Circuit board assemblies and electronic devices

Abstract

This application provides a circuit board assembly and an electronic device, relating to the field of electronic devices. The circuit board assembly includes a circuit board; and at least one first heat sink group and a plurality of second heat sink groups, spaced apart along a first direction on the circuit board; each first heat sink group is provided with a first device group, and each second heat sink group is provided with a second device group; the first device group and the second device group are electrically connected to the circuit board respectively; the length of the first heat sink group is greater than the length of the second heat sink group; wherein, a portion of the power transistors of the first circuit are contained within each of the second device groups, and the remaining power transistors of the first circuit are contained within each of the first device groups; each first device group also includes power transistors in the second circuit. This application allows two circuits to be laid out simultaneously on one circuit board, eliminating the need to lay out a circuit on each circuit board, which can greatly reduce the space occupied and save costs, while also achieving heat dissipation of the power transistors based on the heat sink groups.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a circuit board assembly and an electronic device. Background Technology

[0002] Electronic devices typically include multiple circuits; for example, uninterruptible power supplies (UPS) include at least rectifier circuits and charging / discharging circuits. Each circuit in an electronic device contains power devices that generate significant heat. To prevent damage to circuit boards and devices or shorten their lifespan due to heat during operation, heat sinks are usually installed at the power devices on the circuit board for air cooling.

[0003] In related technologies, different circuits in electronic devices are laid out on different circuit boards, and heat sinks need to be installed on both circuit boards in order to dissipate heat from power devices, resulting in a large space occupation and high cost. Utility Model Content

[0004] This application provides a circuit board assembly and an electronic device to solve the problem that the layout of different circuits in the prior art occupies a large amount of space and has a high cost.

[0005] In a first aspect, embodiments of this application provide a circuit board assembly, including:

[0006] Circuit board;

[0007] In addition, at least one first heat sink group and a plurality of second heat sink groups are distributed at intervals on the circuit board along a first direction; each first heat sink group is provided with a first device group, and each second heat sink group is provided with a second device group; the first device group and the second device group are respectively electrically connected to the circuit board; the length of the first heat sink group is greater than the length of the second heat sink group.

[0008] The power transistors of the first circuit are included in each of the second device groups, and the remaining power transistors of the first circuit are included in each of the first device groups; each of the first device groups also includes power transistors in the second circuit.

[0009] In one possible implementation, the circuit board assembly also includes:

[0010] Multiple third-party device groups are electrically connected to the circuit board;

[0011] There is an installation space between each pair of adjacent heat sink groups, and a third device group is provided in each installation space; the two adjacent heat sink groups include two first heat sink groups and two second heat sink groups, or one first heat sink group and one second heat sink group.

[0012] In one possible implementation, the number of first heat sink groups is two, and the number of second heat sink groups is four;

[0013] Two first heat sink assemblies are spaced apart in the middle area of ​​the circuit board along a first direction; two second heat sink assemblies are spaced apart in the left area of ​​the two first heat sink assemblies along the first direction; and the remaining two second heat sink assemblies are spaced apart in the right area of ​​the two first heat sink assemblies along the first direction.

[0014] In one possible implementation, the first heat sink group is further provided with a first mounting area extending along the second direction, and the first device group is disposed in the first mounting area;

[0015] The second heat sink assembly is also provided with a second mounting area that extends along the second direction, and the second device assembly is located in the second mounting area.

[0016] The second direction is the ventilation direction, and the second direction is perpendicular to the first direction.

[0017] In one possible implementation, a fourth device is provided at the front end of the first mounting area and the second mounting area; the fourth device is used to shield the first mounting area or the second mounting area so that cold air passes through each of the first heat sink groups or each of the second heat sink groups in a second direction.

[0018] The fourth component is electrically connected to the circuit board.

[0019] In one possible implementation, at least one of the plurality of fourth devices is a high-frequency capacitor, which is disposed on and electrically connected to the circuit board; and / or,

[0020] At least one of the plurality of fourth devices is a terminal block; the terminal block is disposed on the circuit board and is electrically connected to the circuit board.

[0021] In one possible implementation, the first heat sink group includes two first heat sinks arranged side by side along a first direction, the two first heat sinks being arranged in the same direction, and each first heat sink having a first mounting area extending along a second direction; a first device group is mounted in the first mounting area of ​​the two first heat sinks in each first heat sink group.

[0022] The second heat sink group includes two second heat sinks arranged side by side along a first direction, the two second heat sinks are arranged in the same direction, and each second heat sink is provided with a second mounting area that runs through a second direction; a second device group is installed in the second mounting area of ​​the two second heat sinks in each second heat sink group.

[0023] In one possible implementation, the front end of the third device group protrudes forward relative to the front ends of the first and second heat sink groups; the rear end of the third device group extends backward relative to the rear ends of the first and second heat sink groups.

[0024] In one possible implementation, a fifth device extending along the second direction is provided at the rear end of the second heat sink assembly;

[0025] The second direction is the ventilation direction, and the second direction is perpendicular to the first direction.

[0026] Secondly, embodiments of this application provide an electronic device, including:

[0027] case;

[0028] The fan assembly is housed inside the casing; and,

[0029] The circuit board assembly as described in the first aspect or any possible implementation thereof is disposed within the housing and located behind the fan assembly.

[0030] This application provides a circuit board assembly and an electronic device. By arranging a first heat sink group and a second heat sink group on the circuit board, and setting a first device group in each first heat sink group and a second device group in each second heat sink group, some power transistors of the first circuit are included in each second device group, and the remaining power transistors of the first circuit are included in each first device group. Each first device group also includes power transistors in the second circuit. Thus, two circuits, namely the first circuit and the second circuit, can be arranged on one circuit board at the same time, without having to arrange a circuit on each circuit board. This can greatly reduce the space occupied and save costs. By setting the first heat sink group and the second heat sink group at the same time, and the length of the first heat sink group is greater than the length of the second heat sink group, heat dissipation can be achieved for the power transistors in the first circuit and the second circuit, avoiding damage to the devices or circuit board due to overheating. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of this application;

[0033] Figure 2 yes Figure 1 A top-view structural diagram;

[0034] Figure 3 This is a schematic diagram of the structure of a heat sink provided in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the structure of a heat sink provided in another embodiment of this application;

[0036] Figure 5 This is a schematic diagram of the circuit structure of an uninterruptible power supply provided in an embodiment of this application;

[0037] Figure 6 This is an exploded structural diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0038] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the following description will be provided in conjunction with the accompanying drawings and specific embodiments.

[0040] Figure 1 A schematic diagram of the circuit board assembly provided in an embodiment of this application is shown. Figure 2 It shows Figure 1 A top view. See also Figure 1 and Figure 2 This application provides a circuit board assembly, including:

[0041] Circuit board 1;

[0042] In addition, at least one first heat sink group 21 and a plurality of second heat sink groups 22 are distributed at intervals along a first direction on the circuit board 1; each first heat sink group 21 is provided with a first device group 4, and each second heat sink group 22 is provided with a second device group 5; the first device group 4 and the second device group 5 are respectively electrically connected to the circuit board 1; the length of the first heat sink group 21 is greater than the length of the second heat sink group 22.

[0043] In this circuit, some power transistors of the first circuit are contained in each of the second device groups 5, and the remaining power transistors of the first circuit are contained in each of the first device groups 4; each of the first device groups 4 also includes power transistors in the second circuit.

[0044] See Figure 6The aforementioned circuit board assembly is typically installed inside the chassis housing 7. The chassis housing 7 also contains a fan assembly 8, which is located in front of the circuit board assembly and supplies air to the circuit board assembly.

[0045] The devices in the first device group 4 and the second device group 5 are all high-heat-generating devices, such as high-heat-generating power devices. The first device group 4 can be attached to the corresponding first heat sink group 21, where the heat sink group 21 absorbs the heat. The second device group 5 can be attached to the corresponding second heat sink group 22, where the heat sink group 22 absorbs the heat. The cool air provided by the fan assembly 8 blows across the first heat sink group 21 and the second heat sink group 22, which can carry away the heat from the first device group 4 and the second device group 5.

[0046] Among them, the first device group 4 and the first heat sink group 21 can be matched one-to-one, and the second device group 5 and the second heat sink group 22 can be matched one-to-one, so as to enable precise heat dissipation for high heat-generating areas.

