A high-efficiency heat dissipating light source device

Abstract

The utility model discloses provide a kind of high-efficiency heat dissipation light source equipment, including cabinet, the inside of the cabinet is provided with light source device, the inside of the cabinet is provided with first isolation aluminum plate and second isolation aluminum block, the first isolation aluminum block is set in the bottom of the light source device, the second isolation aluminum block is set in the side of the first isolation aluminum block, the sidewall of the light source device, first isolation aluminum block, second isolation aluminum block and the inner wall of cabinet form an independent installation space, the inside of the installation space is provided with electric control element, the bottom of the light source device is provided with first heat dissipation system, the bottom of the installation space is provided with second heat dissipation system.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation systems for light source devices, and in particular to a high-efficiency heat dissipation light source device. Background Technology

[0002] Currently, industrial production equipment has increasingly higher requirements for the spectrum of light sources, such as the calibration of multispectral ambient light sensors, the solidification of optical calibration parameters of camera modules, and the image quality assessment of sensors, cameras, and camera lights. The light sources required for these purposes need to be implemented with a large number of LEDs, which will generate a lot of heat during operation. In addition, the circuit boards and power supplies inside the equipment will also generate heat, so a heat dissipation system is required.

[0003] Currently, light source equipment is generally cooled by a single heat dissipation system. However, the heat generated by the LED light board is much greater than that generated by the control board and power supply. If the same heat dissipation system is used, it is necessary to operate at high power for a long time or only cool the LED light board in order to meet the heat dissipation needs of the LED light board, which cannot take into account the heat dissipation needs of other electronic components. Utility Model Content

[0004] This disclosure provides a high-efficiency heat dissipation light source device to solve the above-mentioned technical problems.

[0005] This disclosure provides a high-efficiency heat dissipation light source device, including a chassis. A light source device is disposed inside the chassis. A first isolation aluminum plate and a second isolation aluminum block are disposed inside the chassis. The first isolation aluminum block is disposed at the bottom of the light source device, and the second isolation aluminum block is disposed on the side of the first isolation aluminum block. The side wall of the light source device, the first isolation aluminum block, the second isolation aluminum block, and the inner wall of the chassis form an independent installation space. An electronic control component is disposed in the installation space. A first heat dissipation system is disposed at the bottom of the light source device, and a second heat dissipation system is disposed at the bottom of the installation space.

[0006] Preferably, the first heat dissipation system includes a first thermoelectric cooler, a first heat sink, and a first cooling fan. One side of the first thermoelectric cooler is disposed against the light source device, and the other side is connected to the first heat sink. The first cooling fan is fixed to the bottom of the first heat sink.

[0007] Preferably, the second heat dissipation system includes a second thermoelectric cooler, a second heat sink, a second cooling fan, a third heat sink, and a third cooling fan. The second heat sink is disposed on the side of the second thermoelectric cooler close to the electronic control element, the second cooling fan is disposed on the side of the second heat sink away from the second thermoelectric cooler, the third heat sink is disposed on the side of the second thermoelectric cooler away from the second heat sink, and the third cooling fan is disposed on the side of the third heat sink away from the second thermoelectric cooler.

[0008] Preferably, a third insulating aluminum block is provided on the outer side of the second semiconductor refrigeration chip.

[0009] Preferably, the first insulating aluminum block, the second insulating aluminum block, the third insulating aluminum block, and the inner wall of the chassis are all lined with heat insulation cotton.

[0010] Preferably, ventilation mesh is provided at the bottom of the chassis at the position corresponding to the first heat dissipation system and the second heat dissipation system.

[0011] Preferably, the side of the chassis has multiple air inlets.

[0012] Preferably, the electronic control component includes a power supply, a temperature control system control circuit, and a light source system control circuit, which are respectively installed on different side walls of the installation space.

[0013] Preferably, both the light source device and the installation space are equipped with temperature probes, and the temperature probes are electrically connected to the control circuit of the temperature control system.

[0014] Preferably, the bottom of the chassis is detachably connected with high feet.

