Mainboard module and electronic device

Abstract

The application relates to the technical field of circuit boards, and particularly provides a mainboard module and an electronic device to realize light and thin design. The mainboard module comprises a circuit assembly, a mainboard and a functional module, the mainboard is provided with a connecting area, the functional module is arranged on one side of the mainboard and is provided with a conducting area, the connecting area of the mainboard and the conducting area of the functional module are respectively provided with a plurality of uniformly arranged conductive spheres; a conductive assembly is connected with the mainboard and the functional module respectively, the conductive assembly is provided with a conductive adhesive sheet, the conductive adhesive sheet covers the connecting area and the conducting area and abuts against the plurality of conductive spheres on the connecting area and the conducting area, so that the mainboard and the functional module are connected in signal transmission. The electronic device comprises the above mainboard module.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a motherboard module and electronic device. Background Technology

[0002] Currently, connectors are typically used to connect the motherboard and functional modules. However, these connectors are generally quite large, resulting in a bulky assembly of the motherboard and functional modules. Utility Model Content

[0003] In view of the above situation, it is necessary to provide a motherboard module and electronic device to achieve thinner and lighter designs.

[0004] This application provides a motherboard module, including: A circuit assembly includes a motherboard and a functional module. The motherboard has a connection area, and the functional module is located on one side of the motherboard and has a conduction area. The connection area of ​​the motherboard and the conduction area of ​​the functional module are respectively provided with a plurality of evenly arranged conductive spheres. A conductive component is connected to the motherboard and the functional module respectively. The conductive component has a conductive film that covers the connection area and the conduction area and abuts against a plurality of conductive spheres on the connection area and the conduction area to enable signal transmission connection between the motherboard and the functional module.

[0005] Thus, through the above setup, the motherboard and functional modules achieve signal transmission connection through conductive components. Utilizing the thin and light characteristics of the conductive film, traditional connectors can be effectively replaced, thereby reducing the thickness of the motherboard module and achieving a thinner and lighter motherboard module. At the same time, the conductive film has good conductivity to ensure the signal transmission stability of the motherboard module, and there is no need to use soldering to assemble the motherboard module. This enables the motherboard module to achieve a low-thickness, solderless, and highly reliable modular circuit connection structure.

[0006] In some embodiments, the motherboard and the functional module are spaced apart horizontally, and the conductive component includes: A rigid circuit board is disposed above the motherboard and the functional module; Two locking components are provided, one of which is vertically inserted through the rigid circuit board and the main board and is threadedly connected to the rigid circuit board and the main board respectively; the other locking component is vertically inserted through the rigid circuit board and the functional module and is threadedly connected to the rigid circuit board and the functional module respectively. The conductive film is provided in two parts, one of which is disposed between the rigid circuit board and the conductive area, and the other of which is disposed between the rigid circuit board and the connection area.

[0007] In some embodiments, the conductive component further includes: Both support members are insulators. One of the support members abuts against the motherboard and the rigid circuit board respectively, and the other support member abuts against the functional module and the rigid circuit board respectively.

[0008] In some embodiments, the motherboard and the functional module are spaced apart horizontally, and the conductive component includes: A flexible circuit board is disposed above the motherboard and the functional module; Two support plates are located at both ends of the flexible circuit board, and both are located on the side of the flexible circuit board away from the main board. Each support plate abuts against the flexible circuit board. Two locking components correspond one-to-one with the two support plates. One of the locking components is sequentially inserted through the main board, the flexible circuit board and the corresponding support plate, and is threadedly connected to the main board and the corresponding support plate respectively. The other locking component is sequentially inserted through the functional module, the flexible circuit board and the corresponding support plate, and is threadedly connected to the functional module and the corresponding support plate respectively. The conductive film is provided in two parts, one of which is disposed between the flexible circuit board and the conductive area, and the other of which is disposed between the flexible circuit board and the connection area.

[0009] In some embodiments, the conductive component includes: Both support members are insulators. One of the support members abuts against the motherboard and the flexible circuit board respectively, and the other support member abuts against the functional module and the flexible circuit board respectively.

[0010] In some embodiments, the motherboard and the functional module are spaced apart in a vertical direction, and the conductive component is disposed between the motherboard and the functional module. The conductive component includes the conductive film and the fastening member. The two sides of the conductive film abut against the connection area and the conduction area, respectively. The fastening member passes through the motherboard and the functional module in a vertical direction and is threadedly connected to the functional module and the motherboard, respectively.