[0047] It should be noted that, in this embodiment, the device groups arranged on the first heat sink group 21 are collectively referred to as the first device group 4, but different first heat sink groups 21 are arranged with different first device groups 4. Similarly, the device groups arranged on the second heat sink group 22 are collectively referred to as the second device group 5, but different second heat sink groups 22 are arranged with different second device groups 5.

[0048] The number of first heat sink groups 21 can be at least one, for example, one, two, three or more. The number of second heat sink groups 22 can be at least one or at least two, for example, one, two, three, four, five or more. The specific number can be determined according to actual usage requirements.

[0049] The first heat sink group 21 and the second heat sink group 22 are distributed at intervals along a first direction on the circuit board 1, which can avoid local heat accumulation. The first direction can be the length direction of the circuit board 1.

[0050] The first radiator group 21 and the second radiator group 22 can adopt the structure of radiator groups commonly used in the prior art, and no specific limitation is made here.

[0051] In this embodiment of the application, some power transistors of the first circuit and the remaining power transistors of the first circuit constitute all the power transistors of the first circuit, and all the power transistors of the second circuit are distributed in each of the first device groups 4.

[0052] Specifically, each first device group 4 includes power transistors from both the first and second circuits. Each second device group 5 includes only power transistors from the first circuit. Different first device groups 4 and different second device groups 5 contain different power transistors in their first circuits, and different first device groups 4 contain different power transistors in their second circuits. However, all first device groups 4 and all second device groups 5 include all power transistors in both the first and second circuits. In other words, power transistors with high heat generation are arranged on the first heat sink group 21 and the second heat sink group 22 to ensure heat dissipation.

[0053] Since the first device group 4 includes power transistors from both the first and second circuits, while the second device group 5 only includes power transistors from the first circuit, the number of power transistors in the first circuit included in the first device group 4 and the number of power transistors in the first circuit included in the second device group 5 can be the same. Therefore, the number of devices (power transistors) in the first device group 4 is greater than the number of devices (power transistors) in the second device group 5. To accommodate the first device group 4, the length of the first heat sink group 21 must be greater than the length of the second heat sink group 22 to meet the heat dissipation requirements of the first device group 4.

[0054] The number of power transistors in the second circuit included in different first device groups 4 can be the same.

[0055] It should be noted that, in another implementation, the number of power transistors in the first circuit of a first device group 4 and the number of power transistors in the first circuit of a second device group 5 can also be different, and the number of power transistors in the second circuit of different first device groups 4 can also not be completely the same, which can be determined according to actual usage requirements.

[0056] The power transistor can include power devices such as diodes and switching transistors. The switching transistor can be a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor Module), or other types of switching transistors, without specific limitations.

[0057] The first circuit and the second circuit can be two different circuits used in the same electronic device. For example, if the electronic device is an uninterruptible power supply (UPS), the first circuit can be a rectifier circuit and the second circuit can be a charging / discharging circuit; or, the first circuit can be a rectifier circuit and the second circuit can be an inverter circuit; or, the first circuit can be an inverter circuit and the second circuit can be a charging / discharging circuit; and so on. If the electronic device is an energy storage device, the first circuit can be a DC-AC converter circuit and the second circuit can be a DC-DC converter circuit (boost circuit or buck circuit, etc.).

[0058] In this embodiment, by arranging a first heat sink group 21 and a second heat sink group 22 on the circuit board 1, and setting a first device group 4 in each first heat sink group 21 and a second device group 5 in each second heat sink group 22, some power transistors of the first circuit are included in each second device group 5, and the remaining power transistors of the first circuit are included in each first device group 4. Each first device group 4 also includes power transistors in the second circuit, so that two circuits, namely the first circuit and the second circuit, can be arranged on one circuit board at the same time, without having to arrange a circuit on each circuit board. This can greatly reduce the space occupied and save costs. At the same time, the first heat sink group 21 and the second heat sink group 22 are arranged, and the length of the first heat sink group 21 is greater than the length of the second heat sink group 22, so that heat dissipation can be achieved for the power transistors in the first circuit and the second circuit, avoiding damage to the devices or the circuit board 1 due to overheating.

[0059] In addition, the length of each heat sink group is determined according to the length of the first device group 4 or the second device group 5 to be assembled. Multiple heat sink groups do not need to be designed as equal length structures, thus optimizing the space occupied by each heat sink group.

[0060] As mentioned above, the first heat sink group 21 and the second heat sink group 22 are distributed at intervals along the first direction, which can avoid local heat accumulation. However, there is space between adjacent heat sink groups, and some cold air can pass directly through the space, which will reduce the heat dissipation capacity of the first heat sink group 21 and the second heat sink group 22.

[0061] To address this issue, in some embodiments, see [link to relevant documentation] Figure 1 and Figure 2 The circuit board assembly also includes:

[0062] Multiple third-party device groups 6 are electrically connected to circuit board 1 respectively;

[0063] There is an installation space 11 between each pair of adjacent heat sink groups, and a third device group 6 is provided in each installation space 11; the two adjacent heat sink groups include two first heat sink groups 21 and two second heat sink groups 22, or one first heat sink group 21 and one second heat sink group 22.

[0064] The devices in the third device group 6 are low-heat devices, meaning that the heat generated by the devices in the third device group 6 is less than that of the devices in the first device group 4, and also less than that of the devices in the second device group 5.

[0065] In this embodiment, an installation space 11 is formed between each pair of adjacent heat sink groups. The installation space 11 can extend along a second direction, which is the ventilation direction and perpendicular to the first direction. It can also be considered as the width direction of the circuit board 1. A third device group 6 is provided in each installation space 11. In the first direction, the distance between the third device group 6 and the first heat sink group 21 or the second heat sink group 22 is very small. That is to say, the third device group 6 can basically fill the installation space 11, which can achieve a high-density layout. At the same time, the third device group 6 occupies the installation space 11, blocking the flow of cold air in the installation space 11. This can prevent the air volume from being ineffectively diverted and avoid air volume loss. Furthermore, it can force the cold air to pass only along the second direction from the first heat sink group 21 and the second heat sink group 22, ensuring that the air pressure and air velocity are concentrated in the area that needs to be cooled, preventing the air volume from being ineffectively diverted and avoiding air volume loss, and improving the heat dissipation efficiency.

[0066] There may also be an installation space 11 between the second heat sink group 22 on the far left or far right and the chassis shell 7, where a third component group 6 is provided.

[0067] The third device group 6 may include devices other than power transistors, such as at least one of the following: bus capacitor 61, inductor 62, and control board 63.

[0068] The third device group 6 in different installation spaces 11 can contain different devices or the same devices. It can be set according to actual needs, and no specific restrictions are made here.

[0069] The number and position of the third device group 6 can be determined based on the number and arrangement of the first device group 4 and the second device group 5.

[0070] The number of the first heat sink group 21 and the second heat sink group 22 can be implemented in different ways, as long as the heat dissipation requirements are met. A detailed description follows.

[0071] In some embodiments, see Figure 1 and Figure 2The first heat sink group 21 has two units, and the second heat sink group 22 has four units.

[0072] Two first heat sink groups 21 are spaced apart along a first direction in the middle area of ​​the circuit board 1; two second heat sink groups 22 are spaced apart along a first direction in the left area of ​​the two first heat sink groups 21, and the remaining two second heat sink groups 22 are spaced apart along a first direction in the right area of ​​the two first heat sink groups 21.

[0073] In this embodiment, the area on the circuit board 1 where the two first heat sink groups 21 are located is referred to as the middle area, the area to the left of the middle area is referred to as the left area, and the area to the right of the middle area is referred to as the right area. It should be noted that the middle area does not represent the exact center of the circuit board 1 in the first direction; it can be slightly to the left or slightly to the right of the center area. It simply means that there are no areas on either side of the circuit board 1. The two first heat sink groups 21 are spaced apart along the first direction in the middle area of ​​the circuit board 1 only to indicate that there is no second heat sink group 22 between the two first heat sink groups 21, and that second heat sink groups 22 exist on both the left and right sides of the two first heat sink groups 21.

[0074] In this embodiment, the number of heat sink groups is six. Along a first direction of the circuit board 1, two second heat sink groups 22, two first heat sink groups 21, and two more second heat sink groups 22 are sequentially spaced apart. Each heat sink group includes both first heat sink groups 21 and second heat sink groups 22. The number of heat sink groups is the sum of the number of first heat sink groups 21 and the number of second heat sink groups 22.

