A vibration damping device water cooling controller

Abstract

The utility model discloses an embodiment provides a kind of damping device water cooling controller, by setting up waterway on vertical side plate, heat dissipation is carried out using waterway, on the premise that the appearance size of damping device water cooling controller is not changed, greatly improve heat dissipation effect, so that damping device water cooling controller can satisfy various severe use environment, and then improve the stability of damping system.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and specifically to a water-cooled controller for a vibration damping device. Background Technology

[0002] As vibration damping devices become smaller, their power increases, and the integration of electronic equipment becomes more sophisticated, the volumetric power density or area power density of electronic components and devices is increasing. These factors make it difficult for the heat dissipation devices of vibration damping devices to dissipate the heat generated during operation, significantly impacting their heat dissipation performance. Utility Model Content

[0003] The purpose of this invention is to provide a water-cooled controller for vibration damping devices, which aims to solve the problem of poor heat dissipation in existing vibration damping devices.

[0004] In a first aspect, the present invention provides a water-cooled controller for a vibration damping device, including a vertical side plate and a rear cover. Both the vertical side plate and the rear cover are arranged perpendicular to the horizontal plane, and the vertical side plate and the rear cover are arranged perpendicular to each other. An internal water channel is formed on the inner wall of the vertical side plate, and the rear cover is provided with an inlet and an outlet of the internal water channel.

[0005] In some possible embodiments, the internal waterway is straight, serpentine, or spiral.

[0006] In some possible embodiments, the vertical side plate includes a first side plate and a second side plate disposed opposite to each other. The first side plate and the second side plate are both disposed perpendicular to the rear cover. A first internal water channel and a second internal water channel are respectively formed on the first side plate and the second side plate. The rear cover is respectively formed with an inlet and an outlet of the first internal water channel, and an inlet and an outlet of the second internal water channel.

[0007] In some possible embodiments, the vibration damping device water-cooled controller further includes a heat sink, which is fitted to the inner sidewall of the vertical side plate, and the internal water channel is formed inside the heat sink.

[0008] In some possible embodiments, the vibration damping device water-cooling controller further includes a circuit board disposed inside the vibration damping device water-cooling controller, the side of the circuit board being connected to the heat sink, and the circuit board being perpendicular to the vertical side plate; The circuit board has a heating element with a main heating surface. The heating element is fixed to the edge of the circuit board by element pins, and the main heating surface is perpendicular or approximately perpendicular to the circuit board. The main heating surface of the heating element faces the heat sink, and the heating element is fixed to the heat sink by a pressure plate.

[0009] In some possible embodiments, the pressure plate is an arched structure with a central arched area. The pressure plate includes an arched ring area and a first pressure plate area and a second pressure plate area located at both ends of the arched ring area. The arched ring area arches toward the side away from the vertical side plate.

[0010] In some possible embodiments, the first pressing area is fixedly connected to the heat sink, and the second pressing area is pressed against the side of the heat-generating element away from the heat sink.

[0011] In some possible embodiments, a heat dissipation pad is also provided between the heating element and the heat sink.

[0012] In some possible embodiments, the vibration damping device water-cooled controller further includes an upper cover and a lower cover, the upper cover and the lower cover being disposed opposite to each other, the lower cover and the upper cover being movably connected to the vertical side plate via detachable connectors, the circuit board being disposed between the lower cover and the upper cover, and the upper cover and the lower cover having a plurality of air inlets formed thereon.

[0013] In some possible embodiments, a plurality of heat dissipation teeth are also provided on the outer side wall of the vertical side plate, and the plurality of heat dissipation teeth are arranged perpendicularly to the upper cover and arranged in an array on the outer side wall of the vertical side plate.

