A ceramic packaging structure and an intelligent power module
Patent Information
- Application Number
- CN202522160871.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-13
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-10-13
AI Technical Summary
[0004]针对陶瓷封装结构内部预留给芯片键合和焊接的空腔，需要采用玻璃胶进行填充，导致的芯片的散热效率低的问题，提出了本实用新型，以便提供一种克服上述问题或者至少部分地解决上述问题的陶瓷封装结构和智能功率模块
[0015]Compared with existing technologies, this utility model includes a first ceramic substrate, metal pillars, a first metal-clad ceramic substrate, and a second metal-clad ceramic substrate. The first ceramic substrate has upper core cavities formed on its two end faces, which conform to the shape of a chip. Conductive channels are also provided in the first ceramic substrate, communicating with the upper core cavities. The metal pillars are embedded in the conductive channels and are used for electrical connection with the chip. The first and second metal-clad ceramic substrates are respectively attached to the two end faces of the first ceramic substrate for electrical connection with the chip. Thus, by using metal pillars with conductive channels embedded in the first ceramic substrate to replace wire bonding, electrical connection between chips is achieved. This eliminates the need for pre-reserved space for wire bonding, allowing the chip to directly contact the first and second metal-clad ceramic substrates, significantly improving the chip's heat transfer efficiency.
Smart Images
Figure CN224775280U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a ceramic packaging structure and a smart power module. Background Technology
[0002] With the increasing miniaturization and integration of power semiconductor products, the heat dissipation requirements for these products are also rising. Currently, ceramic materials are increasingly being used as molding compounds in power modules because their excellent thermal conductivity meets the heat dissipation needs of high-power chips.
[0003] For example, some ceramic packaging structures have internal cavities through which chips are bonded and soldered. Then, silicone sealant is used to cover the cavity, allowing the chip surface to contact the sealant and transfer heat generated by the chip to the sealant and then to the ceramic packaging structure. However, because silicone sealant has low thermal conductivity, this significantly reduces the chip's heat dissipation efficiency. Utility Model Content
[0004] To address the issue of low heat dissipation efficiency of chips caused by the need to fill the cavities reserved for chip bonding and soldering within ceramic packaging structures with glass glue, this invention provides a ceramic packaging structure and intelligent power module that overcomes or at least partially solves the aforementioned problems.
[0005] Based on a first aspect of the present invention, a ceramic packaging structure is provided, the ceramic packaging structure comprising: A first ceramic substrate has upper core cavities formed on its two end faces, wherein the upper core cavities are shaped to fit the chip, and a conductive channel is also provided in the first ceramic substrate, wherein the conductive channel is connected to the upper core cavity. A metal pillar, which is embedded in the conductive channel and is used to electrically connect to the chip; A first metal-clad ceramic substrate and a second metal-clad ceramic substrate are respectively attached to the two end faces of the first ceramic substrate for electrical connection with the chip.
[0006] In one optional utility model embodiment, when the number of the first ceramic substrates is at least two, the ceramic encapsulation structure further includes: At least one double-layer metal-coated ceramic substrate, wherein the double-layer metal-coated ceramic substrate is disposed between two adjacent first ceramic substrates.
[0007] An optional utility model includes a first mounting hole formed on the end face of the first ceramic substrate near the first metal-clad ceramic substrate. The ceramic packaging structure further includes a first connecting layer, which is located in the first mounting hole and is used to weld to the first metal-coated ceramic substrate.
[0008] In one optional utility model, the number of the first mounting holes is at least two, and the at least two first mounting holes are respectively located near the two side edges of the first ceramic substrate.
[0009] An optional utility model includes a second mounting hole formed on the end face of the first ceramic substrate near the second metal-clad ceramic substrate. The ceramic packaging structure further includes a second connecting layer located in the second mounting hole for welding to the second metal-clad ceramic substrate.
[0010] In one optional utility model, the number of the second mounting holes is at least two, and the at least two second mounting holes are respectively located near the two side edges of the first ceramic substrate.
[0011] Based on a second aspect of this utility model, a smart power module is also provided. The smart power module includes a packaging structure and a chipset as described in any of the above utility model contents. At least two chips in the chipset are disposed in the upper cavity and are shaped to fit the upper cavity. The chips are electrically connected to the first metal-coated ceramic substrate and the second metal-coated ceramic substrate, respectively.
