A circuit board assembly and power supply device

Abstract

The utility model provides a kind of circuit board assembly and power supply equipment, belong to power supply equipment technical field, including circuit board, two second device groups, radiator group and first device group;Two second device groups are spaced apart on circuit board along first direction, and respectively with circuit board electricity is connected;Ventilation air duct along second direction is formed between two second device groups;Radiator group is arranged in ventilation air duct;First device group is attached and arranged on radiator group, and first device group is electrically connected with circuit board;Among them, the front end of second device group is protruded forward relative to the front end of radiator group, and the rear end of second device group is extended backward relative to the rear end of radiator group.The utility model provides a kind of circuit board assembly, can make cold wind concentrate through radiator group, extend the path after airflow through radiator group, improve air cooling utilization, improve the heat dissipation effect of high heat output first device group.

Description

Technical Field

[0001] This utility model belongs to the field of power supply equipment technology, and more specifically, it relates to a circuit board assembly and a power supply device. Background Technology

[0002] Printed Circuit Boards (PCBs) are core components of power supply equipment, used for mechanical support and electrical connection of electronic devices. To prevent damage to the PCB or shorten its lifespan due to heat generated during electronic device operation, heat sinks are typically installed at the power devices (high-heat-generating electronic components) on the PCB for air cooling. Specifically, the power devices are generally mounted in contact with the heat sink, and a fan is located in front of the heat sink. The heat sink absorbs the heat from the power devices, while cool air blows across the heat sink and other low-heat-generating electronic components, carrying away heat and thus dissipating heat from both the high-heat-generating power devices and the low-heat-generating electronic components.

[0003] In recent years, the diversification of power systems has led to the development of power supply equipment towards higher power, higher power density, and larger capacity. As module power continues to increase, the heat dissipation problem of electrical components has become increasingly prominent. Because fans are typically encapsulated at the front of the power supply equipment's housing, supplying air to the entire interior cavity, the ventilation area is large, the air velocity is low, and the heat dissipation effect on high-heat power components is poor. Utility Model Content

[0004] The purpose of this utility model is to provide a circuit board assembly and power supply device, which aims to solve the technical problem of poor heat dissipation of high-heat electronic devices on circuit boards in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a circuit board assembly, comprising: Circuit board; Two second device groups are spaced apart on the circuit board along a first direction and are electrically connected to the circuit board respectively; a ventilation duct running through the two second device groups along a second direction is formed between them; and A heat sink assembly is disposed within the ventilation duct; a first component assembly is attached to the heat sink assembly, and the first component assembly is electrically connected to the circuit board. The front end of the second device group protrudes forward relative to the front end of the heat sink group, and the rear end of the second device group extends backward relative to the rear end of the heat sink group.

[0006] In one possible implementation, the first device group includes a plurality of power transistors, which are spaced apart and mounted on the heat sink group along the second direction; the second device group includes a plurality of bus capacitors, which are spaced apart and distributed on the circuit board along the second direction.

[0007] In some embodiments, in the height direction of the heat sink assembly, the top surface of the bus capacitor protrudes upward from the top surface of the power transistor; The top surface of the heat sink assembly is flush with the top surface of the bus capacitor; or, the top surface of the heat sink assembly protrudes upward from the top surface of the bus capacitor, and the vertical distance between the top surface of the heat sink assembly and the top surface of the bus capacitor is less than one-third of the height of the heat sink assembly.

[0008] In some embodiments, the second device group further includes at least one of an inductor, a control board, and a fuse.

[0009] In one possible implementation, the heat sink assembly further includes a mounting cavity extending in a second direction, and the first device assembly is fitted onto the cavity wall of the mounting cavity.

[0010] In some embodiments, the heat sink assembly includes two heat sinks spaced apart along the first direction; the mounting cavity is formed between the two heat sinks; a set of the first device group is attached to each heat sink, and in each heat sink assembly, at least one set of the first device group is located in the corresponding mounting cavity.

[0011] In some embodiments, a third device is provided at the front end of the mounting cavity, the third device being used to block the air inlet of the mounting cavity.

