Circuit board assembly and electronic device

Abstract

The application discloses a circuit board assembly and an electronic device. The circuit board assembly comprises a first circuit board, a second circuit board and a shielding cover. The shielding cover is arranged on the first circuit board and forms a shielding cavity together with the first circuit board. An avoiding space is formed between at least part of the shielding cover and the first circuit board along the circumference of the shielding cover. The second circuit board is arranged at the avoiding space and connected with the shielding cover and the first circuit board respectively. The second circuit board is provided with multiple layers of wiring layers.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a circuit board assembly and an electronic device. Background Technology

[0002] As electronic devices become thinner, lighter, and more multifunctional, internal space is becoming increasingly scarce. Factors such as continuously increasing battery capacity and larger camera module sizes further compress the available space on circuit boards. At the same time, the increasing complexity of electronic devices significantly increases the demand for signal and power traces, especially in bottleneck areas where high trace density and the need to carry large currents pose significant challenges to circuit design.

[0003] In existing technologies, the problem of insufficient wiring channels is mainly solved in two ways: one is to add steel sheets as wiring carriers; the other is to add independent modules to handle part of the wiring function. However, both methods have obvious drawbacks: adding steel sheets will occupy valuable internal space and increase the weight of the equipment; while adding modules will not only increase manufacturing costs, but also occupy layout area on the circuit board, thus reducing the overall utilization rate of the circuit board.

[0004] Therefore, there is an urgent need for a new technical solution that can effectively increase the routing channels without occupying the layout area of ​​the main circuit board, while maintaining electromagnetic shielding effect and structural stability. Utility Model Content

[0005] This application aims to provide a circuit board assembly and electronic device that solves the problem of not being able to increase the layout utilization of the circuit board.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] In a first aspect, embodiments of this application provide a circuit board assembly, including: a first circuit board, a second circuit board, and a shielding cover, wherein,

[0008] The shielding cover is placed over the first circuit board and forms a shielding cavity with the first circuit board;

[0009] Along the circumference of the shield, at least a portion of the shield and the first circuit board form a clearance space;

[0010] The second circuit board is arranged in the clearance space. The second circuit board is connected to the shield and the first circuit board respectively. The second circuit board is provided with multiple wiring layers.

[0011] Secondly, embodiments of this application provide an electronic device including the circuit board assembly described above.

[0012] In this embodiment, a clearance space is designed between the shielding cover and the first circuit board, and the second circuit board is placed in this clearance space. This allows for the reasonable use of the connection area between the shielding cover and the first circuit board while maintaining the integrity and shielding effect of the shielding cavity. It also avoids the second circuit board occupying the main layout area on the first circuit board, ensuring the layout utilization rate of the first circuit board. In addition, the second circuit board is provided with multiple wiring layers, which can also provide additional wiring channels to solve the wiring bottleneck problem.

[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is a schematic diagram of the structure of a circuit board assembly according to an embodiment of this application;

[0016] Figure 2 This is a schematic diagram of the structure of a shielding cover and a first circuit board in an embodiment of this application;

[0017] Figure 3 This is a schematic diagram of a structure with two shielding covers in one embodiment of this application;

[0018] Figure 4 This is a schematic diagram of a ring-shaped shielding cover in one embodiment of this application;

[0019] Figure 5 This is a perspective view of a shielding cover that is ring-shaped in one embodiment of this application;

[0020] Figure 6 This is a schematic diagram of the arrangement on a first circuit board according to an embodiment of this application;

[0021] Figure 7 This is a schematic diagram of the wiring on a second circuit board according to an embodiment of this application;

[0022] Figure 8 This is a schematic diagram of the wiring on another second circuit board in an embodiment of this application;

[0023] Figure 9 This is a schematic diagram of the structure of the pads on a second circuit board in an embodiment of this application.