[0012] An optional utility model includes a chipset comprising a control chip and a power chip, wherein the power chip and the control chip are respectively located on both ends of the first ceramic substrate.
[0013] An optional utility model includes a smart power module comprising a first solder layer, wherein the first solder layer is filled on the end face of the control chip away from the first ceramic substrate for soldering to the first metal-clad ceramic substrate or the second metal-clad ceramic substrate.
[0014] An optional utility model includes a smart power module comprising a second solder layer, which fills the end face of the power chip away from the first ceramic substrate for soldering to the first metal-clad ceramic substrate or the second metal-clad ceramic substrate.
[0015] Compared with existing technologies, this utility model includes a first ceramic substrate, metal pillars, a first metal-clad ceramic substrate, and a second metal-clad ceramic substrate. The first ceramic substrate has upper core cavities formed on its two end faces, which conform to the shape of a chip. Conductive channels are also provided in the first ceramic substrate, communicating with the upper core cavities. The metal pillars are embedded in the conductive channels and are used for electrical connection with the chip. The first and second metal-clad ceramic substrates are respectively attached to the two end faces of the first ceramic substrate for electrical connection with the chip. Thus, by using metal pillars with conductive channels embedded in the first ceramic substrate to replace wire bonding, electrical connection between chips is achieved. This eliminates the need for pre-reserved space for wire bonding, allowing the chip to directly contact the first and second metal-clad ceramic substrates, significantly improving the chip's heat transfer efficiency.
[0016] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more obvious and understandable, specific embodiments of this utility model are given below. Attached Figure Description
[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings.
[0018] In the attached diagram: Figure 1 This is a three-dimensional structural diagram of a ceramic packaging structure provided in an embodiment of the present invention; Figure 2 This is a cross-sectional schematic diagram of a ceramic packaging structure provided in an embodiment of the present invention; Figure 3 This is a cross-sectional structural diagram of an intelligent power module provided in an embodiment of this utility model; Figure 4 This is an exploded structural diagram of an intelligent functional module provided in an embodiment of this utility model; Figure 5 This is a partial structural schematic diagram of an intelligent power module provided in an embodiment of this utility model; Figure 6 This is a cross-sectional structural diagram of another intelligent power module provided in an embodiment of this utility model; Figure 7This is a schematic flowchart of the manufacturing method of a ceramic packaging structure provided in an embodiment of the present invention; Reference numerals: 1. First ceramic substrate; 101. Upper core cavity; 102. Conductive channel; 103. First mounting hole; 104. Second mounting hole; 2. Metal pillar; 3. First metal-clad ceramic substrate; 31. First ceramic body; 32. First metal layer; 4. Second metal-clad ceramic substrate; 41. Second ceramic body; 42. Second metal layer; 5. Double-layer metal-clad ceramic substrate; 6. First connecting layer; 7. Second connecting layer; 8. Chipset; 81. Control chip; 82. Power chip; 9. First solder layer; 10. Second solder layer. Detailed Implementation
[0019] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0020] With the increasing miniaturization and integration of power semiconductor products, the heat dissipation requirements for these products are also rising. Currently, ceramic materials are increasingly being used as molding compounds in power modules because their excellent thermal conductivity meets the heat dissipation needs of high-power chips.
[0021] For example, some ceramic packaging structures have internal cavities through which chips are bonded and soldered. Then, silicone sealant is used to cover the cavity, allowing the chip surface to contact the sealant and transfer heat generated by the chip to the sealant and then to the ceramic packaging structure. However, because silicone sealant has low thermal conductivity, this significantly reduces the chip's heat dissipation efficiency.
[0022] Based on the aforementioned technical problems, this utility model embodiment is proposed. This utility model embodiment may include a first ceramic substrate, metal pillars, a first metal-clad ceramic substrate, and a second metal-clad ceramic substrate. The first ceramic substrate has upper core cavities formed on its two end faces, wherein the upper core cavities conform to the shape of a chip. The first ceramic substrate also has conductive channels, which communicate with the upper core cavities. The metal pillars are embedded in the conductive channels and are used for electrical connection with the chip. The first and second metal-clad ceramic substrates are respectively attached to the two end faces of the first ceramic substrate for electrical connection with the chip. Thus, by using metal pillars with conductive channels embedded in the first ceramic substrate to replace wire bonding, electrical connection between chips is achieved. This eliminates the need to reserve space for wire bonding, allowing the chip to directly contact the first and second metal-clad ceramic substrates, greatly improving the chip's heat transfer efficiency.
