts against the first thermal pad 16, and the second thermal pad 17 abuts against the chip 121.

[0037] Both the first thermal pad 16 and the second thermal pad 17 are thermally conductive silicone pads. These silicone pads have a high thermal conductivity, effectively reducing the temperature difference between the chip 121 and the heat sink 14, thus improving heat dissipation efficiency. Their soft and adhesive material not only provides insulation and shock absorption but also fills gaps in the contact surfaces, preventing air from hindering heat transfer and significantly improving heat conduction efficiency.

[0038] Because the electronic components on the motherboard 12 are densely distributed, heat is difficult to conduct quickly and evenly to the heat sink 14, resulting in unsatisfactory heat dissipation in existing main control devices. This application achieves efficient and uniform heat distribution by setting up a heat spreader 18, which has strong thermal conductivity, effectively avoids local overheating, and extends the lifespan of electronic components such as chip 121.

[0039] This application achieves indirect contact between the heat sink 14 and the motherboard 12 by setting a first thermal pad 16, a heat spreader 18, and a second thermal pad 17. By utilizing the high thermal conductivity of the first thermal pad 16, the heat spreader 18, and the second thermal pad 17, the heat dissipation efficiency of the chip 121 is improved.

[0040] Optionally, the heat distribution plate 18 is provided with air supply holes 181, and the air intake 131 of the fan 13 is located at the air supply holes 181. The air inlet 114, air supply holes 181, and air intake 131 are connected in sequence. The heat distribution plate 18 has a large area, which can divide the cavity 113 and prevent heat dissipation. The air supply holes 181 on the heat distribution plate 18 enable ventilation. The air intake 131 of the fan 13 is oriented and located at the air supply holes 181. The main board 12 is located below the air supply holes 181, so that the air intake 131 of the fan 13 carries away the heat on the main board 12 through the air supply holes 181.

[0041] Optionally, the heat-dissipating plate 18 is installed on the inner wall of the cavity 113 by connecting fasteners. Specifically, in order to prevent the heat of the heat-dissipating plate 18 from being transferred to the box 11, the heat-dissipating plate 18 is installed on the inner wall of the cavity 113 by a heat insulation plate 19. The heat insulation plate 19 is installed on the box 11 by connecting fasteners such as screws and rivets. The installation of the heat-dissipating plate 18 on the heat insulation plate 19 avoids the box 11 from being too hot and causing burns to the user.

[0042] In one embodiment, the motherboard 12 has a first width and a second width that are perpendicular to each other, the first width being... Figure 3 The width in the left and right directions, the second width is Figure 3 The width of the projection direction. The fan 13 and the heat sink 14 are both located between the air inlet 114 and the air outlet 115, and the fan 13 and the heat sink 14 are arranged sequentially along the direction of the first width.

[0043] Multiple air inlets 114 are arranged sequentially at intervals along the direction of the second width, and multiple air outlets 115 are arranged sequentially at intervals along the direction of the second width, thereby increasing the air intake and air exhaust volume and thus improving the heat dissipation efficiency.

[0044] The fan 13 and heat sink 14 are arranged from left to right. All air inlets 114 are located at the left end of the box 11, and all air outlets 115 are located at the right end of the box 11, so that the fan 13 and heat sink 14 can dissipate heat and cool down the surface of the motherboard 12 and all electronic components on the surface, thereby improving the heat dissipation effect.

[0045] Optionally, the air intake 131 faces the motherboard 12, and the exhaust 132 faces the heatsink 14. The air intake 131 is aimed directly at the surface of the motherboard 12, quickly drawing away the heat from the surface of the motherboard 12. The air exhausted from the exhaust 132 blows directly onto the heatsink 14, and finally is quickly exhausted from the exhaust vent 115. Through the above-mentioned secondary cooling process, the heat dissipation efficiency is greatly improved.

[0046] Furthermore, the radiator 14 includes multiple heat sinks arranged at intervals to increase the heat dissipation area, thereby improving heat dissipation efficiency and making the cooling effect more obvious. A flow channel is formed between any two adjacent heat sinks to guide the airflow. One end of each flow channel is connected to the exhaust port 132 of the fan 13, and the other end of each flow channel is connected to the air outlet 115 of the casing 11, which improves the heat dissipation efficiency.

