High and low voltage separate control mainboard sealing structure
Patent Information
- Application Number
- CN202522254773.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-24
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-10-24
AI Technical Summary
当前行业内普遍散热调节多依赖壳体上预设的固定散热孔或外置散热风扇,但是主板在不同工况下的散热需求存在差异,如设备满载运行时高压模块发热量大,需增大散热面积,轻载运行时则需减少散热面积以避免灰尘、湿气通过散热槽侵入,现有密封结构的散热槽多为固定尺寸设计,无法根据实际工况调节散热面积,难以兼顾不同工况下的散热需求与密封防护效果
1、本实用新型的L形挡板通过插槽集成在安装架上,兼顾散热灵活调节与便捷维护,转动手拧螺母即可驱动L形挡板上下移动,根据主板不同工况精准调整散热槽遮挡面积,既能在高压模块发热量大时增大散热面积、加速排热,又能在需防灰尘湿气侵入时减小散热面积、强化密封。且L形挡板和安装架为一体结构,安装架拆卸时L形挡板一并取出,大幅简化挡板清洁流程,减少维护时间与操作难度,同时保障散热与密封动态平衡,让主板在复杂环境下稳定运行;
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Figure CN224775238U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of separately controlled motherboard sealing technology, and in particular to a separately controlled motherboard sealing structure for high and low pressure. Background Technology
[0002] In fields such as industrial control, new energy equipment, and intelligent power equipment, high- and low-voltage separate control motherboards are core components for achieving precise control and safe operation of equipment. These motherboards mainly consist of two parts: a high-voltage circuit module and a low-voltage circuit module. The high-voltage circuit module is responsible for processing high-voltage, high-current signals, such as power input, power conversion, and high-voltage load driving, and must be able to withstand high-voltage surges and resist electromagnetic interference. The low-voltage circuit module undertakes signal acquisition, logic control, and data transmission functions, and includes precision components such as microprocessors, sensor interfaces, and communication modules, requiring extremely high cleanliness and stability of the working environment. In practical applications, high- and low-voltage separate control motherboards use physical partitioning to isolate high-voltage and low-voltage circuits on the board, preventing electromagnetic interference from high-voltage circuits from affecting low-voltage circuits and reducing the risk of high-voltage circuit failures impacting the low-voltage control section. To ensure stable operation of the motherboard under complex conditions, it is typically equipped with a sealed structure, encasing the entire motherboard or specific areas within a housing to provide dustproof, waterproof, and foreign object intrusion protection. This ensures that both high- and low-voltage circuit modules can operate reliably in their respective suitable environments, making it a key component for ensuring long-term stable operation of industrial and new energy equipment. Currently, most heat dissipation adjustments in the industry rely on pre-installed fixed heat dissipation holes on the casing or external cooling fans. However, the heat dissipation requirements of motherboards vary under different operating conditions. For example, when the equipment is running at full load, the high-voltage module generates a lot of heat, requiring an increased heat dissipation area. When running at light load, the heat dissipation area needs to be reduced to prevent dust and moisture from entering through the heat dissipation slots. Existing sealed heat dissipation slots are mostly designed with fixed dimensions, making it impossible to adjust the heat dissipation area according to actual operating conditions, and making it difficult to balance the heat dissipation requirements and sealing protection effects under different operating conditions. Utility Model Content
[0003] The purpose of this utility model is to address the shortcomings of existing technologies by proposing a high- and low-pressure separately controlled motherboard sealing structure.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: a high and low voltage separately controlled motherboard sealing structure, including a first outer shell, a second outer shell, and a motherboard body. The motherboard body is located between the first outer shell and the second outer shell. Positioning holes are provided at the four corners of the first outer shell and the second outer shell. Multiple heat dissipation slots are symmetrically provided through both sides of the first outer shell. Mounting brackets are provided on both sides of the first outer shell and the second outer shell. Both sides of the mounting bracket are slidably provided with movable plates. Limiting rods are fixedly installed on the inner sides of the mounting bracket and the movable plates. The limiting rods are adapted to the diameter of the positioning holes. Rectangular slots are opened through both sides of the outer shell. Slots are opened through the middle of both mounting brackets. An L-shaped baffle is inserted into the inside of the slot. One side surface of the L-shaped baffle is in contact with the inner side of the heat dissipation groove. An adjusting screw is rotatably installed in the middle of the inner side of the L-shaped baffle. The other end of the adjusting screw extends through to the outside of the mounting bracket and is fixedly installed with a hand-tightening nut.
