Circuit board module
Patent Information
- Application Number
- CN202522127684.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-07-25
- Filing Date
- 2025-10-09
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-10-09
AI Technical Summary
[0002]现有电路板模块包含有一电路板及安装于所述电路板的多个电子元件，但多个所述电子元件的引脚都是穿过所述电路板、使其尖锐的末端缘露出于外，因而导致现有电路板模块在被人员手持的过程之中、容易造成人员的受伤
[0015] In summary, the circuit board module disclosed in this utility model embodiment is formed in the pre-planned handheld area through multiple through holes, and each pin does not protrude from the second board surface of the handheld area that the user is accustomed to holding, thereby enabling the circuit board module to have an anti-prick function and effectively avoid injury to the user caused by multiple pins.
Smart Images
Figure CN224775095U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an electronic module, and more particularly to a circuit board module. Background Technology
[0002] The existing circuit board module includes a circuit board and multiple electronic components mounted on the circuit board. However, the pins of the multiple electronic components pass through the circuit board, exposing their sharp ends. As a result, the existing circuit board module is prone to causing injury to personnel when it is held by a person.
[0003] Therefore, the inventor believes that the above-mentioned defects can be improved, and proposes this utility model with reasonable design and effective improvement of the above-mentioned defects. Utility Model Content
[0004] This utility model provides a circuit board module that can effectively improve the defects that may occur in existing circuit board modules.
[0005] This utility model discloses a circuit board module, comprising: a circuit board having a first board surface, a second board surface located opposite to the first board surface, and an annular side surface connected to the edge of the first board surface and the edge of the second board surface; wherein the circuit board defines a handheld boundary located inside the annular side surface, and the handheld boundary is at least 2 cm away from the annular side surface by a configuration distance; wherein the circuit board has a handheld area located between the handheld boundary and the annular side surface, and the handheld area forms a plurality of through holes recessed from the first board surface and extending to the second board surface; and a plurality of electronic components disposed in the handheld area and including a plurality of pins, wherein the plurality of pins are respectively inserted into the plurality of through holes of the handheld area from the first board surface toward the second board surface, such that the end edge of each pin is located between the first board surface and the second board surface.
[0006] In one embodiment, the thickness of the circuit board is between 1.55 mm and 1.65 mm, and the end edge of each pin is spaced from the first board surface by an insertion depth of between 1.2 mm and 1.5 mm.
[0007] In one embodiment, the distal edge of each pin is spaced from the first plate surface by an insertion depth, which is 75% to 95% of the depth of the corresponding through hole.
[0008] In one embodiment, the configuration distance is less than or equal to 8 centimeters.
[0009] In one embodiment, the circuit board has a central block surrounded by the handheld block, and the area of the central block is smaller than the area of the handheld block.
[0010] In one embodiment, the area of the central block is between 20% and 30% of the area of the handheld block.
[0011] In one embodiment, the circuit board module includes a plurality of solder bodies respectively filled within a plurality of through holes, and the end edge of each pin is embedded within a corresponding solder body.
[0012] In one embodiment, each of the welded bodies has a touch end face adjacent to the second plate surface, and the touch end faces of the plurality of welded bodies are coplanar with the second plate surface.
[0013] In one embodiment, each of the welded bodies has a touch end face adjacent to the second plate surface, and the touch end face of at least one of the welded bodies is convex relative to the second plate surface; wherein the touch end face has a height of less than or equal to 1.5 mm relative to the second plate surface.
[0014] In one embodiment, each of the welded bodies has a touch end face adjacent to the second plate surface, and at least one of the welded bodies has a touch end face that is concave relative to the second plate surface; wherein the touch end face has a depth of less than or equal to 1.125 mm relative to the second plate surface.
[0015] In summary, the circuit board module disclosed in this utility model embodiment is formed in the pre-planned handheld area through multiple through holes, and each pin does not protrude from the second board surface of the handheld area that the user is accustomed to holding, thereby enabling the circuit board module to have an anti-prick function and effectively avoid injury to the user caused by multiple pins.
[0016] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, these descriptions and drawings are only used to illustrate this utility model and are not intended to limit the scope of protection of this utility model in any way. Attached Figure Description
[0017] Figure 1 This is a plan view of the circuit board module according to an embodiment of the present utility model.
[0018] Figure 2 This is a plan view of the circuit board module from another perspective in an embodiment of the present invention.
[0019] Figure 3 for Figure 2 A schematic cross-sectional view along section line III-III.
[0020] Figure 4 for Figure 3 A cross-sectional view of the first variation type.
[0021] Figure 5 for Figure 3 A cross-sectional diagram of the second variation type.
[0022] Figure 6 for Figure 3 A cross-sectional diagram of the third variation type.
