Metallic packaging structure against strong electromagnetic interference

Abstract

This utility model belongs to the field of circuit board packaging technology, and particularly relates to a metal packaging structure for resisting strong electromagnetic interference. Its features include a cover plate, upright plates, and flanges. Four upright plates form a quadrilateral frame. The cover plate is an anti-interference isolation glass cover plate with a deposited copper mesh. The cover plate is connected to the top of the frame. At least two upright plates are connected to flanges along their lower edges. The cover plate, upright plates, and flanges constitute a box with an open bottom. The flanges are connected to the grounding wire on the printed circuit board. The deposited copper mesh is a hexagonal grid array with a 1mm aperture. The bottom layer of the deposited copper mesh is quartz glass, and the surface film is transparent polyester. The beneficial effects of this utility model are: without affecting the heat dissipation and internal observation of the printed circuit board, it works in conjunction with other conventional anti-interference measures of the printed circuit board to improve the shielding performance of the circuit against strong electromagnetic interference, enabling the circuit to achieve stable and reliable safe operation.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board packaging technology, and in particular relates to a metal packaging structure that resists strong electromagnetic interference. Background Technology

[0002] Electromagnetic interference (EMI) is a type of energy generated by electromagnetic fields that can affect the normal operation of electronic equipment. EMI is generated because changes in voltage and current in a circuit cause changes in the electromagnetic field, resulting in electromagnetic radiation. This radiation can leak out of the circuit and interfere with other circuits, or it can propagate through media such as air and wires to interfere with the outside world.

[0003] Electromagnetic interference (EMI) shielding measures include using shielding materials, grounding, using filters, improving wiring, using ferrite cores, and selecting appropriate filter capacitors and resistors. Shielding materials effectively block the propagation of electromagnetic waves, thus reducing EMI. Commonly used shielding materials include metal mesh, copper foil, and aluminum foil. Grounding is a simple and effective method for suppressing EMI. By connecting the ground wire of equipment or circuit to the ground, the propagation of EMI can be reduced. The ground connection forms a loop, thus confining EMI within that loop. Using filters can suppress conducted EMI. Sensitive electronic equipment conducts EMI signals through power lines, telephone lines, control lines, signal lines, etc. Conducted EMI is often filtered using low-pass filters, which can effectively suppress it. Improving wiring can reduce the coupling of EMI. For example, power lines and signal lines can be laid separately to reduce mutual interference between them. Using ferrite cores can suppress high-frequency EMI. When current passes through a ferrite core, it generates eddy currents, thus canceling out some of the EMI. Selecting appropriate filter capacitors and resistors can filter out high-frequency noise in the circuit, thereby reducing EMI.

[0004] Chinese utility model patent application number 202421892645.6 discloses a cover film for printed circuit boards, comprising: a core layer; an adhesive layer for adhering the cover film to the printed circuit board fixedly connected to the bottom of the core layer; an insulating layer fixedly connected to the upper sidewall of the core layer; a colored composite material layer with a low refractive index fixedly connected to the upper sidewall of the insulating layer; and a protective layer fixedly connected to the upper sidewall of the colored composite material layer. By adding an insulating layer composed of an antistatic layer and an electromagnetic shielding layer to the upper surface of the core layer, the printed circuit board has the functions of antistatic properties and blocking electromagnetic interference. Since electromagnetic interference not only affects printed circuit boards but also the components on them, it is necessary to further enhance anti-interference measures for such molded circuits when necessary, but this is rarely mentioned in relevant published literature. Utility Model Content

[0005] The purpose of this invention is to provide a metal packaging structure that resists strong electromagnetic interference, overcoming the shortcomings of the prior art. By configuring a metal packaging structure outside the printed circuit board, it does not affect the actual needs of heat dissipation and observation of the printed circuit board. It works together with other anti-interference measures of the printed circuit board to improve the shielding performance of the circuit against strong electromagnetic interference, enabling the circuit to achieve stable and reliable safe operation, avoiding production accidents caused by unexpected circuit failures, and reducing the resulting economic losses.

