A master device

Abstract

This application discloses a main control device, belonging to the field of device heat dissipation technology. The main control device includes a housing, a first heat insulation frame, a heat conduction frame, a second heat insulation frame, a fan, a heat sink, and a motherboard. The housing has a cavity, an air inlet, and an air outlet. A control area is provided on the outer side of the housing, with buttons and / or a touchpad. The first heat insulation frame, the heat conduction frame, and the second heat insulation frame are arranged sequentially in the cavity along a direction away from the control area. A first space is formed between the first heat insulation frame and the heat conduction frame, and a second space is formed between the heat conduction frame and the second heat insulation frame. The fan is located in the first space. The heat sink is located in the first space and abuts against the heat conduction frame. The motherboard is located in the second space and abuts against the heat conduction frame. The first space communicates with the outside of the housing through the air inlet and air outlet. This application can prevent users from being burned when operating the main control device by hand, improving the user experience.

Description

Technical Field

[0001] This application relates to the field of equipment heat dissipation technology, and more particularly to a main control device. Background Technology

[0002] Currently, most smart glasses on the market only integrate display functions and do not have their own information processing capabilities. These smart glasses must rely on an external main control device to complete information data processing. The main control device transmits the processed image information to the smart glasses, thereby enabling functions such as image display.

[0003] Therefore, the main control device undertakes the vast majority of computational tasks during the operation of smart glasses, resulting in a massive computational load and thus generating a significant amount of heat. However, as a handheld device, the existing heat dissipation design of the main control device has obvious flaws, with low heat dissipation efficiency. Heat cannot be effectively dissipated in a timely manner, causing the temperature of the main control device's surface, buttons, or touchpad to rise sharply. When users operate the main control device, the excessively high temperature can easily cause burns to the hands holding it, not only affecting the user experience but also posing a certain safety hazard. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a master control device that can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solution: On the one hand, a main control device is provided, including: The box body has a cavity, an air inlet, and an air outlet; the outer side of the box body is provided with a control area, which is provided with buttons and / or a touch panel. A first heat insulation frame, a heat conduction frame, and a second heat insulation frame are arranged sequentially in the cavity along a direction away from the control area; a first space is formed between the first heat insulation frame and the heat conduction frame, and a second space is formed between the heat conduction frame and the second heat insulation frame; A fan is located in the first space; A heat sink is disposed in the first space and abuts against the heat conduction frame; as well as The motherboard is located in the second space and abuts against the heat-conducting frame; The first space is connected to the outside of the box body through the air inlet and the air outlet.

[0006] Preferably, the first heat insulation frame is connected to the inner wall of the cavity, the fan is installed on the first heat insulation frame, the heat sink is connected to the heat conduction frame, and the first heat insulation frame, the heat conduction frame, the motherboard, and the second heat insulation frame are connected in sequence along the direction away from the control area to avoid the heat conduction frame being directly connected to the box body, which would cause heat to be transferred to the box body.

[0007] Preferably, the main control device further includes a third heat insulation frame; there is a heat insulation gap between the heat conduction frame and the inner wall of the cavity, the first heat insulation frame and / or the second heat insulation frame are connected to the third heat insulation frame, the third heat insulation frame is connected to the heat conduction frame and covers the heat insulation gap, so as to prevent high-temperature gas that needs to be discharged outside the box from flowing into the second space through the heat insulation gap, thus ensuring the heat dissipation effect.

[0008] Preferably, the first heat insulation frame is provided with a first protrusion and / or the heat conduction frame is provided with a second protrusion. The first protrusion is connected to the heat conduction frame by connecting fasteners and / or the second protrusion is connected to the first heat insulation frame by connecting fasteners, thereby reducing the contact area between the first heat insulation frame and the heat conduction frame and further improving the heat insulation effect.

[0009] Preferably, when the first heat insulation frame is provided with a first protrusion and the heat conduction frame is provided with a second protrusion, the first protrusion and the second protrusion are sleeved together and connected by the connecting fastener to realize the connection between the first heat insulation frame and the heat conduction frame.