[0005] Preferably, the through connection between the second adjusting screw and the mounting bracket is a threaded connection, and the end of the L-shaped baffle away from the second adjusting screw has a protruding structure and is located on the outside of the slot.
[0006] Preferably, the mounting bracket has sliding grooves on both sides, and the ends of the two movable plates are fixedly installed with slide bars, and the movable plates are slidably installed inside the sliding grooves via the slide bars.
[0007] Preferably, each of the two slide bars is rotatably mounted with an adjusting screw on the side away from the movable plate, and both adjusting screws extend through to the outside of the mounting bracket.
[0008] Preferably, the mounting bracket has through screw holes on both sides, one end of the screw hole is connected to the inside of the slide groove, one adjusting screw is threaded into the inside of the screw hole, and one adjusting screw is fixedly connected to a nut on the side away from the slide bar.
[0009] Preferably, the second outer shell has a circumferentially formed assembly groove at one end near the first outer shell, and a positioning block is fixedly installed at the end of the first outer shell. The first outer shell is inserted and installed on the inner side of the second outer shell through the positioning block.
[0010] Preferably, a placement groove is provided on one inner end of the second outer casing, and one end of the main board body is located inside the placement groove. Two holes are provided inside the second outer casing near the placement groove, and rotating rods are rotatably installed inside the two holes.
[0011] Preferably, a cam is fixedly installed at the end of the rotating rod, and a torsion spring is sleeved on the outer side of the rotating rod, with one end of the torsion spring fixed to the surface of the rotating rod and the other end fixed to the inner wall of the slot.
[0012] In summary, this utility model has the following beneficial effects: 1. The L-shaped baffle of this utility model is integrated into the mounting bracket via a slot, balancing flexible heat dissipation adjustment and convenient maintenance. Turning the hand-tightening nut drives the L-shaped baffle to move up and down, precisely adjusting the shading area of the heat sink according to different motherboard operating conditions. This allows for increased heat dissipation area and accelerated heat removal when the high-voltage module generates significant heat, and reduced heat dissipation area and enhanced sealing when dust and moisture intrusion are required. Furthermore, the L-shaped baffle and mounting bracket are an integrated structure; the L-shaped baffle can be removed together with the mounting bracket, significantly simplifying the baffle cleaning process, reducing maintenance time and operational difficulty, while ensuring a dynamic balance between heat dissipation and sealing, allowing the motherboard to operate stably in complex environments. 2. This utility model utilizes an adjusting screw to drive a movable plate, significantly improving the efficiency of housing assembly and disassembly while enhancing sealing. During housing docking, after initial positioning by the positioning block and assembly groove, and pre-fixation by the limiting rod, rotating the adjusting screw pushes the movable plate to move, generating a uniform clamping force on the housing. During disassembly, rotating the screw in the opposite direction quickly separates the housing, eliminating the need for step-by-step operations or multiple tools, thus greatly shortening assembly and disassembly time. Simultaneously, the clamping force driven by the adjusting screw ensures a tight fit between the housing mating surfaces, and combined with the positioning structure, it blocks gaps, effectively preventing dust and moisture intrusion and avoiding environmental impact on the low-voltage circuit module. This improves maintenance convenience, strengthens sealing protection, and ensures long-term reliable operation of the mainboard. 3. This utility model achieves convenient disassembly and secure positioning of the motherboard within the housing through a placement slot and cam limiting structure. When the motherboard is installed, the cam presses against the motherboard under the action of the torsion spring, ensuring that the motherboard does not shake during equipment operation. When disassembling, simply rotate the cam to overcome the torsion spring force to release the limiting position and directly remove the motherboard from the placement slot. This avoids the inefficiency of traditional screw fixing methods, significantly reduces the difficulty of motherboard inspection and replacement, and reduces maintenance time and costs. Attached Figure Description
[0013] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the overall exploded structure of this utility model; Figure 3 This is an exploded view of the inner side of the outer shell and the inside of the slots of this utility model; Figure 4 This is a cross-sectional view of one end of the mounting bracket and a schematic diagram of the separation structure of this utility model; Figure 5 This is a schematic diagram of the overall central cross-sectional structure of this utility model.