[0006] To achieve the above objectives, this utility model employs the following technical solution: A metal encapsulation structure resistant to strong electromagnetic interference includes a cover plate, upright plates, and flanges. Four upright plates form a quadrilateral frame. The cover plate is an anti-interference isolation glass cover plate with a deposited copper mesh. The cover plate is connected to the top of the frame. Flanges are connected to the lower edges of at least two upright plates. The cover plate, upright plates, and flanges form a box with an open bottom. The flanges are connected to the grounding wire on the printed circuit board by screws.

[0007] Furthermore, at least one of the upright plates is provided with an array of ventilation and heat dissipation holes, with a hole diameter of 1.5-2.5mm and a spacing of 3-5mm × 3-5mm.

[0008] Furthermore, the copper mesh deposited on the copper mesh film is a hexagonal grid array with a pore size of 1 mm, the bottom layer of the copper mesh is quartz glass, the surface film is a transparent polyester layer, and the thickness of the copper mesh film is 100 μm-300 μm.

[0009] Furthermore, the upright plate is made of aluminum plate or galvanized steel plate with a thickness of 0.6mm-1.2mm.

[0010] Furthermore, the upper edge of the upright plate is provided with an inward folded edge, the folded edge being 8-10mm wide, and a threaded hole is provided on the folded edge.

[0011] Furthermore, the printed circuit board beneath the cover plate is equipped with integrated components and an LCD display screen.

[0012] Furthermore, a closed copper strip is provided around the periphery of the copper deposition mesh, and the copper deposition mesh and the copper deposition strip are connected.

[0013] Compared with the prior art, the beneficial effects of this utility model are: A metal encapsulation structure is configured outside the printed circuit board. Without affecting the heat dissipation and internal observation of the printed circuit board, it works together with other conventional anti-interference measures of the printed circuit board to improve the shielding performance of the circuit against strong electromagnetic interference, so that the circuit can achieve stable, reliable and safe operation. This utility model's metal packaging structure can be used with various printed circuit boards. In applications where high circuit stability is required, it can minimize production accidents caused by unexpected circuit failures and reduce economic losses. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the application structure of an embodiment of the present utility model; Figure 2 This is a schematic diagram of the cover plate structure in an embodiment of the present utility model; In the diagram: 1-Cover plate, 2-Upright plate, 3-Flange, 4-Screw, 5-Printed circuit board, 6-Grounding wire, 7-Ventilation and heat dissipation hole, 8-Deposited copper mesh, 9-Deposited copper mesh, 10-Quartz glass, 11-Polyester layer, 12-Folded edge, 13-Integrated components, 14-LCD display screen, 15-Deposited copper strip. Detailed Implementation

[0015] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The components of the embodiments of this utility model described and shown in the drawings herein can be arranged and designed in many different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model.

[0017] See Figure 1-2 This is a schematic diagram of an embodiment of a metal packaging structure for resisting strong electromagnetic interference according to this utility model. It includes a cover plate 1, upright plates 2 and flanges 3. Four upright plates 2 form a quadrilateral frame. The cover plate 1 is an anti-interference isolation glass cover plate. A copper deposited mesh 8 is provided on the cover plate 1. The cover plate 1 is connected to the top of the frame. At least two upright plates 2 are connected to flanges 3 at their lower edges. The cover plate 1, upright plates 2 and flanges 3 form a box with an open bottom. The flanges 3 are connected to the grounding wire 6 on the printed circuit board 5 by screws 4.

[0018] At least one upright plate 2 has an array of ventilation and heat dissipation holes 7. The diameter of the ventilation and heat dissipation holes 7 is 1.5-2.5mm and the spacing is 3-5mm×3-5mm. Preferably, the diameter is 1.5mm and the spacing is 5mm×5mm. This hole diameter can maintain ventilation while still having an anti-interference effect.