[0024] Figure label:

[0025] 1. First circuit board; 2. Second circuit board; 21. Connecting part; 211. Solder pad; 22. Trace; 3. Shielding cover; 31. First shielding cover; 32. Second shielding cover; 4. Shielding cavity; 5. Clearance space; 51. First clearance space; 52. Second clearance space; 6. Second device. Detailed Implementation

[0026] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] The following is combined with Figure 1 - Figure 9This application describes the circuit board assembly and electronic device described in the embodiments.

[0031] This application discloses a circuit board assembly, such as... Figure 1 and Figure 2 As shown, the circuit board assembly includes a first circuit board 1, a second circuit board 2, and a shielding cover 3. The shielding cover 3 covers the first circuit board 1 and forms a shielding cavity 4 with the first circuit board 1. Along the circumference of the shielding cover 3, at least a portion of the shielding cover 3 and the first circuit board 1 form a clearance space 5. The second circuit board 2 is arranged in the clearance space 5 and is connected to the shielding cover 3 and the first circuit board 1 respectively. The second circuit board 2 is provided with multiple wiring layers.

[0032] In this embodiment, a clearance space 5 is designed between the shielding cover 3 and the first circuit board 1, and the second circuit board 2 is arranged in this clearance space 5. While maintaining the integrity and shielding effect of the shielding cavity 4, the connection area between the shielding cover 3 and the first circuit board 1 can be reasonably utilized. This can prevent the second circuit board 2 from occupying the main layout area on the first circuit board 1, ensuring the layout utilization rate of the first circuit board 1. In addition, the second circuit board 2 is provided with multiple wiring layers, which can also provide additional wiring channels to solve the bottleneck problem of wiring 22.

[0033] In this embodiment, the second circuit board 2 can be connected to the side of the first circuit board 1 used to connect the shield 3. The second circuit board 2 is stacked with the first circuit board 1 and can be electrically connected to the first circuit board 1. Both the second circuit board 2 and the first circuit board 1 are provided with multiple wiring layers. Both the second circuit board 2 and the first circuit board 1 can be arranged with wiring 22, so that the circuit board assembly can be provided with more wiring channels to solve the problems of wiring 22 bottleneck and difficulty in carrying large current.

[0034] For example, both the first circuit board 1 and the second circuit board 2 can be provided with 8 wiring layers. The second circuit board 2 is stacked with the first circuit board 1 to achieve 16 wiring layers, thereby expanding the wiring channels and reducing the pressure on the wiring 22.

[0035] Specifically, the first circuit board 1 can be a printed circuit board (PCB). The second circuit board 2 can be a printed circuit board or a flexible printed circuit board (FPC), etc.

[0036] Specifically, the shape of the second circuit board 2 can be straight, L-shaped, curved, ring-shaped, etc., or the second circuit board 2 can also be an irregular structure.

[0037] Specifically, taking the application of the circuit board assembly described in this application embodiment to an electronic device as an example, the first circuit board 1 can be the motherboard of the electronic device, and the second circuit board 2 can be a small board. The size of the second circuit board 2 can be designed to be smaller. In some embodiments, since the second circuit board 2 is arranged at the connection area between the shielding cover 3 and the first circuit board 1, the width of the second circuit board 2 can be designed to be smaller. The waste materials from the manufacture of the first circuit board 1 can also be used to prepare the second circuit board 2, which can also reduce the material cost of the circuit board assembly.

[0038] Specifically, the shielding cover 3 is placed over the first circuit board 1 and can form a shielding cavity 4 with the first circuit board 1. The shielding cover 3 can isolate electromagnetic interference. For example, on the one hand, high-frequency circuits such as radio frequency modules, clock circuits, and high-speed signal channels installed on the first circuit board 1 will generate electromagnetic radiation, which may interfere with other electronic devices or systems in the vicinity. By placing the high-frequency circuits in the shielding cavity 4, the shielding cover 3 can confine this radiation within the cover, avoiding electromagnetic pollution to the external environment and meeting electromagnetic compatibility standards. On the other hand, electromagnetic signals in the external environment, such as radio waves and motor noise, may couple to sensitive circuits on the first circuit board 1, such as receiving modules and analog signal paths, leading to signal distortion, malfunction, or even system crash. By placing the sensitive circuits in the shielding cavity 4, the shielding cover 3 can form a physical barrier, reducing the impact of external interference on internal components. Furthermore, the shielding cover 3 can also have a mechanical protection function, preventing dust, foreign objects, or physical contact from damaging the components inside the shielding cavity 4.

