Heat dissipating device and its converter

Abstract

The application discloses a heat dissipation device, which comprises a shell, a mounting cavity is arranged in the shell, and a circuit board is arranged in the mounting cavity; the shell is further provided with a first cooling part and a second cooling part; the first cooling part and the second cooling part are capable of abutting at two sides of a heating unit on the circuit board respectively; and at least one of the first cooling part and the second cooling part is a water cooling structure. In use, the first cooling part and the second cooling part hold the circuit board from top to bottom, a bidirectional heat conduction path is formed, and the heat dissipation efficiency is significantly improved; most of the heat of the heating unit is dissipated through the water cooling structure, and the heating unit is assisted in heat dissipation through another cooling structure, so that the heat is prevented from accumulating on one side.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat dissipation device and its converter. Background Technology

[0002] Currently, electric vehicles and hybrid vehicles can effectively solve environmental pollution problems and alleviate the energy crisis. Therefore, the development of new energy vehicles has received widespread attention. The cooling requirements for controllers in new energy vehicles are becoming increasingly stringent, evolving from simple natural cooling to coolant cooling. As the power performance of various controllers improves, the heat generation also increases, demanding higher cooling efficiency. More and more controllers are adopting coolant cooling technology. Currently, water cooling involves connecting the battery, motor, motor controller, charger, and DC-DC converter in the electric vehicle through pipelines. A water pump provides the power for the liquid circulation. After absorbing heat through these components, the coolant flows into the vehicle's radiator to dissipate heat, and then returns to the components for further circulation.

[0003] The converter's processor, transistors, resistors, capacitors, light-emitting diodes (LEDs) and other components generate considerable waste heat during operation. When the waste heat accumulates, it can cause high temperatures on the circuit board and its electronic components, leading to abnormal operation of the electronic components or even causing the entire electronic device to malfunction. It may also cause the circuit board and its electronic components to burn out or short-circuit. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a heat dissipation device and its converter, which can dissipate heat from the heat-generating components with high heat output in a timely manner and ensure that the operating temperature of the heat-generating components is at a relatively low temperature. This aims to solve the problem of poor overall heat dissipation caused by the poor thermal conductivity of the circuit board.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A heat dissipation device includes a housing with a mounting cavity for mounting a circuit board; the housing also includes a first cooling section and a second cooling section, which can respectively abut against both sides of a heat-generating unit on the circuit board, and at least one of the first cooling section and the second cooling section is a water-cooled structure.

[0007] Furthermore, the heat dissipation housing includes an upper housing and a lower housing that are sealed to each other. The space between the upper housing and the lower housing is used to install the circuit board. The first cooling part is located in the upper housing, and the second cooling part is located in the lower housing. The first cooling part is a water-cooled structure.

[0008] Furthermore, the first cooling section includes a cooling cavity, which can abut against one side of the heating unit. The cooling cavity is provided with an "S"-shaped heat dissipation channel, with an inlet at one end and an outlet at the other end.

[0009] Furthermore, the lower housing is provided with a heat dissipation protrusion protruding towards the upper housing. One side of the heat dissipation protrusion is a cavity communicating with the atmospheric environment, and the other side of the heat dissipation protrusion is used to abut against the other side of the heat-generating unit. The heat dissipation protrusion constitutes the second cooling section.

[0010] Furthermore, a number of heat dissipation fins are provided at certain locations on the outer wall of the cooling cavity.

[0011] Furthermore, the upper housing is provided with a cover for covering the cooling cavity, and the cover is provided with the heat dissipation fins.

[0012] A converter includes a heat dissipation device, a circuit board is provided inside the heat dissipation device, a heating element is provided on the circuit board, and the two sides of the heating element abut against the first cooling part and the second cooling part respectively.

[0013] Furthermore, the circuit board has a slot for exposing the front or back of the heating unit.

[0014] Furthermore, a heat-conducting medium is adhered to both sides of the heating unit, and the two sides of the heating unit abut against the first cooling part and the second cooling part respectively through the heat-conducting medium.

[0015] Furthermore, the housing is provided with several waterproof connectors, which are sealed to the housing and electrically connected to the circuit board.