[0015] The main advantages of this disclosure are as follows: This utility model uses a first and a second aluminum isolation block to isolate an independent installation space inside the chassis for installing electronic control components, and sets up two independent heat dissipation systems. The first heat dissipation system is set up close to the LED light board at the bottom of the light source device and is specifically designed to dissipate heat from the light source device. The second heat dissipation system uses a wind-cooling mode to blow cold air onto the electronic control components, achieving independent cooling of the installation space. The two heat dissipation systems operate independently and do not interfere with each other, resulting in better heat dissipation.

[0016] It should be understood that both the foregoing general description and the following detailed description are for illustrative purposes and do not necessarily limit the scope of this disclosure. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the subject matter of this disclosure. Furthermore, the specification and drawings serve to explain the principles of this disclosure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the light source device according to an embodiment of the present disclosure. Figure 1 ; Figure 2 This is a schematic diagram of the three-dimensional structure of the light source device according to an embodiment of the present disclosure. Figure 2 ; Figure 3 This is an exploded view of the structure of the light source device according to an embodiment of this disclosure; Figure 4 This is a schematic diagram of the first heat dissipation system structure according to an embodiment of the present disclosure; Figure 5 This is a schematic diagram of the second heat dissipation system structure according to an embodiment of the present disclosure; Icons: 100 - Chassis; 101 - Ventilation mesh; 102 - Air inlet; 103 - High feet; 200 - Light source device; 301 - First insulating aluminum block; 302 - Second insulating aluminum block; 303 - Third insulating aluminum block; 400 - Electronic control components; 500 - First heat dissipation system; 501 - First thermoelectric cooler; 502 - First heat sink; 503 - First cooling fan; 600 - Second heat dissipation system; 601 - Second thermoelectric cooler; 602 - Second heat sink; 603 - Second cooling fan; 604 - Third heat sink; 605 - Third cooling fan. Detailed Implementation

[0019] The technical solutions of this disclosure will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments.

[0020] Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this disclosure.

[0021] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0023] Example like Figure 1-5 As shown, this embodiment provides a high-efficiency heat dissipation light source device, including a chassis 100. The chassis 100 is a cuboid chassis 100 formed by six aluminum plates fixed together with bolts. A light source device 200 is installed inside the chassis 100. An LED light panel is installed at the bottom of the light source device 200 for emitting a specified light source. A first isolation aluminum block 301 and a second isolation aluminum block 302 are installed inside the chassis 100. The first isolation aluminum block 301 is installed at the bottom of the light source device 200, and the second isolation aluminum block 302 is installed on the side of the first isolation aluminum block 301. The first isolation aluminum block 301 and the second isolation aluminum block 302 are tightly fitted and locked to the outer side of the light source device 200 and the inner side wall of the chassis 100 to form an independent installation space. An electronic control component 400 is installed in this installation space. A first heat dissipation system 500 is installed at the bottom of the light source device 200 for dissipating heat from the LED light panel at the bottom of the light source device 200. A second heat dissipation system 600 is installed at the bottom of the installation space for dissipating heat from the electronic control component 400.

[0024] Specifically, the first heat dissipation system 500 includes a first thermoelectric cooler 501, a first heat sink 502, and a first cooling fan 503. One side of the cooling end of the first thermoelectric cooler 501 is abutted against the light source device 200 and connected to the LED light board at the bottom of the light source device 200 through high thermal conductivity silicone, so that the heat generated by the LED light board can be quickly transferred to the first thermoelectric cooler 501. The other side of the first thermoelectric cooler 501 is connected to the first heat sink 502. The first heat sink 502 has multiple heat dissipation fins, which can quickly absorb the heat from the hot end of the first thermoelectric cooler 501. The first cooling fan 503 is fixed to the bottom of the first heat sink 502 and exhausts the heat from the first heat sink 502 and the first thermoelectric cooler 501 to the outside of the chassis 100 through the first cooling fan 503.

