A chip heat spreader structure with fast thermal conduction

Abstract

This utility model relates to the field of chip heat sink technology, specifically to a chip heat sink structure with rapid heat conduction; it includes a PCB board body, a chip body, and a heat dissipation mechanism. The heat dissipation mechanism includes an insulating bracket, a heat transfer copper sheet, a heat sink body, arc-shaped heat conduction fins, and an auxiliary heat conduction device. Thermal grease is filled between the heat transfer copper sheet and the heat sink body. In this application, the thermal grease structure reduces the thickness of the heat conduction part after the heat transfer copper sheet contacts the chip body and improves the thermal conductivity, which helps to reduce the interface thermal resistance between the chip and the heat sink body. Finally, the heat conduction sheet, arc-shaped heat conduction fins, and auxiliary heat conduction device work together to quickly dissipate the heat of the chip body during operation, thereby solving the problem that the heat transfer capacity of traditional chip heat sink structures is limited, and the heat on the chip cannot be dissipated quickly and effectively, which seriously affects the working stability of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of chip heat sink technology, and in particular to a chip heat sink structure with rapid heat conduction. Background Technology

[0002] Most electronic devices in the current technology use PCB boards for control, and corresponding control chips are set on the PCB board. Modern chips use CMOS technology, and electrical energy is used to perform calculations through high-frequency switching of transistors, with instantaneous power consumption reaching tens of watts. This energy conversion process inevitably generates heat, especially under high load scenarios. Heat accumulation can cause the device temperature to rise rapidly. If the heat is not dissipated in time, it will seriously affect the stability of the circuit board.

[0003] Existing heatsink design: Utilizing the compression properties of thermal pads, bosses are directly machined onto the heatsink, and heat is dissipated through contact with the thermal pads. This is sufficient for lower power devices. However, when the power of a single chip reaches 20W or more, the thermal pads become too thick, resulting in higher thermal resistance, making this heat transfer method insufficient for the chip's cooling requirements. Utility Model Content

[0004] The purpose of this invention is to provide a chip heat sink structure that conducts heat quickly, in order to solve the problem that traditional chip heat sink structures have limited heat transfer capacity, and the heat on the chip cannot be dissipated quickly and effectively, which seriously affects the working stability of the circuit board.

[0005] To achieve the above objectives, this utility model provides a chip heat sink structure with rapid heat conduction, including a PCB board body, on which a chip body is connected, and a heat dissipation mechanism. The heat dissipation mechanism includes an insulating bracket, a heat transfer copper sheet, a heat sink body, arc-shaped heat conduction fins, and an auxiliary heat conduction device. The insulating bracket is detachably installed on the PCB board body. The heat transfer copper sheet is slidably connected to the insulating bracket, and its bottom end face is attached to the top end face of the chip body. The heat sink body is made of aluminum, and multiple arc-shaped heat conduction fins and the auxiliary heat conduction device are welded to its top end face. The heat transfer copper sheet is provided with heat-conducting sheets, and multiple heat-conducting sheets are integrally spaced apart and are at 104° to the contact plane of the heat transfer copper sheet. Thermal grease is filled between the heat transfer copper sheet and the heat sink body.

[0006] The radiator body has a positioning component on its fixing part. The positioning component is detachably connected to the insulating bracket and is arranged symmetrically.

[0007] The auxiliary heat-conducting device includes rectangular heat-conducting fins and reinforcing blocks. The rectangular heat-conducting fins are welded to the four corners of the radiator body. Multiple reinforcing blocks are integrally formed with the rectangular heat-conducting fins.

[0008] The thickness of the reinforcing block is the same as the thickness of the plurality of rectangular heat-conducting fins.

[0009] The arc-shaped heat-conducting fins are arranged in a ring at uniform intervals, and the number of fins increases sequentially from the center of the radiator body outwards in a ring.

[0010] This utility model discloses a chip heat sink structure for rapid heat conduction. A heat-transferring copper sheet is attached to the chip body, and a mounting groove is formed on the copper sheet. Thermal grease is then placed in the mounting groove. Finally, heat is conducted through multiple arc-shaped thermal fins on the heat sink body and auxiliary heat conduction devices. The thermal grease structure reduces the thickness of the heat-conducting portion after the copper sheet contacts the chip body, improving thermal conductivity and reducing the interfacial thermal resistance between the chip and the heat sink body. The combined use of the thermal sheet, arc-shaped thermal fins, and auxiliary heat conduction devices facilitates rapid heat dissipation during chip operation. This solves the problem of limited heat transfer capacity in traditional chip heat sink structures, where heat cannot be dissipated quickly and effectively, severely affecting the stability of the circuit board. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0012] Fig. 1 This is a schematic diagram of the overall structure of the fast heat conduction chip heat sink of this utility model.