[0014] This utility model provides a water-cooled controller for a vibration damping device. By setting water channels on the vertical side plate and using the water channels for heat dissipation, the heat dissipation effect is greatly improved without changing the external dimensions of the water-cooled controller for the vibration damping device. This allows the water-cooled controller for the vibration damping device to meet various harsh operating environments, thereby improving the stability of the vibration damping system. Attached Figure Description

[0015] The technical solution and other beneficial effects of this utility model will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0016] Figure 1 A schematic diagram of an embodiment of the water-cooled controller for the vibration damping device provided by this utility model; Figure 2 A schematic diagram of an embodiment of the internal water system provided by this utility model; Figure 3 A schematic diagram of an embodiment of the heating element provided by this utility model; Figure 4 A schematic diagram of an embodiment of the pressing and clamping heating element provided by this utility model; Figure 5 This is a schematic diagram of another embodiment of the water-cooled controller for the vibration damping device provided by this utility model. Detailed Implementation

[0017] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the present invention. Similarly, the following embodiments are only some, not all, embodiments of the present invention, and all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the following description of this utility model, "some embodiments" are used, which describe a subset of all possible embodiments. However, it is understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0019] In the following description of this utility model, the terms "first, second, third" are used only to distinguish similar objects and do not represent a specific order of objects. It is understood that "first, second, third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of this utility model described herein can be implemented in an order other than that illustrated or described herein.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to limit the invention.

[0021] The following detailed description is provided with reference to specific embodiments. It should be noted that the sequence numbers of the embodiments are not intended to limit the preferred order of the embodiments. This utility model provides a water-cooled controller for a vibration damping device. The following detailed description of the water-cooled controller for a vibration damping device provided by this utility model is provided with reference to the accompanying drawings.

[0022] like Figure 1 The diagram shown is a structural schematic of an embodiment of the water-cooled controller for the vibration damping device provided by this utility model. Figure 1In the described embodiment, the vibration damping device water-cooled controller has a rectangular parallelepiped structure, including a vertical side plate 10 and a rear cover 20. Both the vertical side plate 10 and the rear cover 20 are perpendicular to the horizontal plane and are also vertically oriented. An internal water channel is formed on the inner wall of the vertical side plate 10, and the rear cover 20 has an inlet and an outlet for the internal water channel. The inlet and outlet on the rear cover 20 can connect to the internal water channel to utilize coolant for water cooling of the entire vibration damping device water-cooled controller, improving heat dissipation without changing the overall dimensions of the controller. In some embodiments, the coolant can be a liquid with a high specific heat capacity, such as water or ethylene glycol.

[0023] like Figure 2 The diagram shown is a schematic representation of an embodiment of the internal water channel provided by this utility model. For this utility model, the vibration damping device water-cooled controller also includes a heat sink 30, which is fitted to the inner wall of the vertical side plate 10. The internal water channel is formed inside the heat sink 30; that is, no water channel is formed inside the vertical side plate 10. This arrangement is because the vertical side plate 10 typically needs to have a certain strength and rigidity, making it difficult to form a water channel inside it. By setting the heat sink 30 and forming a water channel inside it for heat dissipation, the manufacturing difficulty is lower, and it is easier to maintain and replace heat sinks with water channels of different specifications or sizes. It also reduces the risk of damage to the entire device in case of water channel leakage. In some embodiments, friction welding technology can be used to form a water channel inside the heat sink 30. The specific method for forming the water channel can refer to the prior art and is not limited here.

[0024] For the water-cooled controller of the vibration damping device provided by this utility model, the side plate of the water-cooled controller includes a first side plate and a second side plate arranged opposite to each other. The two sides of the rear cover 20 are respectively connected to the sides of the first side plate and the second side plate. A first internal water channel and a second internal water channel are formed on the first side plate and the second side plate, respectively. The rear cover 20 is respectively formed with the inlet and outlet of the first internal water channel and the inlet and outlet of the second internal water channel. More specifically, heat sinks 30 are attached to the inner walls of the first side plate and the second side plate. The heat sink attached to the inner wall of the first side plate forms a first internal water channel, and the heat sink attached to the inner wall of the second side plate forms a second internal water channel. By setting multiple water channels, the heat dissipation efficiency can be further improved. For this utility model, multiple water channels can be formed in the heat sink on the same side to improve the heat dissipation effect; for example, multiple evenly distributed water channels can be formed in the heat sink on the same side, which improves the heat dissipation efficiency while avoiding the problem of uneven heat dissipation caused by uneven distribution of water channels. Meanwhile, the internal water channels provided in this application can be straight, serpentine, or spiral. By setting the water channels to a serpentine or spiral structure, the length of the water channels can be increased, thereby further improving the heat dissipation effect of water cooling. In other embodiments, the heat dissipation effect can also be improved by adjusting the width of the water channels. Specifically, when the width of the water channels narrows, the contact area between the water channels and the heat-generating device decreases, resulting in poor heat dissipation. However, while the contact area decreases, the flow rate of the coolant also increases, thereby improving the heat dissipation effect. Therefore, when adjusting the width of the water channels, it is also necessary to control the flow rate of the coolant and determine the width of the water channels in combination with the flow rate of the coolant.

