A four-channel multilayer power board solid state power controller structure

Abstract

This invention relates to the technical field of housings or structural components of electrical equipment. The invention discloses a four-channel multilayer power board solid-state power controller structure, including a terminal block assembly. The terminal block assembly is vertically inserted into the top layer of a multilayer horizontal circuit module. OFPC sockets are soldered onto the circuit module for crimping FFC flexible flat cables. The upper part of the terminal block assembly has an outwardly protruding platform structure. Support pillars are erected at the four corners of the aluminum substrate, passing through the multilayer circuit module and fixed to the platform structure of the terminal block assembly. The circuit module is fixed by the support pillars. This invention provides OFPC sockets and terminals on the printed circuit board module and the aluminum substrate circuit module, avoiding the need for cleaning after conventional wire bonding, improving production efficiency; it also facilitates product testing and subsequent maintenance, increases product assembly yield, and avoids component scrap due to solder pad detachment caused by repeated soldering, resulting in good rework and maintainability.

Description

Technical Field

[0001] This utility model relates to the technical field of housings or structural components of electrical equipment. Background Technology

[0002] Traditional SSPC structures typically consist of a base, a housing, a DBC board (power board), and a PCB board (control board). The main internal assembly processes are: 1. Reflow soldering of the DBC board to the base; 2. Manual soldering of the PCB board to the base pins via vias; 3. Laser sealing of the base to the housing. The advantages of this structure and process are that the internal atmosphere and moisture content are effectively controlled, and the manufacturing process is mature. The disadvantages are that, to meet the thermal design requirements of the power devices, all power devices are placed on the DBC board and soldered to the base, resulting in a limited design, large surface area, restricted installation space, and a single heat dissipation method. However, since the housing and base are laser sealed, rework and repair are not feasible after assembly. Utility Model Content

[0003] The purpose of this invention is to provide a four-channel multilayer power board solid-state power controller structure that not only meets current carrying requirements but also provides heat dissipation for MOSFETs, and is easy to rework and maintain.

[0004] To address the aforementioned technical problems, this utility model provides a four-channel multilayer power board solid-state power controller structure, including a terminal block assembly. The terminal block assembly is vertically inserted into the top layer of a multilayer horizontal circuit module. An OFPC socket is soldered onto the circuit module for crimping FFC flexible flat cables. The upper part of the terminal block assembly has an outwardly protruding platform structure. Support columns are erected at the four corners of the aluminum substrate. The support columns pass through the multilayer circuit module and are fixed to the platform structure of the terminal block assembly. The circuit module is fixed by the support columns. A frame is fitted around the circuit module on the aluminum substrate. The top of the frame is connected to the platform structure of the terminal block assembly. A cover plate is installed at the top center of the terminal block assembly.

[0005] The circuit module is fixed with welding terminals, and the side of the terminal block assembly is injection molded with multiple busbars. The terminal block assembly is assembled and fixed to the busbars and welding terminals by fasteners.

[0006] A support block is fixed to the upper edge of the aluminum substrate, and the frame is positioned and fixed by a positioning pin that passes through the support block.

[0007] The multi-layer circuit modules transmit signals to each other via FFC flexible flat cables crimped onto OFPC sockets.

[0008] The side of the frame has a curved concave structure, and the bottom of the frame has a circular sleeve at the curved concave position for threaded fixation.

[0009] The outer diameter of the circular sleeve is 1mm to 2mm larger than the outer diameter of the Grade A flat washer corresponding to the reserved specification screw.

[0010] The circuit module has five layers.

[0011] The thickness of the aluminum substrate is 0.2mm to 0.5mm greater than the reserved thickness of the frame.

[0012] The terminal block assembly has a protective partition structure between multiple terminals on the top, and the terminals are fitted with round nuts.

[0013] The frame has openings for mounting J30J type micro-connectors for signal transmission.

[0014] Compared with the prior art, this utility model provides OFPC sockets and terminals on the printed circuit board module and aluminum substrate circuit module, which can avoid the problem of cleaning required after conventional wire bonding, improve production efficiency, facilitate product testing and subsequent maintenance, increase product assembly output, avoid component scrapping caused by failures such as pad detachment due to repeated soldering, and improve rework and maintainability; the bus bar specification design meets the thermal design requirements of power boards, improves the structural design freedom of multi-channel products, and can be applied to solid-state power controller series products with high current and high power consumption.

[0015] In addition, a five-layer horizontal circuit module is adopted, and FFC flexible flat cables are crimped through OFPC sockets to achieve inter-layer signal transmission. Compared with the traditional single-layer or double-layer PCB layout, this design significantly improves space utilization and reduces external cable interference, which is in line with the trend of highly integrated electronic devices. The four corner support columns of the aluminum substrate penetrate the multi-layer module and are fixed to the terminal block platform to form a rigid frame, avoiding solder joint fatigue caused by vibration. The frame set module and the bottom support block positioning pin are doubly reinforced to resist mechanical stress.