[0023] Reference Figure 1 and Figure 2 As shown in the figure, this utility model embodiment provides a ceramic packaging structure, which may include a first ceramic substrate 1, metal pillars 2, a first metal-clad ceramic substrate 3, and a second metal-clad ceramic substrate 4. The first ceramic substrate 1 has upper core cavities 101 formed on its two end faces, wherein the upper core cavities 101 are shaped to fit a chip. The first ceramic substrate 1 also has conductive channels 102, which communicate with the upper core cavities 101. The metal pillars 2 are embedded in the conductive channels 102 and are electrically connected to the chip. The first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to the two end faces of the first ceramic substrate 1 for electrical connection to the chip.
[0024] In this embodiment of the invention, the ceramic encapsulation structure may include a first ceramic substrate 1, a metal pillar 2, a first metal-clad ceramic substrate 3, and a second metal-clad ceramic substrate 4. The first metal-clad ceramic substrate 3 may be formed by bonding a first ceramic body 31 and a first metal layer 32 using a direct copper bonding process. And / or, the second metal-clad ceramic substrate 4 may be formed by bonding a second ceramic body 41 and a second metal layer 42 using a direct copper bonding process. The first metal layer 32 and / or the second metal layer 42 may be made of one of the following materials: gold, copper, and aluminum.
[0025] The first ceramic substrate 1 has a first end face and a second end face, and upper core cavities 101 are respectively formed on the two end faces of the first ceramic substrate 1. The upper core cavity 101 is used for soldering chips in the intelligent power module. The upper core cavity 101 is shaped to fit the chip, which can be understood as the cavity wall (side wall and bottom wall) of the upper core cavity 101 forming surface contact with the side and bottom of the chip, respectively. This allows the heat generated by the chip during operation to be directly transferred to the first ceramic substrate 1, thereby improving the heat dissipation efficiency of the chip.
[0026] The first ceramic substrate 1 also includes a conductive channel 102, which communicates with the upper core cavity 101. The metal pillar 2 is embedded in the conductive channel 102 and is used for electrical connection with the chip. In one example, the metal pillar 2 is formed by embedding it into the conductive channel using a metal casting method. The conductive channel 102 can be determined based on the electrical connection relationships between chips in the smart power module. For example, the first ceramic substrate 1 can be obtained by 3D printing.
[0027] Therefore, by using metal pillars 2 embedded in the conductive channels within the first ceramic substrate 1 to replace the currently used wire bonding method, electrical connections between chips are achieved. This eliminates the need for pre-reserved space within the ceramic packaging structure for wire bonding and avoids the problem of low thermal conductivity caused by filling and covering the space with materials such as glass glue. It also allows the chip to directly transfer heat to the first ceramic substrate 1.
[0028] Furthermore, the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to both end faces of the first ceramic substrate 1 for electrical connection with the chip. In one example, the first metal-clad ceramic substrate 3 can be attached to the first end face of the first ceramic substrate 1, and the second metal-clad ceramic substrate 4 can be attached to the second end face of the first ceramic substrate 1. That is, the first metal-clad ceramic substrate 3, the first ceramic substrate 1, and the second metal-clad ceramic substrate 4 are arranged sequentially from top to bottom. The first metal layer 32 forms an electrical connection with the chip on the first end face of the first ceramic substrate 1, and the second metal layer 42 forms an electrical connection with the chip on the second end face of the first ceramic substrate 1. The electrical connection can be fixed by soldering.
[0029] Therefore, while achieving electrical connection, the positions of the first metal-clad ceramic substrate 3 and the first ceramic substrate 1, and the second metal-clad ceramic substrate 4 and the first ceramic substrate 1 can also be fixed, thus completing the packaging of the smart power module. Specifically, the end of the first metal layer 32 extending outward along the surface of the first ceramic body 31 can serve as a pin of the smart power module. The end of the second metal layer 42 extending outward along the surface of the second ceramic body 41 can also serve as a pin of the smart power module. The end of the metal pillar 2 extending outward along the conductive channel 102 inside the first ceramic substrate 1 serves as a pin of the smart power module.