[0075] Since the number of power transistors requiring heat dissipation in the second circuit is relatively small, two first heat sink groups 21 are sufficient to meet the heat dissipation requirements. Because the first heat sink group 21 is relatively long, fewer first heat sink groups 21 can save space on the circuit board 1 for the placement of other components.

[0076] In another embodiment, there are two heat sink groups, with three first heat sink groups 21 and three second heat sink groups 22.

[0077] Three first heat sink groups 21 are spaced apart along a first direction in the middle area of ​​the circuit board 1; two second heat sink groups 22 are spaced apart along the first direction in the left area of ​​the three first heat sink groups 21, and the remaining second heat sink group 22 is spaced apart along the first direction in the right area of ​​the three first heat sink groups 21; or, one second heat sink group 22 is spaced apart along the first direction in the left area of ​​the three first heat sink groups 21, and the remaining two second heat sink groups 22 are spaced apart along the first direction in the right area of ​​the three first heat sink groups 21.

[0078] In this embodiment, the number of first heat sink groups 21 is three, which can relatively reduce the heat dissipation pressure of each first heat sink group 21 compared with the layout of two first heat sink groups 21.

[0079] It should be noted that this application only provides an example of the number of the first heat sink group 21 and the second heat sink group 22. In practical applications, the number of the first heat sink group 21 and the second heat sink group 22 can be determined according to actual usage requirements.

[0080] In some possible implementations, for each first heat sink group 21, the power transistors of the first circuit to be mounted thereon can be arranged at the front of the first heat sink group 21, and the power transistors of the second circuit to be mounted thereon can be arranged at the rear of the first heat sink group 21. That is, for each first heat sink group 21, from front to back, the power transistors of the first circuit to be mounted thereon are arranged sequentially first, and then the power transistors of the second circuit to be mounted thereon are arranged sequentially. Furthermore, the two first heat sink groups 21 are spaced apart along the first direction in the middle area of ​​the circuit board 1, without any second heat sink group 22 in between. Therefore, the power transistors of the second circuit are all concentrated at the rear of each first heat sink group 21, which can ensure the minimization of the loop of the second circuit (for example, when the second circuit is a charging / discharging circuit, the charging / discharging loop can be minimized), thereby reducing stray inductance. Therefore, the circuit board assembly provided in this application embodiment can not only arrange two circuits on the same circuit board, but also has heat dissipation capability, and can minimize the loop of the second circuit, reducing stray inductance.

[0081] In some embodiments, see Figure 1 and Figure 2 The first heat sink group 21 is also provided with a first mounting area 212 that extends along the second direction, and the first device group 4 is disposed in the first mounting area 212.

[0082] The second heat sink group 22 is also provided with a second mounting area 222 that extends along the second direction, and the second device group 5 is disposed in the second mounting area 222.

[0083] The second direction is the ventilation direction, and the second direction is perpendicular to the first direction.

[0084] In this embodiment, each heat sink assembly is provided with a mounting area extending along a second direction for mounting the corresponding device assembly. The mounting area in the first heat sink assembly 21 is referred to as the first mounting area 212, and the mounting area in the second heat sink assembly 22 is referred to as the second mounting area 222.

[0085] Each radiator assembly has a corresponding installation area, which can increase the heat dissipation area and space accordingly.

[0086] Each heatsink assembly has a corresponding mounting area. After the components are installed in the mounting area, there is still a certain gap between the components and the heatsink. Some cold air can pass through the gap, which reduces the heat dissipation efficiency of the heatsink.

[0087] To address this issue, in some embodiments, see [link to relevant documentation] Figure 1 and Figure 2 A fourth device is provided at the front end of the first mounting area 212 and the second mounting area 222; the fourth device is used to block the first mounting area 212 or the second mounting area 222 so that cold air passes through each of the first heat sink group 21 or each of the second heat sink group 22 in the second direction.

[0088] The fourth device is electrically connected to circuit board 1.

[0089] The fourth device is mounted on and electrically connected to circuit board 1. Like the devices in the aforementioned third device group 6, the fourth device is a low-heat-generating device with low heat output. It can be dissipated by blowing cool air or by heat conduction through the chassis 7. The fourth device and the third device group 6 will not affect the overall heat dissipation of the circuit board assembly.

[0090] Both the installation area and the installation space 11 extend along the second direction (ventilation direction), forming a through channel parallel to the ventilation duct. The fourth device blocks the front end of the installation area, and the third device group 6 occupies the installation space 11. Forced cold air can only pass through the heat sink group along the second direction, ensuring that the air pressure and air velocity are concentrated in the area that needs to be cooled, so as to cool the first device group 4 and the second device group 5, avoid the air volume being ineffectively diverted, avoid air volume loss, and improve the heat dissipation efficiency.

[0091] The fourth component can be an electrical component that is required on the circuit board 1 and is used in small quantities, or it can be other components inside the chassis housing 7. Therefore, there is no need to add additional electrical components or other structures to the circuit board 1.

[0092] In some embodiments, at least one of the plurality of fourth devices is a high-frequency capacitor 34, which is disposed on and electrically connected to the circuit board 1; and / or,

[0093] At least one of the plurality of fourth devices is a terminal block; the terminal block is disposed on the circuit board 1 and is electrically connected to the circuit board 1.

[0094] High-frequency capacitor 34 is specifically designed for high-frequency circuits, possessing excellent high-frequency characteristics; it can also be referred to as a bus filter capacitor. In the circuit board assembly, it is primarily used to filter out high-frequency switching noise, stabilize the power supply voltage, prevent high-frequency signal coupling from affecting circuit stability, reduce the return path impedance of high-speed signals, and improve signal quality. The number and configuration of high-frequency capacitors 34 in the circuit board assembly depend on the specific functional module, power level, and noise suppression requirements. However, it is certain that high-frequency capacitors 34 will be provided on circuit board 1, such as high-frequency capacitors 34 used to filter bus ripple. For example, high-frequency capacitor 34 can be a filtering capacitor connected in parallel with the bus capacitor in the electronic device. The number of high-frequency capacitors can be determined based on the specific functional module, power level, and noise suppression requirements.

[0095] This embodiment uses a high-frequency capacitor 34 as the fourth component. In addition to fulfilling its own function, it also addresses the airflow optimization requirements of the heat sink assembly. The physical structure of the high-frequency capacitor 34 can partially or completely block the air intake of the mounting area, preventing cold air from escaping directly without flowing through the heat sink. The high-frequency capacitor 34 satisfies circuit requirements and optimizes airflow. For this circuit board assembly, no additional non-functional structures are needed, saving space and cost, and reducing processes and materials. The mounting area includes a first mounting area 212 and a second mounting area 222.

[0096] The terminal blocks on circuit board 1 are key components for achieving electrical connections and mechanical fixation, responsible for reliably connecting circuit board 1 to external devices, power supplies, signal lines, or other modules. The terminal blocks also provide physical support to prevent cable pulling from causing solder pad detachment or damage to circuit board 1. The number and configuration of terminal blocks in the circuit board assembly depend on the specific functional modules, power ratings, and functions to be implemented. However, it is certain that circuit board 1 will have terminal blocks, for example, Figure 1 and Figure 2 The positive bus terminal 31, negative bus terminal 32, and neutral terminal 33 may also include AC wiring terminals (A-phase, B-phase, and C-phase wiring terminals) or grounding terminals, etc., which are not limited here and can be selected and set according to the actual needs of the circuit.

[0097] It should be noted that the terminal block and the high-frequency capacitor 34 are two specific implementations of the fourth device. Each mounting area has one and only one fourth device at its front end, meaning that for any given mounting area, its front end is either the high-frequency capacitor 34 or a terminal block.

[0098] In this embodiment, a terminal block is used as the fourth component. In addition to fulfilling its own function, the terminal block also serves as a windbreak through its physical structure, which is the same as the effect of the high-frequency capacitor 34 as the fourth component. In this embodiment, the use of a terminal block as the fourth component can meet the circuit requirements and optimize the airflow. For this circuit board assembly, there is no need to add any non-functional structures, which saves space and cost and reduces the number of processes and materials.

