A copper deposition line anti-stacking device

Abstract

The utility model discloses a kind of copper sinking line anti-stacking plate devices, including support frame, the bottom of the support frame is equipped with several bottom racks extending along front and back, the left side of the support frame is equipped with several left racks extending along front and back, the front and back sides of the support frame are slidably connected with the first guide sleeve that can move left and right, the first guide sleeve is screwed with first locking screw, the right rack extending along front and back is connected between the first guide sleeve, the bottom rack, left rack and right rack are all equipped with corresponding tooth groove for circuit board placement. The utility model is simple in structure, when using, first, circuit board is placed in the tooth groove of bottom rack and left rack, then push right rack to left, the tooth groove of right rack clamps circuit board, then tighten first locking screw, lock right rack, that is, complete the fixation of circuit board, adapt to the placement requirement of different size circuit board, circuit board is not easy to shake during carrying or copper sinking process, improve copper sinking work efficiency and work quality, and use effect is good.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, specifically to a device for preventing copper plating lines from stacking. Background Technology

[0002] In the circuit board manufacturing process, copper plating is performed on the circuit boards using copper plating lines. However, because circuit boards are generally thin, they tend to stack together during the copper plating process. To prevent this, hanging baskets are typically used to place the circuit boards, with fixing rods used to limit their movement and prevent them from stacking. However, existing hanging baskets cannot accommodate circuit boards of different sizes, and the circuit boards are prone to shaking during handling or copper plating, affecting the efficiency and quality of the copper plating process, resulting in unsatisfactory performance. Therefore, to avoid the shortcomings of the existing technology, it is necessary to improve it. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings and deficiencies in the existing technology and provide a simple and easy-to-use anti-overlapping device for copper wire plating.

[0004] This utility model is achieved through the following technical solution:

[0005] A device for preventing copper wire stacking includes a support frame. The bottom of the support frame is provided with several bottom toothed racks extending forward and backward. The left side of the support frame is provided with several left toothed racks extending forward and backward. The front and rear sides of the support frame are slidably connected with first guide sleeves that can move left and right. The first guide sleeves are screwed with first locking screws. A right toothed rack extending forward and backward is connected between the first guide sleeves. The bottom toothed racks, left toothed racks and right toothed racks are all provided with corresponding toothed grooves for placing circuit boards.

[0006] Furthermore, the support frame is provided with horizontal guide rods on both the front and rear sides for sliding connection of the first guide sleeve, and the first locking screw abuts against the horizontal guide rods.

[0007] Furthermore, the top of the support frame is slidably connected to a second guide sleeve that can move up and down, the second guide sleeve is screwed with a second locking screw, and the second guide sleeve is equipped with a top rack that extends along the front and back.

[0008] Furthermore, the top of the support frame is provided with a vertical guide rod for sliding connection of the second guide sleeve, and the second locking screw abuts against the vertical guide rod.

[0009] Furthermore, both the first locking screw and the second locking screw are manually adjustable screws.

[0010] Furthermore, it also includes a connecting frame for mounting the circuit board, the connecting frame being provided with clips for holding the circuit board.

[0011] Furthermore, the support frame, connecting frame, and clamps are all made of corrosion-resistant alloys.

[0012] Furthermore, the connecting frame is provided with clips for holding the circuit board on all four sides.

[0013] Furthermore, the upper part of the support frame is provided with a reinforcing connecting strip.

[0014] Furthermore, the bottom of the support frame is provided with several reinforcing plates.

[0015] Compared to existing technologies, this utility model features a support frame with several bottom racks extending forward and backward at its bottom, and several left racks extending forward and backward on its left side. First guide sleeves, capable of left and right movement, are slidably connected to both the front and rear sides of the support frame. First locking screws are screwed onto the first guide sleeves, and right racks extending forward and backward are connected between the first guide sleeves. In use, the circuit board is first placed in the grooves of the bottom and left racks, then the right rack is pushed to the left, locking the circuit board in its grooves. Finally, the first locking screws are tightened to lock the right rack, thus securing the circuit board. This design adapts to the placement requirements of circuit boards of different sizes. During transport or copper plating, the circuit board is less prone to shaking, improving the efficiency and quality of copper plating work, resulting in excellent performance. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the anti-overlapping plate device for copper plating wires of this utility model;

[0018] Figure 2 This is a schematic diagram of the connection between the connecting frame and the circuit board of this utility model.