[0010] Preferably, both the first heat insulation frame and the second heat insulation frame are made of heat insulation materials or are covered with a heat insulation layer, which prevents users from being burned when they operate the main control device, eliminates safety hazards, and improves the user experience.

[0011] Preferably, the main control device further includes a battery; a third space is formed between the second heat insulation frame and the inner wall of the cavity, the battery is disposed in the third space and electrically connected to the motherboard and the fan, making it more convenient to carry.

[0012] Preferably, the main control device further includes a heat insulation sheet; the heat insulation sheet is disposed in the third space and is sandwiched between the battery and the inner wall of the cavity, which can prevent the heat of the battery from being transferred to the outer surface of the box, eliminate safety hazards, and improve the user experience.

[0013] Preferably, the fan and the heat sink are sequentially disposed between the air inlet and the air outlet. The fan has an air intake port communicating with the air inlet and an air exhaust port communicating with the air outlet. The heat conduction frame is provided with an air supply hole. The air intake port of the fan is located at the air supply hole and faces the motherboard, and the air exhaust port faces the heat sink, thereby improving heat dissipation efficiency.

[0014] Preferably, the cavity has a first inner wall and a second inner wall arranged opposite to each other, the fan and the heat sink are located between the first inner wall and the second inner wall, there are multiple air inlets arranged sequentially at intervals on the first inner wall, and there are multiple air outlets arranged sequentially at intervals on the second inner wall, thereby improving the heat dissipation effect.

[0015] Preferably, the box body includes a first shell and a second shell; the first shell and the second shell are snapped together and together form the cavity, the air inlet and the air outlet are both opened on the first shell, and the first heat insulation frame is installed on the first shell to facilitate the installation and positioning of the fan, motherboard and heat sink.

[0016] The beneficial effects of this application are as follows: The main control device of this application is set up in the box body with a first heat insulation frame, a heat conduction frame, and a second heat insulation frame to divide it into a first space and a second space. The motherboard is set in the second space and the heat is transferred to the heat sink in the first space through the heat conduction of the heat conduction frame. The fan and heat sink in the first space are used to realize the rapid heat dissipation of the motherboard, which improves the heat dissipation efficiency. The first heat insulation frame and the heat conduction frame can effectively block the heat from being transferred to the outer surface of the box body and the buttons or touch panel on the outer surface, thereby avoiding burns to the user when the user operates the main control device, eliminating safety hazards and improving the user experience. Attached Figure Description

[0017] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0018] Figure 1 A structural schematic diagram of the main control device from one perspective; Figure 2 A structural schematic diagram of the main control equipment from another perspective; Figure 3 A half-sectional view of the main control equipment; Figure 4 A partial sectional view of the main control equipment; Figure 5 Exploded view of the main control equipment; Figure 6 This is a structural diagram of the first heat insulation frame, the heat conduction frame, the second heat insulation frame, and the third heat insulation frame.

[0019] Explanation of reference numerals in the attached figures: 11. Box body; 12. Buttons; 13. Touch panel; 14. First heat insulation frame; 15. Heat conduction frame; 16. Second heat insulation frame; 17. Third heat insulation frame; 18. Heat insulation sheet; 19. Battery; 20. Heat sink; 21. Motherboard; 22. Fan; 111. First housing; 112. Second housing; 113. Air inlet; 114. Air outlet; 115. Control area; 116. Cavity; 117. First space; 118. Second space; 119. Third space; 141. First boss; 151. Second boss; 152. Air outlet; 211. Chip; 221. Air intake; 222. Air exhaust. Detailed Implementation

[0020] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "fixed," "linked," "communicated," "abutting," "clamping," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the operations (or steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but it may also have additional steps not included in the figures. The process may correspond to a method, function, procedure, subroutine, subroutine, etc.

