A PCB layout wiring structure of a module embedded PCB

Abstract

The application relates to a PCB layout wiring structure of a module embedded PCB, which comprises a PCB circuit board, an embedded module and a radiator; the PCB circuit board comprises a plurality of signal layers and a plurality of insulating layers; two groups of isolated gate drive modules are arranged on the uppermost signal layer of the PCB circuit board; the isolated gate drive modules each comprise an isolated gate driver and an isolated gate driver power supply conversion circuit; a signal output terminal is further arranged on the uppermost signal layer of the PCB circuit board; the embedded module comprises a plurality of single-tube modules and a substrate; the plurality of single-tube modules and the substrate are embedded in the PCB circuit board; the single-tube modules are attached to the upper surface of the substrate; the lower surface of the substrate is exposed outside the PCB circuit board; and a window is arranged at the bottom of the PCB circuit board. The application solves the matching problem of the module and the heat dissipation structure from the layout wiring structure, optimizes the volume and weight of the module, and improves the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and in particular to a PCB layout and wiring structure for embedding modules in a PCB. Background Technology

[0002] The power module is the "heart" of the inverter. Its three core indicators—power density, parasitic parameters, and integration level—directly determine the controller's response speed and the output capability of the electric drive system. The packaging scheme is the key factor that determines the performance of these three indicators, playing a crucial role in the overall performance of the inverter and the vehicle.

[0003] Optimizing the packaging design brings direct value: it makes inverters smaller and lighter, saving installation space in the vehicle and contributing to weight reduction. It also reduces energy loss within the module, improves power conversion efficiency, and directly improves the overall energy utilization of the vehicle.

[0004] Currently, the power modules used in electric drive inverters still follow traditional packaging methods. Under this technological approach, core performance indicators such as module size control, parasitic inductance suppression, and thermal resistance optimization have not yet reached ideal levels, indicating significant potential for optimization. Simultaneously, the industry's requirements for the integration level of electric drive controllers are continuously increasing, and traditional solutions are gradually becoming inadequate to meet this trend. Patent CN 119833504 A proposes an innovative solution—embedding an AMB substrate into a PCB-packaged integrated power module. This solution demonstrates significant advantages in increasing power density and reducing module weight and size, effectively addressing some performance pain points of traditional modules. However, limited by its unique packaging structure design, this module still faces inconveniences in practical applications: on the one hand, direct matching between the AMB substrate and the heat dissipation structure is difficult, hindering efficient thermal docking; on the other hand, when connector terminals are integrated inside the PCB module, the bottom surface of the AMB substrate is subject to structural interference, preventing direct contact with the heat dissipation structure, further restricting heat dissipation efficiency and assembly convenience. Utility Model Content

[0005] The purpose of this utility model patent is to provide a PCB layout and wiring structure for embedding modules into PCBs, which solves the matching problem between modules and heat dissipation structures from the perspective of layout and wiring structure, optimizes module size and weight, and improves heat dissipation effect.

[0006] A PCB layout and wiring structure for module embedding in PCB includes a PCB circuit board, an embedded module and a heat sink.

[0007] The PCB circuit board includes several signal layers and several insulating layers; the signal layers and insulating layers are arranged alternately from top to bottom;

[0008] Two sets of isolated gate drive modules are provided on the topmost signal layer of the PCB circuit board. One of the isolated gate drive modules is an upper-bridge isolated gate drive module, and the other is a lower-bridge isolated gate drive module. Each isolated gate drive module includes an isolated gate driver and an isolated gate driver power supply conversion circuit. In each set of isolated gate drive modules, the isolated gate driver and the isolated gate driver power supply conversion circuit are electrically connected. Signal output terminals are also provided on the topmost signal layer of the PCB circuit board, and the isolated gate driver power supply conversion circuits in the two sets of isolated gate drive modules are electrically connected to the signal output terminals respectively.

[0009] The embedded module includes several single-tube modules and a substrate;

[0010] Several of the single-tube modules and the substrate are embedded in the PCB circuit board; the single-tube modules are all mounted on the upper surface of the substrate; the lower surface of the substrate is exposed outside the PCB circuit board.

[0011] The PCB circuit board has a window at the bottom for mounting a heat sink, and the heat sink is attached to the lower surface of the substrate.

[0012] Specifically, the substrate is a double-sided copper-clad ceramic substrate.