[0012] In some embodiments, in the first direction, the width of the third device is greater than or equal to three-quarters of the width of the mounting cavity and less than or equal to the width of the mounting cavity.

[0013] In some embodiments, a fourth device is provided at the rear end of the mounting cavity; and / or, a fourth device is provided at the rear end of the heat sink; the fourth device extends along the second direction.

[0014] The beneficial effects of the circuit board assembly provided by this utility model are as follows: Compared with the prior art, in the circuit board assembly of this utility model, the two second device groups are arranged at intervals along the first direction to form a narrow ventilation channel, so that cold air is concentrated through the ventilation channel to blow on the heat sink group. Due to the reduced cross-sectional area of ​​the channel and the increased wind speed, the heat of the heat sink group can be removed more efficiently, thereby improving the heat dissipation effect on the high heat generation first device group; The front end of the second device group protrudes forward relative to the front end of the heat sink group, which can guide the fan airflow to enter the ventilation duct more concentratedly, reduce turbulence, and improve the airflow stability in the ventilation duct. The rear end of the second device group extends backward relative to the rear end of the heat sink group, which can lengthen the path of the airflow after passing through the heat sink group, avoid the problem of insufficient airflow received at the rear end of the heat sink group due to the airflow spreading directly to the surroundings after passing through the rear half of the heat sink group, thereby improving the air cooling utilization rate and enhancing the heat dissipation effect on the rear half of the heat sink group, especially the first device group at the end of the heat sink group.

[0015] This utility model also provides a power supply device, including: case; The fan assembly is disposed inside the housing; and The aforementioned circuit board assembly is disposed within the housing and located behind the fan assembly.

[0016] The power supply device provided by this utility model, by adopting the above-mentioned circuit board assembly, can concentrate the cold air through the heat sink assembly, extend the airflow path after passing through the heat sink assembly, improve the air cooling utilization rate, and enhance the heat dissipation effect on the first device group with high heat generation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 Schematic diagram of the circuit board assembly provided in the embodiments of this utility model Figure 1 ; Figure 2 for Figure 1 Top view; Figure 3 Schematic diagram of the circuit board assembly provided in the embodiments of this utility model Figure 2 ; Figure 4 This is an exploded structural diagram of the power supply device provided in an embodiment of the present utility model.

[0019] In the picture: 1. Circuit board; 11. Ventilation duct; 2. Radiator assembly; 21. Radiator; 22. Mounting cavity; 3. First Device Group; 4. Second component group; 41. Bus capacitor; 42. Inductor; 43. Control board; 5. Third device; 6. The fourth component; 7. Shell; 8. Fan assembly. Detailed Implementation

[0020] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] Please refer to the following: Figure 1 and Figure 2 The circuit board assembly provided by this utility model will now be described. The circuit board assembly includes a circuit board 1, two second device groups 4, a heat sink group 2, and a first device group 3; the two second device groups 4 are spaced apart on the circuit board 1 along a first direction and are electrically connected to the circuit board 1 respectively; a ventilation duct 11 is formed between the two second device groups 4 along a second direction; the heat sink group 2 is disposed in the ventilation duct 11; the first device group 3 is attached to the heat sink group 2 and is electrically connected to the circuit board 1; wherein, the front end of the second device group 4 protrudes forward relative to the front end of the heat sink group 2, and the rear end of the second device group 4 extends backward relative to the rear end of the heat sink group 2.

[0022] The circuit board assembly is typically installed inside the chassis housing 7. The chassis housing 7 also contains a fan assembly 8, which is located in front of the circuit board assembly and supplies air to the circuit board assembly.

[0023] It should be noted that the first component group 3 is a high-heat-generating component, which is attached to the heat sink group 2. The heat sink group 2 absorbs the heat, and the cool air blows across the heat sink group 2 to remove the heat from the first component group 3. The second component group 4 is a low-heat-generating component with low heat generation. It can be dissipated by the cool air or by heat conduction through the chassis shell 7. The second component group 4 will not affect the overall heat dissipation of the circuit board assembly.

