A heat dissipation structure for a high-thermal-conductivity copper-aluminum composite material substrate

Abstract

The utility model relates to a heat dissipation technical field discloses a kind of heat dissipation structures for high thermal conductivity copper-aluminum composite material substrate, including first base, second base being stacked above it, heat dissipation mechanism and dismounting mechanism, the bottom surface of second base is fixedly connected with multiple convex points abutting against first base, heat dissipation mechanism includes multiple parallel fins being wavelike, dismounting mechanism is used to detachably fix heat dissipation mechanism in second base, it includes the sliding slot of second base, the sliding block of heat dissipation mechanism bottom and the baffle fixed by bolt, first base and convex point are copper, second base and fin are aluminum.The utility model increases contact area after pressure deformation by setting copper convex point, effectively reduces interface thermal resistance, improves heat conduction efficiency, simultaneously, detachable heat dissipation mechanism greatly facilitates cleaning maintenance, guarantees the heat dissipation stability of long-term use of product.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate. Background Technology

[0002] With the rapid development of electronic technology, high power density components are increasingly widely used. They generate a lot of heat during operation. To ensure the stability and service life of these components, an efficient heat dissipation solution is crucial. High thermal conductivity copper-aluminum composite substrates have become an ideal choice for supporting these components due to their excellent thermal conductivity and structural strength. Equipping them with a heat dissipation structure that matches their performance is the key to ensuring that heat is dissipated in a timely manner.

[0003] In existing heat dissipation technologies, the common practice is to fix a heat sink with multiple heat dissipation fins directly or indirectly onto a heat-generating substrate. Heat is conducted from the substrate to the heat sink and then dissipated through convection heat exchange between the heat dissipation fins and the surrounding air. In this process, the efficiency of heat conduction from the substrate to the heat sink base is the fundamental factor that determines the overall heat dissipation performance.

[0004] However, theoretically efficient heat conduction often encounters bottlenecks in practical applications. Due to limitations in processing precision, even two precision-machined metal surfaces are not absolutely flat at the microscopic level. When the base of the heat sink contacts the heating substrate or the heat conduction seat in the middle, the physical contact between the two actually only occurs at a few raised points, while most of the remaining area is filled with air with extremely poor thermal conductivity. This creates a significant contact thermal resistance between the contact surfaces.

[0005] This inherent contact thermal resistance acts like a barrier in the heat transfer path, greatly hindering the smooth flow of heat. This causes heat to accumulate on the substrate side and cannot be efficiently transferred to the heat dissipation fins. As a result, the overall heat dissipation efficiency of the heat dissipation structure is greatly reduced, and the high thermal conductivity substrate and heat dissipation fins cannot fully perform. This has become a core technical problem restricting the improvement of heat dissipation performance.

[0006] Therefore, this utility model proposes a heat dissipation structure for high thermal conductivity copper-aluminum composite substrates to overcome the shortcomings of the prior art. Utility Model Content

[0007] In view of the problems existing in the heat dissipation structure for high thermal conductivity copper-aluminum composite substrates, such as low heat conduction efficiency due to inherent contact thermal resistance at the contact surfaces of various components, and the difficulty in cleaning dust accumulation on the heat dissipation fins leading to a decline in heat dissipation performance after long-term use, this utility model aims to provide a heat dissipation structure for high thermal conductivity copper-aluminum composite substrates with an improved structure that can effectively solve the above problems.

[0008] This utility model provides a heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate, including a first base, a second base stacked on top of the first base, a heat dissipation mechanism, and a disassembly and assembly mechanism.

[0009] The bottom surface of the second base is fixedly connected with multiple protrusions, which abut against the upper surface of the first base.

[0010] Furthermore, the heat dissipation mechanism includes multiple fins arranged in parallel, with guide grooves formed between adjacent fins. The disassembly and assembly mechanism is used to detachably fix the heat dissipation mechanism to the second base. Specifically, a sliding groove is provided on the upper surface of the second base, and a sliding block is fixedly connected to the bottom of the heat dissipation mechanism and slides within the sliding groove. The disassembly and assembly mechanism also includes a baffle and bolts. The baffle is detachably fixed to the second base by the bolts and abuts against the end of the heat dissipation mechanism along the sliding direction of the sliding groove to limit its movement.

[0011] Preferably, the fins are wavy.

[0012] Preferably, the fins extend along the length of the groove.

[0013] Preferably, the protrusion is a frustum-shaped structure that extends integrally from the bottom surface of the second base.

[0014] Preferably, the plurality of protrusions are arranged in an array on the bottom surface of the second base.

[0015] Preferably, the baffle has a through hole, and the second base has a corresponding threaded hole, and the bolt passes through the through hole and is threadedly connected to the threaded hole.

[0016] Preferably, the first base and the protrusion are made of copper.

[0017] Preferably, the second base and the fins are made of aluminum.