[0013] Specifically, the PCB circuit board has four signal layers.

[0014] Specifically, the upper bridge isolated gate drive module and the lower bridge isolated gate drive module are distributed on both sides of the embedded module.

[0015] Preferably, mounting holes are provided at the corners of the PCB circuit board.

[0016] Preferably, the upper surface of the heat sink is provided with a copper layer, and the double-sided copper-clad ceramic substrate is attached to the heat sink by sintering.

[0017] Preferably, the PCB circuit board has a plurality of connection holes filled with a conductive medium to realize electrical connections between corresponding signal layers and between signal layers and embedded modules and corresponding signal layers.

[0018] The PCB layout and wiring structure for module embedding in PCB of this utility model has the following advantages compared with the prior art:

[0019] The PCB circuit board features a layout and wiring structure that places the upper and lower bridge driver chips on both sides of the PCB to differentiate the high voltage of the upper and lower bridges and to isolate different high voltage signals, meeting the requirements for creepage and electrical isolation. The copper plating on the signal layers within the PCB circuit board increases current carrying capacity and distributes current to each individual transistor, ensuring equal power for each transistor and absorbing part of the heat dissipation function for each transistor. Embedded modules are connected to other signal layers via conductive media in the connection holes to guide current. The bottom layer openings and copper plating on the PCB circuit board enhance module heat dissipation. The bottom layer openings on the PCB circuit board are sintered with the heat sink base plate, further improving the heat dissipation function of the PCB circuit board. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the isolated gate drive module in Example 1 mounted on a PCB circuit board.

[0021] Figure 2 This is a schematic diagram of the internal structure of the embedded module embedded in the PCB circuit board in Example 1;

[0022] Figure 3 This is a schematic diagram of the connection between the PCB circuit board and the heat sink in Example 1;

[0023] Figure 4 This is a schematic diagram of the embedded module embedded in the PCB circuit board in Example 1. Detailed Implementation

[0024] The specific embodiments of this utility model patent will be further described in detail below with reference to the accompanying drawings.

[0025] Example 1

[0026] like Figure 1 As shown, a PCB layout and wiring structure for module embedding in PCB is characterized by including a PCB circuit board 1, an embedded module 2, and a heat sink 3.

[0027] The PCB circuit board 1 includes several signal layers 4 and several insulating layers 5; the signal layers 4 and the insulating layers 5 are arranged alternately from top to bottom.

[0028] Two sets of isolated gate drive modules are located on the top signal layer of the PCB circuit board 1. One of the isolated gate drive modules is the upper bridge isolated gate drive module, and the other is the lower bridge isolated gate drive module. Each isolated gate drive module includes an isolated gate driver 6 and an isolated gate driver power supply conversion circuit 7. The upper bridge isolated drive module isolates the low-level drive signal of the control circuit from the high potential of the upper bridge arm, and provides a suitable drive voltage for the upper bridge arm power transistor, enabling it to conduct and turn off normally. In each set of isolated gate drive modules, the isolated gate driver and the isolated gate driver power supply conversion circuit are electrically connected. The lower bridge isolated drive module isolates the control signal from the power circuit, enhances the anti-interference capability of the drive signal, and ensures that the lower bridge arm power transistor can operate accurately according to the control signal. A signal output terminal 8 is also provided on the top signal layer of the PCB circuit board, and the isolated gate driver power supply conversion circuit 7 in the two sets of isolated gate drive modules is electrically connected to the signal output terminal 8.

[0029] The embedded module 3 includes several single-tube modules 9 and a substrate 10;

[0030] like Figure 2 As shown, several of the single-tube modules 9 and the substrate 10 are embedded in the PCB circuit board 1; the single-tube modules 9 are all mounted on the upper surface of the substrate 10; the lower surface of the substrate 10 is exposed outside the PCB circuit board 1.

[0031] like Figure 3 and Figure 4 As shown, the bottom of the PCB circuit board 1 has a window for mounting the heat sink 3, and the heat sink 3 is attached to the lower surface of the substrate 10. By creating a window at the bottom of the PCB circuit board to match the heat sink, the ease of use of the module is improved.

[0032] In this embodiment, the substrate 10 is a double-sided copper-clad ceramic substrate.