[0039] Specifically, the shielding cover 3 can be made of metallic materials such as copper, aluminum, or alloys. By grounding it to the first circuit board 1, electromagnetic isolation is achieved, and the structural strength of the shielding cover 3 is ensured, thus protecting the components within the shielding cavity 4. The shielding cover 3 can have a regular structure, for example, as shown in the image. Figure 1 The regular rectangle shown can be used, or the shield 3 can be any shape with arbitrary curvature, curvature, or irregular shape.

[0040] Specifically, the layout area of ​​the first circuit board 1 may include an area corresponding to the shielding cover 3 for arranging components; the first circuit board 1 also includes a non-layout area, which may include an area for connecting the shielding cover 3.

[0041] Specifically, along the circumference of the shielding cover 3, at least a portion of the shielding cover 3 and the first circuit board 1 form a clearance space 5. The second circuit board 2 is arranged in the clearance space 5, so that at least a portion of the shielding cover 3 can be indirectly connected to the first circuit board 1 through the second circuit board 2. On the one hand, the sealing of the shielding cavity 4 can be guaranteed. On the other hand, the second circuit board 2 is arranged at the installation position between the shielding cover 3 and the first circuit board 1, that is, the second circuit board 2 occupies the connection area between the shielding cover 3 and the first circuit board 1, thereby reducing the occupation of the layout area on the first circuit board 1 by the second circuit board 2, and thus improving the layout utilization rate of the first circuit board 1.

[0042] Specifically, the number of second circuit boards 2 can be one, two, or more, and the number of shielding covers 3 can be one, two, or three.

[0043] Specifically, the first circuit board 1 may be provided with a connection area corresponding to the shielding cover 3. The connection area may be rectangular ring, elliptical ring, circular ring, racetrack-shaped or irregular shape, etc. At least part of the connection area may be connected to the second circuit board 2 and part of it may be connected to the shielding cover 3, or the entire connection area may be connected to the second circuit board 2 so as to indirectly connect the shielding cover 3 through the second circuit board 2.

[0044] Specifically, the second circuit board 2 can be enlarged, reduced, or surrounded by the shielding cover 3 in any form. For example, at least a portion of the second circuit board 2 can protrude inward from the inner wall of the shielding cover 3, or at least a portion of the second circuit board 2 can protrude outward from the outer wall of the shielding cover 3; or the edge of the second circuit board 2 does not protrude from the wall surface of the shielding cover 3; or the second circuit board 2 can also be arranged around the circumference of the shielding cover 3.

[0045] In this embodiment, a second circuit board 2 can be designed and mounted on the foot of the shielding cover 3, i.e. the connection area of ​​the first circuit board 1. By shortening at least part of the edge of the shielding cover 3, a clearance space 5 is formed between at least part of the shielding cover 3 and the first circuit board 1. The clearance space 5 is used to arrange the second circuit board 2. In this way, the wiring channel can be increased without occupying too much layout area of ​​the first circuit board 1.

[0046] In this embodiment, the waste material from the manufacturing of the first circuit board 1 can be used to process the second circuit board 2. The existing shielding cover 3 can be designed with notches. The shielding cover 3, the first circuit board 1 and the second circuit board 2 can be assembled by surface mount technology, which makes the circuit board assembly more feasible.

[0047] In some alternative embodiments of this application, such as Figures 5 to 7As shown, the second circuit board 2 is provided with at least two connecting parts 21, which are electrically connected to the first circuit board 1; the two interconnected connecting parts 21 are connected by a trace 22, which can be arranged on the surface or inner layer of the second circuit board 2.