[0099] In some embodiments, the front end of the mounting area located in the middle of circuit board 1 (which should be understood as a portion of the area in the middle of the first direction, not limited to the center line) may not have a fourth device, while the front ends of all other mounting areas have a fourth device. See Figure 6 In this embodiment, since the fan assembly 8 corresponding to the heat dissipation of the circuit board assembly includes multiple fans placed along the first direction (the number of fans in this embodiment is three), at least two fans together dissipate heat for the first device group 4 or the second device group 5 in the mounting area where the fourth device is not provided at the front end, which can also meet the heat dissipation requirements.

[0100] In other embodiments, the positions of the fan assembly 8 and the fourth device are optimized so that the heat sink assembly without the fourth device at the front end is positioned in the middle of the circuit board 1, and one of the central axes 53 of the fan assembly 8 is aligned with one of the mounting areas of the heat sink assembly. In the second direction, there is almost no airflow at the position directly opposite the central axis 53, and the cool air diffuses outwards from the central axis 53. Therefore, no airflow passes through the mounting area directly opposite the central axis 53, which also allows the airflow to mainly pass through the heat sink assembly, preventing air leakage.

[0101] In some embodiments, in the first direction, the width of the fourth device may be greater than or equal to three-quarters of the width of the mounting area, and less than or equal to the width of the mounting area. The mounting area includes a first mounting area 212 and a second mounting area 222, and the widths of the first mounting area 212 and the second mounting area 222 may be the same.

[0102] Specifically, in the height direction of the heat sink assembly, the bottom surface of the mounting area also extends downward through the heat sink assembly. That is to say, the mounting area has a downward opening to facilitate the fitting of the first device group 4 or the second device group 5 onto the side wall (mounting surface) of the mounting area, and to facilitate the insertion of the first device group 4 or the second device group 5 into the circuit board 1.

[0103] Preferably, in one embodiment, the width of the fourth device is four-fifths of the width of the mounting area; in the second embodiment, the width of the fourth device is six-sevenths of the width of the mounting area; in the third embodiment, the width of the fourth device is three-quarters of the width of the mounting area; and in the fourth embodiment, the width of the fourth device is equal to the width of the mounting area.

[0104] In addition, in the height direction of the heat sink assembly, the top surface of the mounting area protrudes upwards from the top surface of the fourth device, and the vertical distance between the top surface of the mounting area and the top surface of the fourth device is less than one-quarter of the height of the mounting area. In other words, in the height direction of the heat sink assembly, the fourth device blocks more than three-quarters of the mounting area, which basically achieves wind protection.

[0105] Preferably, in one embodiment, the height of the fourth device is three-quarters of the height of the mounting area; in the second embodiment, the height of the fourth device is equal to the height of the mounting area; and in the third embodiment, the height of the fourth device is five-sixths of the height of the mounting area.

[0106] It should be noted that in the attached drawings, the fourth device is not shown at the front end of some mounting areas. However, in actual applications, the fourth device is provided in all mounting areas where the front end needs to be set up according to actual usage requirements.

[0107] In some embodiments, see Figure 1 and Figure 2 The first heat sink group 21 includes two first heat sinks 211 arranged side by side along a first direction. The two first heat sinks 211 are arranged in the same direction. Each first heat sink 211 is provided with a first mounting area 212 that runs through a second direction. A first device group 4 is installed in the first mounting area 212 of the two first heat sinks 211 in each first heat sink group 21.

[0108] The second heat sink group 22 includes two second heat sinks 221 arranged side by side along a first direction. The two second heat sinks 221 are arranged in the same direction. Each second heat sink 221 is provided with a second mounting area 222 that runs through a second direction. A second device group 5 is installed in the second mounting area 222 of the two second heat sinks 221 in each second heat sink group 22.

[0109] In this embodiment, each heat sink group includes two heat sinks arranged in the same direction, and each heat sink has a mounting area extending along a second direction for mounting some devices in the corresponding device group. The heat sinks included in the first heat sink group 21 are referred to as the first heat sink 211, and the mounting area in the first heat sink 211 is referred to as the first mounting area 212. The heat sinks included in the second heat sink group 22 are referred to as the second heat sink 221, and the mounting area in the second heat sink 221 is referred to as the second mounting area 222.

[0110] In one possible implementation, the two heat sinks in each heat sink group can also be arranged opposite each other (face to face), and the mounting areas of the two heat sinks can form a mounting cavity for mounting the corresponding device group.

[0111] It should be noted that each heat sink group can contain two heat sinks or other numbers, depending on the actual usage requirements and the space available on circuit board 1.

[0112] The length of the first radiator 211 is greater than the length of the second radiator 221.

[0113] The first radiator 211 and the second radiator 221 may have the same structure or different structure.

[0114] In one possible implementation, the first heat sink 211 and the second heat sink 221 have the same structure, only differing in length. The structure of the heat sink is described below. This heat sink can be either the first heat sink 211 or the second heat sink 221.

[0115] The heat sink can be made of, for example Figure 3 The structure shown is described in the following document. Figure 3 The heat sink includes a first heat sink substrate 23, a first heat sink fin group 24, and a second heat sink fin group 25. The first heat sink substrate 23 is perpendicular to the circuit board 1; the first heat sink substrate 23 has a first plate surface and a second plate surface that are disposed opposite to each other; the first plate surface is divided into a heat dissipation surface and a mounting surface 28; the first heat sink fin group 24 is connected to the heat dissipation surface; the second heat sink fin group 25 is connected to the second plate surface and covers the entire second plate surface; wherein, the first device group 4 or the second device group 5 is attached to the mounting surface 28, and the mounting surface 28 is close to the circuit board 1.

[0116] For the first heat sink 211, the space formed by the first heat dissipation fin group 24 and the mounting surface 28 is called the first mounting area 212 (including the mounting surface 28), and the corresponding first device group 4 is installed in the first mounting area 212; for the second heat sink 221, the space formed by the first heat dissipation fin group 24 and the mounting surface 28 is called the second mounting area 222 (including the mounting surface 28), and the corresponding second device group 5 is installed in the second mounting area 222.

[0117] The first heat dissipation fin group 24 is located on the first plate surface, adjacent to the mounting surface 28 of the device, and directly absorbs the heat generated by the device and dissipates heat through the fins. The second heat dissipation fin group 25 covers the second plate surface, making full use of the back space of the heat dissipation substrate to increase the heat dissipation surface area. By covering the second plate surface with fins, the heat dissipation capacity is nearly doubled compared to a single-sided heat sink.

[0118] Since the first heat dissipation substrate 23 is perpendicular to the circuit board 1 and the toothed fins extend along the second direction, cold air can flow through the first heat dissipation toothed fins 24 and the second heat dissipation toothed fins 25 at the same time, forming double-sided forced convection, which greatly improves the heat dissipation efficiency.

[0119] The components in the first component group 4 or the second component group 5 are directly attached to the mounting surface 28, close to the circuit board 1, facilitating insertion with the circuit board 1 for electrical connection and shortening the heat conduction path, thus reducing thermal resistance. If the height of the heat sink is greater than the height of the first component group 4 or the second component group 5, a heat dissipation area can be provided on the extended portion of the first board surface. The heat dissipation area is equipped with a first heat dissipation fin group 24 to ensure maximum utilization of the heat dissipation fins and improve heat dissipation density.

[0120] The mounting surfaces 28 of the two heat sinks in the same heat sink group are spaced apart, which not only meets the electrical safety distance, but also enables the fixing of the first device group 4 or the second device group 5.

[0121] Preferably, please refer to Figure 4 Based on the above embodiments, the heat sink further includes a second heat sink substrate 26 and a third heat sink fin group 27; the second heat sink substrate 26 is connected to one end of the first heat sink substrate 23 and is arranged perpendicular to the first heat sink substrate 23; the third heat sink fin group 27 is connected to one side of the second heat sink substrate 26; wherein, the third heat sink fin group 27 is located on one side of the second heat sink substrate 26, and the first heat sink fin group 24 and the second heat sink fin group 25 are located on the other side of the second heat sink substrate 26.

[0122] The first heat dissipation substrate 23 and the second heat dissipation substrate 26 form a T-shaped three-dimensional heat dissipation structure, so that the heat dissipation fins are distributed in multiple positions. Cool air can flow through the first heat dissipation fin group 24, the second heat dissipation fin group 25 and the third heat dissipation fin group 27 at the same time, forming multi-faceted forced convection, further increasing the heat dissipation surface area and improving the heat dissipation uniformity.