[0013] Fig. 2 This is a schematic diagram of the structure of the insulating card holder of this utility model.

[0014] Fig. 3 This is a schematic diagram showing the placement of the thermal grease according to this utility model.

[0015] In the diagram: 101-PCB board body, 102-chip body, 103-insulating card holder, 104-heat transfer copper sheet, 105-heat sink body, 106-arc-shaped heat conduction fins, 107-heat conduction sheet, 108-thermal grease, 109-positioning component, 110-rectangular heat conduction fins, 111-reinforcing block. Detailed Implementation

[0016] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0017] like Figs. 1 to 3 As shown, where Fig. 1 This is a schematic diagram of the overall structure of a fast-conducting heat sink for chips. Fig. 2 This is a schematic diagram of the insulating card holder. Fig. 3 This is a schematic diagram showing the placement of thermal grease. This invention provides a chip heatsink structure for rapid heat conduction: it includes a PCB board body 101, a chip body 102, and a heat dissipation mechanism. The heat dissipation mechanism includes an insulating bracket 103, a heat transfer copper sheet 104, a heatsink body 105, arc-shaped heat-conducting fins 106, and an auxiliary heat-conducting device. Thermal grease 108 is filled between the heat transfer copper sheet 104 and the heatsink body 105. The auxiliary heat-conducting device includes rectangular heat-conducting fins 110 and reinforcing blocks 111. This solution solves the problem of limited heat transfer capacity in traditional chip heat dissipation structures, where heat on the chip cannot be dissipated quickly and effectively, severely affecting the stability of the circuit board. It is understood that the aforementioned solution enables rapid and effective heat dissipation from the chip, ensuring the stability of the circuit board.

[0018] In this embodiment, a chip body 102 is connected to the PCB board body 101.

[0019] The insulating bracket 103 is detachably mounted on the PCB board body 101. The heat transfer copper sheet 104 is slidably connected to the insulating bracket 103, and its bottom end face is in contact with the top end face of the chip body 102. The heat sink body 105 is made of aluminum, and multiple arc-shaped heat-conducting fins 106 and the auxiliary heat-conducting device are welded on its top end face. The insulating bracket 103 is fixed to the isolation connection part of the PCB board body 101 by bolts. Then, the insulating bracket 103 is made of insulating plastic. The heat transfer copper sheet 104 can be directly slidably mounted in the groove of the insulating bracket 103. One side of the groove is through, and the other side is not through for easy positioning. Finally, the heat transfer copper sheet 104 on the through side of the groove is positioned by screws. The heat sink body 105 improves the heat conduction effect through the multiple arc-shaped heat-conducting fins 106 and the auxiliary heat-conducting device. After fixing, its bottom is in contact with the top end face of the thermal grease 108.

[0020] The heat transfer copper sheet 104 is provided with heat-conducting plates 107. Multiple heat-conducting plates 107 are integrally spaced and form a 104° angle with the contact plane of the heat transfer copper sheet 104. The multiple heat-conducting plates 107 can improve the heat conduction effect of the heat transfer copper sheet 104. The insulating card holder 103 is provided with air guide stepped grooves that are aligned with the multiple heat-conducting plates 107 to facilitate air flow, thereby facilitating contact between external air and the heat-conducting plates 107. Furthermore, the heat-conducting plates 107 can conduct some of the heat conducted by the heat transfer copper sheet 104, which helps to improve the heat conduction effect and thus improve the heat dissipation efficiency.

[0021] Thermal grease 108 is used to fill the space between the heat transfer copper sheet 104 and the heat sink body 105. Since the thermal grease 108 is a paste and almost never hardens, it has excellent thermal conductivity. Therefore, using the thermal grease 108 as a heat transfer medium improves the contact between the heat transfer copper sheet 104 and the heat sink body 105, thereby significantly enhancing the heat transfer effect between them.