[0024] Specifically, the heat sink assembly 2 can adopt the heat sink 21 structure commonly used in the prior art, including a heat sink substrate and multiple heat sink fins. The first device assembly 3 is attached to the heat sink substrate. The heat sink substrate and multiple heat sink fins absorb the heat of the first device assembly 3. Cool air blows across the multiple heat sink fins to remove the heat of the first device assembly 3.

[0025] Since the two second device groups 4 are spaced apart along the first direction and form a ventilation duct 11 that runs through the second direction, the second direction is the ventilation direction and is perpendicular to the first direction. Both the second device group 4 and the heat sink group 2 extend along the second direction; it can be understood that the length direction of the second device group 4 and the heat sink group 2 is the second direction.

[0026] In order to improve the utilization rate of the heat sink assembly 2, in the prior art, the first device group 3 is arranged to cover the heat sink assembly 2 along the second direction. For the rear half of the heat sink assembly 2, the airflow received is the airflow passing through its front plate. That is to say, the rear half cannot receive pure cold air. Moreover, after the airflow passes through the rear half of the heat sink assembly 2, it directly diffuses to the surroundings, resulting in a decrease in air pressure and air speed, which further leads to insufficient cold air volume received by the rear half. Therefore, the heat dissipation effect of the rear half, especially the first device group 3 corresponding to the end, is poor.

[0027] Compared with the prior art, the circuit board assembly provided by this utility model has two second device groups 4 arranged at intervals along the first direction to form a narrow ventilation duct 11, which allows cold air to be concentrated and blown onto the heat sink group 2. Due to the reduced cross-sectional area of ​​the duct and the increased air velocity, the heat of the heat sink group 2 can be removed more efficiently, thus improving the heat dissipation effect on the high-heat-generating first device group 3.

[0028] The front end of the second device group 4 protrudes forward relative to the front end of the heat sink group 2, which can guide the fan airflow to enter the ventilation duct 11 more concentratedly, reduce turbulence, and improve the airflow stability within the ventilation duct 11. The rear end of the second device group 4 extends backward relative to the rear end of the heat sink group 2, which can extend the path of the airflow after passing through the heat sink group 2, ensuring that the airflow completely passes through the heat sink group 2 in the second direction, avoiding the problem of insufficient airflow received at the rear end of the heat sink group 2 due to the airflow directly diffusing to the surroundings after passing through the rear half of the heat sink group 2, thereby improving the air cooling utilization rate and enhancing the heat dissipation effect on the rear half of the heat sink group 2, especially on the end of the heat sink group 2.

[0029] Specifically, please refer to Figure 1 and Figure 2 In this embodiment, the second device group 4 is not limited to two, but can be two or more. A ventilation duct 11 is formed between each pair of adjacent second device groups 4, and a heat sink group 2 is provided in each ventilation duct 11. Moreover, in the first direction, the distance between the second device group 4 and the heat sink group 2 is very small, that is, the heat sink group 2 can basically fill the ventilation duct 11. The second device group 4 blocks the cold air from flowing backward from the periphery of the heat sink group 2, thereby avoiding the ineffective diversion of airflow and avoiding airflow loss.

[0030] It should be noted that a ventilation duct 11 can also be formed between the second device group 4 located on the side and the side wall of the chassis housing 7, and a heat sink group 2 is also provided in the ventilation duct 11.

[0031] Therefore, for circuit board assemblies with multiple heat sink groups 2 and multiple second device groups 4, the heat sink groups 2 and second device groups 4 are arranged alternately, that is, the heat sink groups 2 and second device groups 4 are arranged alternately to maximize the use of the space on the circuit board 1 and meet the requirements of high power density. Moreover, the second device groups 4 fill the idle space between the multiple heat sink groups 2, taking into account both the heat dissipation of low-heat devices and the compactness of the layout; the multiple second device groups 4 also form a directional airflow channel, which increases the airflow speed and enhances the heat dissipation capacity.