[0048] In this embodiment of the application, the interconnection between the two connection parts 21 can be achieved by routing traces 22 on the surface or inner layer of the second circuit board 2, which can improve the diversity of the arrangement of the traces 22.

[0049] Specifically, such as Figure 5 As shown, trace 22 can be arranged on the surface layer of the second circuit board 2; as Figure 6 and Figure 7 As shown, blind vias (VIA) can also be created on the second circuit board 2 using a laser to arrange the trace 22 on the inner layer of the second circuit board 2.

[0050] Specifically, the connecting part 21 is electrically connected to the first circuit board 1, enabling an electrical connection between the second circuit board 2 and the first circuit board 1 to facilitate the transmission of electrical signals. The connecting part 21 and the first circuit board 1 form an interconnection, enabling interconnection between multiple sets of signal pins.

[0051] Specifically, the shape of the connecting part 21 can be regular or irregular, and different shapes or sizes can be selected according to the actual number of signals during implementation.

[0052] Specifically, the side of the connecting part 21 facing the first circuit board 1 may be provided with a solder pad 211, so that the connecting part 21 can be soldered to the first circuit board 1 through the solder pad 211, which can achieve both physical fixation and electrical conduction to meet the electrical performance requirements of the circuit board assembly. Among them, the solder pad 211 may be provided with a solder mask opening for soldering connection to the first circuit board 1.

[0053] Optionally, the shape of the pad 211 can be a regular shape such as a square or a circle, or it can be other irregular shapes.

[0054] Optionally, the connecting part 21 may be arranged in the area where the second circuit board 2 is sandwiched between the shielding cover 3 and the first circuit board 1; or, the connecting part 21 may be arranged at the position where the second circuit board 2 protrudes from the shielding cavity 4.

[0055] In the embodiments of this application, the connection part 21 can be arranged in various ways, which can enrich the diversity and reliability of the arrangement of the connection part 21 and meet the electrical performance requirements of the circuit board assembly.

[0056] Specifically, the end of the second circuit board 2 may protrude beyond the shielding cover 3, and the connecting portion 21 may also be disposed at the end of the second circuit board 2. In the embodiments of this application, the position of the connecting portion 21 can be selected according to actual needs to enrich the diversity and reliability of the arrangement of the connecting portion 21, and to meet the electrical performance requirements of the circuit board assembly.

[0057] Specifically, the width of the connecting part 21 can be greater than the width of other areas in the second circuit board 2, or the width of the connecting part 21 can be equal to the width of other areas in the second circuit board 2. The specific design can be made according to the design requirements, and no specific limitation is made in this embodiment.

[0058] Specifically, such as Figure 1 As shown, a second circuit board 2 can have two connecting parts 21, or it can have multiple connecting parts 21. When multiple connecting parts 21 are provided on the second circuit board 2, the multiple connecting parts 21 can be interconnected in pairs, or they can be interconnected individually, etc. Figure 8 and Figure 9 As shown, the second circuit board 2 is provided with four connecting parts 21, namely connecting part 21A, connecting part 21B, connecting part 21C, and connecting part 21D. In one case, connecting part 21A and connecting part 21B are interconnected, and connecting part 21C and connecting part 21D are interconnected. In another case, connecting part 21A and connecting part 21B are interconnected, connecting part 21A and connecting part 21C are interconnected, and connecting part 21A and connecting part 21D are interconnected. In yet another case, connecting part 21A, connecting part 21B, connecting part 21C, and connecting part 21D are interconnected in pairs.

[0059] In some alternative embodiments, the shielding cover 3 may include a shielding frame and a cover body. One end of the shielding frame may be provided with a first skirt, which is connected to the first circuit board 1 or the second circuit board 2. The cover body covers the shielding frame and can be enclosed with the first circuit board 1 to form a shielding cavity 4.

