Electronic component heat shield cap

Abstract

The utility model discloses an electronic component heat -proof cap, including setting in the protection cap main part of installation mainboard, the central part of installation mainboard is provided with element fixed position, and element fixed position is fixed with electronic component main body, the protection cap main part sets up on installation mainboard to the shielding of electronic component main body, the protection cap main part is provided with heat dissipation structure, and the heat dissipation structure is to electronic component main body heat dissipation, and the heat -generating end of heat dissipation structure carries away heat through the ventilation structure on the protection cap main part. The utility model discloses the combination of heat -proof and active heat dissipation, and its heat -insulating structure blocks outside heat source, and the internal refrigeration system actively absorbs element heat, and then through the ventilation structure, the waste heat is efficiently discharged, and the heat -insulating material prevents the cold and hot interference, effectively solves the problem of electronic component overheating under high temperature environment, and significantly improves the reliability, stability and service life of element.

Description

Technical Field

[0001] This utility model relates to a heat-insulating protective cap, specifically a heat-insulating protective cap for electronic components. Background Technology

[0002] Traditional heat dissipation solutions experience a sharp decline in heat dissipation capacity when the ambient temperature is high, making it difficult to effectively reduce the temperature of electronic components. The heat generated by the components themselves, combined with the heat from the external environment, causes the component temperature to easily exceed the safe operating range, affecting performance and lifespan.

[0003] Although thermoelectric coolers (TECs) can actively cool components, the heat generated at their heat-generating ends is far greater than the heat absorbed, and the temperature is also higher. If the heat-generating ends do not dissipate heat well, it can lead to a sharp drop in TEC efficiency or even damage, and the accumulated heat may be conducted back to the cooled component or the surrounding environment, negating the cooling effect. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a heat-insulating protective cap for electronic components, so as to solve the problems existing in the background art.

[0005] The present invention provides a heat-insulating protective cap for electronic components, which is achieved through the following technical solution, including a protective cap body disposed on the mounting motherboard; The mounting motherboard has a component fixing position in the center, and an electronic component body is fixedly mounted on the component fixing position; the protective cap body is mounted on the mounting motherboard and covers the electronic component body. The protective cap body is provided with a heat dissipation structure, which dissipates heat from the electronic component body, and the heat-generating end of the heat dissipation structure carries away the heat through the ventilation structure on the protective cap body.

[0006] As a preferred technical solution, the heat dissipation structure includes a semiconductor cooling chip and heat dissipation fins; The protective cap body is provided with a clearance groove, the semiconductor cooling chip is placed in the clearance groove, and the cooling end of the semiconductor cooling chip is in contact with the top of the electronic component body, thereby achieving cooling of the electronic component body. The heat dissipation fins are disposed on the heat-generating end of the semiconductor cooling chip, and the heat dissipation end of the heat dissipation fins is placed inside the ventilation structure, thereby achieving heat dissipation of the semiconductor cooling chip.

[0007] As a preferred technical solution, the ventilation structure includes a U-shaped ventilation duct, an intake fan, and an exhaust fan; The ventilation duct is fixed above the main body of the protective cap, and the inlet fan is installed above one end of the ventilation duct, while the outlet fan is installed above the other end of the ventilation duct. The heat dissipation structure achieves heat dissipation under the action of the inlet and outlet fans.

[0008] As a preferred technical solution, the mounting motherboard is provided with a mounting slot, and the side of the protective cap body is provided with a mounting plate; the mounting plate is set in the clearance slot, and the protective cap body is fixed to the mounting motherboard by screwing.

[0009] As a preferred technical solution, it also includes a control panel, which connects to and controls the semiconductor cooling chip, the inlet fan, and the outlet fan to operate, and is powered by an external power source.

[0010] As a preferred technical solution, both the protective cap body and the ventilation duct are made of heat-insulating materials.

[0011] The beneficial effects of this utility model are: This invention combines thermal insulation with active heat dissipation. Its thermal insulation structure blocks external heat sources, while the internal cooling system actively absorbs heat from the components and then efficiently discharges waste heat through the ventilation structure. At the same time, the thermal insulation material prevents cold and heat interference. It effectively solves the problem of overheating of electronic components in high-temperature environments and significantly improves the reliability, stability and service life of the components. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the exploded structure of this utility model; Figure 3 This is a cross-sectional structural diagram of the present invention.