[0032] For a circuit board assembly with multiple heat sink groups 2, one specific implementation is that the front ends of each heat sink group 2 are aligned, and the rear end of at least one heat sink group 2 protrudes rearward relative to the rear ends of the other heat sink groups 2. That is, the length of the first device group 3 corresponding to the heat sink group 2 is longer, while the length of the other first device groups 3 is shorter, which can reduce the length of the corresponding heat sink group 2 accordingly. The length of each heat sink group 2 is determined according to the length of the first device group 3 to be assembled. Multiple heat sink groups 2 do not need to be designed as equal length structures, which optimizes the space occupied by each heat sink group 2. Moreover, the second device group 4 is set in the installation space corresponding to the shorter heat sink group 2, and the installation position of the second device group 4 is provided, which improves the integration of the circuit board 1.

[0033] In some embodiments, the first device group 3 and the second device group 4 described above can be employed as follows: Figure 1 and Figure 2 The structure shown is described in the following document. Figure 1 and Figure 2 The first device group 3 includes multiple power transistors, which are spaced apart on the heat sink group 2 along the second direction; the second device group 4 includes multiple bus capacitors 41, which are spaced apart on the circuit board 1 along the second direction.

[0034] The power transistors in the first device group 3 typically refer to high-heat-generating semiconductor switching devices, including but not limited to MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), IGBTs (Insulated Gate Bipolar Transistors), and SiC / GaN power devices. These devices are characterized by concentrated heat generation and require close contact with the heat sink 21 to reduce junction temperature, ensuring reliability and lifespan.

[0035] Specifically, from the air intake side to the air outlet side of the radiator assembly 2, the heat generation of multiple power tubes gradually decreases, and the distance between two adjacent power tubes gradually decreases.

[0036] When cold air enters the radiator 21 from the intake side, its temperature is lowest, prioritizing the cooling of power transistors (such as IGBTs) that generate the most heat, thus preventing them from being derated or failing due to high temperatures. The exhaust side of the radiator 21 has a higher temperature, so power transistors with relatively lower heat generation are preferably placed there to avoid heat buildup.

[0037] In addition, among the multiple power transistors, the spacing on the air intake side near the heat sink 21 is large, ensuring that the high-heat-generating power transistors have sufficient heat dissipation area and that the airflow fully contacts the heat sink fins. Meanwhile, the power transistors on the air exhaust side near the heat sink 21 generate relatively less heat, reducing their heat dissipation requirements and allowing for a compact arrangement, saving space on the circuit board 1 and achieving a high power density layout within the limited area of ​​the heat sink 21.

[0038] Bus capacitor 41 is used to buffer voltage fluctuations caused by sudden load changes or switching operations, and to suppress high-frequency ripple on the DC bus. It releases stored energy during load surges or absorbs excess energy during energy feedback, maintaining system power balance. Bus capacitor 41, together with inductor 42, forms an LC filter to filter out high-frequency noise and harmonics.

[0039] The bus capacitor 41 is a low-heat-generating device, and it is generally cylindrical in shape, with a large volume and relatively high height. It is positioned around the periphery of the heat sink assembly 2, effectively blocking cold air from flowing from the outside of the heat sink assembly 2. In the first direction, the distance between the bus capacitor 41 and the heat sink assembly 2 is relatively small.

[0040] It should be noted that there is a safety clearance between every two adjacent bus capacitors 41. The close arrangement of multiple bus capacitors 41 prevents cold air from leaking from the periphery of the radiator assembly 2, ensuring that all airflow is used for effective heat dissipation. In addition, the bus capacitor 41 located at the front protrudes forward relative to the front end of the radiator assembly 2.

[0041] Specifically, in the height direction of the heat sink assembly 2, the top surface of the bus capacitor 41 protrudes upward from the top surface of the power transistor.

[0042] The power transistor preferably relies on heat sinks close to it for heat dissipation. In other words, the closer the heat sink is to the power transistor, the greater the heat absorption, and therefore the greater the required ventilation volume. In this embodiment, the top surface of the bus capacitor 41 is higher than the top surface of the power transistor. That is, in the orthographic projection in the first direction, the bus capacitor 41 can cover the power transistor and the heat sinks close to the power transistor, so as to force a large amount of cold air to flow only from the multiple heat sinks close to the power transistor, thereby improving the utilization rate of cold air.