[0060] In this embodiment, the shielding cover 3 can be designed in a split manner. It can be assembled with the first circuit board 1 or the second circuit board 2 first through the shielding frame, and then the cover body can be assembled with the shielding frame. This can improve the convenience of assembly and achieve a better shielding effect.

[0061] Specifically, the first skirt can be understood as a protrusion or flange structure extending outward from one end edge of the shielding frame facing the first circuit board 1 or the second circuit board 2, used to assist in assembly. The first skirt can be fixed to the first circuit board 1 or the second circuit board 2 by welding.

[0062] Specifically, at least a portion of the first skirt along the circumference of the shielding frame can be fixed to the second circuit board 2, so as to make reasonable use of the connection area between the shielding cover 3 and the first circuit board 1 and improve the layout utilization rate of the first circuit board 1.

[0063] Optionally, the shielding cover 3 can be an integral structure, and one end of the shielding cover 3 can be provided with a second skirt, which is connected to the first circuit board 1 or the second circuit board 2.

[0064] In this embodiment, the shielding cover 3 can be an integral structure, which can improve the structural strength of the shielding cover 3 and reduce the number of assembly points, making it easier to ensure the sealing of the shielding cavity 4, thereby ensuring the shielding effect as well as the dustproof and waterproof effects.

[0065] Specifically, the design of the second skirt hem can be referenced from that of the first skirt hem, and will not be elaborated on here.

[0066] Specifically, by shortening a portion of the second skirt, the shortened height can be the thickness of the second circuit board 2 plus the height of the connection layer between the second circuit board 2 and the first circuit board 1. For example, the shortened height of the second skirt can be the thickness of the second circuit board 2 plus the height of the surface mount solder.

[0067] In some alternative embodiments, the number of second circuit boards 2 can be at least two; wherein the two second circuit boards 2 can be connected to opposite sides of the shielding cover 3, and / or wherein the two second circuit boards 2 can be connected to adjacent sides of the shielding cover 3.

[0068] In this embodiment of the application, the number of second circuit boards 2 can be designed to be multiple, thereby superimposing the second circuit boards 2 on multiple areas of the first circuit board 1 to improve the pressure on the traces 22.

[0069] Specifically, when there is only one shielding cover 3, one side of the shielding cover 3 can be connected to the first circuit board 1 through a second circuit board 2 to form a closed shielding cavity 4; or, both sides of the shielding cover 3 can be connected to the first circuit board 1 through two second circuit boards 2 respectively to form a closed shielding cavity 4.

[0070] Specifically, when there are multiple shielding covers 3, each shielding cover 3 can be connected to at least one second circuit board 2.

[0071] In some alternative embodiments, such as Figure 3As shown, there can be two shielding covers 3, namely a first shielding cover 31 and a second shielding cover 32. The clearance space 5 includes a first clearance space 51 and a second clearance space 52. At least a portion of the first shielding cover 31 and the second shielding cover 32 are arranged opposite to each other. The first clearance space 51 is formed between the opposite sides of the first shielding cover 31 and the second shielding cover 32 and the first circuit board 1. The second clearance space 52 is formed between the opposite sides of the second shielding cover 32 and the first shielding cover 31 and the first circuit board 1. The second circuit board 2 is arranged in the first clearance space 51 and the second clearance space 52. The second circuit board 2 is connected to the first shielding cover 31 and the second shielding cover 32 respectively.

[0072] In this embodiment, the second circuit board 2 can make reasonable use of the connection area between the first shielding cover 31, the second shielding cover 32 and the first circuit board 1, which can further widen the width of the second circuit board 2, making it easier to arrange more wiring channels and increase the wiring area. Moreover, the stacking of the second circuit board 2 and the first circuit board 1 can enhance the structural strength, improve the stress band problem caused by the concentrated arrangement of the two shielding covers 3, and thus improve the reliability and stability of the circuit board assembly.