[0024] Unless otherwise stated or defined, the term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0025] In the field of smart wearable devices, smart glasses, as a highly innovative product, are gradually entering people's lives. Currently, most smart glasses on the market only integrate display functions and do not have their own information processing capabilities. In actual use, these smart glasses must rely on an external main control device to complete information data processing. The main control device transmits the processed image information to the smart glasses, thereby realizing functions such as image display.

[0026] However, this design pattern brings many problems. The main control device undertakes the vast majority of computing tasks during the operation of smart glasses, resulting in a huge amount of computation and thus generating a lot of heat. In order to maintain the normal operation of the device and avoid performance degradation or even damage due to overheating, existing main control devices usually have built-in heat dissipation devices, generally using a combination of cooling fans and heat sinks.

[0027] However, as a handheld device, the main control device's existing heat dissipation design has significant flaws, resulting in low heat dissipation efficiency. During prolonged operation, heat cannot be effectively dissipated in a timely manner, causing a rapid increase in temperature on the surface of the main control device, its buttons, or the touchpad. When users operate the main control device, the excessively high temperature can easily cause burns to their hands, affecting not only the user experience but also posing a safety hazard. Therefore, improving the design of smart glasses and their accompanying main control device to enhance heat dissipation efficiency and avoid the risk of burns has become an urgent technical problem to be solved.

[0028] To address the aforementioned issues, the main control device of this application can improve the thermal conductivity and heat dissipation efficiency within the casing, thus avoiding the risk of burns when the user operates the main control device by hand.

[0029] For ease of description, the up and down directions mentioned below are... Figure 3 Its vertical direction is consistent with the horizontal direction mentioned below. Figure 3 Its left and right directions are consistent.

[0030] like Figures 1 to 6 As shown, this embodiment provides a main control device, which is mainly used for electrical connection with smart glasses. The main control device can perform information data processing and send image information to the smart glasses.

[0031] The main control equipment includes a housing 11, a first heat insulation frame 14, a heat conduction frame 15, a second heat insulation frame 16, a fan 22, a heat sink 20, and a motherboard 21.

[0032] The motherboard 21 is a circuit board (PCB) that integrates various electronic components to process information and data. By electrically connecting the circuit board to the glasses, information, data, and image information can be sent to the smart glasses. The electrical connection between the motherboard 21 and the glasses can be a wired connection or a wireless communication connection such as Bluetooth.

[0033] Fan 22, also known as a fan, provides power for airflow. Heat sink 20 has good heat conduction performance and can quickly transfer the heat generated by motherboard 21 and electronic components on motherboard 21.

[0034] The housing 11 has a cavity 116, an air inlet 113, and an air outlet 114. The cavity 116 is connected to the outside of the housing 11 through the air inlet and the air outlet 114. The housing 11 is square, and the motherboard 21, fan 22, and heat sink 20 are all located inside the cavity 116 of the housing 11. Under the action of the fan 22, cool air from outside the housing 11 enters the cavity 116 through the air inlet 113. The cool air absorbs the heat inside the cavity 116 and is then exhausted to the outside of the housing 11 through the air outlet 114, achieving circulating heat dissipation and cooling.

[0035] The outer side of the housing 11 has a control area 115, which includes buttons 12 and / or a touchpad 13. The control area 115 can be a region of the outer side of the housing 11 or the entire outer side. The main control device can be controlled via the buttons 12 and / or the touchpad, facilitating information processing between the main control device and devices such as smart glasses.

[0036] The first heat insulation frame 14, the heat conduction frame 15, and the second heat insulation frame 16 are arranged sequentially within the cavity 116 in a direction away from the control area 115. The first heat insulation frame 14 is located within the cavity 116 near the inner wall of the button 12 or the touch panel 13. A first space 117 is formed between the first heat insulation frame 14 and the heat conduction frame 15, and a second space 118 is formed between the heat conduction frame 15 and the second heat insulation frame 16. The first space 117 is connected to the outside of the housing 11 through an air inlet 113 and an air outlet 114.

