LNA chip matching structure of LNB assembly

Abstract

The utility model discloses a kind of LNA chip cooperation structure of LNB assembly, it includes PCB board, LNA chip and insulating protective glue;PCB board is equipped with welding area corresponding to LNA chip;LNA chip is flip chip, and LNA chip and the welding area welding of PCB board are connected;Insulating protective glue is attached on PCB board, and insulating protective glue completely covers LNA chip and the welding place of LNA chip and PCB board.The utility model directly cooperates LNA chip to PCB board, can effectively improve production efficiency and reduce production cost.

Description

Technical Field

[0001] This utility model relates to the field of LNB components, and in particular to an LNA chip mating structure for an LNB component. Background Technology

[0002] The LNB (Low Noise Downconverter) module is used to amplify and downconvert satellite signals transmitted from the feedhorn, converting Ku-band or C-band signals into L-band signals, which are then transmitted to the satellite receiver via coaxial cable. The LNA (Low Noise Amplifier) ​​is a crucial component of the LNB module. Currently, the LNA chip is typically packaged independently into an LNA device, which is then soldered onto the LNB module's PCB board along with other components. However, packaging the LNA chip into an LNA device requires a packaging mold, which is costly and not universally compatible. Changing the component's mating structure necessitates creating a new packaging mold. Furthermore, wire bonding is performed during LNA chip packaging (the LNA chip is a front-mounted chip), requiring high reliability, and wire resistance can affect product performance.

[0003] In view of the above problems, it is necessary to study an LNA chip mating structure for LNB components to overcome the shortcomings of the existing technology. Utility Model Content

[0004] The purpose of this invention is to provide an LNA chip mating structure for an LNB component to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, the solution of this utility model is: An LNA chip mating structure for an LNB component includes a PCB board, an LNA chip, and an insulating protective adhesive; the PCB board has a soldering area corresponding to the LNA chip; the LNA chip is a flip chip, and the LNA chip is soldered to the soldering area of ​​the PCB board; the insulating protective adhesive is attached to the PCB board, and the insulating protective adhesive completely covers the LNA chip and the solder joint between the LNA chip and the PCB board.

[0006] The LNA chip is soldered to the soldering area of ​​the PCB board using SMT surface mount technology.

[0007] The insulating protective adhesive is made of UV adhesive, epoxy adhesive, or silicone.

[0008] The insulating protective adhesive is elastic.

[0009] By adopting the above solution, this utility model directly mounts the LNA chip onto the PCB board, eliminating the existing process of packaging the LNA chip into an LNA device, improving production efficiency, and eliminating the need to develop corresponding packaging molds, thus reducing costs. Furthermore, the LNA chip of this utility model is a flip chip, so there is no need to solder the LNA chip to the PCB board, avoiding the defects caused by soldering when packaging LNA chips into LNA devices in the past. In addition, this utility model also uses insulating protective adhesive to completely cover the LNA chip and the solder joint between the LNA chip and the PCB board, effectively protecting the LNA chip. Attached Figure Description

[0010] Figure 1 This is a partial structural schematic diagram of the present invention.

[0011] Figure 2 This is a partial structural cross-sectional view of the present invention.

[0012] Label Explanation: PCB board 1, soldering area 11 LNA chip 2, Insulating protective adhesive 3. Detailed Implementation

[0013] To further explain the technical solution of this utility model, the following detailed description is provided through specific embodiments.

[0014] like Figure 1 and Figure 2 As shown, this utility model discloses an LNA chip mating structure for an LNB component, which includes a PCB board 1, an LNA chip 2, and an insulating protective adhesive 3; wherein, the PCB board 1 has a soldering area 11 corresponding to the LNA chip 2; the LNA chip 2 is a flip chip, and the LNA chip 2 is soldered to the soldering area 11 of the PCB board 1; the insulating protective adhesive 3 is attached to the PCB board 1, and the insulating protective adhesive 3 completely covers the LNA chip 2 and the solder joint between the LNA chip 2 and the PCB board 1.

[0015] As described above, this utility model directly mounts the LNA chip 2 onto the PCB board 1, eliminating the existing process of packaging the LNA chip 2 into an LNA device, thus improving production efficiency and reducing costs by eliminating the need to develop corresponding packaging molds. Furthermore, the LNA chip 2 of this utility model is a flip chip, so there is no need to solder the LNA chip 2 to the PCB board 1, avoiding the defects caused by soldering when packaging the LNA chip 2 into an LNA device. In addition, this utility model also completely covers the LNA chip 2 and the solder joint between the LNA chip 2 and the PCB board 1 with insulating protective adhesive 3, effectively protecting the LNA chip 2.

[0016] In an embodiment of this utility model, the LNA chip 2 is soldered to the soldering area 11 of the PCB board 1 through an SMT (Surface Mount Technology) process. In this way, the present utility model can use an existing SMT placement machine to mount the LNA chip 2 onto the PCB board 1.

[0017] In embodiments of this invention, the insulating protective adhesive 3 may be elastic, thus providing a cushioning effect and preventing the LNA chip 2 from being subjected to excessive vibration. The insulating protective adhesive 3 may be made of UV adhesive, epoxy adhesive, or silicone.

[0018] The above embodiments and figures are not intended to limit the product form and style of this utility model. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of this utility model.

Claims

1. An LNA chip matching structure of an LNB assembly, characterized in that: This includes the PCB board, LNA chip, and insulating protective adhesive; The PCB board has a soldering area corresponding to the LNA chip; The LNA chip is a flip chip, and the LNA chip is soldered to the soldering area of ​​the PCB board. The insulating protective adhesive is applied to the PCB board, completely covering the LNA chip and the solder joint between the LNA chip and the PCB board.

2. The LNA chip matching structure of an LNB assembly of claim 1, wherein: The LNA chip is soldered to the soldering area of ​​the PCB board using SMT surface mount technology.

3. The LNA chip matching structure of an LNB assembly of claim 1, wherein: The insulating protective adhesive is made of UV adhesive, epoxy adhesive, or silicone.

4. The LNA chip matching structure of an LNB assembly of claim 1, wherein: The insulating protective adhesive is elastic.

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