[0025] Please continue to refer to this. Figure 1 The vibration damping device water-cooling controller provided by this utility model also includes a circuit board 40, which is disposed inside the vibration damping device water-cooling controller. The side of the circuit board 40 is connected to the heat sink 30, and the circuit board 40 is perpendicular to the vertical side plate 10. The circuit board 40 also has a heating element 50, which is also disposed inside the vibration damping device water-cooling controller. The heating element 50 continuously generates heat during operation, and the water circuit provided by this utility model mainly dissipates the heat generated by the heating element 50. Specifically, as... Figure 3The diagram shown is a schematic representation of an embodiment of the heating element provided by this invention. In this invention, the heating element 50 can be fixed to the edge of the circuit board 40 via element pins, and the heating element 50 has a main heating surface, from which the heat generated by the heating element 50 is mainly released. The main heating surface can be perpendicular or approximately perpendicular to the circuit board; that is, the heating element can be perpendicular or approximately perpendicular to the circuit board, which facilitates airflow, reduces heat accumulation, and thus improves heat dissipation. The angle between the main heating surface and the circuit board can be approximately 85°-90°. When there are multiple heating elements 50, all of them can be fixed to the edge of the circuit board via element pins, and the main heating surfaces of the multiple heating elements face the same direction.

[0026] Since the circuit board is perpendicular to the vertical side plate 10, and the heating element 50 is also perpendicular or nearly perpendicular to the circuit board, the heating element 50 and the vertical side plate 10 can be arranged parallel to each other. Specifically, the main heating surface of the heating element 50 can face the inner wall of the vertical side plate 10, and the heating element 50 can be fixed to the heat sink 30 by the pressure plate 60. This invention uses the pressure plate 60 to fix the heating element 50 to the heat sink 30, which can guide the heat generated by the heating element 50 to the heat sink 30, and dissipate heat using the heat sink 30 and the water channels inside the heat sink 30. Furthermore, this invention also provides a heat dissipation pad 70 between the heating element 50 and the inner wall of the heat sink 30. This heat dissipation pad 70 can further guide the heat generated by the heating element 50 to the heat sink 30 for heat dissipation; at the same time, the heat dissipation pad can further fix the heating element 50, ensuring that the heating element 50 and the vertical side plate 10 are in close contact. In some embodiments, the heat dissipation pad 70 can be a thermally conductive silicone sheet, a thermally conductive silver paste layer, or an indium foil.

[0027] Figure 4 This is a schematic diagram of an embodiment of the heating element compressed by a pressure plate, provided by this utility model. Figure 4 In the illustrated embodiment, the pressure plate 60 is an arched structure with an arched middle section. The pressure plate 60 includes an arched ring area 602 and a first pressure plate area 601 and a second pressure plate area 603 located at both ends of the arched ring area. The first pressure plate area 601 and the second pressure plate area 603 are located on the left and right sides of the arched ring area 602, respectively. The first pressure plate area 601 is usually fixedly connected to the inner wall of the vertical side plate 10 by screws, while the second pressure plate area 603 is pressed on the side of the heating element 50 away from the heat sink 70. The main heating surface of the heating element 50 is the side close to the inner wall of the vertical side plate 10 (or the heat sink 30).