[0037] Fan 22 is located in the first space 117 to provide power for airflow within the first space 117. Heat sink 20 is located in the first space 117 and abuts against heat conduction frame 15. Motherboard 21 is located in the second space 118 and abuts against heat conduction frame 15, so that heat on motherboard 21 can be conducted to heat sink 20 through heat conduction frame 15. Finally, fan 22 blows cool air towards heat sink 20, so that the cool air carrying heat flows out of air outlet 114 to the outside of box 11, realizing heat dissipation and cooling of the main control device.

[0038] Thus, this application achieves heat insulation through the first heat insulation frame 14 and the second heat insulation frame 16, effectively preventing heat transfer to the outer surface of the housing 11 and the buttons 12 or touchpad 13 on the outer surface. This avoids burns to the user when operating the main control device, eliminates safety hazards, and improves the user experience. Simultaneously, the heat on the motherboard 21 located between the first heat insulation frame 14 and the second heat insulation frame 16 is efficiently dissipated through the cooperation of the heat conduction frame 15, fan 22, and heat sink 20, improving heat dissipation efficiency.

[0039] Optionally, since the chip 211 on the motherboard 21 mainly undertakes heavy computing tasks with a huge amount of computing power and generates more heat than other electronic components, this application attaches the heat sink 20 to the chip 211 on the motherboard 21 to improve the heat dissipation efficiency of the chip 211.

[0040] Furthermore, the first heat insulation frame 14 is connected to the inner wall of the cavity 116, the fan 22 is installed on the first heat insulation frame 14, and the heat sink 20 is connected to the heat conduction frame 15. The first heat insulation frame 14, the heat conduction frame 15, the motherboard 21, and the second heat insulation frame 16 are connected in sequence along the direction away from the control area 115 to avoid the heat conduction frame 15 being directly connected to the box 11, which would cause heat to be transferred to the box 11.

[0041] Optionally, to achieve better heat conduction in the main control device, the main control device of this application further includes a first thermal pad and a second thermal pad. The thermal pad 15 is a heat-dissipating plate and is sandwiched between the first thermal pad and the second thermal pad. The heat sink 20 abuts against the first thermal pad, and the second thermal pad abuts against the chip 211.

[0042] Both the first and second thermal pads are made of thermally conductive silicone. The high thermal conductivity of the silicone pads effectively reduces the temperature difference between the chip 211 and the heatsink 20, improving heat dissipation efficiency. The material is soft and adhesive, providing insulation and shock absorption, and filling gaps in the contact surfaces to prevent air from hindering heat transfer, thus significantly improving heat conduction efficiency.

[0043] Because the electronic components on the motherboard 21 are densely distributed, heat is difficult to conduct quickly and evenly to the heat sink 20, resulting in unsatisfactory heat dissipation in existing main control devices. The heat dissipation frame 15 of this application is a heat-dissipating plate, which can achieve efficient and uniform heat distribution, has strong thermal conductivity, effectively avoids local overheating, and extends the life of electronic components such as chip 211.

[0044] Thus, this application achieves indirect contact between the heat sink 20 and the motherboard 21 by setting a first thermal pad, a thermal bracket 15, and a second thermal pad, and improves the heat dissipation efficiency of the chip 211 by utilizing the high thermal conductivity of the first thermal pad, the thermal bracket 15, and the second thermal pad.

[0045] Optionally, the main control device also includes a third heat insulation frame 17. A heat insulation gap exists between the heat-conducting frame 15 and the inner wall of the cavity 116. The first heat insulation frame 14 and / or the second heat insulation frame 16 are connected to the third heat insulation frame 17, and the third heat insulation frame 17 is connected to the heat-conducting frame 15 and covers the heat insulation gap. Specifically, in this embodiment, both the first heat insulation frame 14 and the second heat insulation frame 16 are connected to the third heat insulation frame 17 via hooks, screws, rivets, or other fasteners. One end of the third heat insulation frame 17 is connected to the heat-conducting frame 15, and the other end of the third heat insulation frame 17 abuts against the inner wall of the cavity 116. The third heat insulation frame 17 completely covers the heat insulation gap.