[0025] Specifically, the second heat dissipation system 600 includes a second thermoelectric cooler 601, a second heat sink 602, a second cooling fan 603, a third heat sink 604, and a third cooling fan 605. The second heat sink 602 is located on the side of the second thermoelectric cooler 601 closest to the electronic control component 400, and the end of the second thermoelectric cooler 601 closest to the second heat sink 602 is the cold end. The second heat sink 602 has multiple heat dissipation fins to conduct heat to the second thermoelectric cooler 601. The second cooling fan 603 is located away from the second heat sink 602. On one side of the second thermoelectric cooler 601, the temperature of the cold end of the second thermoelectric cooler 601 is transferred to the entire installation space by the second cooling fan 603 to dissipate heat from the electronic control component 400. The third heat sink 604 is located on the side of the second thermoelectric cooler 601 away from the second heat sink 602, and the third cooling fan 605 is located on the side of the third heat sink 604 away from the second thermoelectric cooler 601. The third cooling fan 605 exhausts the temperature of the hot end of the second thermoelectric cooler 601 to the outside of the chassis 100 to dissipate heat from the installation space.

[0026] Furthermore, a third insulating aluminum block 303 is provided on the outer side of the second semiconductor cooling chip 601. The third insulating aluminum block 303 isolates the cold end and the hot end of the second semiconductor cooling chip 601, thereby improving the cooling efficiency.

[0027] Furthermore, the first insulating aluminum block 301, the second insulating aluminum block 302, the third insulating aluminum block 303, and the inner wall of the chassis 100 are all lined with heat insulation cotton. The heat insulation cotton improves the heat insulation effect, isolates the first heat dissipation system 500 and the second heat dissipation system 600, and prevents the heat from the two heat dissipation systems from interfering with each other.

[0028] Specifically, ventilation mesh 101 is provided at the bottom of the chassis 100 at the position corresponding to the first heat dissipation system 500 and the second heat dissipation system 600, and heat is discharged to the outside of the chassis 100 through the ventilation mesh 101.

[0029] Furthermore, the side of the chassis 100 is provided with multiple air intake holes 102, and the bottom cooling fans of the two cooling systems are surrounded by air intake holes 102, which form air convection with the ventilation mesh 101 at the bottom of the chassis 100, thereby increasing the airflow speed and accelerating the heat dissipation.

[0030] Specifically, the electronic control component 400 includes a power supply, a temperature control system control circuit, and a light source system control circuit. The power supply, temperature control system control circuit, and light source system control circuit are respectively installed on different side walls of the installation space. Dispersed installation helps heat dissipation and reduces mutual interference. The power supply is used to power the entire equipment. The temperature control system control circuit is used to control the operation of the semiconductor cooling chip and cooling fan in the first heat dissipation system 500 and the second heat dissipation system 600. The light source system control circuit is used to control the operation of the light source device 200.

[0031] Furthermore, both the light source device 200 and the installation space are equipped with temperature probes. The temperature probes are electrically connected to the temperature control system control circuit. The temperature probes detect the temperature of the LED light board of the light source device 200 and the temperature of the installation space, and adjust the power of the semiconductor cooling chip and the cooling fan in real time to ensure that the performance of the electronic components inside the equipment does not change with temperature.

[0032] Furthermore, the bottom of the chassis 100 is detachably connected with high feet 103 around its perimeter. The high feet 103 raise the height of the bottom of the chassis 100, thereby raising the ventilation mesh 101 at the bottom to provide air outlet distance and to provide support and shock absorption for the entire light source equipment. When the light source equipment needs to be installed on industrial production equipment, the detachable high feet 103 can be removed for installation, which is flexible and convenient.

[0033] The working principle of this utility model is as follows: This utility model uses the first isolation aluminum block 301 and the second isolation aluminum block 302 to isolate an independent installation space inside the chassis 100 for installing the electronic control component 400, and sets up two independent heat dissipation systems. The first heat dissipation system 500 is set close to the LED light board at the bottom of the light source device 200 and is specifically designed to dissipate heat from the light source device 200. The second heat dissipation system adopts a wind-cooling mode to blow cold air onto the electronic control component 400, thereby achieving independent cooling of the installation space.

[0034] The first heat dissipation system 500 collects the temperature of the LED light board through a temperature probe, converts it into a digital signal via an ADC module, and feeds it back to the temperature control microprocessor. The temperature control microprocessor calculates the deviation between the set value and the actual temperature according to an algorithm, and outputs a PWM signal to adjust the execution circuit. The execution circuit adjusts the power according to the duty cycle of the PWM signal. The execution circuit includes a first cooling fan 503 and a first thermoelectric cooler 501. When the actual temperature is higher than the set temperature, the first thermoelectric cooler 501 cools at full power, and the first cooling fan 503 rotates at full power to dissipate heat. When the actual temperature is close to the set temperature, the first thermoelectric cooler 501 switches to pulse cooling, and the first cooling fan 503 rotates at low speed to dissipate heat. The temperature probe continuously detects the temperature and feeds it back to the temperature control microprocessor, forming a closed-loop regulation to maintain the LED light board temperature within a suitable temperature range, ensuring stable brightness of the light board that does not change with temperature variations.