[0023] [List of Labels in the Attached Image]
[0024] 100: Circuit board module
[0025] 1: Circuit board
[0026] 1a: First panel
[0027] 1b: Second panel
[0028] 1c: Circumferential side
[0029] 1d: Handheld Border
[0030] 11: Handheld Block
[0031] 111: First sub-block
[0032] 112: Second sub-block
[0033] 113: Third Sub-block
[0034] 114: Fourth Sub-block
[0035] 115: Through hole
[0036] 12: Central Block
[0037] 2: Processor socket
[0038] 3: Welded body
[0039] 31: Touch end face
[0040] 4: Electronic components
[0041] 41: Pin
[0042] 411: Terminal edge
[0043] D: Configuration Distance
[0044] D1: First configuration distance
[0045] D2: Second configuration distance
[0046] D3: Third Configuration Distance
[0047] D4: Fourth Configuration Distance
[0048] T115: Hole depth
[0049] T41: Burial depth
[0050] H31: Altitude
[0051] T31: Depth
[0052] C: Center
[0053] X: Horizontal axis
[0054] Y: Longitudinal axis
[0055] Q1: First Quadrant
[0056] Q2: Second Quadrant
[0057] Q3: Third Quadrant
[0058] Q4: Fourth Quadrant Detailed Implementation
[0059] The following specific embodiments illustrate the implementation of the "circuit board module" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.
[0060] It should be understood that while terms such as “first,” “second,” and “third” may be used in this document to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. Furthermore, the term “or” as used herein may, depending on the context, include any combination of one or more of the related listed items.
[0061] Please see Figures 1 to 6 As shown, this is one embodiment of the present invention. Figures 1 to 4As shown, this embodiment discloses a circuit board module 100, which includes a circuit board 1, a processor socket 2 mounted on the circuit board 1, a plurality of solder bodies 3 disposed on the circuit board 1, and a plurality of electronic components 4 inserted into the circuit board 1 and the plurality of solder bodies 3. However, this utility model is not limited thereto. For example, in other embodiments of this utility model not shown, the processor socket 2 and the plurality of solder bodies 3 may be replaced by other components or omitted according to actual needs (e.g., the solder bodies 3 may be replaced by conductive paste).
[0062] In this embodiment, the circuit board 1 is generally rectangular and has a first board surface 1a, a second board surface 1b located on the opposite side of the first board surface 1a, and an annular side surface 1c connected to the edge of the first board surface 1a and the edge of the second board surface 1b. The circuit board 1 defines a handhold boundary 1d located inside the annular side surface 1c, and the handhold boundary 1d is separated from the annular side surface 1c by a configuration distance D of at least 2 cm, preferably less than or equal to 8 cm, but this invention is not limited thereto.
[0063] More specifically, the circuit board 1 has a handheld area 11 located between the handheld boundary 1d and the annular side 1c, and a central area 12 surrounded by the handheld area 11. In this embodiment, the central area 12 is generally rectangular and its area is smaller than the area of the annular handheld area 11, and the area of the central area 12 can be between 20% and 30% of the area of the handheld area 11; for example, 24.7% to 24.8%. A practical example is as follows: the area of the central area 12 is 9cm × 20.3cm = 18,270mm. 2 The area of the handheld block 11 is 24.3cm × 30.4cm = 73,872mm². 2 However, this utility model is not limited thereto. For example, in other embodiments of this utility model not shown, the area of the central block 12 may be greater than or equal to the area of the handheld block 11, depending on actual needs.
[0064] In this embodiment, the processor socket 2 is fixed to the central block 12, and the handheld block 11 has a plurality of through holes 115 recessed from the first plate surface 1a to the second plate surface 1b. That is, the hole depth T115 of each through hole 115 is equal to the thickness of the circuit board 1, and the plurality of through holes 115 can adopt the same hole diameter or different hole diameters according to actual needs, which is not limited in this utility model.
[0065] Furthermore, the plurality of welded bodies 3 are spaced apart from each other and respectively fill the plurality of through holes 115. The plurality of electronic components 4 include a plurality of pins 41, and the specific configuration of the pins 41 of each electronic component can be adjusted and varied according to actual needs, and is therefore not limited herein. Furthermore, the plurality of pins 41 are respectively inserted from the first plate surface 1a toward the second plate surface 1b into the plurality of through holes 115 of the handheld block 11, such that the end edge 411 of each pin 41 is embedded within the corresponding welded body 3. That is, the end edge 411 of each pin 41 is located between the first plate surface 1a and the second plate surface 1b.