[0030] Based on the above structure, the problem of poor electrical performance stability caused by messy inductance due to excessive bonding wires can be avoided, and the structural complexity of the intelligent power module can be simplified, improving the stability of electrical performance. Specifically, the chip located on the first end face of the first ceramic substrate 1 can transfer some heat to the first ceramic substrate 1 and some heat directly to the first metal-clad ceramic substrate 3, finally dissipating heat to the outside. The chip located on the second end face of the second ceramic substrate can transfer some heat to the first ceramic substrate 1 and some heat directly to the second metal-clad ceramic substrate 4, finally dissipating heat to the outside, thereby greatly improving the heat dissipation efficiency of the chip. The chips can be three-dimensionally distributed on both end faces of the first ceramic substrate 1, ensuring the heat dissipation requirements of the chips while also meeting the structural requirements of high integration and miniaturization of the intelligent power module.
[0031] In one or more embodiments, refer to Figure 6 As shown, when the number of first ceramic substrates 1 is at least two, the ceramic packaging structure may further include at least one double-layer metal-coated ceramic substrate 5, which is disposed between two adjacent first ceramic substrates 1.
[0032] In this embodiment of the invention, the number of first ceramic substrates 1 can be multiple. When the number of first ceramic substrates 1 is at least two, the ceramic packaging structure may further include at least one double-layer metal-coated ceramic substrate 5. The double-layer metal-coated ceramic substrate 5 may include a third metal layer, a fourth metal layer, and a third ceramic body. The third metal layer and the fourth metal layer are respectively located on both end faces of the third ceramic body and can be bonded together using a direct copper bonding process to obtain the double-layer metal-coated ceramic substrate 5. The third metal layer and / or the fourth metal layer may be made of one of the following materials: gold, copper, and aluminum.
[0033] The double-layer metal-clad ceramic substrate 5 is disposed between two adjacent first ceramic substrates 1. In other words, when the chip integration in the intelligent power module is high, at least two first ceramic substrates 1 can be disposed, allowing multiple chips to be arranged three-dimensionally on different end faces of at least two first ceramic substrates 1. In this case, the third metal layer is attached to the first end face of the first first ceramic substrate 1 and is used for electrical connection with the chip on that first end face; the fourth metal layer is attached to the second end face of the second first ceramic substrate 1 and is used for electrical connection with the chip on that second end face. The end of the third metal layer extending along the surface of the third ceramic body can serve as a pin of the intelligent power module, and the end of the fourth metal layer extending along the surface of the third ceramic body can serve as a pin of the intelligent power module.
[0034] The heat generated by the chip on the first ceramic substrate 1 can be transferred to the double-layer metal-clad ceramic substrate 5, or to the first metal-clad ceramic substrate 3 or the second metal-clad ceramic substrate 4, thereby greatly improving the heat dissipation efficiency of the ceramic packaging structure for the chip.
[0035] Based on the above structural design, the chip integration of the intelligent power module can be further improved while meeting the chip heat dissipation requirements under high integration, which is conducive to the miniaturization and high integration of the intelligent power module.
[0036] In one or more embodiments, refer to Figure 2 As shown, a first mounting hole 103 is formed on the end face of the first ceramic substrate 1 near the first metal-clad ceramic substrate 3. The ceramic packaging structure also includes a first connecting layer 6, which is located in the first mounting hole 103 and is used to weld to the first metal-clad ceramic substrate 3.
[0037] In this embodiment of the invention, a first mounting hole 103 is provided on the end face of the first ceramic substrate 1 near the first metal-clad ceramic substrate 3 (also referred to as the first end face of the first ceramic substrate 1). The ceramic encapsulation structure may further include a first connecting layer 6, wherein the first connecting layer 6 is used to connect the first ceramic substrate 1 and the first metal-clad ceramic substrate 3. The first connecting layer 6 is located in the first mounting hole 103 and is used to weld to the first metal-clad ceramic substrate 3. In one example, the first connecting layer 6 may be formed of a metal material, for example, the first connecting layer 6 may be a copper layer.
[0038] Based on the above structural design, the welding area between the first ceramic substrate 1 and the first metal-clad ceramic substrate 3 can be increased by the first connecting layer 6, and the encapsulation firmness of the ceramic packaging structure can be improved.
[0039] In one or more embodiments, refer to Figure 2 and Figure 4 As shown, at least two first mounting holes 103 are provided, and at least two first mounting holes 103 are respectively provided near the two side edges of the first ceramic substrate 1.