[0123] In order to improve the utilization rate of heat sink group 2, in the prior art, the first device group 4 is fully arranged along the second direction to form the first heat sink group 21, and the second device group 5 is fully arranged along the second direction to form the second heat sink group 22. For the rear half of the heat sink group, the airflow that passes through its front plate is received. In other words, the rear half cannot receive pure cold air. Moreover, after the airflow passes through the rear half of the heat sink group, it directly diffuses to the surroundings, resulting in a decrease in air pressure and air velocity, which further leads to insufficient cold air volume received by the rear half. Therefore, the heat dissipation effect of the first device group 4 and the second device group 5 corresponding to the rear half is poor.

[0124] To address this issue, in some embodiments, see [link to relevant documentation] Figure 1 and Figure 2 The front end of the third device group 6 protrudes forward relative to the front ends of the first heat sink group 21 and the second heat sink group 21; the rear end of the third device group 6 extends backward relative to the rear ends of the first heat sink group 21 and the second heat sink group 22.

[0125] Among them, the front end of the third device group 6 protrudes forward relative to the front ends of the first heat sink group 21 and the second heat sink group 21. While protruding forward, it can be aligned with the front end of the fourth device or not, which can be determined according to actual needs.

[0126] Two third device groups 6 are spaced apart along the first direction, forming a narrow ventilation channel that allows cool air to be concentrated and blown onto the heat sink group. Due to the reduced cross-sectional area of ​​the channel and the increased air velocity, the heat from the heat sink group can be carried away more efficiently, improving the heat dissipation effect on the high-heat-generating first device group 4 and second device group 5.

[0127] The front end of the third device group 6 protrudes forward relative to the front end of the heat sink group, which can guide the fan airflow to enter the ventilation duct more concentratedly, reduce turbulence, and improve the airflow stability in the ventilation duct. The rear end of the third device group 6 extends backward relative to the rear end of the heat sink group, which can lengthen the path of the airflow after passing through the heat sink group, avoid the problem of insufficient airflow received at the rear end of the heat sink group due to the airflow spreading directly to the surroundings after passing through the rear half of the heat sink group, so as to improve the air cooling utilization rate and improve the heat dissipation effect of the first device group 4 and the second device group 5 on the rear half of the heat sink group.

[0128] It should be noted that a ventilation duct can also be formed between the third component group 6 located on the side and the side wall of the chassis housing 7, and a heat sink group is also installed in the ventilation duct.

[0129] Therefore, for circuit board assemblies with multiple heat sinks and multiple third device groups 6, the multiple heat sink groups and the third device groups 6 are arranged alternately to maximize the use of the space on the circuit board 1 and meet the requirements of high power density. Moreover, the third device groups 6 fill the idle space between multiple heat sink groups, taking into account both heat dissipation of low-heat devices and layout compactness; the multiple third device groups 6 also form directional air channels, which increases the airflow speed and enhances the heat dissipation capacity.

[0130] In some implementations, see Figure 1 and Figure 2 The third component group 6 may include multiple bus capacitors 61, which are distributed along the second direction on the circuit board 1. The bus capacitors 61 can be capacitors between DC buses in electronic equipment, and their number can be determined according to actual needs.

[0131] In the height direction of the heat sink assembly, the top surface of the bus capacitor 61 protrudes upward from the top surface of the mounting area; the top surface of the heat sink assembly protrudes upward from the top surface of the bus capacitor 61, and the vertical distance between the top surface of the heat sink assembly and the top surface of the bus capacitor 61 is less than one-third of the height of the heat sink assembly; or, the top surface of the heat sink assembly is flush with the top surface of the bus capacitor 61.

[0132] Bus capacitor 61 is used to buffer voltage fluctuations caused by sudden load changes or switching operations, and to suppress high-frequency ripple on the DC bus. It releases stored energy during load surges or absorbs excess energy during energy feedback, maintaining system power balance. Bus capacitor 61 can be used in conjunction with an inductor to form an LC filter, filtering out high-frequency noise and harmonics.

[0133] The bus capacitor 61 is a low-heat-generating device, and it is generally cylindrical in shape, with a large volume and height. Positioned on the periphery of the heatsink assembly, it can block the flow of cold air from the outside of the heatsink assembly. In the first direction, the distance between the bus capacitor 61 and the heatsink assembly is relatively small.

[0134] It should be noted that there is a safety clearance between every two adjacent bus capacitors 61. The close arrangement of multiple bus capacitors 61 prevents cold air from leaking from the outside of the radiator assembly, ensuring that all airflow is used for effective heat dissipation.

[0135] Specifically, in the height direction of the heat sink assembly, the top surface of the bus capacitor 61 protrudes upwards from the top surface of the power transistor, and the top surface of the heat sink assembly is flush with the top surface of the bus capacitor 61. Alternatively, the top surface of the heat sink assembly protrudes upwards from the top surface of the bus capacitor 61, and the vertical distance between the top surface of the heat sink assembly and the top surface of the bus capacitor 61 is less than one-third of the height of the heat sink assembly.

[0136] The power transistor preferably relies on heat sinks close to it for heat dissipation. In other words, the closer the heat sink is to the power transistor, the greater the heat absorption, and therefore the greater the required ventilation volume. In this embodiment, the top surface of the bus capacitor 61 is higher than the top surface of the power transistor. That is, in the orthographic projection in the first direction, the bus capacitor 61 can cover the power transistor and the heat sinks close to it, so as to force a large amount of cold air to flow only from the multiple heat sinks close to the power transistor, thereby improving the utilization rate of cold air.

[0137] In addition, since the bus capacitor 61 is a standard component with a fixed height, while the heat sink assembly is a non-standard component, in this embodiment, the top surface of the heat sink assembly protrudes upward from the top surface of the bus capacitor 61, or is aligned with the top surface of the bus capacitor 61, which can correspondingly increase the heat dissipation area of ​​the heat sink assembly, which is also beneficial to improving the heat dissipation effect on the first device group 4 and the second device group 5.

[0138] However, the height of the heat sink assembly should not be too high. Preferably, the vertical distance between the top surface of the heat sink assembly and the top surface of the bus capacitor 61 is less than one-third of the height of the heat sink assembly.

[0139] Preferably, in one embodiment, the height of the bus capacitor 61 is four-fifths of the height of the heat sink assembly; in the second embodiment, the height of the bus capacitor 61 is six-sevenths of the height of the heat sink assembly; in the third embodiment, the height of the bus capacitor 61 is three-quarters of the height of the heat sink assembly; and in the fourth embodiment, the height of the bus capacitor 61 is equal to the height of the heat sink assembly.

[0140] In some implementations, see Figure 1 and Figure 2 The third device group 6 may also include an inductor 62, which is located behind a plurality of bus capacitors 61.

[0141] The number and arrangement of bus capacitors 61 are determined according to the design requirements of the circuit board assembly. If the arrangement of bus capacitors 61 is satisfied, and the length occupied by multiple bus capacitors 61 is less than the length of the heat sink group for the third device group 6 in the same group, an inductor 62 can be set behind the bus capacitors 61 to extend the length of the third device group 6.

[0142] Inductor 62 is a common electrical component in circuit board assemblies. It can be an inductor in the first and second circuits, or an inductor in other locations of the electronic device. In this embodiment, inductor 62 is used to extend the length of the third component group 6. In addition to fulfilling its own function and meeting the circuit requirements, it also optimizes the ventilation channel of the heat sink group. For this circuit board assembly, there is no need to add additional non-functional structures, saving space and cost, and reducing processes and materials.

[0143] As another embodiment, see Figure 1 and Figure 2 The third device group 6 may also include an electronic control board 63 and / or a fuse, which is located behind the plurality of bus capacitors 61.

[0144] Similarly, if the length occupied by multiple bus capacitors 61 is less than the length of the heat sink group for the third device group 6 in the same group, an electronic control board 63 and / or a fuse can be installed behind the bus capacitors 61 to extend the length of the third device group 6.