[0011] In some embodiments, the conductive component further includes: A support member, which is an insulator, has its two ends abutting against the motherboard and the functional module, respectively.

[0012] In some embodiments, the conductive film is conductive in the vertical direction and insulating in the horizontal direction.

[0013] In some embodiments, the conductive component further includes: Multiple conductive needles are evenly arranged in the horizontal direction and are all inserted into the conductive film.

[0014] This application also provides an electronic device, including: The motherboard module described in any of the above embodiments.

[0015] Thus, through the above configuration, the motherboard and functional modules in the electronic device achieve signal transmission connection through conductive components. Utilizing the thin and light characteristics of the conductive film, traditional connectors can be effectively replaced, thereby reducing the thickness of the motherboard module and achieving a thinner and lighter motherboard module. At the same time, the conductive film has good conductivity to ensure the signal transmission stability of the motherboard module, and there is no need to use soldering to assemble the motherboard module. This enables the motherboard module to achieve a low-thickness, solderless, and highly reliable modular circuit connection structure. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the motherboard module provided in the first embodiment of this application.

[0017] Figure 2 for Figure 1 A cross-sectional schematic diagram of a portion of the motherboard module structure is shown.

[0018] Figure 3 A cross-sectional schematic diagram of a portion of the structure of a motherboard module provided in the second embodiment of this application.

[0019] Figure 4 A cross-sectional schematic diagram of a portion of the structure of the motherboard module provided in the third embodiment of this application.

[0020] Explanation of key component symbols: Main board module 100, circuit assembly 10, main board 11, connection area 111, functional module 12, conductive area 121, conductive ball 13, conductive component 20, conductive film 21, rigid circuit board 22, locking component 23, support component 24, conductive pin 25, flexible circuit board 26, support plate 27. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0022] In the description of this application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] The following will describe some embodiments of this application in detail with reference to the accompanying drawings.

[0025] First Embodiment Please see Figure 1 This embodiment provides a motherboard module 100, including a circuit assembly 10 and a conductive assembly 20. Please refer to [link / reference]. Figure 1 and Figure 2 The circuit assembly 10 includes a motherboard 11 and a functional module 12. The motherboard 11 has a connection area 111 on one side, and the functional module 12 is located on one side of the motherboard 11 and has a conductive area 121. The connection area 111 of the motherboard 11 and the conductive area 121 of the functional module 12 each have a plurality of evenly arranged conductive spheres 13. A conductive component 20 is connected to the motherboard 11 and the functional module 12 respectively. The conductive component 20 has a conductive film 21 that covers the connection area 111 and the conductive area 121, and abuts against the plurality of conductive spheres 13 on the connection area 111 and the conductive area 121 to enable signal transmission connection between the motherboard 11 and the functional module 12.

[0026] Thus, through the above configuration, the motherboard 11 and the functional module 12 achieve signal transmission connection through the conductive component 20. Utilizing the thin and light characteristics of the conductive film 21, it can effectively replace the traditional connector, thereby reducing the thickness of the motherboard module 100 and achieving a thinner and lighter motherboard module 100. At the same time, the conductive film 21 has good conductivity to ensure the signal transmission stability of the motherboard module 100, and there is no need to use soldering to assemble the motherboard module 100, thereby enabling the motherboard module 100 to achieve a low-thickness, solderless, and highly reliable modular circuit connection structure.

[0027] The motherboard module 100 can be used in electronic systems such as laptops, automotive devices, and wearable devices. The conductive film 21 can be made of carbon adhesive, silver adhesive, conductive rubber, or other insulating polymer materials containing conductive particles.

[0028] It is understood that in this embodiment, there are multiple functional modules 12, which can be 5G modules, USB modules, WIFI modules, etc. The motherboard 11 can be provided with multiple connection areas 111. The motherboard module 100 includes multiple conductive components 20, each corresponding to a conductive area and a functional module 12. Each conductive component 20 connects a functional module 12 to a corresponding connection area 111 on the motherboard 11. The conductive ball 13 can be a BGA ball (Ball Grid Array ball).

[0029] Please see Figure 2 In this embodiment, the main board 11 and the functional module 12 are arranged horizontally at intervals. The conductive component 20 includes a rigid circuit board 22 and two locking members 23. The rigid circuit board 22 is disposed above the main board 11 and the functional module 12. One locking member 23 passes vertically through the rigid circuit board 22 and the main board 11 and is threadedly connected to both the rigid circuit board 22 and the main board 11. The other locking member 23 passes vertically through the rigid circuit board 22 and the functional module 12 and is threadedly connected to both the rigid circuit board 22 and the functional module 12. There are two conductive films 21. One conductive film 21 is disposed between the rigid circuit board 22 and the conductive area 121, and the other conductive film 21 is disposed between the rigid circuit board 22 and the connection area 111.