[0040] In this embodiment of the invention, at least two first mounting holes 103 are respectively disposed near the two side edges of the first ceramic substrate 1. This can be understood as the first side and the second side of the first ceramic substrate 1, with at least one first mounting hole 103 formed near the edge on each of these sides. Thus, a first connecting layer 6 embedded in the first mounting hole 103 can be welded to the first metal-clad ceramic substrate 3. The first side and the second side are disposed opposite to each other.
[0041] In some embodiments, the first mounting hole 103 can be a long rectangular hole, and the length direction of the first mounting hole 103 is consistent with the width direction of the first ceramic substrate 1.
[0042] Based on the above structure, the welding area between the first ceramic substrate 1 and the first metal-clad ceramic substrate 3 can be further increased without affecting the chip arrangement. Furthermore, the multi-point distribution of the welding area and its proximity to the edge greatly improves the encapsulation strength of the ceramic packaging structure.
[0043] In one or more embodiments, refer to Figure 2 and Figure 4 As shown, a second mounting hole 104 is formed on the end face of the first ceramic substrate 1 near the second metal-clad ceramic substrate 4. The ceramic packaging structure also includes a second connecting layer 7, which is located in the second mounting hole 104 and is used to weld to the second metal-clad ceramic substrate 4.
[0044] In this embodiment of the invention, a second mounting hole 104 is provided on the end face of the first ceramic substrate 1 near the second metal-clad ceramic substrate 4 (also referred to as the second end face of the first ceramic substrate 1). The ceramic encapsulation structure may further include a second connecting layer 7, wherein the second connecting layer 7 is used to connect the first ceramic substrate 1 and the second metal-clad ceramic substrate 4. The second connecting layer 7 is located in the second mounting hole 104 and is used to weld to the second metal-clad ceramic substrate 4. In one example, the second connecting layer 7 may be formed of a metal material, for example, the second connecting layer 7 may be a copper layer.
[0045] Based on the above structural design, the welding area between the first ceramic substrate 1 and the second metal-ceramic substrate can be increased by the second connecting layer 7, and the encapsulation firmness of the ceramic packaging structure can be improved.
[0046] In one or more embodiments, refer to Figure 2 and Figure 4 As shown, at least two second mounting holes 104 are provided, and at least two second mounting holes 104 are respectively provided near the two side edges of the first ceramic substrate 1.
[0047] In this embodiment of the invention, at least two second mounting holes 104 are respectively disposed near the two side edges of the first ceramic substrate 1. This can be understood as the first side and the second side of the first ceramic substrate 1, with at least one second mounting hole 104 formed near the edge on each of these sides. Thus, a second connecting layer 7 embedded in the second mounting hole 104 can be welded to the second metal-clad ceramic substrate 4. The first side and the second side are disposed opposite to each other.
[0048] In some embodiments, the second mounting hole 104 can be a long rectangular hole, and the length direction of the second mounting hole 104 is consistent with the width direction of the first ceramic substrate 1.
[0049] Based on the above structure, the welding area between the first ceramic substrate 1 and the second metal-clad ceramic substrate 4 can be further increased without affecting the chip arrangement. Furthermore, the multi-point distribution of the welding area and its proximity to the edge greatly improves the encapsulation strength of the ceramic packaging structure.
[0050] In summary, this utility model discloses a ceramic packaging structure, which may include a first ceramic substrate 1, metal pillars 2, a first metal-clad ceramic substrate 3, and a second metal-clad ceramic substrate 4. The first ceramic substrate 1 has upper core cavities 101 on its two end faces, which are shaped to fit a chip. The first ceramic substrate 1 also has conductive channels 102 communicating with the upper core cavities 101. The metal pillars 2 are embedded in the conductive channels 102 and are used for electrical connection with the chip. The first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to the two end faces of the first ceramic substrate 1 for electrical connection with the chip. Thus, by using the metal pillars 2 embedded in the conductive channels 102 of the first ceramic substrate 1 to replace wire bonding, electrical connection between chips is achieved. This eliminates the need to reserve space for wire bonding, allowing the chip to directly contact the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4, greatly improving the chip's heat transfer efficiency.
[0051] Reference Figure 3-6 As shown, this utility model embodiment also discloses an intelligent power module, which may include any of the ceramic packaging structures and chipset 8 described in any one of the embodiments. At least two chips in the chipset 8 are disposed in the upper core cavity 101 and are shaped to fit the upper core cavity 101. The chips are electrically connected to the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4, respectively.