[0014] 1. Motherboard; 2. Electronic component body; 3. Protective cap body; 4. Component mounting position; 5. Semiconductor cooling chip; 6. Heat sink fins; 7. Clearance slot; 8. Ventilation duct; 9. Intake fan; 10. Exit fan; 11. Mounting slot; 12. Mounting plate; 13. Screws. Detailed Implementation

[0015] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0016] like Figures 1-3As shown, the present invention provides a heat insulation protection cap for electronic components, including a protective cap body 3 disposed on a mounting motherboard 1; The mounting motherboard 1 has a component fixing position 4 in the center, and an electronic component body 2 is fixedly mounted on the component fixing position 4; the protective cap body 3 is mounted on the mounting motherboard 1 and covers the electronic component body 2. The protective cap body 3 is provided with a heat dissipation structure, which dissipates heat from the electronic component body 2, and the heat-generating end of the heat dissipation structure carries away the heat through the ventilation structure on the protective cap body 3.

[0017] The heat dissipation structure includes a semiconductor cooling chip 5 and heat dissipation fins 6. The protective cap body 3 is provided with a clearance groove 7, the semiconductor cooling chip 5 is placed in the clearance groove 7, and the cooling end of the semiconductor cooling chip 5 is in contact with the top of the electronic component body 2, thereby achieving cooling of the electronic component body 2. The heat dissipation fins 6 are disposed on the heat-generating end of the semiconductor cooling chip 5, and the heat dissipation end of the heat dissipation fins 6 is placed inside the ventilation structure, thereby achieving heat dissipation of the semiconductor cooling chip 5.

[0018] The ventilation structure includes a U-shaped ventilation duct 8, an intake fan 9, and an exhaust fan 10. The ventilation duct 8 is fixed above the protective cap body 3, and the inlet fan 9 is installed above one end of the ventilation duct 8, and the outlet fan 10 is installed above the other end of the ventilation duct 8. The heat dissipation structure achieves heat dissipation under the action of the inlet fan 9 and the outlet fan 10.

[0019] To facilitate the installation of the protective cap body 3, in this embodiment, the mounting main board 1 is provided with a mounting groove 11, and the side of the protective cap body 3 is provided with a mounting piece 12; the mounting piece 12 is disposed in the clearance groove 7, and the protective cap body 3 is fixed to the mounting main board 1 by means of screw 13.

[0020] For ease of control, this embodiment also includes a control panel, which is connected to control the semiconductor cooling chip 5, the inlet fan 9 and the outlet fan 10 to operate, and is powered by an external power source.

[0021] In order to achieve the effect of heat insulation, in this embodiment, both the protective cap body 3 and the ventilation duct 8 are made of heat insulation material.

[0022] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A heat-insulating protective cap for electronic components, characterized in that, Includes a protective cap body (3) mounted on the mounting motherboard (1); The mounting motherboard (1) has a component fixing position (4) in the center, and an electronic component body (2) is fixedly mounted on the component fixing position (4); the protective cap body (3) is mounted on the mounting motherboard (1) and covers the electronic component body (2); The protective cap body (3) is provided with a heat dissipation structure, which dissipates heat from the electronic component body (2), and the heat-generating end of the heat dissipation structure carries away the heat through the ventilation structure on the protective cap body (3). The heat dissipation structure includes a semiconductor cooling chip (5) and heat dissipation fins (6); The protective cap body (3) is provided with a relief groove (7), the semiconductor cooling chip (5) is placed in the relief groove (7), and the cooling end of the semiconductor cooling chip (5) is in contact with the top of the electronic component body (2), thereby achieving cooling of the electronic component body (2); The heat dissipation fins (6) are disposed at the heat-generating end of the semiconductor cooling chip (5), and the heat dissipation end of the heat dissipation fins (6) is placed in the ventilation structure, thereby achieving heat dissipation of the semiconductor cooling chip (5). The ventilation structure includes a U-shaped ventilation duct (8), an intake fan (9), and an exhaust fan (10); The ventilation duct (8) is fixed above the protective cap body (3), and the inlet fan (9) is installed above one end of the ventilation duct (8), and the outlet fan (10) is installed above the other end of the ventilation duct (8). The heat dissipation structure achieves heat dissipation under the action of the inlet fan (9) and the outlet fan (10).

2. The heat-insulating protective cap for electronic components according to claim 1, characterized in that: The mounting motherboard (1) is provided with a mounting groove (11), and the side of the protective cap body (3) is provided with a mounting piece (12); the mounting piece (12) is located in the clearance groove (7), and the protective cap body (3) is fixed to the mounting motherboard (1) by means of screws (13).

3. The heat-insulating protective cap for electronic components according to claim 1, characterized in that: It also includes a control panel, which is connected to control the semiconductor cooling chip (5), the inlet fan (9) and the outlet fan (10) to operate, and is powered by an external power source.

4. The heat-insulating protective cap for electronic components according to claim 1, characterized in that: The protective cap body (3) and the ventilation duct (8) are both made of heat-insulating material.

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