[0046] Because the contact between the heat-conducting frame 15 and the box body 11 would cause heat to be transferred to the outside of the box body 11, potentially causing burns to the user, a small gap exists between the heat-conducting frame 15 and the inner wall of the cavity 116. However, the gap between the end of the heat-conducting frame 15 near the air outlet 114 and the inner wall of the cavity 116 would cause high-temperature gas to flow to areas outside the first space 117 within the cavity 116, for example, flowing from the heat insulation gap between the heat-conducting frame 15 and the inner wall of the cavity 116 to the second space 118. This application addresses this by providing a third heat insulation frame 17 to cover the heat insulation gap. This not only utilizes the heat insulation performance of the third heat insulation frame 17 to prevent heat from the heat-conducting frame 15 from being transferred to the outside of the box body 11, but also prevents high-temperature gas that needs to be exhausted outside the box body 11 from flowing from the heat insulation gap to the second space 118, thus ensuring effective heat dissipation.

[0047] In one embodiment, the first heat insulation frame 14 is provided with a first boss 141 and / or the heat conduction frame 15 is provided with a second boss 151. The first boss 141 is connected to the heat conduction frame 15 by connecting fasteners and / or the second boss 151 is connected to the first heat insulation frame 14 by connecting fasteners. By using connecting fasteners such as screws and rivets passing through the first boss 141 and / or the second boss 151, the first heat insulation frame 14 and the heat conduction frame 15 are connected. By using the method of the first boss 141 abutting against the heat conduction frame 15 and the second boss 151 abutting against the first heat insulation frame 14, the contact area between the first heat insulation frame 14 and the heat conduction frame 15 can be reduced, further improving the heat insulation effect.

[0048] Furthermore, when the first heat insulation frame 14 is provided with a first boss 141 and the heat conduction frame 15 is provided with a second boss 151, the first boss 141 and the second boss 151 are sleeved together and connected by connecting fasteners. Specifically, the first heat insulation frame 14 is located above the heat conduction frame 15. The first boss 141 on the first heat insulation frame 14 extends downward, and the second boss 151 on the heat conduction frame 15 extends downward and is provided with a sleeve groove. The first boss 141 is inserted downward into the sleeve groove, and then connected to the first boss 141 and the second boss 151 by fasteners such as screws and rivets, thereby realizing the connection between the first heat insulation frame 14 and the heat conduction frame 15.

[0049] Optionally, there are multiple first protrusions 141 and two protrusions 151, which correspond one-to-one, to improve the connection stability between the first heat insulation frame 14 and the heat conduction frame 15.

[0050] Optionally, the first heat insulation frame 14 and the second heat insulation frame 16 are both made of heat insulation material or are covered with a heat insulation layer, which can effectively block heat from being transferred to the outer surface of the box 11 and the buttons 12 or touch panel 13 on the outer surface, thereby preventing users from being burned when they operate the main control device, eliminating safety hazards and improving the user experience.

[0051] In one embodiment, the main control device further includes a battery 19. A third space 119 is formed between the second heat insulation frame 16 and the inner wall of the cavity 116. The battery 19 is disposed in the third space 119 and electrically connected to the motherboard 21 and the fan 22, thereby providing power to electronic components such as the motherboard 21 and the fan 22. This method is more convenient to carry than the method of always using an external power supply.

[0052] Optionally, the main control device also includes a heat insulation sheet 18. The heat insulation sheet 18 is located in the third space 119 and is sandwiched between the battery 19 and the inner wall of the cavity 116. The battery 19 is wrapped together by the second heat insulation frame 16 and the heat insulation sheet 18, which can prevent the heat of the battery 19 from being transferred to the outer surface of the box 11, eliminate safety hazards, and improve the user experience.