[0052] In this embodiment of the present invention, the intelligent power module may include a ceramic packaging structure and a chipset 8. The ceramic packaging structure may include a first ceramic substrate 1, metal pillars 2, a first metal-clad ceramic substrate 3, and a second metal-clad ceramic substrate 4. The first metal-clad ceramic substrate 3 may be formed by bonding a first ceramic body 31 and a first metal layer 32 using a direct copper bonding process. And / or, the second metal-clad ceramic substrate 4 may be formed by bonding a second ceramic body 41 and a second metal layer 42 using a direct copper bonding process. The first metal layer 32 and / or the second metal layer 42 may be made of one of the following materials: gold, copper, and aluminum.
[0053] The first ceramic substrate 1 has a first end face and a second end face, and upper core cavities 101 are respectively formed on the two end faces of the first ceramic substrate 1. The upper core cavity 101 is used for soldering chips in the intelligent power module. The upper core cavity 101 is shaped to fit the chip, which can be understood as the cavity wall (side wall and bottom wall) of the upper core cavity 101 forming surface contact with the side and bottom of the chip, respectively. This allows the heat generated by the chip during operation to be directly transferred to the first ceramic substrate 1, thereby improving the heat dissipation efficiency of the chip.
[0054] The first ceramic substrate 1 also includes a conductive channel 102, which communicates with the upper core cavity 101. The metal pillar 2 is embedded in the conductive channel 102 and is used for electrical connection with the chip. In one example, the metal pillar 2 is formed by embedding it into the conductive channel using a metal casting method. The conductive channel 102 can be determined based on the electrical connection relationships between chips in the smart power module. For example, the first ceramic substrate 1 can be obtained by 3D printing.
[0055] Therefore, by using metal pillars 2 embedded in the conductive channels within the first ceramic substrate 1 to replace the currently used wire bonding method, electrical connections between chips are achieved. This eliminates the need for pre-reserved space within the ceramic packaging structure for wire bonding and avoids the problem of low thermal conductivity caused by filling and covering the space with materials such as glass glue. It also allows the chip to directly transfer heat to the first ceramic substrate 1.
[0056] Furthermore, the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to both end faces of the first ceramic substrate 1 for electrical connection with the chip. In one example, the first metal-clad ceramic substrate 3 can be attached to the first end face of the first ceramic substrate 1, and the second metal-clad ceramic substrate 4 can be attached to the second end face of the first ceramic substrate 1. That is, the first metal-clad ceramic substrate 3, the first ceramic substrate 1, and the second metal-clad ceramic substrate 4 are arranged sequentially from top to bottom. The first metal layer 32 forms an electrical connection with the chip on the first end face of the first ceramic substrate 1, and the second metal layer 42 forms an electrical connection with the chip on the second end face of the first ceramic substrate 1. The electrical connection can be fixed by soldering.
[0057] Therefore, while achieving electrical connection, the positions of the first metal-clad ceramic substrate 3 and the first ceramic substrate 1, and the second metal-clad ceramic substrate 4 and the first ceramic substrate 1 can also be fixed, thus completing the packaging of the smart power module. Specifically, the end of the first metal layer 32 extending outward along the surface of the first ceramic body 31 can serve as a pin of the smart power module. The end of the second metal layer 42 extending outward along the surface of the second ceramic body 41 can also serve as a pin of the smart power module. The end of the metal pillar 2 extending outward along the conductive channel 102 inside the first ceramic substrate 1 serves as a pin of the smart power module.
[0058] Based on the above structure, the problem of poor electrical performance stability caused by messy inductance due to excessive bonding wires can be avoided, and the structural complexity of the intelligent power module can be simplified, improving the stability of electrical performance. Specifically, the chip located on the first end face of the first ceramic substrate 1 can transfer some heat to the first ceramic substrate 1 and some heat directly to the first metal-clad ceramic substrate 3, finally dissipating heat to the outside. The chip located on the second end face of the second ceramic substrate can transfer some heat to the first ceramic substrate 1 and some heat directly to the second metal-clad ceramic substrate 4, finally dissipating heat to the outside, thereby greatly improving the heat dissipation efficiency of the chip. The chips can be three-dimensionally distributed on both end faces of the first ceramic substrate 1, ensuring the heat dissipation requirements of the chips while also meeting the structural requirements of high integration and miniaturization of the intelligent power module.