[0145] The control board 63 and the fuse are also common electrical components in the circuit board assembly. In this embodiment, the control board 63 and / or the fuse are used to extend the length of the third component group 6, which has the same effect as extending the length of the third component group 6 using the inductor 62. In addition to fulfilling its own function to meet the circuit requirements, it also combines the optimization requirements of the ventilation channel of the heat sink group. For this circuit board assembly, there is no need to add non-functional structures, saving space and cost, and reducing processes and materials.

[0146] Specifically, for a circuit board assembly with multiple heat sink groups, one column of the third component group 6 includes only a bus capacitor 61, another column of the third component group 6 includes a bus capacitor 61 and an inductor 62, and the third column of the third component group 6 includes a bus capacitor 61 and a fuse, or a bus capacitor 61 and an electronic control board 63, or a bus capacitor 61, a fuse, and an electronic control board 63. The number of bus capacitors 61, inductors 62, fuses, and electronic control boards 63 is determined according to the design requirements of circuit board 1. The various electrical components are flexibly distributed according to the length of the heat sink group, as well as the number and location requirements of bus capacitors 61, inductors 62, fuses, and electronic control boards 63.

[0147] In some embodiments, see Figure 1 and Figure 2 A fifth device 10 extending in the second direction is provided at the rear end of the second heat sink assembly 22.

[0148] The second direction is the ventilation direction, and the second direction is perpendicular to the first direction.

[0149] Specifically, a fifth device 10 extending in a second direction is provided at the rear end of the second heat sink assembly 22, which may include: a fifth device 10 extending in a second direction being provided at the rear end of the second mounting area 222; and / or, a fifth device 10 extending in a second direction being provided at the rear end of the second heat sink 221.

[0150] The fifth device 10 at the rear end of the second mounting area 222 serves to shield the rear end of the second mounting area 222, blocking the airflow and preventing it from escaping from the rear end of the second mounting area 222. The fifth device 10 at the rear end of the second heat sink 221 has the same function as the third device group 6. It extends along the second direction, which extends the airflow path. After the airflow passes through a single second heat sink 221, it continues to flow backward, preventing the airflow from directly diffusing to the surroundings after passing through the rear half of a single second heat sink 221. This increases the ventilation volume of the rear half of a single second heat sink 221, improves the air-cooling utilization rate, and enhances the heat dissipation effect on the power tubes on the rear half of the second heat sink group 22.

[0151] The fifth device 10 may include at least one of devices such as an electronic control board and a fuse, and may also include any other applicable devices, without specific limitations herein.

[0152] In some possible implementations, if there is still free space at the rear end of the first heat sink assembly 21, a fifth device 10 extending in the second direction can be provided at the rear end of the first heat sink assembly 211. Specifically, a fifth device 10 extending in the second direction can be provided at the rear end of the first mounting area 212; and / or, a fifth device 10 extending in the second direction can be provided at the rear end of the first heat sink 211. The effect achieved is similar to that of the second heat sink assembly 22, and will not be described in detail here.

[0153] In some embodiments, the first device group 4 includes a plurality of power transistors in the first circuit, which are spaced apart on the first heat sink group 21 along a second direction; the heat generation of the plurality of power transistors gradually decreases from the air inlet side to the air outlet side of the mounting area, and the spacing between two adjacent power transistors gradually decreases. Specifically, the plurality of power transistors are all attached to the mounting surface 28 of the first heat sink substrate 23.

[0154] The aforementioned first device group 4 also includes multiple power transistors in the second circuit. These power transistors are also spaced apart on the first heat sink group 21 along the second direction. From the air inlet side to the air outlet side of the mounting area, the heat generation of these power transistors gradually decreases, and the spacing between adjacent power transistors gradually decreases or remains constant. Specifically, these power transistors are all attached to the mounting surface 28 of the first heat sink substrate 23. The power transistors in the first circuit are located at the front of the corresponding first heat sink group 21, and the power transistors in the second circuit are located at the rear of the corresponding first heat sink group 21.

[0155] The aforementioned second device group 5 includes a plurality of power transistors from the first circuit, which are spaced apart on the second heat sink group 22 along a second direction. The heat generation of these power transistors gradually decreases from the air inlet side to the air outlet side of the mounting area, and the spacing between adjacent power transistors also gradually decreases. Specifically, all power transistors are attached to the mounting surface 28 of the first heat sink substrate 23.

[0156] The power transistors in the first device group 4 and the second device group 5 typically refer to high-heat semiconductor power devices, characterized by concentrated heat generation and the need to be in close contact with a heat sink to reduce junction temperature and ensure reliability and lifespan.

[0157] When cool air enters the radiator from the intake side, its temperature is lowest, prioritizing the cooling of the power transistors that generate the most heat, thus preventing them from being derated or failing due to high temperatures. The exhaust side of the radiator has a higher temperature, so power transistors with relatively lower heat generation are preferred to be placed there to avoid heat buildup.

[0158] In addition, among the multiple power transistors, the spacing between the ones closest to the heatsink on the intake side is large, ensuring that the high-heat-generating power transistors have sufficient heat dissipation area and that the airflow fully contacts the heatsink fins. Meanwhile, the power transistors closer to the heatsink exhaust side generate relatively less heat, reducing their heat dissipation requirements and allowing for a compact arrangement, saving circuit board space and achieving a high power density layout within a limited heatsink area.

[0159] The following description uses the example of a rectifier circuit as the first circuit and a charging / discharging circuit as the second circuit. (See also...) Figure 5 This diagram illustrates the circuit structure of an uninterruptible power supply (UPS) according to an embodiment of this application. The UPS may include a rectifier circuit 91, a charging / discharging circuit 92, an inverter circuit 93, a battery pack BAT, a positive bus BUS+, a negative bus BUS-, and a neutral line (N line) N. The neutral line N can also be called the zero line. The rectifier circuit 91 may include rectifier structures corresponding to each phase, which may include phase A, phase B, and phase C.

[0160] The three-phase AC power supply (e.g., mains power) is connected to the positive bus BUS+ and negative bus BUS- through the rectifier circuit 91. The positive bus BUS+ and negative bus BUS- are connected to the load through the inverter circuit 93. The battery pack BAT is connected to the positive bus BUS+ and negative bus BUS- through the charging and discharging circuit 92. The battery pack BAT can also be connected to the positive bus BUS+ and negative bus BUS- through the rectification structure of each phase of the rectifier circuit 91.

[0161] A first capacitor C1, also known as the positive bus capacitor, is connected between the positive bus BUS+ and the neutral bus N; a second capacitor C2, also known as the negative bus capacitor, is connected between the neutral bus N and the negative bus BUS-.

[0162] See Figure 5 The uninterruptible power supply may also include a second fuse F2, a fourth capacitor C4, a fifth inductor L5, a third capacitor C3, a fifth switch K5, a sixth switch K6, a fifth capacitor C5, a ninth switch K9, a sixth inductor L6, a fifth fuse F5, a seventh switch K7, an eighth switch K8, a first SCR (Silicon Controlled Rectifier) ​​S1, a second SCR S2, and a sixth capacitor C6, etc. The connection relationships of these components can be found in [reference needed]. Figure 5 I will not go into details.

[0163] Figure 5 The input IN in the diagram represents any phase of the three-phase AC power supply, such as phase A, phase B, or phase C. The corresponding output O represents that output and is used to connect the load. It should be noted that... Figure 5The diagram only shows the structure of one phase of the rectifier circuit 91 and the inverter circuit 93. In practical applications, phases A, B, and C all have corresponding rectifier and inverter structures.

[0164] When the uninterruptible power supply is in mains power mode, the three-phase AC power supply is converted into DC power through the second fuse F2, filter (fifth inductor L5 and third capacitor C3), fifth switch K5, sixth switch K6 and rectifier circuit 91, and sent to the positive bus BUS+ and negative bus BUS-. The inverter circuit 93 then converts the DC power from the positive bus BUS+ and negative bus BUS- into AC power that meets the load requirements, and supplies power to the load.

[0165] When the uninterruptible power supply is in the mains power state, the positive bus BUS+ and the negative bus BUS- can also charge the battery pack BAT through the charging and discharging circuit 92.

[0166] When the uninterruptible power supply is switching from mains power to battery power, the battery pack BAT discharges, temporarily supplying power to the positive bus BUS+ and negative bus BUS- through the charging and discharging circuit 92, and then supplying power to the load through the inverter circuit 93.