[0066] Furthermore, each pin 41 has a embedment depth T41 between its end edge 411 and the first board surface 1a, and the embedment depth T41 is 75% to 95% of the hole depth T115 of the corresponding through hole 115. For example, when the thickness of the circuit board 1 is 1.55 mm to 1.65 mm (e.g., 1.6 mm), the embedment depth T41 can be between 1.2 mm and 1.5 mm, but this invention is not limited thereto.
[0067] As described above, in this embodiment, the circuit board module 100 is formed in the pre-planned handheld area 11 through a plurality of through holes 115, and each pin 41 does not protrude from the second plate surface 1b of the handheld area 11 which the user is accustomed to holding (e.g., the embedment depth T41 of each pin 41 corresponding to the through hole 115 is controlled at a specific ratio), thereby enabling the circuit board module 100 to have an anti-prick function, so as to effectively avoid injury to the user caused by the multiple pins 41.
[0068] Furthermore, while implementing the anti-prick hand function, the embedment depth T41 of each pin 41 is controlled to be greater than or equal to 75% of the hole depth T115, so that each pin 41 can maintain sufficient contact area with the corresponding solder body 3, thereby enabling each pin 41 to be stably and fixedly attached to the circuit board 1 through the corresponding solder body 3.
[0069] Furthermore, since the embedment depth T41 of each pin 41 is controlled to be greater than or equal to 75% of the hole depth T115, when any electronic component 4 is affected by external force, the corresponding pin 41 can have sufficient length to be attached to the solder body 3, thereby effectively preventing loosening between them.
[0070] In addition to embedding the end edge 411 of each pin 41 within the corresponding solder body 3 to achieve the anti-prick function, the circuit board module 100 in this embodiment can further optimize the structure of a touch end face 31 of each solder body 3 adjacent to (or exposed) the second board surface 1b, thereby further improving the grip feel of the handheld block 11. The following description will use several feasible embodiments of the touch end face 31 as examples, but the present invention is not limited thereto.
[0071] like Figure 3 and Figure 4 As shown, the touch end face 31 of each of the welded bodies 3 is planar, and the touch end faces 31 of the plurality of welded bodies 3 are coplanar on the second plate surface 1b. Alternatively, as... Figure 5 As shown, at least one of the welded bodies 3 has a convex curved surface 31 relative to the second plate surface 1b, and the touch surface 31 has a height H31 of less than or equal to 1.5 mm relative to the second plate surface 1b. Alternatively, as... Figure 6 As shown, at least one of the welded bodies 3 has a concave curved surface 31 relative to the second plate surface 1b, and the touch end surface 31 has a depth T31 of less than or equal to 1.125 mm relative to the second plate surface 1b (e.g., the depth T31 may be less than or equal to 0.1 mm; or the depth T31 may be between 0.9 mm and 1.125 mm).
[0072] It should be noted that although the specific planning and coverage of the handheld block 11 can be implemented in various ways according to actual needs, the handheld block 11 is actually related to the position of the processor socket 2 and the specific shape of the circuit board 1. Therefore, in the following description, the configuration of the handheld block 11 and its corresponding components will be described using one of the preferred embodiments, but this utility model is not limited thereto.
[0073] like Figures 1 to 4 As shown, in this embodiment, the handheld block 11 includes a first sub-block 111 located on one side of the processor socket 2, a second sub-block 112 located on the other side of the processor socket 2, a third sub-block 113 connected between one end of the first sub-block 111 and one end of the second sub-block 112 and adjacent to the processor socket 2, and a fourth sub-block 114 connected between the other end of the first sub-block 111 and the other end of the second sub-block 112 and away from the processor socket 2.
[0074] In this embodiment, the first sub-block 111 and the second sub-block 112 are both rectangular and located on opposite sides of the processor socket 2, and the third sub-block 113 and the fourth sub-block 114 are both rectangular and located on the other opposite sides of the processor socket 2. In this embodiment, the first sub-block 111 and the second sub-block 112 correspond to two long sides of the circuit board 1 and a portion of one short side of the circuit board 1, respectively, while the third sub-block 113 corresponds to another portion of one short side of the circuit board 1, and the fourth sub-block 114 corresponds to the other short side of the circuit board 1.
[0075] Furthermore, the configuration distance D corresponding to the first sub-block 111 is defined as a first configuration distance D1 and is between 6 cm and 8 cm; the configuration distance D corresponding to the second sub-block 112 is defined as a second configuration distance D2 and is between 2 cm and 8 cm; the configuration distance D corresponding to the third sub-block 113 is defined as a third configuration distance D3 and is between 2 cm and 5 cm; and the configuration distance D corresponding to the fourth sub-block 114 is defined as a fourth configuration distance D4 and is between 6 cm and 8 cm. However, this utility model is not limited thereto.