[0053] In one embodiment, the fan 22 and the heat sink 20 are sequentially disposed between the air inlet 113 and the air outlet 114. The fan 22 has an air intake 221 communicating with the air inlet 113 and an air outlet 222 communicating with the air outlet 114. The heat conduction frame 15 is provided with an air supply hole 152. The air intake 221 of the fan 22 is located at the air supply hole 152 and faces the motherboard 21, while the air outlet 222 faces the heat sink 20. The air intake 221 of the fan 22 can be used to draw away the heat on the motherboard 21 to achieve primary heat dissipation. Then, the fan 22 and the heat sink 20 are used together to achieve secondary heat dissipation, thereby improving the heat dissipation efficiency.

[0054] Optionally, in this application, the fan 22 and the motherboard 21 are spaced apart, and a heat dissipation gap is formed between the air intake 221 of the fan 22 and the motherboard 21. The air inlet 113, the heat dissipation gap, and the air intake 221 are connected in sequence, so that the cold air from outside the housing 11 enters the cavity 116 through the air inlet 113 and then enters the heat dissipation gap, and then enters the fan 22 through the air intake 221. During this process, the air intake 221 of the fan 22 can carry away the heat on the motherboard 21, achieving the first cooling of the motherboard 21. Since some heat on the motherboard 21 is still transferred to the heat sink 20, the air entering the fan 22 is blown onto the heat sink 20 through the exhaust 222 of the fan 22, so that the air carries away the heat on the heat sink 20 and is discharged from the air outlet 114, achieving the second cooling of the motherboard 21. After the above-mentioned two cooling processes, the main control device of this application embodiment greatly improves the heat dissipation efficiency, ensures the normal operation of the main control device, and improves the service life and reliability of the main control device.

[0055] Thus, the air exhausted from the exhaust port 222 of the fan 22 can directly blow onto the heatsink 20, and finally be quickly discharged from the exhaust vent 114. Through this secondary cooling process, the heat dissipation efficiency is greatly improved. The intake port 221 is aligned with the surface of the motherboard 21, quickly absorbing heat from the surface of the motherboard 21. The air exhausted from the exhaust port 222 blows directly onto the heatsink 20, and finally is quickly discharged from the exhaust vent 114. Through this secondary cooling process, the heat dissipation efficiency is greatly improved.

[0056] Optionally, the cavity 116 has a first inner wall and a second inner wall disposed opposite to each other, the first inner wall being located on the left side of the housing 11 and the second inner wall being located on the right side of the housing 11. The fan 22 and the heat sink 20 are located between the first inner wall and the second inner wall. Multiple air inlets 113 are arranged sequentially and at intervals on the first inner wall, and multiple air outlets 114 are arranged sequentially and at intervals on the second inner wall, thereby increasing the air intake and exhaust volume. In this application, all air inlets 113 are located on the left side of the housing 11, and all air outlets 114 are located on the right side of the housing 11, so that the fan 22 and the heat sink 20 can dissipate heat and cool down the surface of the motherboard 21 and all electronic components on the surface, thereby improving the heat dissipation effect.

[0057] In one embodiment, the housing 11 includes a first housing 111 and a second housing 112. The first housing 111 and the second housing 112 are snapped together to form a cavity 116. An air inlet 113 and an air outlet 114 are both formed on the first housing 111, and a first heat insulation frame 14 is mounted on the first housing 111. The first heat insulation frame 14, the heat conduction frame 15, the second heat insulation frame 16, the fan 22, the motherboard 21, and the heat sink 20 can be installed with the first housing 111 as a reference, which facilitates the installation and positioning of the fan 22, the motherboard 21, and the heat sink 20.