[0016] The beneficial effects of this utility model are:

[0017] 1. This utility model proposes a heat dissipation device, comprising a housing with a mounting cavity for mounting a circuit board inside. The housing also includes a first cooling section and a second cooling section, which can respectively abut against both sides of a heat-generating unit on the circuit board. At least one of the first cooling section and the second cooling section is a water-cooled structure. In use, the first cooling section and the second cooling section clamp the circuit board from above and below, forming a bidirectional heat conduction path, significantly improving heat dissipation efficiency. The water-cooling structure dissipates most of the heat from the heat-generating unit, while the other cooling structure provides auxiliary heat dissipation, preventing heat accumulation on one side, reducing production costs caused by using water-cooled structures on both sides of the heat-generating unit, and expanding its applicability.

[0018] 2. The heat dissipation device proposed in this utility model, by setting a first cooling section, the flow divider plate designs the coolant path in an "S" shape, increases the flow stroke, allows the coolant to fully absorb heat, and improves the heat dissipation efficiency; the parallel flow channel layout avoids local flow velocity differences, ensures that the temperature of each area of ​​the heat-generating component is balanced, and the flow divider plate partition optimizes the flow channel shape, reduces turbulence and pressure drop, and reduces water pump energy consumption.

[0019] 3. The heat dissipation device proposed in this utility model provides a second cooling section. The heat dissipation protrusion directly contacts the lower surface of the heat-generating component to quickly dissipate heat. The protrusion supports the circuit board, reducing the impact of vibration on the solder joint and improving mechanical stability. The heat is diffused to the external environment through the thermal conductivity of the lower shell material.

[0020] 4. The heat dissipation device proposed in this utility model simplifies the installation and maintenance process by setting up a heat dissipation shell. The split shell design protects the circuit board from dust and moisture corrosion, improving equipment reliability. The circuit board is embedded inside the shell, and the heat dissipation holes are directly aligned with the heat-generating components, reducing the space occupied by additional heat dissipation structures.

[0021] 5. The heat dissipation device proposed in this utility model enhances the synergistic effect of liquid cooling by setting heat dissipation fins, thereby improving the overall heat dissipation power. The fins are integrally formed with the shell, improving the resistance to deformation and maintaining shape stability at high temperatures. The optimized fin spacing reduces air turbulence noise, thus reducing overall noise.

[0022] 6. The converter proposed in this utility model exposes the front and back sides of the chip by setting slots in the circuit board and combining high thermal conductivity phase change material to achieve direct heat conduction with the heat dissipation structure. This eliminates the obstruction of heat conduction by the traditional circuit board, and the heat of the chip can be directly transferred to the cooling cavity and heat dissipation protrusion, thereby improving the heat dissipation response speed.

[0023] 7. The converter proposed in this utility model, by setting a waterproof connector, ensures that the converter can resist the erosion of rain and sand in the outdoor environment, extends its service life, and reduces the risk of short circuit caused by coolant seepage. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a cross-sectional view of a converter according to the present invention;

[0026] Figure 2 This is an exploded view of a converter according to the present invention;

[0027] Figure 3 This is one of the schematic diagrams of the upper housing of a converter according to this utility model;

[0028] Figure 4 This is a second schematic diagram of the upper housing of a converter according to the present invention (cover omitted);

[0029] Figure 5 This is a third schematic diagram of the upper housing of a converter according to the present invention;

[0030] Figure 6 This is a schematic diagram of the lower housing of a converter according to the present invention;

[0031] Figure 7 This is one of the schematic diagrams of a circuit board for a converter according to this utility model;

[0032] Figure 8 This is a second schematic diagram of a circuit board for a converter according to this utility model;

[0033] Figure 9 This is one of the schematic diagrams of the heating element of a converter according to this utility model;

[0034] Figure 10 This is a second schematic diagram of the heating element of a converter according to the present invention;

[0035] In the figure, 10 is the upper shell; 101 is the cooling cavity; 1011 is the flow divider; 102 is the water inlet; 103 is the water outlet; 104 is the cover; 105 is the heat dissipation fins; 106 is the second fixing hole; 20 is the lower shell; 201 is the heat dissipation protrusion; 2011 is the cavity; 30 is the circuit board; 301 is the slot; 302 is the heating unit; 303 is the first fixing hole; and 40 is the heat conduction medium. Detailed Implementation

[0036] The following is combined Figure 1-10 This utility model will be described in detail.