[0022] Secondly, a positioning element 109 is provided on the fixing part of the radiator body 105. The positioning element 109 is detachably connected to the insulating bracket 103 and is symmetrically arranged. The positioning element 109 is a positioning block structure, which facilitates the quick installation of the radiator body 105 onto the insulating bracket 103. An external hexagonal nut is heat-fused and fixed on the insulating bracket 103, which facilitates the fixing part of the radiator body 105 to be fixed by bolts.

[0023] Then, the rectangular heat-conducting fins 110 are welded to the four corners of the radiator body 105; a plurality of reinforcing blocks 111 are integrally formed with the rectangular heat-conducting fins 110. The rectangular heat-conducting fins 110 and the reinforcing blocks 111 are integrally cast using a mold and finally welded and fixed to the radiator body 105.

[0024] Furthermore, the thickness of the reinforcing block 111 is the same as the thickness of the plurality of rectangular heat-conducting fins 110. The reinforcing block 111, once installed, will help improve the stability of the rectangular heat-conducting fins 110 and simultaneously provide thermal conductivity.

[0025] Finally, the arc-shaped heat-conducting fins 106 are arranged in a ring at uniform intervals, with the number increasing sequentially from the center of the heat sink body 105 outwards in a ring-like pattern. This increased number helps to increase the number of heat-conducting points, thereby improving the heat dissipation effect.

[0026] When using this utility model to solve the problem that traditional chip heat dissipation structures have limited heat transfer capabilities, and the heat on the chip cannot be dissipated quickly and effectively, seriously affecting the working stability of the circuit board, the heat transfer copper sheet 104 is attached to the chip body 102, and a mounting groove and multiple heat-conducting fins 107 are provided on the heat transfer copper sheet 104 to improve the heat conduction effect of the heat transfer copper sheet 104. Then, the thermal grease 108 is applied in the mounting groove, and finally, heat is conducted through multiple arc-shaped heat-conducting fins 106 on the heat sink body 105 and the auxiliary heat-conducting device. The presence of the thermal grease 108 structure reduces the thickness of the thermally conductive portion after the heat-conducting copper sheet 104 contacts the chip body 102, and improves thermal conductivity. This helps reduce the interfacial thermal resistance between the chip and the heat sink body 105. Finally, the thermal conductive sheet 107, the arc-shaped thermal conductive fins 106, and the auxiliary thermal conductive device work together to quickly dissipate the heat generated by the chip body 102 during operation. This solves the problem that traditional chip heat dissipation structures have limited heat transfer capabilities, and the heat on the chip cannot be dissipated quickly and effectively, which seriously affects the stability of the circuit board.

[0027] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A fast-heat-conducting chip heat sink structure, comprising a PCB board body, wherein a chip body is connected to the PCB board body, characterized in that: It also includes a heat dissipation mechanism; The heat dissipation mechanism includes an insulating bracket, a heat transfer copper sheet, a heat sink body, arc-shaped heat conduction fins, and an auxiliary heat conduction device. The insulating bracket is detachably installed on the PCB board body. The heat transfer copper sheet is slidably connected to the insulating bracket, and its bottom end face is attached to the top end face of the chip body. The heat sink body is made of aluminum, and multiple arc-shaped heat conduction fins and the auxiliary heat conduction device are welded to its top end face. The heat transfer copper sheet is provided with heat-conducting sheets, and multiple heat-conducting sheets are integrally spaced apart and are at 104° to the contact plane of the heat transfer copper sheet. Thermal grease is filled between the heat transfer copper sheet and the heat sink body.

2. The chip heat sink structure with rapid heat conduction as described in claim 1, characterized in that... : A positioning component is provided on the fixing part of the radiator body. The positioning component is detachably connected to the insulating bracket and is arranged symmetrically.

3. The chip heat sink structure with rapid heat conduction as described in claim 1, characterized in that... : The auxiliary heat conduction device includes rectangular heat conduction fins and reinforcing blocks. The rectangular heat conduction fins are welded to the four corners of the radiator body. Multiple reinforcing blocks are integrally formed with the rectangular heat conduction fins.

4. The chip heat sink structure with rapid heat conduction as described in claim 3, characterized in that... : The thickness of the reinforcing block is the same as the thickness of the plurality of rectangular heat-conducting fins.

5. The chip heat sink structure with rapid heat conduction as described in claim 1, characterized in that... : The arc-shaped heat-conducting fins are arranged in a ring at uniform intervals, and the number of fins increases in a ring from the center of the radiator body outwards.

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