[0073] Specifically, the first shielding cover 31 and the second shielding cover 32 are partially arranged opposite each other, or the first shielding cover 31 and the second shielding cover 32 are arranged opposite each other, so that the first shielding cover 31 and the second shielding cover 32 are arranged side by side, which can easily cause stress bands between the first shielding cover 31 and the second shielding cover 32. In this embodiment of the application, by arranging the second circuit board 2, the structural strength of the first circuit board 1 in the area between the first shielding cover 31 and the second shielding cover 32 can be enhanced, thereby improving the stress band problem.

[0074] In the embodiments of this application, such as Figure 3 As shown, the first shielding cover 31 and the second shielding cover 32 are at least partially opposite to each other, and the adjacent sides of the first shielding cover 31 and the second shielding cover 32 can be provided with clearance space 5, that is, the opposite sides of the first shielding cover 31 and the second shielding cover 32 and the first circuit board 1 form a first clearance space 51; the opposite sides of the second shielding cover 32 and the first shielding cover 31 and the first circuit board 1 form a second clearance space 52, which can realize the connection of the two shielding covers 3 to the same second circuit board 2. In this case, the second circuit board 2 can be a long strip structure.

[0075] In some embodiments, the circuit board assembly may also include three shielding covers 3, which may be connected to the same second circuit board 2. For example, the second circuit board 2 may be a trapezoidal structure, with one side of the second circuit board 2 connected to two shielding covers 3 respectively, and the other side connected to another shielding cover 3.

[0076] In some embodiments of this application, such as Figure 4 As shown, the second circuit board 2 can be a ring structure connected end to end along the circumference of the shielding cover 3. One side of the second circuit board 2 can be connected to the shielding cover 3, and the other side of the second circuit board 2 can be connected to the first circuit board 1.

[0077] In this embodiment, the second circuit board 2 can be a ring structure, and the second circuit board 2 can be disposed between the shielding cover 3 and the second circuit board 2 to make full use of the connection area between the shielding cover 3 and the second circuit board 2, increase the area for more wiring 22, and improve the layout utilization of the first circuit board 1.

[0078] Specifically, such as Figure 4 As shown, the shielding cover 3 can be clamped onto the side of the second circuit board 2 facing away from the first circuit board 1. The shielding cover 3, the inner periphery of the second circuit board 2, and the first circuit board 1 together form a shielding cavity 4, allowing the second circuit board 2 to elevate the entire shielding cover 3. The height of the shielding cavity 4 can be equal to the sum of the heights of the shielding cover 3, the second circuit board 2, and the connecting layer. In this embodiment, the height of the shielding cover 3 is shortened compared to the existing shielding cover 3 height. The shortened height is the thickness of the second circuit board 2 plus the height of the surface mount solder.

[0079] Specifically, the second circuit board 2 can be a rectangular ring or a circular ring, etc. Figure 4 As shown, the second circuit board 2 can be U-shaped. In this embodiment, a better shielding effect and more wiring channels can be achieved by raising the shielding cover 3 as a whole, i.e., shortening the overall height of the shielding cover 3.

[0080] In some alternative embodiments of this application, the circuit board assembly further includes a shielding structure that can fill the gap between the shielding cover 3 and the second circuit board 2.

[0081] In this embodiment, a shielding structure can be used to fill the gap between the shielding cover 3 and the second circuit board 2, which helps to ensure the sealing of the shielding cavity 4. This not only ensures the shielding effect against electromagnetic interference signals, but also improves the dustproof and waterproof effect.

[0082] Specifically, the shielding structure can be solder or auxiliary materials. In some embodiments, the shielding cover 3 and the second circuit board 2 can be soldered together to fill the gap between the shielding cover 3 and the second circuit board 2, forming a shielding structure. In other embodiments, auxiliary materials can be used to fill the gap between the shielding cover 3 and the second circuit board 2. The auxiliary materials may include conductive cloth, Mylar, shielding film, or adhesive, etc. For example, copper foil, aluminum foil, or other shielding materials can be pasted between the shielding cover 3 and the second circuit board 2 to fill the gap between the shielding cover 3 and the second circuit board 2, forming a shielding structure.