[0043] In addition, the top surface of the heat sink assembly 2 is flush with the top surface of the bus capacitor 41; or, the top surface of the heat sink assembly 2 protrudes upward from the top surface of the bus capacitor 41, and the vertical distance between the top surface of the heat sink assembly 2 and the top surface of the bus capacitor 41 is less than one-third of the height of the heat sink assembly 2.

[0044] Since the bus capacitor 41 is a standard component with a fixed height, while the heat sink assembly 2 is a non-standard component, in this embodiment, the top surface of the heat sink assembly 2 protrudes upward from the top surface of the bus capacitor 41, which can correspondingly increase the heat dissipation area of ​​the heat sink assembly 2, which is also beneficial to improving the heat dissipation effect on the first device group 3.

[0045] However, the height of the heat sink assembly 2 should not be too high. Preferably, the vertical distance between the top surface of the heat sink assembly 2 and the top surface of the bus capacitor 41 is less than one-third of the height of the heat sink assembly 2.

[0046] Preferably, in one embodiment, the height of the bus capacitor 41 is four-fifths of the height of the heat sink assembly 2; in the second embodiment, the height of the bus capacitor 41 is six-sevenths of the height of the heat sink assembly 2; in the third embodiment, the height of the bus capacitor 41 is three-quarters of the height of the heat sink assembly 2; and in the fourth embodiment, the height of the bus capacitor 41 is equal to the height of the heat sink assembly 2.

[0047] In some embodiments, the second device group 4 described above may also employ, for example... Figure 1 and Figure 2 The structure shown is described in the following document. Figure 1 and Figure 2 The second device group 4 also includes an inductor 42, which is located behind a plurality of bus capacitors 41.

[0048] The number and arrangement of bus capacitors 41 are determined according to the design requirements of the circuit board assembly. If the arrangement of bus capacitors 41 is satisfied, and the length occupied by multiple bus capacitors 41 is less than the length of heat sink group 2 for the second device group 4 in the same group, an inductor 42 can be set behind the bus capacitors 41 to extend the length of the second device group 4.

[0049] Inductor 42 is a commonly used electronic component in circuit board assemblies. In this embodiment, inductor 42 is used to extend the length of the second component group 4. In addition to fulfilling its own function and meeting the circuit requirements, it also meets the optimization requirements of the ventilation channel 11 of the heat sink group 2. For this circuit board assembly, there is no need to add non-functional structures, saving space and cost, and reducing processes and materials.

[0050] In another embodiment, the second device group 4 also includes an electronic control board 43 and / or a fuse, which is located behind the plurality of bus capacitors 41.

[0051] Similarly, if the length occupied by multiple bus capacitors 41 is less than the length of heat sink group 2 for the second device group 4 in the same group, an electrical control board 43 and / or a fuse can be installed behind the bus capacitors 41 to extend the length of the second device group 4.

[0052] The control board 43 and the fuse are also common electronic components in the circuit board assembly. In this embodiment, the control board 43 and / or the fuse are used to extend the length of the second component group 4, which has the same effect as extending the length of the second component group 4 using the inductor 42. In addition to fulfilling its own function to meet the circuit requirements, it also combines the optimization requirements of the ventilation channel 11 of the heat sink group 2. For this circuit board assembly, there is no need to add non-functional structures, saving space and cost, and reducing processes and materials.

[0053] Specifically, for a circuit board assembly with multiple heat sink groups 2, one column of the second component group 4 includes only capacitors, another column of the second component group 4 includes capacitors and inductors 42, and the third column of the second component group 4 includes capacitors and fuses, or capacitors and control boards 43, or capacitors, fuses and control boards 43. The number of capacitors, inductors 42, fuses and control boards 43 is determined according to the design requirements of the circuit board 1. The electronic components are flexibly distributed according to the length of the heat sink group 2 and the number and location requirements of capacitors, inductors 42, fuses and control boards 43.

[0054] In some embodiments, the heat sink assembly 2 may employ, as follows: Figure 1 , Figure 2 and Figure 3 The structure shown is described in the following document. Figure 1 , Figure 2 and Figure 3 The heat sink assembly 2 also has a mounting cavity 22 that runs through the second direction, and the first device assembly 3 is attached to the cavity wall of the mounting cavity 22.