[0014] Figure label: 1. Outer shell one; 101. Outer shell two; 102. Assembly slot; 103. Positioning block; 104. Heat dissipation slot; 2. Motherboard itself; 3. Positioning holes; 4. Placement slot; 401. Hole slot; 402. Rotating rod; 403. Cam; 404. Torsion spring; 5. Mounting bracket; 501. Slide groove; 502. Limiting rod; 503. Screw hole; 6. Movable plate; 601. Slide bar; 602. Adjusting screw one; 7. Rectangular groove; 8. Slot; 801. L-shaped baffle; 802. Adjusting screw two; 803. Hand-tightening nut. Detailed Implementation
[0015] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.
[0016] The specific embodiments of this utility model are described below with reference to the accompanying drawings: Example: Reference Figures 1-5 The high and low voltage separately controlled motherboard sealing structure includes a first outer shell 1, a second outer shell 101 and a motherboard body 2. The motherboard body 2 is located between the first outer shell 1 and the second outer shell 101. Positioning holes 3 are provided at the four corners of the first outer shell 1 and the second outer shell 101. Multiple heat dissipation slots 104 are symmetrically provided through both sides of the first outer shell 1. Mounting brackets 5 are provided on both sides of the first outer shell 1 and the second outer shell 101. Movable plates 6 are slidably provided on both sides of the mounting bracket 5. Limiting rods 502 are fixedly installed on the inner side of the mounting bracket 5 and the movable plates 6. The limiting rods 502 are adapted to the diameter of the positioning holes 3. Rectangular slots 7 are opened through both sides of the outer shell 1. Slots 8 are opened through the middle of the two mounting brackets 5. An L-shaped baffle 801 is inserted into the inside of the slot 8. One side surface of the L-shaped baffle 801 is in contact with the inner side of the heat dissipation groove 104. An adjusting screw 802 is rotatably installed in the middle of the inner side of the L-shaped baffle 801. The other end of the adjusting screw 802 extends through to the outside of the mounting bracket 5 and is fixedly installed with a hand-tightening nut 803.
[0017] Specifically: In actual use, the outer shell 1 and the outer shell 2 101 together form a sealed protective space for the motherboard body 2. By wrapping the motherboard body 2, dustproof and waterproof effects are achieved. At the same time, the heat dissipation groove 104 opened in the outer shell 1 provides a channel for heat dissipation inside the shell. The mounting bracket 5 is set as the mounting carrier for the movable plate 6 and the L-shaped baffle 801. Through cooperation with the shell, the two shells are stably connected. The movable plate 6 is set to form a clamping structure for the shell by adapting the inner limiting rod 502 to the positioning hole 3. The sliding characteristics allow it to adjust the clamping position according to the shell size, ensuring that the limiting rod 502 is stably inserted into the positioning hole 3. The L-shaped baffle 801 adjusts the shading area of the heat sink 104 by fitting against the inner side of the heat sink 104. The plug-in installation method allows it to be disassembled along with the mounting bracket 5 for easy maintenance. The adjustment screw 802 and the hand-tightening nut 803 constitute the driving component of the L-shaped baffle 801. The hand-tightening nut 803 allows the operator to apply force, while the threaded engagement of the adjustment screw 802 converts the rotational motion into the up-and-down linear motion of the L-shaped baffle 801, providing power for adjusting the shading area of the heat sink 104.
[0018] By attaching the mounting bracket 5 to both sides of the housing, the limiting rod 502 is inserted into the positioning hole 3 to complete the pre-fixation. Rotating the adjusting screw 602 drives the movable plate 6 to slide, which, together with the mounting bracket 5, forms a clamping force on the housing to achieve a sealed connection. When adjusting the heat dissipation, rotating the hand-tightening nut 803 drives the adjusting screw 802 to rotate, which drives the L-shaped baffle 801 to move up and down along the slot 8, adjusting the contact area with the heat dissipation groove 104 to achieve a dynamic balance between heat dissipation and sealing. The overall structure, through the coordinated cooperation of various components, takes into account the reliability of sealing, the adjustability of heat dissipation, and the convenience of maintenance.