[0019] In the diagram: 1-Support frame; 2-Bottom rack; 3-Left rack; 4-First guide sleeve; 5-First locking screw; 6-Right rack; 7-Circuit board; 8-Horizontal guide rod; 9-Second guide sleeve; 10-Second locking screw; 11-Top rack; 12-Vertical guide rod; 13-Connecting frame; 14-Clamp; 15-Reinforcing connecting strip; 16-Reinforcing plate. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1 and Figure 2 The present invention discloses a copper plating anti-overlapping device, comprising a support frame 1. The bottom of the support frame 1 has several bottom toothed racks 2 extending forward and backward, and the left side of the support frame 1 has several left toothed racks 3 extending forward and backward. First guide sleeves 4, which can move left and right, are slidably connected to both the front and rear sides of the support frame 1. First locking screws 5 are screwed onto the first guide sleeves 4. Right toothed racks 6 extending forward and backward are connected between the first guide sleeves 4. The bottom toothed racks 2, left toothed racks 2, and right toothed racks 3 each have corresponding toothed grooves for placing the circuit board. In use, the circuit board is first placed in the toothed grooves of the bottom toothed racks 2 and left toothed racks 3. Then, the right toothed rack 6 is pushed to the left, and the toothed grooves of the right toothed rack 6 hold the circuit board in place. Then, the first locking screws 5 are tightened to lock the right toothed rack 6, thus completing the fixation of the circuit board 7. This device adapts to the placement requirements of circuit boards 7 of different sizes. During transportation or copper plating, the circuit board 7 is less likely to shake, improving the efficiency and quality of copper plating work, and providing good performance.

[0022] The support frame 1 has horizontal guide rods 8 on both the front and rear sides for sliding connection of the first guide sleeve 4. The first locking screw 5 abuts against the horizontal guide rods 8, making the installation structure of the first guide sleeve 4 simple, smooth sliding, and stable locking.

[0023] The top of the support frame 1 is slidably connected to a second guide sleeve 9 that can move up and down. The second guide sleeve 9 is screwed with a second locking screw 10. The second guide sleeve 9 is equipped with a top rack 11 that extends along the front and back. When the top rack 11 is pushed down, the tooth groove of the top rack 11 locks the circuit board. Then, the second locking screw 10 is tightened to lock the top rack 11, preventing the circuit board from moving upward under force when immersed in the medicine, thus improving the placement stability of the circuit board.

[0024] The top of the support frame 1 is provided with a vertical guide rod 12 for sliding connection of the second guide sleeve 9. The second locking screw 10 abuts against the vertical guide rod 12, making the installation structure of the second guide sleeve 9 simple, smooth sliding, and stable locking.

[0025] Both the first locking screw 5 and the second locking screw 10 are hand-adjustable screws, making tightening and loosening operations more convenient.

[0026] It also includes a connecting frame 13 for mounting the circuit board 7. The connecting frame 13 is provided with a clip 14 for holding the circuit board 7. For some thinner circuit boards 7, the circuit board 7 needs to be clamped and fixed to the connecting frame 13 with the clip 14 to prevent the circuit board 7 from deforming due to gravity and affecting the copper plating.

[0027] The support frame 1, connecting frame 13, and clamp 14 are all made of corrosion-resistant alloy, which improves the service life of the device and avoids affecting the copper plating.

[0028] The connecting frame 13 is equipped with clips 14 around its perimeter to hold the circuit board 7, thereby improving the stability of the circuit board 7 during installation and preventing the circuit board 7 from deforming during operation.

[0029] The upper part of the support frame 1 is provided with a reinforcing connecting strip 15, which improves the structural stability of the upper part of the device and facilitates the lifting of the device.

[0030] The bottom of the support frame 1 is provided with several reinforcing plates 16 to improve the structural stability of the bottom of the device.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A device for preventing copper wire overlap, characterized in that: The device includes a support frame, the bottom of which is provided with several bottom racks extending forward and backward, and the left side of which is provided with several left racks extending forward and backward. The front and rear sides of the support frame are slidably connected with first guide sleeves that can move left and right. The first guide sleeves are screwed with first locking screws. The first guide sleeves are connected with right racks extending forward and backward. The bottom racks, left racks and right racks are all provided with corresponding toothed grooves for placing the circuit board.

2. The anti-overlapping device for copper plating lines according to claim 1, characterized in that: The support frame is provided with horizontal guide rods on both the front and rear sides for sliding connection of the first guide sleeve, and the first locking screw abuts against the horizontal guide rods.

3. The anti-overlapping device for copper plating lines according to claim 1, characterized in that: The top of the support frame is slidably connected to a second guide sleeve that can move up and down. The second guide sleeve is screwed with a second locking screw and is equipped with a top rack that extends forward and backward.

4. The anti-overlapping device for copper plating lines according to claim 3, characterized in that: The top of the support frame is provided with a vertical guide rod for sliding connection of the second guide sleeve, and the second locking screw abuts against the vertical guide rod.

5. The anti-overlapping device for copper plating lines according to claim 3, characterized in that: Both the first and second locking screws are manually adjustable screws.

6. The anti-overlapping device for copper plating lines according to claim 1, characterized in that: It also includes a connecting frame for mounting the circuit board, the connecting frame being provided with clips for holding the circuit board.

7. The anti-overlapping device for copper plating lines according to claim 6, characterized in that: The support frame and connecting frame clips are both made of corrosion-resistant alloy.

8. The anti-overlapping device for copper plating lines according to claim 6, characterized in that: The connecting frame is provided with clips for holding the circuit board on all four sides.

9. The anti-overlapping device for copper plating lines according to claim 1, characterized in that: The upper part of the support frame is provided with a reinforcing connecting strip.

10. The anti-overlapping device for copper plating lines according to claim 1, characterized in that: The bottom of the support frame is provided with several reinforcing plates.

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