[0059] In one or more embodiments, refer to Figure 3 , Figure 4 , Figure 5 as well as Figure 6 As shown, the chipset 8 includes a control chip 81 and a power chip 82, with the power chip 82 and the control chip 81 located on the two end faces of the first ceramic substrate 1, respectively.
[0060] In this embodiment of the invention, the chipset 8 may include a control chip 81 and a power chip 82. At least two power chips 82 may be provided, and each power chip 82 is the primary heat-generating chip in the intelligent power module. The power chip 82 and the control chip 81 are respectively located on both end faces of the first ceramic substrate 1. For example, the control chip 81 is mounted in the upper cavity 101 on the first end face, and the power chip 82 is mounted in the upper cavity 101 on the second end face.
[0061] Based on the above structural design, the chips in the intelligent power module can be arranged in multiple layers along the height direction, improving the chip integration density of the intelligent power module. It also improves the chip mounting efficiency of the intelligent power module, as the control chip 81 is mounted on one end face and the power chip 82 is mounted on the other end face. Furthermore, the control chip 81 can be separated from the power chip 82, which generates significant heat, thus protecting the control chip 81.
[0062] In one or more embodiments, refer to Figure 3 , Figure 4 as well as Figure 6 As shown, the intelligent power module includes a first solder layer 9, wherein the first solder layer 9 is filled on the end face of the control chip 81 away from the first ceramic substrate 1, for welding to the first metal-clad ceramic substrate 3 or the second metal-clad ceramic substrate 4.
[0063] In this embodiment of the present invention, the intelligent power module may further include a first solder layer 9, wherein the first solder layer 9 fills the end face of the control chip 81 away from the first ceramic substrate 1. Thus, the first solder layer 9 can completely fill the remaining space at the top of the control chip 81. The first solder layer 9 can also be used to weld and fix the control chip 81 to the first metal-clad ceramic substrate 3. Alternatively, the first solder layer 9 can be used to weld the control chip 81 to the second metal-clad ceramic substrate 4. Considering the possible thickness errors of different control chips 81, or assembly errors after mounting, the filling thickness of the first solder layer 9 can be adjusted to accommodate these errors, ensuring that all end faces of the control chip 81 located in the upper cavity 101 can directly contact a material with high thermal conductivity, thereby maximizing the heat dissipation efficiency of the control chip 81.
[0064] Based on the above structural design, the upper cavity 101 can be completely filled by the first solder layer 9, so that the heat generated by the control chip 81 can be directly transferred to the first metal-clad ceramic substrate 3 or the second metal-clad ceramic substrate 4 through the first solder layer 9 with high thermal conductivity, thereby improving the heat dissipation efficiency of the control chip 81 and realizing the electrical connection between the control chip 81 and the first metal layer 32 or the second metal layer 42.
[0065] In one or more embodiments, refer to Figure 3 , Figure 4 as well as Figure 6As shown, the intelligent power module includes a second solder layer 10, which fills the end face of the power chip 82 away from the first ceramic substrate 1, for welding to the first metal-clad ceramic substrate 3 or the second metal-clad ceramic substrate 4.
[0066] In this embodiment, the intelligent power module may further include a second solder layer 10, wherein the second solder layer 10 fills the end face of the power chip 82 away from the first ceramic substrate 1. Thus, the second solder layer 10 can completely fill the remaining space at the top of the power chip 82. The second solder layer 10 can also be used to weld and fix the power chip 82 to the second metal-clad ceramic substrate 4. Alternatively, the second solder layer 10 can be used to weld the power chip 82 to the first metal-clad ceramic substrate 3. Considering the possible thickness variations of different power chips 82, or assembly errors after mounting, the filling thickness of the second solder layer 10 can be adjusted to accommodate these errors, ensuring that all end faces of the power chip 82 located in the upper cavity 101 can directly contact a material with high thermal conductivity, thereby maximizing the heat dissipation efficiency of the power chip 82.
[0067] Based on the above structural design, the upper cavity 101 can be completely filled by the second solder layer 10, so that the heat generated by the power chip 82 can be directly transferred to the first metal-clad ceramic substrate 3 or the second metal-clad ceramic substrate 4 through the second solder layer 10 with high thermal conductivity, thereby improving the heat dissipation efficiency of the power chip 82 and realizing the electrical connection between the power chip 82 and the first metal layer 32 or the second metal layer 42.