[0076] Furthermore, the weight of the circuit board module 100 in the first sub-block 111 (e.g., the total weight of the first sub-block 111 and the electronic components 4 and the solder body 3 mounted thereon) is greater than any one of the weights of the circuit board module 100 in the second sub-block 112, the third sub-block 113, and the fourth sub-block 114. Moreover, the number of the plurality of through holes 115 distributed in the first sub-block 111 is greater than the number distributed in the second sub-block 112, the third sub-block 113, and the fourth sub-block 114.
[0077] From another perspective, in this embodiment, the circuit board 1 can be defined by a horizontal axis X and a vertical axis Y intersecting at its center C, so that the circuit board 1 is sequentially divided into a first quadrant Q1, a second quadrant Q2, a third quadrant Q3, and a fourth quadrant Q4 by the horizontal axis X and the vertical axis Y (in a counterclockwise direction).
[0078] Wherein, the first sub-block 111 is located in the first quadrant Q1 and the fourth quadrant Q4, the second sub-block 112 is located in the second quadrant Q2 and the third quadrant Q3, the third sub-block 113 is located in the first quadrant Q1 and the second quadrant Q2, and the fourth sub-block 114 is located in the third quadrant Q3 and the fourth quadrant Q4.
[0079] Furthermore, the number of the plurality of through holes 115 distributed in the first quadrant Q1 is greater than any one of the number distributed in the second quadrant Q2, the third quadrant Q3, and the fourth quadrant Q4, and no through holes 115 are formed in the portion of the second sub-block 112 located in the third quadrant Q3, but this is not a limitation.
[0080] [Technical Effects of the Embodiments of this Utility Model]
[0081] In summary, the circuit board module disclosed in this utility model embodiment is formed in the pre-planned handheld area through multiple through holes, and each pin does not protrude from the second board surface of the handheld area that the user is accustomed to holding, thereby enabling the circuit board module to have an anti-prick function and effectively avoid injury to the user caused by multiple pins.
[0082] Furthermore, in the circuit board module disclosed in this embodiment of the present invention, while achieving the anti-prick function, the embedding depth of each pin is controlled to be greater than or equal to 75% of the hole depth, so that each pin can maintain sufficient area to contact the corresponding solder body, thereby enabling each pin to be stably and fixedly bonded to the motherboard through the corresponding solder body.
[0083] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made based on the contents of the present utility model specification and drawings are included in the patent scope of the present utility model.
Claims
1. A circuit board module, characterized by It includes: A circuit board has a first surface, a second surface opposite to the first surface, and an annular side surface connected to the edges of the first and second surfaces; wherein the circuit board defines a handhold boundary located inside the annular side surface, and the handhold boundary is spaced at least 2 cm from the annular side surface; wherein the circuit board has a handhold area located between the handhold boundary and the annular side surface, and the handhold area has a plurality of through holes recessed from the first surface to the second surface; and Multiple electronic components are disposed in the handheld block and include multiple pins, and the multiple pins are respectively inserted into the multiple through holes of the handheld block from the first plate surface toward the second plate surface, such that the end edge of each pin is located between the first plate surface and the second plate surface.
2. The circuit board module of claim 1, wherein, The thickness of the circuit board is between 1.55 mm and 1.65 mm, and the end edge of each pin is spaced from the first board surface by an insertion depth of between 1.2 mm and 1.5 mm.
3. The circuit board module of claim 1, wherein, The distal edge of each pin is separated from the first plate surface by an insertion depth, which is 75% to 95% of the depth of the corresponding through hole.
4. The circuit board module of claim 1, wherein, The configuration distance is less than or equal to 8 centimeters.
5. The circuit board module of claim 4, wherein, The circuit board has a central block surrounded by the handheld block, and the area of the central block is smaller than the area of the handheld block.
6. The circuit board module of claim 5, wherein, The area of the central block is between 20% and 30% of the area of the handheld block.
7. The circuit board module of claim 1, wherein, The circuit board module includes a plurality of solder bodies respectively filled within a plurality of through holes, and the end edge of each pin is embedded within a corresponding solder body.
8. The circuit board module of claim 7, wherein, Each of the welded bodies has a touch end face adjacent to the second plate surface, and the touch end faces of the plurality of welded bodies are coplanar with the second plate surface.
9. The circuit board module of claim 7, wherein, Each of the welded bodies has a touch end face adjacent to the second plate surface, and at least one of the welded bodies has a convex curved surface relative to the second plate surface; wherein the touch end face has a height of less than or equal to 1.5 mm relative to the second plate surface.
10. The circuit board module of claim 7, wherein, Each of the welded bodies has a touch end face adjacent to the second plate surface, and at least one of the welded bodies has a touch end face that is concave relative to the second plate surface; wherein the touch end face has a depth of less than or equal to 1.125 mm relative to the second plate surface.