[0019] The connection between the adjusting screw 802 and the mounting bracket 5 is a threaded connection. The L-shaped baffle 801 has a raised structure on the side away from the adjusting screw 802 and is located on the outside of the slot 8. The mounting bracket 5 has sliding grooves 501 on both sides. The ends of the two movable plates 6 are fixedly installed with slide bars 601. The movable plates 6 are slidably installed in the sliding grooves 501 through the slide bars 601. The two slide bars 601 are rotatably installed with adjusting screws 602 on the side away from the movable plates 6. The two adjusting screws 602 extend through to the outside of the mounting bracket 5. The mounting bracket 5 has screw holes 503 on both sides. One end of the screw hole 503 is connected to the inside of the sliding groove 501. The adjusting screws 602 are threaded into the screw hole 503. The side of the adjusting screws 602 away from the slide bars 601 is fixedly connected with a nut. Specifically: In actual use, the setting of the slide groove 501 clearly defines the sliding path of the slide bar 601, preventing the slide bar 601 from deviating during sliding. At the same time, the compatibility between the slide groove 501 and the slide bar 601 ensures the smoothness of the sliding process of the movable plate 6, adapting to the assembly requirements of the housing. The slide bar 601 is set as the connecting link between the movable plate 6 and the adjusting screw 602. One end is fixed to the movable plate 6, and the other end is rotatably connected to the adjusting screw 602. It not only transmits the driving force of the adjusting screw 602, but also prevents the movable plate 6 from rotating synchronously with the adjusting screw 602, ensuring that the movable plate 6 only slides in a straight line.
[0020] The adjusting screw 602 is configured to engage with the screw hole 503 of the mounting bracket 5, converting the rotational force applied by the operator into a linear force that pushes the slide bar 601 to slide. The screw hole 503 is adapted to the thread of the adjusting screw 602, providing a stable installation and transmission foundation for the adjusting screw 602. Furthermore, the design of the screw hole 503 being connected to the inside of the slide groove 501 ensures that the adjusting screw 602 can directly act on the slide bar 601, achieving efficient power transmission.
[0021] By rotating the nut at the end of the adjusting screw 602, the adjusting screw 602 rotates in the screw hole 503 and pushes the slide bar 601 to slide along the slide groove 501. The slide bar 601 drives the movable plate 6 to move closer to the shell, so that the limiting rod 502 on the inner side of the movable plate 6 is accurately inserted into the positioning hole 3 of the shell. Together with the limiting rod 502 of the mounting bracket 5, a bidirectional clamping is formed on the shell, realizing a stable connection between the outer shell 1 and the outer shell 2 101. The overall structure, through the coordinated transmission of each component, not only ensures the reliability of the shell clamping, but also simplifies the operation process of shell disassembly and assembly.
[0022] The outer casing 101 has a circumferentially formed assembly groove 102 near the outer casing 1. The end of the outer casing 1 is fixedly installed with a positioning block 103. The outer casing 1 is inserted and installed on the inner side of the outer casing 101 through the positioning block 103. The inner side of the outer casing 101 has a placement groove 4. One end of the main board body 2 is located inside the placement groove 4. The inner side of the outer casing 101 near the placement groove 4 has two holes 401. A rotating rod 402 is rotatably installed inside the two holes 401. A cam 403 is fixedly installed at the end of the rotating rod 402. A torsion spring 404 is sleeved on the outer side of the rotating rod 402. One end of the torsion spring 404 is fixed to the surface of the rotating rod 402 and the other end is fixed to the inner wall of the hole 401.
[0023] Specifically: In actual use, the circumferential mounting groove 102 at the end of the second outer shell 101 forms a precise insertion fit with the positioning block 103 at the end of the first outer shell 1, providing a positioning reference for the docking of the first outer shell 1 and the second outer shell 101, avoiding misalignment during docking. At the same time, the circumferential layout can make the docking surfaces of the two shells fit evenly. The positioning block 103, through its insertion fit with the mounting groove 102, directly limits the relative position of the first outer shell 1 and the second outer shell 101, ensuring that the motherboard body 2 can be precisely wrapped between the two shells, preventing the shells from shifting and squeezing the motherboard.