[0033] In this embodiment, the upper bridge isolated gate drive module and the lower bridge isolated gate drive module are distributed on both sides of the surface layer of the PCB circuit board. The upper / lower bridge drivers are placed on both sides of the surface layer of the PCB circuit board through the layout and wiring structure of the PCB circuit board 1 to distinguish the high voltage of the upper / lower bridge and the isolation between different high voltage signals to meet the spacing requirements for creepage and electrical isolation.

[0034] In this embodiment, the PCB circuit board 1 has four signal layers. The second copper layer of the PCB circuit board increases current carrying capacity and distributes current to each individual transistor to ensure that each transistor has the same power and also undertakes part of the heat dissipation function of the individual transistor. The third layer structure of the PCB circuit board 1 has a fixedly embedded module, which is connected to the first and second copper layers through blind and buried vias to conduct current. The bottom opening and copper layer of the PCB circuit board 1 increase the heat dissipation function of the module. The bottom opening of the PCB circuit board 1 is sintered with the heat sink 3 to improve the heat dissipation effect.

[0035] In this embodiment, mounting holes (not shown in the figure) are provided at the corners of the PCB circuit board 1 to improve the connection strength with the heat sink 3.

[0036] Furthermore, the upper surface of the heat sink 6 is provided with a copper layer, and the double-sided copper-clad ceramic substrate is sintered to achieve bonding with the heat sink, thereby improving the bonding strength between the heat sink 6 and the embedded module 2, as well as the signal layer in the PCB circuit board 1.

[0037] In this embodiment, the PCB circuit board 1 is provided with a plurality of connection holes 11, which are filled with conductive medium to realize electrical connections between corresponding signal layers and between signal layers and embedded modules and corresponding signal layers.

[0038] Working principle: An embedded module is placed in the middle of the PCB circuit board. The control and bridge isolated gate drive module and the lower bridge isolated gate drive module are distributed on both sides of the PCB circuit board's surface layer, achieving isolation between the high-voltage and low-voltage sides, as well as isolation between the upper and lower bridges of the power module and related circuits. The layout and wiring of the top and second layers of the PCB circuit board meet electrical regulations while also allowing for the carrying of larger currents and voltages. Embedding the power module reduces the size and weight of the power module.

Claims

1. A PCB layout routing structure for a module embedded PCB, characterized by, Includes PCB circuit boards, embedded modules, and heat sinks; The PCB circuit board includes several signal layers and several insulating layers; the signal layers and insulating layers are arranged alternately from top to bottom; Two sets of isolated gate drive modules are provided on the topmost signal layer of the PCB circuit board. One of the isolated gate drive modules is an upper-bridge isolated gate drive module, and the other is a lower-bridge isolated gate drive module. Each isolated gate drive module includes an isolated gate driver and an isolated gate driver power supply conversion circuit. In each set of isolated gate drive modules, the isolated gate driver and the isolated gate driver power supply conversion circuit are electrically connected. Signal output terminals are also provided on the topmost signal layer of the PCB circuit board, and the isolated gate driver power supply conversion circuits in the two sets of isolated gate drive modules are electrically connected to the signal output terminals respectively. The embedded module includes several single-tube modules and a substrate; Several of the single-tube modules and the substrate are embedded in the PCB circuit board; the single-tube modules are all mounted on the upper surface of the substrate; the lower surface of the substrate is exposed outside the PCB circuit board. The PCB circuit board has a window at the bottom for mounting a heat sink, and the heat sink is attached to the lower surface of the substrate.

2. The PCB layout and routing structure for module embedding in a PCB as described in claim 1, characterized in that, The substrate is a double-sided copper-clad ceramic substrate.

3. The PCB layout structure of claim 1, wherein, The PCB circuit board has four signal layers.

4. The PCB layout structure of claim 1, wherein, The upper-bridge isolated gate drive module and the lower-bridge isolated gate drive module are located on both sides of the embedded module.

5. The PCB layout structure of claim 2, wherein, The PCB circuit board has mounting holes at its corners.

6. The PCB layout structure of claim 5, wherein, The upper surface of the heat sink is provided with a copper layer, and the double-sided copper-clad ceramic substrate is attached to the heat sink by sintering.

7. A PCB layout structure of a module embedded PCB according to any one of claims 1 to 6, wherein, The PCB circuit board has several connection holes filled with conductive medium to achieve electrical connections between corresponding signal layers and between signal layers and embedded modules and their corresponding signal layers.

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