[0037] A heat dissipation device, such as Figure 1-2 As shown, the device includes a housing with a mounting cavity for mounting a circuit board 30. The housing also includes a first cooling section and a second cooling section, which can respectively abut against the two sides of the heating unit 302 on the circuit board 30, and at least one of the first cooling section and the second cooling section is a water-cooled structure.

[0038] In this embodiment, as Figure 3-6As shown, the heat dissipation housing includes an upper housing 10 and a lower housing 20 that are sealed to each other. The space between the upper housing 10 and the lower housing 20 is used to install the circuit board 30. A first cooling section is disposed in the upper housing 10, and a second cooling section is disposed in the lower housing 20. The first cooling section is a water-cooled structure. Further, the first cooling section includes a cooling cavity 101, which can abut against one side of the heat-generating unit 302. The cooling cavity 101 is provided with an "S"-shaped heat dissipation channel. One end of the heat dissipation channel is provided with a water inlet 102, and the other end of the heat dissipation channel is provided with a water outlet 103.

[0039] Furthermore, the lower housing 20 is provided with a heat dissipation protrusion 201 protruding from the upper housing 10. One side of the heat dissipation protrusion 201 is a cavity 2011 connected to the atmospheric environment, and the other side of the heat dissipation protrusion 201 is used to abut against the other side of the heat generation unit 302. The heat dissipation protrusion 201 constitutes a second cooling section.

[0040] Specifically, the cooling chamber 101 is integrally formed within the upper shell 10 by machining or casting, and the diverter plate 1011 divides the chamber into multiple parallel flow channels. For example, the coolant enters from the left inlet 102, flows through the alternating upper and lower flow channels in sequence, forming an "S" shaped path, and finally exits from the right outlet 103, significantly improving heat exchange efficiency.

[0041] Regarding the shape of the flow divider 1011, in order to maximize the heat dissipation area of ​​the flow divider 1011, the flow divider 1011 can be set in a straight plate shape, a wave shape, or other possible shapes. It can be understood that the heat dissipation channel extends along the extension direction of the flow divider 1011, so that the heat dissipation channel can be set as long as possible to improve the heat exchange efficiency. Of course, the specific shape and material of the flow divider 1011 and the heat dissipation channel can also be determined according to the actual situation. This specification does not limit this aspect.

[0042] The heat dissipation protrusion 201 is an extruded columnar structure with a height matching the thickness of the mounting cavity, and the top is machined to be a flat surface to fit the heat-generating component. For example, if the lower housing 20 is made of die-cast aluminum, the heat dissipation protrusion 201 is machined to be raised, and the contact surface is coated with thermal grease to reduce contact thermal resistance.

[0043] In this embodiment, a plurality of heat dissipation fins 105 are provided on a portion of the outer wall of the cooling cavity 101. Furthermore, the upper housing 10 is provided with a cover 104 for covering the cooling cavity 101, and the cover 104 is provided with heat dissipation fins 105. The heat dissipation fins are formed in one piece with the housing through an extrusion process, and their direction is parallel to the flow direction of the coolant, further enhancing air convection heat dissipation.

[0044] The opening size of the upper housing 10 matches that of the cooling cavity 101. The cover 104 is connected to the opening of the upper housing 10 by friction welding, which is suitable for coolant flow channels with high sealing requirements and can prevent coolant leakage for a long time.

[0045] A converter includes a heat dissipation device, a circuit board 30 is provided inside the heat dissipation device, and a heating element 302 is provided on the circuit board 30. The two sides of the heating element abut against a first cooling part and a second cooling part, respectively.

[0046] After installation, thermal grease is evenly applied to the upper and lower surfaces of the heating unit 302. After pressing, the grease fills the microscopic gaps. Thermal grease or phase change material fills the micron-level gaps between the heating element and the cooling section, reducing contact thermal resistance. The flexible medium absorbs mechanical vibration, preventing the heating element and heat dissipation structure from detaching due to impact. The phase change material liquefies at high temperatures to fill gaps and solidifies upon cooling, preventing a decrease in thermal conductivity due to aging.