[0030] Thus, through the above configuration, a connection structure is formed by the rigid circuit board 22 and the two conductive films 21, which are arranged horizontally to connect the motherboard 11 and the functional module 12, achieving a horizontal connection between the motherboard 11 and the functional module 12. At the same time, the rigid circuit board 22 has a higher hardness than the conductive film 21, which can support the conductive film 21 and prevent the conductive film 21 from deforming and coming into contact with other parts that should not be in contact, thereby causing a short circuit in the motherboard module 100 and ensuring the stable operation of the motherboard module 100.

[0031] It should be noted that the rigid circuit board 22 can be a single or multi-layer PCB (Printed Circuit Board), so that the rigid circuit board 22 can serve as a support component to support the conductive film 21. At the same time, the rigid circuit board 22 has a grounding shielding function, which can effectively reduce electromagnetic interference.

[0032] Please see Figure 2 In this embodiment, the conductive component 20 further includes two support members 24, both of which are insulators. One support member 24 abuts against the main board 11 and the rigid circuit board 22 respectively, and the other support member 24 abuts against the functional module 12 and the rigid circuit board 22 respectively.

[0033] Thus, through the above configuration, one support member 24 supports the motherboard 11 and the rigid circuit board 22, and the other support member 24 supports the functional module 12 and the rigid circuit board 22, preventing the conductive ball 13 from deforming or breaking due to pressure, thereby preventing short circuits. This ensures that the conductive ball 13 and the conductive film 21 always maintain good contact, thereby improving the operational stability of the motherboard module 100. At the same time, the support member 24 can effectively limit the vibration and slippage of the components connected to it, thereby improving the overall connection stability of the motherboard module 100.

[0034] It should be noted that the support member 24 can be made of plastic, ceramic, or a heat-resistant insulating material to prevent thermal deformation due to high temperatures. This ensures that the support member 24 stably supports the corresponding components and prevents poor contact between the conductive film 21 and the motherboard 11 or functional module 12 due to loss of support caused by thermal deformation. Specifically, the support member 24 has good compressive modulus and resistance to deformation to prevent the motherboard module 100 from being affected by external forces, thus ensuring that the conductive contacts in the motherboard module 100 are not affected by external forces and thus do not shift or fail.

[0035] In this embodiment, the conductive film 21 is conductive in the vertical direction and insulating in the horizontal direction.

[0036] Thus, through the above-mentioned configuration, the good conductivity of the conductive film 21 in the vertical direction can ensure the stable and efficient transmission of electrical signals between the motherboard 11 and the functional module 12, which helps the circuit system of the motherboard module 100 to operate stably. In the horizontal direction, it has insulation properties, which can prevent signal interference from adjacent conductive paths and ensure the accurate transmission of electrical signals in the motherboard module 100.

[0037] Please see Figure 2 In this embodiment, the conductive component 20 further includes a plurality of conductive pins 25, which are evenly arranged in the horizontal direction and all pass through the conductive film 21.

[0038] Thus, through the above configuration, the conductive needle 25 is relatively thin, enabling it to form point contact with the connection area 111 or the conductive area 121. At the same time, the excellent conductivity of the conductive needle 25 enables high-speed signal transmission, improving the stability of signal transmission. Furthermore, the conductive needle 25 and the conductive film 21 work together to increase the conductive path of the signal, preventing the conductive film 21 from being affected by wear, contamination, or local damage, thus further improving the stability of signal transmission.

[0039] Please see Figure 2 In this embodiment, a portion of the conductive needles 25 are inserted vertically into the conductive film 21, while another portion of the conductive needles 25 are inclined relative to the vertical direction and inserted into the conductive film 21.

[0040] Thus, by vertically inserting the conductive pin 25 into the conductive film 21, the conductive pin 25 can provide a low-impedance, multi-point contact signal conduction path, ensuring low loss and high efficiency in signal transmission, which is beneficial for high-speed signal transmission, while improving signal transmission stability and durability. In addition, since some surfaces of the motherboard 11 or functional module 12 are uneven, by tilting the conductive pin 25 and inserting it into the conductive film 21, the conductive pin 25 can better fit the surface, ensuring stable signal transmission.