[0019] The copper mesh 9 deposited on the copper-coated mesh 8 is a hexagonal grid array with a pore size of 1 mm. The bottom layer of the deposited copper mesh is a quartz glass cover plate 10, and the surface film is a transparent polyester layer 11. The total thickness of the deposited copper mesh is 100 μm-300 μm. The deposited copper mesh 9 is fabricated on a quartz glass substrate using electrodeposition technology. Copper electrodeposition is a common material preparation technique that deposits a copper layer on a conductive substrate through an electrolytic process. This technique can be used to prepare various copper-based materials, including copper thin films and copper nanowires.

[0020] The upright plate 2 is made of aluminum plate or galvanized steel plate with a thickness of 0.6mm-1.2mm, preferably aluminum plate with a thickness of 1.2mm. The upper edge of the upright plate 2 is provided with an inward folded edge 12, the width of which is 8-10mm, preferably 8mm. The folded edge 12 is provided with threaded holes for connecting the cover plate 1.

[0021] The printed circuit board 5 below the cover plate 1 is equipped with integrated components 13 and an LCD display screen 14, which facilitates the observation of the display information of the LCD display screen from outside the cover plate and prevents interference from strong electromagnetic environment to the LCD display screen.

[0022] A closed copper strip 15 is provided around the periphery of the deposited copper mesh 9. The deposited copper mesh 9 and the deposited copper strip 15 are connected to form an equipotential structure. The working principle of the anti-interference isolation glass cover of this utility model is based on the principle of a Faraday cage, which is based on electrostatic shielding. That is, the electric field is shielded by a hollow conductor, so that the interior is not affected by the external electric field, and the internal electric field does not affect the exterior. When the Faraday cage is in a high-voltage electric field, due to electrostatic induction, the charge will redistribute on the surface of the cage, but the electric field strength inside the cage is zero. Therefore, people or objects inside the cage will not be affected by the electric field.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A metal packaging structure against strong electromagnetic interference, characterized by, It includes a cover plate, upright plates, and flanges. The four upright plates form a quadrilateral frame. The cover plate is an anti-interference isolation glass cover plate with a deposited copper mesh. The cover plate is connected to the top of the frame. At least two upright plates are connected to flanges at their lower edges. The cover plate, upright plates, and flanges form a box with an open bottom. The flanges are connected to the grounding wire on the printed circuit board by screws.

2. The metal packaging structure for resisting strong electromagnetic interference according to claim 1, characterized in that, At least one of the upright plates is provided with an array of ventilation and heat dissipation holes, with a hole diameter of 1.5-2.5mm and a spacing of 3-5mm × 3-5mm.

3. The metal packaging structure for resisting strong electromagnetic interference according to claim 1, characterized in that, The copper mesh deposited on the copper-coated film is a hexagonal grid array with a pore size of 1 mm. The bottom layer of the copper mesh is quartz glass, and the surface film is a transparent polyester layer. The thickness of the copper-coated film is 100 μm-300 μm.

4. The metal packaging structure for resisting strong electromagnetic interference according to claim 1, characterized in that, The upright plate is made of aluminum plate or galvanized steel plate with a thickness of 0.6mm-1.2mm.

5. The metal packaging structure for resisting strong electromagnetic interference according to claim 1, characterized in that, The upper edge of the upright plate is provided with an inward folded edge, the folded edge being 8-10mm wide, and a threaded hole is provided on the folded edge.

6. The metal packaging structure according to claim 1, wherein the metal packaging structure is a metal packaging structure for a semiconductor device. The printed circuit board beneath the cover plate houses integrated components and an LCD display screen.

7. The metal packaging structure according to claim 3, wherein the metal packaging structure is a metal packaging structure for a semiconductor device. The copper deposition mesh is surrounded by a closed copper deposition strip, and the copper deposition mesh and the copper deposition strip are connected.

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