[0047] In this embodiment, as Figure 7-10 As shown, the circuit board 30 has a slot 301 for exposing the front or back of the heating unit 302. Further, a thermally conductive medium 40 is adhered to both sides of the heating unit 302, and the two sides of the heating unit 302 respectively abut against the first cooling section and the second cooling section via the thermally conductive medium 40. The circuit board 30 has a rectangular slot 301 at the location of the heating unit 302, and the chip body is fixed to the circuit board 30 via a connecting contact 3021 and covers the rectangular slot 301, so that both sides of the chip are fully exposed. Direct heat conduction with the heat dissipation structure is achieved by combining a high thermal conductivity material.

[0048] In this embodiment, the housing is provided with several waterproof connectors, which are sealed to the housing and electrically connected to the circuit board 30. IP68-level waterproof connectors are installed on the side wall of the housing, and the connection points between the cables and the circuit board 30 are sealed with potting compound inside.

[0049] In this embodiment, the upper housing 10 and the lower housing 20 are respectively provided with a first mounting groove and a second mounting groove that cooperate with each other; the first mounting groove and the second mounting groove close to form a mounting cavity, and a sealing ring is provided between the periphery of the groove opening 301 of the first mounting groove and the second mounting groove. Further, the circuit board 30 has first fixing holes 303 distributed circumferentially along its edge, and the inner sidewall of the upper housing 10 has second fixing holes 106 that are adapted to the first fixing holes 303. Fasteners pass through the first fixing holes 303 and the second fixing holes 106. The upper housing 10 and the lower housing 20 are connected by bolts or clips, and the circuit board 30 is horizontally installed between them. The circuit board 30 is a rectangular PCB, and a threaded insert is pre-embedded inside the upper housing 10. The circuit board 30 is locked with screws to ensure that the PCB does not wobble.

[0050] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A heat dissipating device comprising a housing, characterized in that, The housing has an installation cavity for mounting a circuit board; the housing also has a first cooling section and a second cooling section, which can respectively abut against both sides of the heating unit on the circuit board, and at least one of the first cooling section and the second cooling section is a water-cooled structure.

2. The heat dissipating device of claim 1, wherein The housing includes an upper housing and a lower housing that are sealed to each other. The space between the upper housing and the lower housing is used to install the circuit board. The first cooling part is located in the upper housing, and the second cooling part is located in the lower housing. The first cooling part is a water-cooled structure.

3. The heat dissipating device of claim 2, wherein The first cooling section includes a cooling cavity that can abut against one side of the heating unit. The cooling cavity is provided with an "S"-shaped heat dissipation channel. One end of the heat dissipation channel is provided with a water inlet, and the other end of the heat dissipation channel is provided with a water outlet.

4. The heat dissipating device of claim 2, wherein The lower housing is provided with a heat dissipation protrusion that protrudes toward the upper housing. One side of the heat dissipation protrusion is a cavity that communicates with the atmospheric environment, and the other side of the heat dissipation protrusion is used to abut against the other side of the heat-generating unit. The heat dissipation protrusion constitutes the second cooling section.

5. The heat dissipating device of claim 3, wherein Several heat dissipation fins are provided on a portion of the outer wall of the cooling chamber.

6. The heat dissipating device of claim 5, wherein The upper housing is provided with a cover for covering the cooling cavity, and the cover is provided with the heat dissipation fins.

7. A converting machine characterized by, The device includes a heat dissipation device as described in any one of claims 1-6, wherein the heat dissipation device has a circuit board, the circuit board has a heating unit, and the two sides of the heating unit abut against the first cooling part and the second cooling part, respectively.

8. A converting machine as claimed in claim 7, characterized in that The circuit board has a slot to expose the front or back of the heating unit.

9. A converting machine as claimed in claim 8, characterized in that The heating unit has a heat-conducting medium adhered to both sides, and the two sides of the heating unit abut against the first cooling part and the second cooling part respectively through the heat-conducting medium.

10. A converting machine as claimed in claim 9, characterized in that The housing is provided with several waterproof joints, which are sealed to the housing and electrically connected to the circuit board.

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