[0083] Specifically, the shielding structure can be configured to correspond to the number of gaps, and the specific number is not limited in this embodiment. In this embodiment, at least one shielding structure can be used to fill the gap between the shielding cover 3 and the second circuit board 2, ensuring the complete sealing of the shielding cavity 4, thereby achieving a complete shielding effect and waterproof properties.

[0084] In some optional embodiments of this application, the second circuit board 2 includes two opposing connecting surfaces and a circumferential side surface surrounding the connecting surfaces. The two connecting surfaces are a first connecting surface and a second connecting surface, respectively. The first connecting surface is connected to the shielding cover 3, and the second connecting surface is connected to the first circuit board 1. The circumferential side surface is covered with a metal layer.

[0085] In this embodiment, the connecting surface of the second circuit board 2 has a larger area. The first connecting surface contacts the connecting cover surface, and the second connecting surface contacts the surface of the first circuit board 1, facilitating connection and assembly. The circumferential side is covered with a metal layer, enabling grounding connection and ensuring effective shielding against electromagnetic interference signals, thus meeting better electromagnetic shielding requirements.

[0086] Specifically, the two connecting surfaces can be two large surfaces of the second circuit board 2 arranged opposite each other along its thickness, the first connecting surface can be the top surface of the second circuit board 2, and the second connecting surface can be the bottom surface of the second circuit board 2.

[0087] Specifically, the circumferential side can be prepared by side plating, for example, by depositing metal layers such as copper, tin, nickel, and gold on the circumferential side using an electroplating process.

[0088] Specifically, the portion of the circumferential side facing the shielding cover 3 is used to enclose and form the shielding cavity 4. By setting a metal layer on the circumferential side, the metal layer can also play the role of shielding electromagnetic interference signals, and can also enhance the mechanical properties and corrosion resistance of the circuit board.

[0089] In some alternative embodiments of this application, at least a portion of the second circuit board 2 may extend into the shielding cavity 4; the circuit board assembly also includes a first device, which may be located within the shielding cavity 4 and electrically connected to the second circuit board 2.

[0090] In this embodiment, at least a portion of the second circuit board 2 extends into the shielding cavity 4, thereby increasing the area of ​​the traces 22 on the second circuit board 2. By arranging the first device within the shielding cover 3 on the second circuit board 2, it is possible to arrange devices on the second circuit board 2, improving layout utilization.

[0091] Specifically, the height of the first device can be less than or equal to the difference between the height of the shielding cover 3 and the thickness of the second circuit board 2, so that there is a gap between the first device and the end of the shielding cover 3 away from the first circuit board 1, so as to avoid the shielding cover 3 causing wear to the first device.

[0092] Specifically, the first device can be a Hall switch, a power inductor, a voltage regulator, a capacitor, or a board-to-board connector, etc.

[0093] Specifically, the second circuit board 2 may further include a second device 6, which may be located within the shielding cavity 4 and arranged on the first circuit board 1. The height of the second device 6 may be less than the height of the shielding cover 3, so that there is a gap between the second device 6 and the end of the shielding cover 3 away from the first circuit board 1, thereby preventing the shielding cover 3 from causing wear to the second device 6.

[0094] Specifically, the second device 6 can be a high-precision analog device such as an operational amplifier, analog-to-digital converter (ADC), digital-to-analog converter (DAC), or sensor signal conditioning chip; a low-noise circuit module such as a radio frequency (RF) receiver module, GPS positioning module, or RF front end; or a clock device such as a crystal oscillator or clock generator. These devices are themselves susceptible to interference, and can be isolated from interference by the shielding cover 3 to prevent interference from other devices.