[0024] The inner side of the outer casing 101 houses the slot 4, which provides installation space for the motherboard body 2, clearly defining the motherboard's assembly position and preventing it from wobbling freely within the casing. It also provides support to the motherboard's ends, reducing deformation caused by its own weight. The rotating rod 402 serves as the rotational support for the cam 403, connecting the cam 403 and the torsion spring 404 in series. This ensures the cam 403 can rotate stably around a fixed axis. The cam 403, utilizing its asymmetrical profile, can tightly press against the motherboard surface under the force of the torsion spring 404, achieving physical limitation of the motherboard. During rotation, it can quickly disengage from the motherboard, providing a convenient operating point for motherboard removal. The torsion spring 404 provides continuous elastic driving force to the rotating rod 402 and the cam 403, keeping the cam 403 in a fixed, limited position against the motherboard without the need for additional fasteners. Its deformable nature allows operators to release the limitation by rotating the cam 403 with external force, balancing limitation reliability and operational convenience.
[0025] By placing one end of the motherboard into the placement slot 4 to complete the initial positioning, the positioning block 103 and the assembly slot 102 are connected to achieve precise docking of the outer shell 1 and the outer shell 2 101. The torsion spring 404 drives the rotating rod 402 to drive the cam 403 to press against the motherboard to form a secondary limit, which not only ensures the installation stability of the motherboard in the shell, but also simplifies the operation steps of shell docking and motherboard disassembly and assembly.
[0026] It should be noted that: a connector groove is provided on the side of the motherboard body 2 away from the placement groove 4, and a slot adapted to the size of the connector groove is reserved at the mating edge of the outer shell 1 and the outer shell 2 101; during the assembly process, after one end of the motherboard body 2 is inserted into the placement groove 4 inside the outer shell 2 101 to complete the initial positioning, the end of the motherboard body 2 away from the placement groove 4 will be simultaneously fitted into the reserved slot formed by the mating of the outer shell 1 and the outer shell 2 101, so that the motherboard body 2 forms a two-end support structure of "one end supported by the placement groove 4 and the other end fitted into the reserved slot".
[0027] On the one hand, it can limit the entire length of the motherboard body 2, preventing the motherboard from shifting, tilting or moving up and down due to vibration during operation. On the other hand, the tight fit between the end of the motherboard body 2 and the reserved slot can seal the gap of the shell mating surface, blocking some dust and moisture from entering the shell from the mating gap between the outer shell 1 and the outer shell 2 101.
[0028] The working principle of this utility model is as follows: In specific use, the two cams 403 are first rotated to one side, and then one end of the main board body 2 is placed into the placement groove 4 inside the outer shell 2 101. After the main board is completely placed in the placement groove 4, the cams 403 are released to allow the torsion spring 404 to restore its elastic deformation, which drives the rotating rod 402 to rotate in the opposite direction, thereby causing the cams 403 to reset and tightly press against the surface of the main board, realizing the initial positioning of the main board in the outer shell 2 101 and preventing the main board from shifting in subsequent operations.
[0029] Then, align the positioning block 103 at the end of the outer shell 1 with the assembly groove 102 of the outer shell 2 101 and insert it to make the outer shell 1 and the outer shell 2 101 precisely dock. At this time, the main body 2 is completely wrapped between the two shells. Next, attach the mounting brackets 5 on both sides to the outer wall of the shell, so that the mounting brackets 5 and the limiting rods 502 on the inner side of the movable plate 6 are inserted into the positioning holes 3 at the four corners of the shell, completing the pre-fixation of the shell and the mounting brackets 5. Then, rotate the adjusting screws 602 on both sides of the mounting brackets 5. The adjusting screws 602 are pushed along the screw holes 503 and push the slide bar 601 to slide along the slide groove 501. The slide bar 601 drives the movable plate 6 to move towards the shell until the movable plate 6 and the mounting bracket 5 cooperate to generate a uniform clamping force on the two shells, realizing a stable and sealed connection between the outer shell 1 and the outer shell 2 101, blocking the intrusion channel of dust and moisture at the shell docking gap.