[0167] When the uninterruptible power supply is in battery mode, the battery pack BAT discharges. Through the rectification structures of each phase in the eighth switch K8, the seventh switch K7, and the rectifier circuit 91, the DC voltage is converted into the bus voltage, and then through the inverter circuit 93, it supplies power to the load.

[0168] Among them, see Figure 5 The rectification structure of any phase of the rectifier circuit 91 may include a first diode D1, a second diode D2, a third diode D3, a fourth diode D4, a first switch Q1, a second switch Q2, a third switch Q3, and a fourth switch Q4. For specific connection relationships, please refer to [reference needed]. Figure 5 I will not go into details.

[0169] See Figure 5 The rectification structure of any phase of the rectifier circuit 91 may also include a first inductor L1, a second inductor L2, a first Hall sensor H1 for detecting electrical parameters (e.g., current or voltage) of the branch, and a second Hall sensor H2 for detecting electrical parameters (e.g., current or voltage) of the branch. See [link to specific connection details] for details. Figure 5 I will not go into details.

[0170] It should be noted that, Figure 5The rectifier circuit 91 shown above contains only one of each component. However, in practical applications, different components may be connected in parallel in varying numbers to meet specific requirements. For example, the rectification structure of any phase of the rectifier circuit 91 may include three first diodes D1 connected in parallel, two second diodes D2 connected in parallel, two third diodes D3 connected in parallel, three fourth diodes D4 connected in parallel, three first switching transistors Q1 connected in parallel, three second switching transistors Q2 connected in parallel, three third switching transistors Q3 connected in parallel, and three fourth switching transistors Q4 connected in parallel, and so on. The number of components connected in parallel in the rectifier circuit 91 can be determined according to actual usage requirements and is not specifically limited here.

[0171] See Figure 5 The charging / discharging circuit 92 may include a fifth switch Q5, a sixth switch Q6, and a seventh switch Q7. See [link to circuit diagram] for specific connections. Figure 5 I will not go into details.

[0172] The charging / discharging circuit 92 may further include a first switch K1, a second switch K2, a third switch K3, a fourth switch K4, a third inductor L3, a fourth inductor L4, a third Hall sensor H3 for detecting electrical parameters (e.g., current or voltage) of the branch, and a fourth Hall sensor H4 for detecting electrical parameters (e.g., current or voltage) of the branch. See [link to specific connection details] for details. Figure 5 I will not go into details.

[0173] Same as rectifier circuit 91, Figure 5 The charging / discharging circuit 92 shown above includes only one of each component. However, in practical applications, different components may be connected in parallel in varying numbers to meet specific requirements. For example, the charging / discharging circuit 92 may include four fifth switches Q5, four sixth switches Q6, and four seventh switches Q7 connected in parallel, and so on. The number of components connected in parallel in the charging / discharging circuit 92 can be determined based on actual usage requirements and is not specifically limited here.

[0174] In this context, multiple devices connected in parallel at the same location can perform the same action. For example, the first switch Q1 and the switches connected in parallel with it can turn on and off simultaneously, and so on.

[0175] The charging and discharging circuit 92 can also be used as a balancing bridge circuit between the positive bus BUS+ and the negative bus BUS-. Therefore, the charging and discharging circuit 92 can also be called a charging and discharging and balancing bridge circuit.

[0176] Specifically, the fifth switch Q5 and the seventh switch Q7 can be used as high-frequency tubes for bus balancing, with complementary switching states. The sixth switch Q6 is normally closed, connecting the two balanced bridge inductors (the third inductor L3 and the fourth inductor L4) in parallel.

[0177] When the absolute value of the voltage on the positive bus BUS+ is greater than the absolute value of the voltage on the negative bus BUS- (for example, the voltage on the positive bus BUS+ is +450V, and the voltage on the negative bus BUS- is -350V, indicating bus imbalance), the fifth switch Q5 turns on, and the positive bus BUS+ stores energy for the third inductor L3 and the fourth inductor L4. Afterwards, the fifth switch Q5 turns off, and the seventh switch Q7 turns on, transferring the energy from the third inductor L3 and the fourth inductor L4 to the negative bus BUS-, thus achieving bus balance.

[0178] When the absolute value of the voltage on the positive bus BUS+ is less than the absolute value of the voltage on the negative bus BUS- (for example, the voltage on the positive bus BUS+ is +350V, and the voltage on the negative bus BUS- is -450V, indicating bus imbalance), the seventh switch Q7 is turned on, and the negative bus BUS- stores energy for the third inductor L3 and the fourth inductor L4. Afterwards, the seventh switch Q7 is turned off, and the fifth switch Q5 is turned on, allowing the energy from the third inductor L3 and the fourth inductor L4 to charge the positive bus BUS+, thus achieving bus balance.

[0179] In the rectifier circuit 91 and the charging and discharging circuit 92, the switching transistor and diode are high-heat power devices, and heat sinks are required to dissipate heat for them.

[0180] It should be noted that, Figure 5 The rectifier circuit 91 shown adopts the Vienna topology, but this is only one example of the rectifier circuit 91. In practical applications, the rectifier circuit 91 can also adopt other topologies that can achieve the rectification function, and no specific restrictions are made here.

[0181] The inverter circuit 93 can adopt an I-type three-level topology, a T-type three-level topology, or other types of topologies that can achieve the inverter function. No specific restrictions are imposed here.

[0182] The switch types of the aforementioned first switch K1 to ninth switch K9 can be relays or other types of switches, and no specific restrictions are made here.

[0183] The aforementioned first switch Q1 to seventh switch Q7 can be a MOS transistor (Metal-Oxide-Semiconductor Field-Effect Transistor), an IGBT module (Insulated Gate Bipolar Transistor Module), or other types of switch transistors, without specific restrictions here.

[0184] See Figure 5 The rectifier structure of each phase in the rectifier circuit 91 may include an upper bridge arm and a lower bridge arm. The devices mounted on the heat sink in the upper bridge arm include a first diode D1, a second diode D2, a first switch Q1, a second switch Q2, and their respective parallel power transistors. The devices mounted on the heat sink in the lower bridge arm include a third diode D3, a fourth diode D4, a third switch Q3, a fourth switch Q4, and their respective parallel power transistors.

[0185] As mentioned earlier, the number of heat sink groups on circuit board 1 can be six, with two heat sink groups corresponding to phases A, B, and C respectively. For each phase's two heat sink groups, one heat sink group (referred to as the heat sink group corresponding to the upper bridge arm) is used to house the power transistors in the upper bridge arm of the rectifier structure of that phase, and the other heat sink group (referred to as the heat sink group corresponding to the lower bridge arm) is used to house the power transistors in the lower bridge arm of the rectifier structure of that phase. In the heat sink group corresponding to the upper bridge arm, one heat sink can sequentially house the first diode D1 and its parallel diodes, and the first switch Q1 and its parallel switch from front to back; the other heat sink can sequentially house the second diode D2 and its parallel diodes, and the second switch Q2 and its parallel switch from front to back. In the heat sink assembly corresponding to the lower bridge arm, one heat sink can be equipped with a third diode D3 and its parallel diodes, and a third switch Q3 and its parallel switch from front to back. The other heat sink can be equipped with a fourth diode D4 and its parallel diodes, and a fourth switch Q4 and its parallel switch from front to back.

[0186] In one implementation, on circuit board 1, from left to right or from right to left, along a first direction, the heat sink group corresponding to the upper bridge arm of phase A, the heat sink group corresponding to the lower bridge arm of phase A, the heat sink group corresponding to the upper bridge arm of phase B, the heat sink group corresponding to the lower bridge arm of phase B, the heat sink group corresponding to the upper bridge arm of phase C, and the heat sink group corresponding to the lower bridge arm of phase C can be sequentially arranged.

[0187] However, see Figure 5The power transistors in the upper bridge arm can be considered as those directly connected to the positive busbar BUS+, and can be considered as power transistors at the same potential as the positive busbar BUS+. Similarly, the power transistors in the lower bridge arm can be considered as those directly connected to the negative busbar BUS-, and can be considered as power transistors at the same potential as the negative busbar BUS-. If the power transistor at the same potential as the negative busbar BUS- is located near the positive busbar terminal 31, an isolation strip needs to be installed between the positive busbar terminal 31 and the power transistor at the same potential as the negative busbar BUS- to prevent the positive busbar terminal 31 from directly connecting to the power transistor and causing a malfunction. Likewise, if the power transistor connected to the positive busbar BUS+ is located near the negative busbar terminal 32, an isolation strip needs to be installed between the negative busbar terminal 32 and the power transistor at the same potential as the positive busbar BUS+ to prevent the negative busbar terminal 32 from directly connecting to the power transistor and causing a malfunction. This layout presents such a situation, which undoubtedly increases the manufacturing process and cost.