[0041] Second Embodiment Please see Figure 3The second embodiment is similar to the first embodiment in that the main board 11 and the functional module 12 are both arranged horizontally at intervals. The difference lies in the structure of the conductive component 20. Specifically, the conductive component 20 includes a flexible circuit board 26, two support plates 27, and two locking members 23. The flexible circuit board 26 is located above the main board 11 and the functional module 12. The two support plates 27 are located at both ends of the flexible circuit board 26, and are both located on the side of the flexible circuit board 26 facing away from the main board 11. Each support plate 27 abuts against the flexible circuit board 26. The two locking members 23 correspond one-to-one with the two support plates 27. One locking member 23 passes through the main board 11, the flexible circuit board 26, and the corresponding support plate 27 in sequence, and is threadedly connected to the main board 11 and the corresponding support plate 27 respectively. The other locking member 23 passes through the functional module 12, the flexible circuit board 26, and the corresponding support plate 27 in sequence, and is threadedly connected to the functional module 12 and the corresponding support plate 27 respectively. The conductive film 21 is provided in two parts. One conductive film 21 is disposed between the flexible circuit board 26 and the conductive area 121, and the other conductive film 21 is disposed between the flexible circuit board 26 and the connection area 111. For example, the flexible circuit board can be an FPC (Flexible Printed Circuit).

[0042] Thus, through the above-described configuration, the motherboard 11 and functional module 12 can be horizontally connected. Furthermore, due to the flexibility of the flexible circuit board 26, it can be bent and deformed to a certain extent, further reducing the space occupancy of the motherboard module 100 and optimizing its structure. In addition, the flexible circuit board 26 has a certain degree of flexibility, allowing it to absorb stress caused by structural misalignment or thermal expansion differences, which helps improve the durability and connection stability of the motherboard module 100. Moreover, the two support plates 27 are locked together by two locking members 23, allowing each support plate 27 to support both ends of the flexible circuit board 26. This prevents the flexible circuit board 26 from bending at the connection point between the motherboard 11 and functional module 12, ensuring the connection stability between the flexible circuit board 26 and the motherboard 11 and functional module 12, preventing bending at the ends of the flexible circuit board 26 that could lead to poor contact, and thus ensuring stable signal transmission of the motherboard module 100.

[0043] Please see Figure 3 In this embodiment, the conductive component 20 includes two support members 24, both of which are insulators. One support member 24 abuts against the main board 11 and the flexible circuit board 26 respectively, and the other support member 24 abuts against the functional module 12 and the flexible circuit board 26 respectively.

[0044] Thus, through the above arrangement, one support member 24 supports the motherboard 11 and the flexible circuit board 26, and the other support member 24 supports the functional module 12 and the flexible circuit board 26, preventing the conductive ball 13 from deforming or breaking due to pressure, thereby preventing short circuits. This ensures that the conductive ball 13 and the conductive film 21 always maintain good contact, thereby improving the operational stability of the motherboard module 100.

[0045] Third Embodiment Please see Figure 4 The third embodiment is similar to the first embodiment in that the motherboard module 100 includes a motherboard 11 and a functional module 12. The difference is that the conductive component 20 does not include a rigid circuit board 22, a flexible circuit board 26 and a support plate 27.

[0046] In this embodiment, the conductive component 20 includes a conductive film 21 and a locking member 23. The two sides of the conductive film 21 abut against the connection area 111 and the conduction area 121, respectively. The locking member 23 passes through the main board 11 and the functional module 12 in a vertical direction and is threadedly connected to the functional module 12 and the main board 11, respectively.

[0047] Thus, through the above-mentioned setup, by utilizing the conductive film 21 and the locking element 23, the motherboard 11 and the functional module 12 can be vertically connected. Utilizing the thin and light characteristics of the conductive film 21, the motherboard module 100 is made thinner and lighter in the vertical direction, thereby enabling the motherboard module 100 to achieve a space-saving vertical module stacking structure, and thus optimizing the structure of the motherboard module 100.

[0048] In this embodiment, the conductive component 20 further includes a support member 24, which is an insulator, and its two ends abut against the main board 11 and the functional module 12, respectively.

[0049] Thus, through the above configuration, the support member 24 supports the motherboard 11 and the functional module 12 respectively, preventing the conductive ball 13 from deforming or breaking due to pressure, which would lead to a short circuit. This ensures that the conductive ball 13 and the conductive film 21 always maintain a good contact state, thereby improving the operational stability of the motherboard module 100.