[0035] The second heat dissipation system 600 collects the temperature of the internal circuit space of the device through a temperature probe, converts it into a digital signal via an ADC module, and feeds it back to the temperature control microprocessor. The temperature control microprocessor calculates the deviation between the set value and the actual temperature according to an algorithm, and outputs a PWM signal to adjust the execution circuit. The execution circuit adjusts the power according to the duty cycle of the PWM signal. The execution circuit includes a second cooling fan 603, a third cooling fan 605, and a second thermoelectric cooler 601. When the actual temperature is higher than the set temperature, the second thermoelectric cooler 601 cools at full power, and the second cooling fan 603 and the third cooling fan 605 rotate at full power for heat dissipation. When the actual temperature is close to the set temperature, the second thermoelectric cooler 601 switches to pulse cooling, and the second cooling fan 603 and the third cooling fan 605 rotate at low speed for heat dissipation. The temperature probe continuously detects the temperature and feeds it back to the temperature control microprocessor, forming a closed-loop regulation that maintains the temperature of the internal circuit space of the device within a suitable temperature range, ensuring that the performance of the internal circuit of the device does not change with temperature variations.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A high-efficiency heat dissipation light source device, characterized in that, The device includes a chassis, inside which a light source device is installed. The chassis also contains a first insulating aluminum block and a second insulating aluminum block. The first insulating aluminum block is located at the bottom of the light source device, and the second insulating aluminum block is located on the side of the first insulating aluminum block. The side wall of the light source device, the first insulating aluminum block, the second insulating aluminum block, and the inner wall of the chassis form an independent installation space. Electronic control components are installed within this installation space. A first heat dissipation system is installed at the bottom of the light source device, and a second heat dissipation system is installed at the bottom of the installation space.

2. A high-efficiency heat dissipating light source device according to claim 1, wherein The first heat dissipation system includes a first thermoelectric cooler, a first heat sink, and a first cooling fan. One side of the first thermoelectric cooler is disposed against the light source device, and the other side is connected to the first heat sink. The first cooling fan is fixed to the bottom of the first heat sink.

3. A high-efficiency heat dissipating light source device according to claim 1, wherein The second heat dissipation system includes a second thermoelectric cooler, a second heat sink, a second cooling fan, a third heat sink, and a third cooling fan. The second heat sink is located on the side of the second thermoelectric cooler close to the electronic control element. The second cooling fan is located on the side of the second heat sink away from the second thermoelectric cooler. The third heat sink is located on the side of the second thermoelectric cooler away from the second heat sink. The third cooling fan is located on the side of the third heat sink away from the second thermoelectric cooler.

4. A high-efficiency heat dissipating light source device according to claim 3, wherein A third insulating aluminum block is provided on the outside of the second semiconductor cooling chip.

5. A high-efficiency heat dissipating light source device according to claim 4, wherein The first, second, and third aluminum isolation blocks, as well as the inner wall of the chassis, are all lined with heat insulation cotton.

6. A high-efficiency heat dissipating light source device according to claim 1, wherein Ventilation mesh is provided at the bottom of the chassis at positions corresponding to the first and second heat dissipation systems.

7. A high efficiency heat dissipating light source device as set forth in claim 1, wherein The side of the chassis has multiple air inlets.

8. A high efficiency heat dissipating light source device according to claim 1, wherein The electronic control components include a power supply, a temperature control system control circuit, and a light source system control circuit, which are respectively installed on different side walls of the installation space.

9. A high-efficiency heat dissipating light source device according to claim 8, wherein Both the light source device and the installation space are equipped with temperature probes, which are electrically connected to the temperature control system control circuit.

10. A high efficiency heat dissipating light source device according to claim 1, wherein The bottom of the chassis is detachably equipped with high feet.

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