[0055] The heat sink assembly 2 has a mounting cavity 22. Since the mounting cavity 22 is through in the second direction, it has two opposite sidewalls. Each sidewall can be fitted with a set of first device groups 3. In other words, each heat sink assembly 2 can dissipate heat for two sets of first device groups 3. Compared with one heat sink assembly 2 corresponding to one set of first device groups 3, the number of heat sink assemblies 2 can be reduced to achieve a high-density layout, or the number of first device groups 3 can be increased to improve the power of the circuit board assembly.

[0056] Specifically, in the height direction of the heat sink assembly 2, the bottom surface of the mounting cavity 22 also extends downward through the heat sink assembly 2. That is to say, the mounting cavity 22 has a downward opening to facilitate the fitting of the power tube to the side wall of the mounting cavity 22 and to facilitate the insertion of the power tube into the circuit board 1.

[0057] In some embodiments, the heat sink assembly 2 may employ, as follows: Figure 1 , Figure 2 and Figure 3 The structure shown is described in the following document. Figure 1 , Figure 2 and Figure 3The heat sink assembly 2 includes two heat sinks 21 spaced apart along a first direction; a mounting cavity 22 is formed between the two heat sinks 21; a first device group 3 is attached to each heat sink 21, and in each heat sink assembly 2, at least one first device group 3 is located in the corresponding mounting cavity 22.

[0058] Two heat sinks 21 are arranged side by side, and the space between them naturally forms a mounting cavity 22. No additional structural components are needed, nor is it necessary to drill holes in the heat sink assembly 2 to create the mounting cavity 22, thus simplifying the structure of the heat sink assembly 2. The two heat sinks 21 constitute one heat sink assembly 2, which also increases the heat dissipation area. Each first device group 3 corresponds independently to one heat sink 21, further avoiding thermal coupling.

[0059] It should be noted that a first device group 3 can be set in the mounting cavity 22, while another first device group 3 is attached to the outer wall of the corresponding heat sink 21 facing the second device group 4. That is to say, the two first device groups 3 have the same orientation. Alternatively, two first device groups 3 can be set in the mounting cavity 22, with the two first device groups 3 attached to the opposite side walls of the mounting cavity 22 respectively, and the two first device groups 3 facing each other.

[0060] In some embodiments, the front end of the aforementioned heat sink assembly 2 may also adopt a design such as Figure 3 The structure shown is described in the following document. Figure 3 The front end of the mounting cavity 22 is provided with a third device 5, which is used to block the air inlet of the mounting cavity 22.

[0061] The third device 5 blocks the front end of the mounting cavity 22. The second device group 4 is located on the periphery of the heat sink group 2. The third device 5 cooperates with the second device group 4 to force the cold air to pass through the heat sink 21 only in the second direction, ensuring that the air pressure and air speed are concentrated in the area that needs to be cooled, avoiding the air volume being ineffectively diverted, avoiding air volume loss, and improving the heat dissipation efficiency.

[0062] Specifically, the third device 5 can be a necessary electronic component on the circuit board 1 in small quantities, or it can be other components inside the chassis housing 7. Therefore, there is no need to add additional electronic components or other structures to the circuit board 1. A third device 5 is set at the front end of the mounting cavity 22. The third device 5 blocks the air inlet of the mounting cavity 22, preventing a large amount of cold air from passing through the mounting cavity 22. This forces a large amount of cold air to pass through the heat sink assembly 2 in the second direction, ensuring that the air pressure and air velocity are concentrated to dissipate heat from the high-heat power tubes.

[0063] Preferably, based on the above embodiments, in the first direction, the width of the third device 5 is greater than or equal to three-quarters of the width of the mounting cavity 22, and less than or equal to the width of the mounting cavity 22.

[0064] It should be noted that if the first device group 3 is attached to both opposite sidewalls of the mounting cavity 22, a safety clearance is required between the two first device groups 3 to prevent them from contacting and short-circuiting. Since the two first device groups 3 are attached to the mounting cavity 22, they occupy most of the space in the mounting cavity 22. Therefore, the width of the safety clearance is very small in the first direction.