[0018] This utility model has the following beneficial effects: 1. This utility model solves the problem of high contact thermal resistance and low heat conduction efficiency caused by uneven contact surfaces between the components of the heat dissipation base in the prior art by setting copper protrusions on the bottom surface of the second base that abut against the first base. It achieves the technical effect of increasing the effective contact area, reducing the interface thermal resistance, and improving the overall thermal conductivity by deforming the protrusions under pressure.

[0019] 2. This utility model solves the problem that in the prior art, heat dissipation fins are usually fixed and dust is difficult to clean after long-term use, which leads to a serious decline in heat dissipation performance. By setting up a sliding groove, a sliding block, and a detachable limiting structure composed of baffles and bolts, this utility model achieves the technical effect of enabling the heat dissipation mechanism to be quickly disassembled and installed, greatly facilitating the user's cleaning and maintenance, and ensuring the heat dissipation stability of the product under long-term use.

[0020] 3. This utility model solves the problem that a stable thermal boundary layer easily forms around ordinary flat fins in the prior art, which limits the convective heat transfer efficiency, by designing the fins of the heat dissipation mechanism as wavy and forming guide grooves between the fins. It achieves the technical effect of effectively disturbing the airflow, destroying the thermal boundary layer, and guiding the airflow smoothly, thereby enhancing convective heat transfer and further improving heat dissipation efficiency. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of a heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate proposed in this utility model. Figure 2 This is a schematic diagram of the protrusion portion of a heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate proposed in this utility model. Figure 3 This is a schematic diagram of the second base portion of a heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate proposed in this utility model. Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0022] Legend: 1. First base; 2. Second base; 3. Heat dissipation mechanism; 301. Fins; 302. Airflow channel; 303. Protrusion; 4. Disassembly and assembly mechanism; 401. Baffle; 402. Bolt; 403. Slide groove. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0024] Example: Please refer to Figures 1 to 4This utility model provides a heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate, which aims to solve the problems in the prior art where the heat dissipation structure has a large contact thermal resistance between the components, resulting in low thermal conductivity, and the fins 301 are difficult to clean after dust accumulation, leading to a decline in heat dissipation performance after long-term use.

[0025] like Figure 1 and Figure 3 As shown, the overall frame of the heat dissipation structure is composed of a first base 1, which serves as the heat conduction base, and a second base 2 stacked on top of it. The first base 1 is in direct contact with the external heat-generating substrate to quickly absorb initial heat. The second base 2 carries the main heat dissipation components. In the assembled state, the second base 2 forms a tight heat transfer contact with the upper surface of the first base 1 through multiple protrusions 303 integrally formed on its bottom surface. As a preferred embodiment, these protrusions 303 are frustum-shaped structures that extend integrally from the bottom surface of the second base 2. In order to ensure uniform pressure distribution and heat transfer stability, they are arranged in an array on the bottom surface of the second base 2. In order to optimize the heat conduction path to the extreme, the first base 1, which is in direct contact with the heat source, and the protrusions 303, which are key heat transfer interfaces, are both made of copper material with excellent thermal conductivity, while the main body of the second base 2 is made of lightweight aluminum material.

[0026] Above the second base 2, a heat dissipation mechanism 3 is installed to ultimately dissipate heat into the air, such as... Figure 1 and Figure 2 As shown, the main body of the heat dissipation mechanism 3 is composed of multiple parallel fins 301. These fins 301 naturally form a guide groove 302 for guiding airflow. The fins 301 in the heat dissipation mechanism 3 are also made of aluminum to achieve good heat dissipation. The connection between the heat dissipation mechanism 3 and the second base 2 is not permanently fixed, but is detachable through a specially designed disassembly and assembly mechanism 4.

[0027] To facilitate the easy assembly and disassembly of the heat dissipation mechanism 3 and the second base 2, the core of the technical solution in this embodiment lies in the specific structure of the assembly and disassembly mechanism 4. Furthermore, the assembly and disassembly mechanism 4 forms a specific structural fit and connection relationship with the aforementioned second base 2 and heat dissipation mechanism 3.

[0028] Please refer to the following carefully. Figure 1 , Figure 3 and Figure 4The guiding and cooperating structure of the disassembly and assembly mechanism 4 is basically set on the upper surface of the second base 2. Specifically, a sliding groove 403 is integrally opened along its length direction. At the same time, a sliding block that matches the shape and size of the sliding groove 403 is fixedly connected to the bottom of the heat dissipation mechanism 3. During assembly, the sliding block of the heat dissipation mechanism 3 can smoothly slide and cooperate in the sliding groove 403 of the second base 2. This sliding cooperation structure provides precise guidance and limit for the installation and disassembly of the heat dissipation mechanism 3, ensuring the stability and alignment accuracy of the two. As a specific implementation method, multiple fins 301 extend along the length direction of the sliding groove 403, so that the airflow direction is consistent with the disassembly and assembly direction.