[0095] Specifically, the second device 6 can be a high-frequency / RF transmitting device such as an RF power amplifier (PA), an RF transceiver chip, or a walkie-talkie module; a switching power supply device such as a DC-DC converter, a switching power supply module (SMPS), or a low-dropout linear regulator; a high-speed digital device such as a high-speed microprocessor (CPU) or a high-speed interface chip; or a high-power driving device such as a motor driver chip or an LED driver chip. These devices have strong self-radiation, which can be isolated from interference by the shielding cover 3 to prevent interference with other devices.

[0096] The circuit board assembly described in this application embodiment has at least the following advantages:

[0097] In this embodiment, a clearance space is designed between the shielding cover and the first circuit board, and the second circuit board is placed in this clearance space. This allows for the efficient use of the connection area between the shielding cover and the first circuit board while maintaining the integrity and shielding effect of the shielding cavity. It also prevents the second circuit board from occupying a major layout area on the first circuit board, ensuring the layout utilization rate of the first circuit board. Furthermore, the second circuit board has multiple wiring layers, providing additional wiring channels to address wiring bottlenecks.

[0098] Secondly, this application also discloses an electronic device that may include the circuit board assembly described above.

[0099] The electronic devices described in this application include, but are not limited to, mobile phones, tablets, laptops, or smartwatches.

[0100] The electronic device described in this application embodiment can achieve the same beneficial effects as the circuit board assembly described above, and will not be repeated here.

[0101] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0102] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, include: The components include a first circuit board, a second circuit board, and a shielding cover. The shielding cover is placed over the first circuit board and forms a shielding cavity with the first circuit board; Along the circumference of the shield, at least a portion of the shield and the first circuit board form a clearance space; The second circuit board is arranged in the clearance space. The second circuit board is connected to the shield and the first circuit board respectively. The second circuit board is provided with multiple wiring layers.

2. The circuit board assembly according to claim 1, characterized in that, The second circuit board is provided with at least two connecting parts, which are electrically connected to the first circuit board; The two interconnected connection parts are connected by a trace, which is arranged on the surface or inner layer of the second circuit board.

3. The circuit board assembly according to claim 2, characterized in that, The connecting portion is arranged in the area where the second circuit board is sandwiched between the shield and the first circuit board, or the connecting portion is located where the second circuit board protrudes from the shield cavity.

4. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes a shielding structure that fills the gap between the shielding cover and the second circuit board.

5. The circuit board assembly according to claim 1, characterized in that, The number of shielding covers is two, namely a first shielding cover and a second shielding cover, and the clearance space includes a first clearance space and a second clearance space; The first shield and the second shield are at least partially disposed opposite to each other, and a first clearance space is formed between the opposite sides of the first shield and the second shield and the first circuit board, and a second clearance space is formed between the opposite side of the second shield and the first shield and the first circuit board. The second circuit board is arranged in the first clearance space and the second clearance space, and the second circuit board is connected to the first shield and the second shield respectively.

6. The circuit board assembly according to claim 1, characterized in that, The second circuit board has a ring structure, and the shielding cover is mounted on the side of the second circuit board away from the first circuit board. The shielding cover, the inner periphery of the second circuit board, and the first circuit board together form the shielding cavity.

7. The circuit board assembly according to claim 1, characterized in that, The second circuit board includes two opposing connecting surfaces and a circumferential side surface surrounding the connecting surfaces, wherein the two connecting surfaces are a first connecting surface and a second connecting surface; The first connecting surface is connected to the shielding cover, and the second connecting surface is connected to the first circuit board; The circumferential side is covered with a metal layer.

8. The circuit board assembly according to claim 1, characterized in that, At least a portion of the second circuit board extends into the shielding cavity; The circuit board assembly further includes a first device located within the shielding cavity and disposed on the second circuit board.

9. The circuit board assembly according to claim 1, characterized in that, The shielding cover includes a shielding frame and a cover body. One end of the shielding frame may be provided with a first skirt. The first skirt is connected to the first circuit board or the second circuit board. The cover body covers the shielding frame and surrounds the first circuit board to form the shielding cavity.

10. An electronic device, characterized in that, include: The circuit board assembly according to any one of claims 1-9.

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