[0188] Therefore, in order to reduce manufacturing processes and costs, in another implementation, the heat sink group corresponding to the upper bridge arm of each phase is located in the area where the positive bus terminal 31 is located, and the heat sink group corresponding to the lower bridge arm of each phase is located in the area where the negative bus terminal 32 is located.

[0189] In each phase, each power transistor directly connected to the positive bus terminal 31 is contained in the upper bridge arm of that phase, and the distance between the power transistor and the positive bus terminal 31 is less than the distance between the other power transistors in the upper bridge arm of that phase and the positive bus terminal 31; each power transistor directly connected to the negative bus terminal 32 is contained in the lower bridge arm of that phase, and the distance between the power transistor and the negative bus terminal 32 is less than the distance between the other power transistors in the lower bridge arm of that phase and the negative bus terminal 32.

[0190] See Figure 1 and Figure 2 The positive bus terminal 31 can be located in the aforementioned left-hand region (e.g., at the front of the second heatsink group arranged from left to right, with the first heatsink group 21 and the second heatsink group 22 arranged together), and the negative bus terminal 32 can be located in the aforementioned right-hand region (e.g., at the front of the sixth heatsink group arranged from left to right). Alternatively, in practical applications, the positive bus terminal 31 can also be located in the aforementioned right-hand region (e.g., at the front of the second heatsink group arranged from right to left, with the first heatsink group 21 and the second heatsink group 22 arranged together), and the negative bus terminal 32 can be located in the aforementioned left-hand region (e.g., at the front of the sixth heatsink group arranged from right to left), and the negative bus terminal 32 can also be located in the aforementioned left-hand region.

[0191] If the positive bus terminal 31 is located in the left area and the negative bus terminal 32 is located in the right area, then from left to right along the first direction, the heat sink groups corresponding to the upper bridge arm of phase A, the upper bridge arm of phase B, the upper bridge arm of phase C, the lower bridge arm of phase A, the lower bridge arm of phase B, and the lower bridge arm of phase C can be sequentially arranged. If the positive bus terminal 31 is located in the right area and the negative bus terminal 32 is located in the left area, then from right to left along the first direction, the heat sink groups corresponding to the upper bridge arm of phase A, the upper bridge arm of phase B, the upper bridge arm of phase C, the lower bridge arm of phase A, the lower bridge arm of phase B, and the lower bridge arm of phase C can be sequentially arranged. The positions of the heat sink groups corresponding to the upper bridge arm of phase A, phase B, and phase C can be interchanged, as can the positions of the heat sink groups corresponding to the lower bridge arm of phase A, phase B, and phase C. This layout allows for equipotential bonding between the positive bus terminal 31, negative bus terminal 32, and the power transistors, eliminating the need for isolation strips between the positive bus terminal 31 and the power transistors, and between the negative bus terminal 32 and the power transistors. This reduces manufacturing steps and saves costs.

[0192] In both of the above implementation methods, the power transistor in the charging and discharging circuit 92 can be placed at the rear of the two or three heat sink groups in the middle area.

[0193] For example, if the power transistors in the charging and discharging circuit 92 are disposed on two heat sink groups, one heat sink group can be disposed on the fifth switch transistor Q5 and its parallel switch transistors, the other heat sink group can be disposed on the sixth switch transistor Q6 and its parallel switch transistors, and the seventh switch transistor Q7 and its parallel switch transistors can be distributed uniformly or non-uniformly on the two heat sink groups.

[0194] If the power transistors in the charging / discharging circuit 92 are mounted on three heat sink groups, then the first heat sink group can be equipped with the fifth switch transistor Q5 and its parallel switches, the second heat sink group can be equipped with the sixth switch transistor Q6 and its parallel switches, and the third heat sink group can be equipped with the seventh switch transistor Q7 and its parallel switches.

[0195] join Figure 6 Corresponding to the circuit board assembly described above, this application embodiment also provides an electronic device, including a housing 7, a fan assembly 8, and any one of the circuit board assemblies described above. The fan assembly 8 is disposed inside the housing 7; the circuit board assembly is disposed inside the housing 7 and is located behind the fan assembly 8.

[0196] Among them, electronic devices can be power supply devices, such as uninterruptible power supplies, energy storage devices, etc.

[0197] For a detailed description of the electronic device and its beneficial effects, please refer to the relevant descriptions in the aforementioned circuit board assembly section, which will not be repeated here.

[0198] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0199] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A circuit board assembly, characterized in that, include: Circuit board; In addition, at least one first heat sink group and a plurality of second heat sink groups are distributed at intervals along a first direction on the circuit board; each first heat sink group is provided with a first device group, and each second heat sink group is provided with a second device group; the first device group and the second device group are respectively electrically connected to the circuit board; the length of the first heat sink group is greater than the length of the second heat sink group; The power transistors of the first circuit are included in each of the second device groups, and the remaining power transistors of the first circuit are included in each of the first device groups; each of the first device groups also includes power transistors in the second circuit.

2. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes: Multiple third-party device groups are electrically connected to the circuit board, respectively; There is an installation space between each pair of adjacent heat sink groups, and the third device group is provided in each installation space; the two adjacent heat sink groups include two first heat sink groups and two second heat sink groups, or one first heat sink group and one second heat sink group.

3. The circuit board assembly according to claim 1, characterized in that, The number of the first heat sink assembly is two, and the number of the second heat sink assembly is four; Two first heat sink assemblies are spaced apart along the first direction in the middle region of the circuit board; two second heat sink assemblies are spaced apart along the first direction in the left region of the two first heat sink assemblies, and the remaining two second heat sink assemblies are spaced apart along the first direction in the right region of the two first heat sink assemblies.

4. The circuit board assembly according to claim 1, characterized in that, The first heat sink assembly is further provided with a first mounting area extending along the second direction, and the first device assembly is disposed within the first mounting area; The second heat sink assembly is further provided with a second mounting area extending along the second direction, and the second device assembly is disposed within the second mounting area; The second direction is the ventilation direction, and the second direction is perpendicular to the first direction.

5. The circuit board assembly according to claim 4, characterized in that, A fourth device is provided at the front end of the first installation area and the second installation area; the fourth device is used to block the first installation area or the second installation area so that cold air passes through each of the first heat sink group or each of the second heat sink group along the second direction; The fourth device is electrically connected to the circuit board.

6. The circuit board assembly according to claim 5, characterized in that, At least one of the plurality of the fourth devices is a high-frequency capacitor, the high-frequency capacitor being disposed on the circuit board and electrically connected to the circuit board; and / or, At least one of the plurality of the fourth devices is a terminal block; the terminal block is disposed on the circuit board and electrically connected to the circuit board.

7. The circuit board assembly according to claim 4, characterized in that, The first heat sink group includes two first heat sinks arranged side by side along the first direction, the two first heat sinks being arranged in the same direction, and each first heat sink having a first mounting area extending along the second direction; the first device group is mounted in the first mounting area of ​​the two first heat sinks in each first heat sink group. The second heat sink assembly includes two second heat sinks arranged side by side along the first direction, the two second heat sinks being arranged in the same direction, and each second heat sink having a second mounting area extending along the second direction; the second device group is mounted in the second mounting area of ​​the two second heat sinks in each second heat sink assembly.

8. The circuit board assembly according to claim 2, characterized in that, The front end of the third device group protrudes forward relative to the front ends of the first heat sink group and the second heat sink group; the rear end of the third device group extends backward relative to the rear ends of the first heat sink group and the second heat sink group.

9. The circuit board assembly according to any one of claims 1 to 8, characterized in that, A fifth device extending in the second direction is provided at the rear end of the second heat sink assembly; The second direction is the ventilation direction, and the second direction is perpendicular to the first direction.

10. An electronic device, characterized in that, include: case; The fan assembly is housed inside the housing; as well as, The circuit board assembly as described in any one of claims 1 to 9 is disposed within the housing and located behind the fan assembly.

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