[0058] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A master control device, characterized in that, include: The box body (11) has a cavity (116), an air inlet (113), and an air outlet (114); the outer side of the box body (11) is provided with a control area (115), and the control area (115) is provided with buttons (12) and / or a touch panel (13); A first heat insulation frame (14), a heat conduction frame (15), and a second heat insulation frame (16) are arranged sequentially in the cavity (116) in a direction away from the control area (115); a first space (117) is formed between the first heat insulation frame (14) and the heat conduction frame (15), and a second space (118) is formed between the heat conduction frame (15) and the second heat insulation frame (16); A fan (22) is provided in the first space (117); A radiator (20) is disposed in the first space (117) and abuts against the heat conduction frame (15); as well as The motherboard (21) is located in the second space (118) and abuts against the heat conduction frame (15); The first space (117) is connected to the outside of the box (11) through the air inlet (113) and the air outlet (114).

2. The main control device according to claim 1, characterized in that, The first heat insulation frame (14) is connected to the inner wall of the cavity (116), the fan (22) is installed on the first heat insulation frame (14), the heat sink (20) is connected to the heat conduction frame (15), and the first heat insulation frame (14), the heat conduction frame (15), the motherboard (21), and the second heat insulation frame (16) are connected in sequence along the direction away from the control area (115).

3. The main control device according to claim 2, characterized in that, It also includes a third heat insulation frame (17); there is a heat insulation gap between the heat-conducting frame (15) and the inner wall of the cavity (116), the first heat insulation frame (14) and / or the second heat insulation frame (16) are connected to the third heat insulation frame (17), and the third heat insulation frame (17) is connected to the heat-conducting frame (15) and covers the heat insulation gap.

4. The main control device according to claim 2, characterized in that, The first heat insulation frame (14) is provided with a first boss (141) and / or the heat conduction frame (15) is provided with a second boss (151). The first boss (141) is connected to the heat conduction frame (15) by connecting fasteners and / or the second boss (151) is connected to the first heat insulation frame (14) by connecting fasteners.

5. The main control device according to claim 4, characterized in that, When the first heat insulation frame (14) is provided with a first boss (141) and the heat conduction frame (15) is provided with a second boss (151), the first boss (141) and the second boss (151) are sleeved together and connected by the connecting fastener.

6. The main control device according to any one of claims 1 to 5, characterized in that, The first heat insulation frame (14) and the second heat insulation frame (16) are both made of heat insulation material or are covered with heat insulation layer.

7. The main control device according to any one of claims 1 to 5, characterized in that, It also includes a battery (19) and a heat insulation sheet (18); a third space (119) is formed between the second heat insulation frame (16) and the inner wall of the cavity (116), the battery (19) is disposed in the third space (119) and electrically connected to the motherboard (21) and the fan (22); the heat insulation sheet (18) is disposed in the third space (119) and is sandwiched between the battery (19) and the inner wall of the cavity (116).

8. The main control device according to any one of claims 1 to 5, characterized in that, The fan (22) and the heat sink (20) are sequentially disposed between the air inlet (113) and the air outlet (114). The fan (22) has an air intake (221) communicating with the air inlet (113) and an air outlet (222) communicating with the air outlet (114). The heat conduction frame (15) is provided with an air supply hole (152). The air intake (221) of the fan (22) is located at the air supply hole (152) and faces the motherboard (21). The air outlet (222) faces the heat sink (20).

9. The main control device according to any one of claims 1 to 5, characterized in that, The cavity (116) has a first inner wall and a second inner wall arranged opposite to each other. The fan (22) and the radiator (20) are located between the first inner wall and the second inner wall. There are multiple air inlets (113) arranged sequentially and at intervals on the first inner wall, and there are multiple air outlets (114) arranged sequentially and at intervals on the second inner wall.

10. The main control device according to any one of claims 1 to 5, characterized in that, The box body (11) includes a first shell (111) and a second shell (112); the first shell (111) and the second shell (112) are snapped together and together enclose the cavity (116), the air inlet (113) and the air outlet (114) are both opened on the first shell (111), and the first heat insulation frame (14) is installed on the first shell (111).

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