[0047] In one embodiment, the housing 11 includes a first housing 111 and a second housing 112. The first housing 111 and the second housing 112 are snapped together to form a cavity 113. The air inlet 114 and the air outlet 115 are both located on the first housing 111. When installing the fan 13, the motherboard 12, and the heat sink 14, they can be installed with the first housing 111 as a reference, which facilitates the installation and positioning of the fan 13, the motherboard 12, and the heat sink 14.

[0048] Furthermore, a battery 22 is also installed inside the cavity 113 of the box 11. The battery 22 is installed inside the cavity 113 of the box 11 via a heat insulation bracket. The battery 22 and the fan 13 are both electrically connected to the motherboard 12. The battery 22 supplies power to the fan 13 and the motherboard 12, which is more convenient to carry than the method of always being powered by an external power source.

[0049] Optionally, the outer side of the housing 11 is provided with a control area 116, which is equipped with buttons 20 and / or touchpad 21. The main control device can be controlled by the buttons 20 and / or touchpad 21, which facilitates information processing between the main control device and devices such as smart glasses.

[0050] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A master device, characterized by include: The box body (11) has a cavity (113), an air inlet (114), and an air outlet (115); the cavity (113) is connected to the outside of the box body (11) through the air inlet (114) and the air outlet (115); The motherboard (12) is located inside the cavity (113); A fan (13) is disposed inside the cavity (113); a heat dissipation gap (15) is provided between the fan (13) and the motherboard (12); as well as A heat sink (14) is disposed inside the cavity (113) and attached to the motherboard (12); The fan (13) has an air intake (131) and an air exhaust (132). The air inlet (114), the heat dissipation gap (15), the air intake (131), the air exhaust (132), and the air outlet (115) are connected in sequence to form a heat dissipation channel. The heat sink (14) is located in the heat dissipation channel and between the air exhaust (132) and the air outlet (115).

2. The master device of claim 1, wherein, The motherboard (12) is provided with a chip (121), and the heat sink (14) abuts against the chip (121).

3. The master device of claim 2, wherein, It also includes a first thermal pad (16), a second thermal pad (17), and a heat spreader (18) sandwiched between the first thermal pad (16) and the second thermal pad (17); the heat sink (14) abuts against the first thermal pad (16), and the second thermal pad (17) abuts against the chip (121).

4. The master device of claim 3, wherein, The heat distribution plate (18) is provided with an air supply hole (181), and the air intake (131) of the fan (13) is located at the air supply hole (181). The air inlet (114), the air supply hole (181), and the air intake (131) are connected in sequence.

5. The master device of claim 3, wherein, It also includes a heat insulation plate (19); the heat equalization plate (18) is installed on the inner wall of the cavity (113) by connecting fasteners and the heat insulation plate (19).

6. The master device according to any one of claims 1 to 5, characterized in that, The motherboard (12) has a first width and a second width that are perpendicular to each other. The fan (13) and the heat sink (14) are both located between the air inlet (114) and the air outlet (115), and the fan (13) and the heat sink (14) are arranged sequentially along the direction of the first width. The air inlet (114) has multiple holes and is arranged at intervals along the direction of the second width, and the air outlet (115) has multiple holes and is arranged at intervals along the direction of the second width.

7. The master device according to any one of claims 1 to 5, wherein The air intake (131) faces the motherboard (12), and the air exhaust (132) faces the heat sink (14).

8. The master device according to any one of claims 1 to 5, characterized in that, The radiator (14) includes a plurality of heat sinks arranged at intervals in sequence. A flow channel is formed between any two adjacent heat sinks. One end of each flow channel is connected to the exhaust port (132) of the fan (13), and the other end of each flow channel is connected to the air outlet (115) of the box body (11).

9. The master device according to any one of claims 1 to 5, wherein, The box body (11) includes a first shell (111) and a second shell (112); the first shell (111) and the second shell (112) are snapped together to form the cavity (113), and the air inlet (114) and the air outlet (115) are both located on the first shell (111).

10. The master device according to any one of claims 1 to 5, wherein, The outer side of the box (11) is provided with a control area (116), and the control area (116) is equipped with buttons (20) and / or touch panel (21).

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