[0065] Because of the existence of the safety clearance, if there is no third device 5 at the front end of the mounting cavity 22, air will escape through the safety clearance. However, the third device 5 is located at the front end of the mounting cavity 22, and the width of the third device 5 is greater than or equal to three-quarters of the width of the mounting cavity 22 and less than or equal to the width of the mounting cavity 22. Therefore, the third device 5 completely blocks the safety clearance in the second direction, thereby preventing air from escaping.

[0066] If the first device group 3 is attached to only one side wall of the mounting cavity 22, then in order to ensure that the first device group 3 can be fixed to the side wall of the mounting cavity 22 (the two are generally fixed by screws), there must be a mounting gap between the other side wall of the mounting cavity 22 and the first device group 3 in the first direction. Similarly, the width of the mounting gap is also very small.

[0067] Because of the aforementioned installation gap, if there is no third device 5 at the front end of the mounting cavity 22, air will escape through the installation gap. However, the third device 5 is located at the front end of the mounting cavity 22, and the width of the third device 5 is greater than or equal to three-quarters of the width of the mounting cavity 22 and less than or equal to the width of the mounting cavity 22. Therefore, the third device 5 completely blocks the installation gap in the second direction, thereby preventing air from escaping.

[0068] Therefore, regardless of whether there is an installation gap or a safety gap, it can be blocked by the third device 5 to avoid the air volume being ineffectively diverted and to avoid air volume loss.

[0069] Preferably, in one embodiment, the width of the third device 5 is four-fifths of the width of the mounting cavity 22; in the second embodiment, the width of the third device 5 is six-sevenths of the width of the mounting cavity 22; in the third embodiment, the width of the third device 5 is three-quarters of the width of the mounting cavity 22; and in the fourth embodiment, the width of the third device 5 is equal to the width of the mounting cavity 22.

[0070] In addition, in the height direction of the heat sink assembly 2, the top surface of the mounting cavity 22 protrudes upward from the top surface of the third device 5, and the vertical distance between the top surface of the mounting cavity 22 and the top surface of the third device 5 is less than one-quarter of the height of the mounting cavity 22. In other words, in the height direction of the heat sink assembly 2, the third device 5 blocks more than three-quarters of the mounting cavity 22, which basically achieves wind protection.

[0071] Preferably, in one embodiment, the height of the third device 5 is three-quarters of the height of the mounting cavity 22; in the second embodiment, the height of the third device 5 is equal to the height of the mounting cavity 22; in the third embodiment, the height of the third device 5 is five-sixths of the height of the mounting cavity 22.

[0072] It should be noted that the third device 5 can be an electronic device that is required on the circuit board 1 and is used in small quantities, or it can be other components inside the chassis housing 7. Therefore, there is no need to add additional electronic devices or other structures to the circuit board 1.

[0073] Since the heat sink assembly 2 consists of two heat sinks 21, there is a mounting cavity 22 between the two heat sinks 21. Although the front end of the mounting cavity 22 is blocked by the third device 5, the airflow will still enter the mounting cavity 22 when passing through a single heat sink 21, resulting in a reduction in airflow. Moreover, in the first direction, the overall width of the heat sink assembly 2 is larger than the width of a single heat sink 21. After the airflow passes through the rear half of a single heat sink 21, it will also diffuse to the surroundings through the mounting cavity 22, resulting in a drop in wind pressure and a decrease in wind speed, resulting in insufficient cold air volume received in the rear half.

[0074] To address the aforementioned issues, in some embodiments, the rear end of the aforementioned heat sink assembly 2 may also employ a design such as... Figure 1 and Figure 2 The structure shown is described in the following document. Figure 1 and Figure 2 The rear end of the mounting cavity 22 is provided with a fourth device 6; and / or the rear end of the heat sink 21 is provided with a fourth device 6, the fourth device 6 extending and distributed along the second direction.