[0028] In this invention, the pressing plate 60 can be made of a material with high hardness, such as stainless steel, to press the second pressing area 603 tightly onto the heating element 50, ensuring close contact between the heating element 50 and the heat sink 30. Furthermore, when the pressing plate 60 is not fixed to the vertical side plate 10 and is not tightly attached to the heating element 50, the bottom of the first pressing area 601 and the bottom of the second pressing area 603 are typically on the same plane. This allows for greater pressure to be applied to the heating element 50 when the second pressing area 603 is pressed against the heating element 50, ensuring close contact between the heating element 50 and the heat sink 30.

[0029] In this invention, the water-cooled controller of the vibration damping device also includes a heat shrink tubing (not shown in the figure). The heat shrink tubing has a hollow structure, and the second pressing area 603 is fitted inside the heat shrink tubing and is in close contact with the heating element 50. Specifically, since the pressing plate 60 in this invention is usually made of a metal thermally conductive material to facilitate heat conduction, directly pressing the pressing plate 60 onto the heating element 50 may damage the heating element 50. Therefore, an additional heat shrink tubing can be provided, and the area of ​​the pressing plate 60 that needs to be in close contact with the heating element 50 can be placed inside the heat shrink tubing to avoid direct contact between the pressing plate 60 and the heating element 50, thereby protecting the heating element 50. Therefore, the second pressing area 603 can be fitted inside the heat shrink tubing, and the heat shrink tubing can be heated to shrink and then securely fastened to the outside of the second pressing area 603; then the second pressing area 603 including the heat shrink tubing is pressed tightly against the side of the heating element. At this time, the heat shrink tubing is in direct contact with the heating element 50, avoiding damage to the heating element 50 by the pressing plate 60. In some embodiments, the second pressing region 603 may further include multiple pressing sub-regions, that is, a portion of the pressing area in the second pressing region 603 may be divided into multiple segments, and multiple segments are simultaneously in close contact with a heating element 50; thus, if a segment warps or causes other problems, the other segments can also apply pressure to ensure that the second pressing region 603 remains in close contact with the heating element 50. In the aforementioned embodiments, when a portion of the pressing area in the second pressing region 603 includes multiple segments, there may also be multiple heat shrink tubings, with the multiple segments respectively fitted inside the multiple heat shrink tubings to protect the heating element 50.

[0030] In some embodiments, when there are multiple heating elements 50, the main heating surfaces of the multiple heating elements 50 can all be arranged facing the vertical side plate 10. There are also multiple pressure plates 60, which press the multiple heating elements 50 onto the heat sink 30; at the same time, a heat dissipation pad is provided between each heating element 50 and the heat sink 30 for further heat dissipation.

[0031] Please refer to Figure 5 This is a schematic diagram of another embodiment of the water-cooled controller for the vibration damping device provided by this utility model. Figure 5The vibration damping device water-cooled controller also includes an upper cover 80 and a lower cover 90, and a front cover 100, which are arranged opposite to each other. The front cover 100 and the rear cover 20 are arranged opposite to each other. The rear cover 20 has multiple mounting holes for mounting a fan, and the front cover 100 has multiple signal interfaces. The circuit board is positioned close to the front cover 100. Multiple air inlets are formed on the upper cover 80 and the lower cover 90 at positions corresponding to the circuit board. Air can enter through these air inlets and exit through the fan on the rear cover 20, forming an airflow channel primarily for cooling the low-heat-generating chips and power supply inside the vibration damping device water-cooled controller. In some embodiments, the multiple air inlets can be evenly distributed in the upper cover 80 and the lower cover 90; in other embodiments, more air inlets can be provided in areas with higher heat generation to improve heat dissipation, while the number or size of the air inlets can be appropriately reduced in areas with lower heat generation to improve the overall structural stability. Figure 5 In the illustrated embodiment, an air inlet (i.e.,) can be provided in the upper cover 80 and the lower cover 90 near the chip or control center. Figure 5 (The air intake is located on the right side of the upper cover 80 and the lower cover 90), while no air intake is needed in locations far from the chip or control center.