[0016] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, specific embodiments of this utility model are given below. Attached Figure Description

[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0018] Figure 1 This is a schematic diagram of the structure of at least one embodiment of the present invention; Figure 2 yes Figure 1 3D exploded view; Figure 3 yes Figure 1 Internal structure diagram; Figure 4 yes Figure 3 A magnified view of a portion of the image; Figure 5 yes Figure 2 A schematic diagram of the installation of the aluminum substrate.

[0019] In the diagram: 1-cover plate, 2-terminal assembly, 3-frame, 4-circuit module, 5-support column, 6-support block, 7-aluminum substrate, 8-busbar, 9-welding terminal, 10-OFPC socket, 11-circular sleeve. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of this utility model. The embodiments can be combined with and referenced by each other without contradiction.

[0021] Example 1 like Figures 1-5 The diagram shows a four-channel multilayer power board solid-state power controller structure, including a terminal block assembly 2. The terminal block assembly 2 is vertically inserted into the top layer of a multilayer horizontal circuit module 4. An OFPC socket 10 is soldered onto the circuit module 4 for crimping FFC flexible flat cables. The upper part of the terminal block assembly 2 has an outwardly protruding platform structure. Support columns 5 are erected at the four corners of the aluminum substrate 7. The support columns 5 pass through the multilayer circuit module 4 and are fixed to the platform structure of the terminal block assembly 2. The circuit module 4 is fixed by the support columns 5. A frame 3 is fitted on the aluminum substrate 7 and fits around the circuit module 4. The top of the frame 3 is connected to the platform structure of the terminal block assembly 2. A cover plate 1 is installed at the top center of the terminal block assembly 2.

[0022] Example 2 Based on embodiment 1, the circuit module 4 is fixed with welding terminals 9, and the side of the terminal block assembly 2 is injection molded with multiple busbars 8. The terminal block assembly 2 is fixed to the busbars 8 and welding terminals 9 by fasteners.

[0023] A support block 6 is fixed to the upper edge of the aluminum substrate 7, and the frame 3 is positioned and fixed by a positioning pin that passes through the support block 6.

[0024] The multi-layer circuit modules 4 transmit signals to each other via FFC flexible flat cables crimped onto OFPC sockets 10.

[0025] The frame 3 has a curved concave structure on its side, and a circular sleeve 11 at the bottom of the frame 3 at the curved concave position is used for threaded fixation.

[0026] Example 3 Based on Example 1, the outer diameter of the circular sleeve 11 is 1mm to 2mm larger than the outer diameter of the flat washer of grade A corresponding to the reserved specification screw.

[0027] The circuit module 4 has five layers.

[0028] The thickness of the aluminum substrate 7 is 0.2mm to 0.5mm greater than the reserved thickness of the frame 3.

[0029] The terminal block assembly 2 has a protective partition structure between multiple terminals on its top, and the terminals are fitted with round nuts.

[0030] The frame 3 has an opening for mounting a J30J type micro-connector for signal transmission.

[0031] Example 4 Based on the above embodiments, from top to bottom, the components are: cover plate 1, terminal block assembly 2, frame 3, circuit module 4, support column 5, support block 6, and aluminum substrate 7. The terminal block assembly 2 includes components such as an embedded round nut and a busbar 8, and is integrally molded using injection molding. The material is PA66+30% glass fiber (black). The cover plate 1 and frame 3 are integrally molded using injection molding, and are made of PA66+30% glass fiber (black). The support column 5 uses common standard specifications and is made of brass. The bracket includes an embedded round nut, is integrally molded using injection molding, and is made of PA66+30% glass fiber. A guide pin is designed to ensure the installation position of the support block 6. The structure internally contains five circuit modules 4 and one aluminum substrate circuit module 7. Control signals are transmitted via soldered PH1.0 FPC sockets 10 and crimped FFC flexible flat cables. The overall product outputs external control signals via a J30J micro-type connector. Power input and output are achieved through PCB soldering terminals 9 soldered on the circuit modules and through holes in the busbar 8 in the terminal block assembly 2, using standard parts for fixed assembly. The five printed circuit board circuit modules 4 and the one aluminum substrate circuit module 7 are fixed and limited by support columns. The mounting position of the terminal block assembly 2 is fixed by the holes in its own busbar 8 and the holes in the soldered terminals 9 on the circuit modules. The frame 3 is fixed to the terminal block assembly 2 and the support block 6 using standard parts.