[0075] The fourth device 6 at the rear end of the mounting cavity 22 serves to shield the rear end of the mounting cavity 22, blocking the airflow and preventing it from escaping from the rear end of the mounting cavity 22. The fourth device 6 at the rear end of the heat sink 21 has the same function as the second device group 4. It extends along the second direction, which extends the airflow path. After the airflow passes through a single heat sink 21, it continues to flow backward, preventing the airflow from directly diffusing to the surroundings after passing through the rear half of a single heat sink 21. This increases the ventilation volume of the rear half of a single heat sink 21, improves the air-cooling utilization rate, and enhances the heat dissipation effect on the power tubes on the rear half of the heat sink group 2.

[0076] Please see Figure 4 Based on the same inventive concept, this application also provides a power supply device, including a housing 7, a fan assembly 8 and the aforementioned circuit board assembly, wherein the fan assembly 8 is disposed inside the housing 7; the circuit board assembly is disposed inside the housing 7 and is located behind the fan assembly 8.

[0077] The power supply device provided by the present invention, by adopting the above-mentioned circuit board assembly, can concentrate the cold air through the heat sink group 2, extend the airflow path after passing through the heat sink group 2, improve the air cooling utilization rate, and enhance the heat dissipation effect on the first device group 3 with high heat generation.

[0078] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board assembly, characterized in that, include: Circuit board (1); Two second device groups (4) are spaced apart on the circuit board (1) along a first direction and are electrically connected to the circuit board (1) respectively; a ventilation duct (11) is formed between the two second device groups (4) along a second direction; and A heat sink assembly (2) is disposed inside the ventilation duct (11); a first device assembly (3) is attached to the heat sink assembly (2), and the first device assembly (3) is electrically connected to the circuit board (1). The front end of the second device group (4) protrudes forward relative to the front end of the heat sink group (2), and the rear end of the second device group (4) extends backward relative to the rear end of the heat sink group (2).

2. The circuit board assembly as claimed in claim 1, characterized in that, The first device group (3) includes a plurality of power transistors, which are spaced apart on the heat sink group (2) along the second direction; the second device group (4) includes a plurality of bus capacitors (41), which are spaced apart on the circuit board (1) along the second direction.

3. The circuit board assembly as described in claim 2, characterized in that, In the height direction of the heat sink assembly (2), the top surface of the bus capacitor (41) protrudes upward from the top surface of the power transistor; The top surface of the heat sink assembly (2) is flush with the top surface of the bus capacitor (41); or, the top surface of the heat sink assembly (2) protrudes upward from the top surface of the bus capacitor (41), and the vertical distance between the top surface of the heat sink assembly (2) and the top surface of the bus capacitor (41) is less than one-third of the height of the heat sink assembly (2).

4. The circuit board assembly as claimed in claim 2, characterized in that, The second device group (4) also includes at least one of an inductor (42), an electronic control board (43), and a fuse.

5. The circuit board assembly as claimed in claim 1, characterized in that, The heat sink assembly (2) also has a mounting cavity (22) extending in the second direction, and the first device assembly (3) is attached to the cavity wall of the mounting cavity (22).

6. The circuit board assembly as claimed in claim 5, characterized in that, The heat sink assembly (2) includes two heat sinks (21) spaced apart along the first direction; the mounting cavity (22) is formed between the two heat sinks (21); a set of the first device group (3) is attached to each heat sink (21), and in each heat sink assembly (2), at least one set of the first device group (3) is located in the corresponding mounting cavity (22).

7. The circuit board assembly as claimed in claim 5, characterized in that, The front end of the mounting cavity (22) is provided with a third device (5), which is used to block the air inlet of the mounting cavity (22).

8. The circuit board assembly as claimed in claim 7, characterized in that, In the first direction, the width of the third device (5) is greater than or equal to three-quarters of the width of the mounting cavity (22) and less than or equal to the width of the mounting cavity (22).

9. The circuit board assembly as claimed in claim 6, characterized in that, The rear end of the mounting cavity (22) is provided with a fourth device (6); and / or the rear end of the heat sink (21) is provided with a fourth device (6); the fourth device (6) extends along the second direction.

10. A power supply device, characterized in that, include: Shell (7); The fan assembly (8) is disposed inside the housing (7); as well as The circuit board assembly according to any one of claims 1-9 is disposed within the housing (7) and located behind the fan assembly (8).

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