[0032] The vertical side plate 10 of this invention is further provided with multiple heat dissipation teeth 120 on its outer side wall. These teeth are perpendicular to the upper cover 80 / lower cover 90 and are arranged in an array on the outer side wall of the vertical side plate 10. When the thrust required by the water-cooled controller of the vibration damping device is not large, i.e., when the heat dissipation power of the motor heating chip is not large, natural heat dissipation can be achieved. This means that the motor heating chip is mainly pressed onto the heat sink for natural heat dissipation, with heat primarily dissipated through the multiple heat dissipation teeth. A thermally conductive silicone sheet is also filled between the motor heating chip and the heat sink to ensure efficient transfer of heat generated by the motor heating chip to the heat sink 30. When the demand for water-cooled controllers in vibration damping devices is high, the heating power of the motor heating chip can reach 1500W. At this point, air cooling and natural heat dissipation are no longer sufficient to meet the heat dissipation requirements. This invention adds water channels inside the heat sink 30 using friction welding technology without changing the external dimensions of the water-cooled controller, and adds water inlet and outlet ports on the rear cover. Under the condition of the same overall size, it has no significant impact on the appearance. By using air cooling, natural heat dissipation and water cooling together, the heat dissipation effect is greatly improved, enabling the water-cooled controller of the vibration damping device to meet various harsh operating environments, thereby ensuring the stability of the vibration damping system.

[0033] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0034] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A water-cooled controller for a vibration damping device, characterized in that, It includes a vertical side plate and a rear cover, both of which are arranged perpendicular to the horizontal plane, and the vertical side plate and the rear cover are arranged perpendicular to each other. An internal water channel is formed on the inner wall of the vertical side plate, and the rear cover is provided with an inlet and an outlet for the internal water channel.

2. The vibration damping apparatus water cooling controller according to claim 1, characterized by, The internal waterway can be straight, serpentine, or spiral.

3. The vibration damping apparatus water cooling controller of claim 1, wherein The vertical side plate includes a first side plate and a second side plate arranged opposite to each other. Both the first side plate and the second side plate are arranged perpendicularly to the rear cover. A first internal water channel and a second internal water channel are respectively formed on the first side plate and the second side plate. The rear cover is respectively formed with an inlet and an outlet of the first internal water channel, and an inlet and an outlet of the second internal water channel.

4. The vibration damping apparatus water cooling controller of claim 1, wherein The vibration damping device water-cooled controller also includes a heat sink, which is fitted to the inner wall of the vertical side plate, and the heat sink has an internal water channel formed inside.

5. The vibration damping apparatus water cooling controller according to claim 4, characterized by, The vibration damping device water-cooling controller also includes a circuit board, which is disposed inside the vibration damping device water-cooling controller. The side of the circuit board is connected to the heat sink, and the circuit board is perpendicular to the vertical side plate. The circuit board has a heating element with a main heating surface. The heating element is fixed to the edge of the circuit board by element pins, and the main heating surface is perpendicular or approximately perpendicular to the circuit board. The main heating surface of the heating element faces the heat sink, and the heating element is fixed to the heat sink by a pressure plate.

6. The water cooling controller for a vibration damping device according to claim 5, wherein The pressing plate is an arched structure with an arched middle area. The pressing plate includes an arched ring area and a first pressing plate area and a second pressing plate area located at both ends of the arched ring area. The arched ring area arches towards the side away from the vertical side plate.

7. The vibration damping apparatus water cooling controller of claim 6, wherein The first pressing area is fixedly connected to the heat sink, and the second pressing area is pressed against the side of the heating element away from the heat sink.

8. The vibration damping apparatus water cooling controller of claim 6, wherein A heat dissipation pad is also provided between the heating element and the heat sink.

9. The vibration damping apparatus water cooling controller of claim 5, wherein The vibration damping device water-cooled controller also includes an upper cover and a lower cover, which are arranged opposite to each other. The lower cover and the upper cover are respectively movably connected to the vertical side plate through detachable connectors. The circuit board is arranged between the lower cover and the upper cover. Multiple air inlets are formed on the upper cover and the lower cover respectively.

10. The vibration damping apparatus water cooling controller of claim 9, wherein The outer wall of the vertical side plate is also provided with a plurality of heat dissipation teeth, which are arranged perpendicularly to the top cover and arrayed on the outer wall of the vertical side plate.

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