[0050] Fourth embodiment This embodiment provides an electronic device (not shown) including a motherboard module 100. The motherboard module 100 can be any of the motherboard modules 100 provided in the first, second, and third embodiments. The electronic device can be a laptop computer, an industrial controller, an in-vehicle device, a wearable device, or other terminal devices containing a modular motherboard structure.

[0051] Thus, through the above configuration, the motherboard 11 and functional module 12 in the electronic device are connected for signal transmission through the conductive component 20. Utilizing the thin and light characteristics of the conductive film 21, it can effectively replace the traditional connector, thereby reducing the thickness of the motherboard module 100 and making reasonable use of the internal space of the electronic device to achieve a thinner and lighter electronic device. At the same time, the conductive film 21 has good conductivity, thereby ensuring the stability of signal transmission in the electronic device.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A motherboard module, characterized in that, include: A circuit assembly includes a motherboard and a functional module. The motherboard has a connection area, and the functional module is located on one side of the motherboard and has a conduction area. The connection area of ​​the motherboard and the conduction area of ​​the functional module are respectively provided with a plurality of evenly arranged conductive spheres. A conductive component is connected to the motherboard and the functional module respectively. The conductive component has a conductive film that covers the connection area and the conduction area and abuts against a plurality of conductive spheres on the connection area and the conduction area to enable signal transmission connection between the motherboard and the functional module.

2. The motherboard module of claim 1, wherein, The motherboard and the functional modules are spaced apart horizontally, and the conductive components include: A rigid circuit board is disposed above the motherboard and the functional module; Two locking components are provided, one of which is vertically inserted through the rigid circuit board and the main board and is threadedly connected to the rigid circuit board and the main board respectively; the other locking component is vertically inserted through the rigid circuit board and the functional module and is threadedly connected to the rigid circuit board and the functional module respectively. The conductive film is provided in two parts, one of which is disposed between the rigid circuit board and the conductive area, and the other of which is disposed between the rigid circuit board and the connection area.

3. The motherboard module of claim 2, wherein, The conductive component also includes: Both support members are insulators. One of the support members abuts against the motherboard and the rigid circuit board respectively, and the other support member abuts against the functional module and the rigid circuit board respectively.

4. The motherboard module of claim 1, wherein, The motherboard and the functional modules are spaced apart horizontally, and the conductive components include: A flexible circuit board is disposed above the motherboard and the functional module; Two support plates are located at both ends of the flexible circuit board, and both are located on the side of the flexible circuit board away from the main board. Each support plate abuts against the flexible circuit board. Two locking components correspond one-to-one with the two support plates. One of the locking components is sequentially inserted through the main board, the flexible circuit board and the corresponding support plate, and is threadedly connected to the main board and the corresponding support plate respectively. The other locking component is sequentially inserted through the functional module, the flexible circuit board and the corresponding support plate, and is threadedly connected to the functional module and the corresponding support plate respectively. The conductive film is provided in two parts, one of which is disposed between the flexible circuit board and the conductive area, and the other of which is disposed between the flexible circuit board and the connection area.

5. The motherboard module of claim 4, wherein the first and second connectors are arranged in a staggered configuration. The conductive component includes: Both support members are insulators. One of the support members abuts against the motherboard and the flexible circuit board respectively, and the other support member abuts against the functional module and the flexible circuit board respectively.

6. The motherboard module of claim 1, wherein, The motherboard and the functional module are arranged at intervals along the vertical direction. The conductive component is disposed between the motherboard and the functional module. The conductive component includes the conductive film and the locking member. The two sides of the conductive film abut against the connection area and the conduction area, respectively. The locking member passes through the motherboard and the functional module along the vertical direction and is threadedly connected to the functional module and the motherboard, respectively.

7. The motherboard module of claim 1, wherein the motherboard module is configured to be inserted into a slot of a host device. The conductive component also includes: A support member, which is an insulator, has its two ends abutting against the motherboard and the functional module, respectively.

8. The motherboard module of claim 1, wherein, The conductive film is conductive in the vertical direction and insulating in the horizontal direction.

9. The motherboard module of claim 1, wherein, The conductive component also includes: Multiple conductive needles are evenly arranged in the horizontal direction and are all inserted into the conductive film.

10. An electronic device, comprising: include: The motherboard module as described in any one of claims 1-9.

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