[0032] For ease of design, the product base plate is designed as an aluminum substrate 7, which serves as a structural component and also functions as a power control board. To ensure reliable contact between the aluminum substrate 7 and the mounting surface, the thickness of the aluminum substrate 7 should be 0.2 to 0.5 mm greater than the reserved thickness of the frame 3, ensuring that the aluminum substrate 7 can make full contact during product installation, effectively conduct heat, and meet the thermal design requirements of the product. To ensure the transmission of control signals within the product, an OFPC socket 10 should be designed on circuit module 4. Internal signal transmission is carried out through FFC flexible flat cable, avoiding traditional wire bonding processes and providing good debuggability and maintainability. At the same time, a soldering terminal 9 is designed for assembly and fixation with fasteners. To ensure the protection between the power terminals of the product, a protective partition is designed between them. The terminal block assembly 2 is injection molded with an embedded round nut and a busbar 8. When the busbar 8 is injection molded, it should be designed to be 0.2 to 0.5 mm higher than the injection molded part to ensure the reliability of the user's wiring. In addition, the reserved mounting holes for the busbar 8 and the welding terminal 9 are designed as waist-shaped holes in the height direction to ensure the tolerance of the welding and assembly process of the redundant welding terminal 9. The specifications of the busbar are designed according to the heat generation of the field effect tube. To ensure the accuracy and reliability of the assembly position of the support block 6, the support block 6 should be designed with a locating pin. The diameter of the locating pin should be 0.2mm smaller than the diameter of the small end of the mounting hole, and the end should be chamfered to ensure that the locating pin can be quickly inserted into the mounting hole of the aluminum substrate 7 during the assembly process. The mounting hole of the aluminum substrate 7 should be designed as a conical hole that gradually decreases in size from top to bottom to ensure that the position of the support block is more accurate. To ensure the strength of the pre-drilled mounting holes on the frame 3, stainless steel circular sleeves 11 need to be injection molded at the mounting holes of the frame. The outer diameter of the sleeves should be 1-2 mm larger than the outer diameter of the flat washer A-grade corresponding to the pre-drilled screws, so as to ensure that the screw installation action is fully applied to the stainless steel circular sleeves 11. To facilitate the potting, venting, and observation of the product's potting process, a separate cover plate component was designed. After potting, the cover plate 1 was assembled using fasteners.

[0033] Preferably, the internal encapsulation uses silicone rubber with a thermal conductivity of 2.1 W / km. The heat dissipation path for the internal MOSFET is: MOSFET - silicone rubber - housing / busbar. Compared to the conventional heat dissipation path: MOSFET - air - housing / busbar, the heat dissipation performance is significantly improved, and the required busbar specifications can be designed based on the MOSFET's heat dissipation. A stainless steel circular sleeve is injection-molded at the mounting holes in the frame to enhance the strength of the mounting holes. The busbar at the reserved power terminal connection point in the terminal block assembly should protrude by 0.2–0.5 mm.

[0034] Those skilled in the art will understand that the above embodiments can be modified in form and detail in practical applications without departing from the spirit and scope of this utility model.

Claims

1. A four-channel multilayer power board solid-state power controller structure, characterized in that: The assembly includes a connector assembly (2), which is vertically inserted into the top layer of a multi-layer horizontal circuit module (4). The circuit module (4) is soldered with an OFPC socket (10) for crimping FFC flexible flat cable. The upper part of the connector assembly (2) has an outwardly protruding platform structure. Support columns (5) are erected at the four corners of the aluminum substrate (7). The support columns (5) pass through the multi-layer circuit module (4) and are fixed to the platform structure of the connector assembly (2). The circuit module (4) is fixed by the support columns (5). A frame (3) is fitted on the aluminum substrate (7) and fits outside the circuit module (4). The top of the frame (3) is connected to the platform structure of the connector assembly (2). The top of the middle part of the connector assembly (2) is covered by a cover plate (1).

2. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The circuit module (4) is fixed with welding terminals (9), and the side of the terminal block assembly (2) is injection molded with multiple busbars (8). The terminal block assembly (2) is fixed to the busbars (8) and welding terminals (9) by fasteners.

3. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: A support block (6) is fixed on the upper edge of the aluminum substrate (7), and the frame (3) is positioned and fixed by the positioning pins that pass into the support block (6).

4. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The multilayer circuit modules (4) transmit signals to each other via FFC flexible flat cables crimped onto OFPC sockets (10).

5. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The frame (3) has a curved concave structure on its side, and a circular sleeve (11) is located at the bottom of the frame (3) at the curved concave position for threaded fixation.

6. The four-channel multilayer power board solid-state power controller structure as described in claim 5, characterized in that: The outer diameter of the circular sleeve (11) is 1mm~2mm larger than the outer diameter of the A-grade flat washer corresponding to the reserved specification screw.

7. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The circuit module (4) has five layers.

8. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The thickness of the aluminum substrate (7) is 0.2mm~0.5mm greater than the reserved thickness of the frame (3).

9. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The terminal block assembly (2) has a protective partition structure between multiple terminals on the top, and the terminals are fitted with round nuts.

10. The four-channel multilayer power board solid-state power controller structure as described in claim 1, characterized in that: The frame (3) has an opening for mounting a J30J type micro-connector for signal transmission.

Images