[0029] To reliably lock and fix the heat dissipation mechanism 3 in place, the disassembly and assembly mechanism 4 also includes a baffle 401 as a limiting component and a bolt 402 as a fastener. The baffle 401 abuts against the end of the heat dissipation mechanism 3 along the sliding direction of the slide groove 403 to prevent it from accidentally sliding out. The baffle 401 is detachably fixedly connected to the second base 2 by the bolt 402. In a specific connection structure, the baffle 401 is provided with a through hole, and the second base 2 is provided with a corresponding threaded hole. During installation, the bolt 402 passes through the through hole of the baffle 401 and is threadedly connected to the threaded hole of the second base 2, thereby firmly pressing the baffle 401 onto the second base 2, and thus securely locking the heat dissipation mechanism 3 in the working position.

[0030] As a preferred implementation method, to further enhance convective heat transfer efficiency, please refer to... Figure 2 The fins 301 of the heat dissipation mechanism 3 are designed in a specific wave shape. This wave-shaped profile can effectively disrupt the air layer flowing through the surface of the fins 301, promoting more full contact and exchange between the cold air and the hot surface.

[0031] As another preferred embodiment, in order to ensure heat conduction efficiency while taking into account the lightweight and cost-effectiveness of the structure, the different components in the heat dissipation structure adopt an optimized material combination. Specifically, the first base 1, which directly bears the heat, and the protrusion 303, which is a key heat transfer node, are both made of copper material with extremely high thermal conductivity, while the second base 2, which occupies the main volume and weight, and the fins 301 of the heat dissipation mechanism 3 are made of aluminum material with good thermal conductivity and low density.

[0032] The working principle of this utility model for a heat dissipation structure used in a high thermal conductivity copper-aluminum composite substrate is as follows: When the high thermal conductivity copper-aluminum composite substrate generates heat during operation, the heat is first transferred to the first base 1 through thermal conduction, and then transferred to the body of the second base 2 through the protrusions 303 on the bottom surface of the second base 2. During this process, due to the installation pressure generated by the tight fit between the first base 1 and the substrate, the copper protrusions 303 are compressed and flattened. This deformation greatly increases the effective physical contact area between the first base 1 and the second base 2, thereby significantly reducing the contact thermal resistance between the interfaces and ensuring that the heat can be conducted efficiently and smoothly.

[0033] After reaching the second base 2, the heat quickly diffuses to the heat dissipation mechanism 3 installed above it, and is dissipated to the surrounding air through multiple fins 301 of the heat dissipation mechanism 3. The unique wave-shaped structure of the fins 301 can continuously disturb the airflow when the air flows through it, effectively destroying the thermal boundary layer that hinders heat exchange. At the same time, the guide grooves 302 formed between the fins 301 provide a smooth channel for the airflow, enhance the heat exchange efficiency between the air and the fins 301, and accelerate the process of heat being carried away by the flowing air.

[0034] When the heat dissipation mechanism 3 needs to be cleaned and maintained, its disassembly and assembly process is as follows: First, loosen the bolt 402 and remove the baffle 401 used for limiting. Then, the sliding block at the bottom of the heat dissipation mechanism 3 can easily slide out along the sliding groove 403 on the upper surface of the second base 2, realizing the quick separation of the heat dissipation mechanism 3 from the second base 2. The installation process is the reverse operation. This convenient disassembly and assembly mechanism 4 design avoids the problem of poor heat dissipation caused by dust accumulation on the fins 301 after long-term use.

[0035] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate, comprising a first base (1) and a second base (2) stacked on top of the first base (1), characterized in that, Also includes: The heat dissipation mechanism (3) includes a plurality of fins (301) arranged in parallel, and a guide groove (302) is formed between adjacent fins (301). The disassembly and assembly mechanism (4) is used to detachably fix the heat dissipation mechanism (3) to the second base (2); The bottom surface of the second base (2) is fixedly connected with a plurality of protrusions (303), and the protrusions (303) abut against the upper surface of the first base (1); The disassembly and assembly mechanism (4) includes a groove (403), a baffle (401), and a bolt (402) on the upper surface of the second base (2). A sliding block is fixedly connected to the bottom of the heat dissipation mechanism (3). The sliding block is slidably fitted in the groove (403). The baffle (401) is detachably fixed to the second base (2) by the bolt (402) and abuts against the end of the heat dissipation mechanism (3) along the sliding direction of the groove (403) to limit its movement.

2. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1, characterized in that, The fin (301) is wavy.

3. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1, characterized in that, The fin (301) extends along the length direction of the groove (403).

4. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1, characterized in that, The protrusion (303) is a frustum-shaped structure that extends integrally from the bottom surface of the second base (2).

5. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1 or 4, characterized in that, The plurality of protrusions (303) are arranged in an array on the bottom surface of the second base (2).

6. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1, characterized in that, The baffle (401) has a through hole, and the second base (2) has a corresponding threaded hole. The bolt (402) passes through the through hole and is threadedly connected to the threaded hole.

7. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1, characterized in that, The first base (1) and the protrusion (303) are made of copper.

8. The heat dissipation structure for a high thermal conductivity copper-aluminum composite substrate according to claim 1, characterized in that, The second base (2) and the fin (301) are made of aluminum.

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