[0030] During equipment operation, when the high-voltage module of the main board generates a lot of heat, the hand-tightening nut 803 in the middle of the mounting bracket 5 is rotated clockwise. The hand-tightening nut 803 drives the adjusting screw 802 to rotate. The adjusting screw 802 drives the L-shaped baffle 801 to move downward along the slot 8 through the threaded engagement with the mounting bracket 5, reducing the area of the L-shaped baffle 801 blocking the heat dissipation slot 104, increasing the heat dissipation channel, and accelerating the heat dissipation from the housing. When the equipment is operating under light load or in a humid or dusty environment, the hand-tightening nut 803 is rotated counterclockwise, causing the adjusting screw 802 to rotate in the opposite direction, so that the L-shaped baffle 801 moves upward along the slot 8, increasing the area of the heat dissipation slot 104 blocking the heat dissipation slot 104, reducing the amount of external dust and moisture entering the housing through the heat dissipation slot 104, and ensuring a clean operating environment for the low-voltage circuit module.
[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A high- and low-pressure separately controlled mainboard sealing structure, comprising a first outer shell (1), a second outer shell (101), and a mainboard body (2), characterized in that: The main body (2) is located between the first shell (1) and the second shell (101). The first shell (1) and the second shell (101) are provided with positioning holes (3) at the four corners. The first shell (1) is provided with multiple heat dissipation slots (104) symmetrically through both sides. The first shell (1) and the second shell (101) are provided with mounting brackets (5) on both sides. Movable plates (6) are slidably provided on both sides of the mounting bracket (5). Limiting rods (502) are fixedly installed on the inner side of the mounting bracket (5) and the movable plates (6). The limiting rods (502) are adapted to the diameter of the positioning holes (3). Rectangular slots (7) are opened through both sides of the outer shell (1). Slots (8) are opened through the middle of the two mounting brackets (5). An L-shaped baffle (801) is inserted into the slot (8). One side surface of the L-shaped baffle (801) is in contact with the inner side of the heat dissipation groove (104). An adjusting screw (802) is rotatably installed in the middle of the inner side of the L-shaped baffle (801). The other end of the adjusting screw (802) extends through to the outside of the mounting bracket (5) and is fixedly installed with a hand-tightening nut (803).
2. The high-low voltage split control type mainboard sealing structure according to claim 1, characterized in that: The through connection between the second adjusting screw (802) and the mounting bracket (5) is a threaded connection. The end of the L-shaped baffle (801) away from the second adjusting screw (802) is a protruding structure and is located on the outside of the slot (8).
3. The high-low voltage split control mainboard sealing structure according to claim 1, characterized in that: The mounting bracket (5) has sliding grooves (501) on both sides, and the ends of the two movable plates (6) are fixedly installed with slide bars (601). The movable plates (6) are slidably installed inside the sliding grooves (501) through the slide bars (601).
4. The high and low pressure separately controlled mainboard sealing structure according to claim 3, characterized in that: Each of the two slide bars (601) is rotatably mounted with an adjusting screw (602) on the side away from the movable plate (6), and both adjusting screws (602) extend through to the outside of the mounting bracket (5).
5. The high-low voltage split control mainboard sealing structure according to claim 4, characterized in that: The mounting bracket (5) has screw holes (503) through both sides. One end of the screw hole (503) is connected to the inside of the slide groove (501). The adjusting screw (602) is threaded into the screw hole (503). A nut is fixedly connected to the side of the adjusting screw (602) away from the slide bar (601).
6. The high-low voltage split control mainboard sealing structure according to claim 1, characterized in that: The second outer shell (101) has an assembly groove (102) circumferentially opened at one end near the first outer shell (1). A positioning block (103) is fixedly installed at the end of the first outer shell (1). The first outer shell (1) is inserted and installed on the inner side of the second outer shell (101) through the positioning block (103).
7. The high-low voltage split control mainboard sealing structure according to claim 1, characterized in that: The inner side of the second outer shell (101) is provided with a placement groove (4), and one end of the main body (2) is located inside the placement groove (4). The inner side of the second outer shell (101) near the placement groove (4) has two holes (401), and a rotating rod (402) is rotatably installed inside the two holes (401).
8. The high-low voltage split control mainboard sealing structure according to claim 7, characterized in that: A cam (403) is fixedly installed at the end of the rotating rod (402), and a torsion spring (404) is sleeved on the outside of the rotating rod (402). One end of the torsion spring (404) is fixed to the surface of the rotating rod (402), and the other end is fixed to the inner wall of the slot (401).