[0068] In summary, this utility model discloses an intelligent power module, which may include a first ceramic substrate 1, metal pillars 2, a first metal-clad ceramic substrate 3, and a second metal-clad ceramic substrate 4. The first ceramic substrate 1 has upper core cavities 101 on its two end faces, which are shaped to fit a chip. The first ceramic substrate 1 also has conductive channels 102 communicating with the upper core cavities 101. The metal pillars 2 are embedded in the conductive channels 102 and are electrically connected to the chip. The first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to the two end faces of the first ceramic substrate 1 for electrical connection to the chip. Thus, by using the metal pillars 2 embedded in the conductive channels 102 of the first ceramic substrate 1 to replace wire bonding, electrical connection between chips is achieved. This eliminates the need for pre-reserved space for wire bonding, allowing the chip to directly contact the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4, significantly improving the chip's heat transfer efficiency.
[0069] Reference Figure 7 As shown in the figure, this utility model embodiment also discloses a method for manufacturing a ceramic packaging structure, the method comprising: S701. A first ceramic substrate 1 is formed by 3D printing. The first ceramic substrate 1 has an upper core cavity 101 on each of its two end faces. The upper core cavity 101 is matched with the shape of the chip. The first ceramic substrate 1 also has a conductive channel 102, which is connected to the upper core cavity 101.
[0070] In this embodiment of the invention, a first ceramic substrate 1 can be obtained by 3D printing using a ceramic slurry. The ceramic slurry refers to a mixed slurry comprising at least ceramic powder, anhydrous ethanol, and photosensitive resin. For example, the anhydrous ethanol, alumina ceramic powder, and photosensitive resin can be mixed in a certain proportion to obtain the ceramic slurry. The photosensitive resin is mainly used to cure the ceramic slurry in a subsequent photocuring process. The anhydrous ethanol serves as a dispersion medium, allowing for thorough mixing of the alumina ceramic powder and photosensitive resin during the mixing process, thus obtaining the ceramic slurry. The alumina content in the alumina ceramic powder is 99.99% or higher.
[0071] In some alternative embodiments, the anhydrous ethanol, silica ceramic powder, and photosensitive resin can be mixed in a certain proportion to obtain the ceramic slurry. The photosensitive resin is mainly used to cure the ceramic slurry in the subsequent photocuring process. The anhydrous ethanol serves as a dispersion medium, allowing for thorough mixing of the silica ceramic powder and photosensitive resin during the mixing process to obtain the ceramic slurry. The silica ceramic powder contains 99.99% or more silica.
[0072] The ceramic slurry is repeatedly coated onto the selectively transparent film platform. After each coating of ceramic slurry, the sample stage is pressed down to expose the ceramic slurry, causing the cured ceramic slurry to adhere to the cured substrate green body on the sample stage, thus obtaining a multilayer substrate green body. This completes the printing of the first ceramic substrate 1.
[0073] Before manufacturing the first ceramic substrate 1, the three-dimensional model of the first ceramic substrate 1 can be sliced, that is, divided into multiple layers in the thickness direction, to obtain a photocurable model. The photocurable model is then imported into a photocurable molding machine. A preset exposure intensity and preset exposure time for each single-layer substrate green body can be set, and the green body is cured layer by layer according to the preset exposure intensity and preset exposure time. After obtaining the complete multi-layer substrate green body corresponding to the first ceramic substrate 1, the multi-layer substrate green body is calcined, and the calcined multi-layer substrate green body is sintered to obtain the first ceramic substrate 1.
[0074] The first ceramic substrate 1 has a first end face and a second end face, and upper core cavities 101 are respectively formed on the two end faces of the first ceramic substrate 1. The upper core cavity 101 is used for soldering chips in the intelligent power module. The upper core cavity 101 is shaped to fit the chip, which can be understood as the cavity wall (side wall and bottom wall) of the upper core cavity 101 forming surface contact with the side and bottom of the chip, respectively. This allows the heat generated by the chip during operation to be directly transferred to the first ceramic substrate 1, thereby improving the heat dissipation efficiency of the chip.
[0075] The first ceramic substrate 1 also has a conductive channel 102, which communicates with the upper core cavity 101. The conductive channel 102 can have a width on the order of hundreds of micrometers, allowing for high integration within the first ceramic substrate 1. This satisfies the electrical interconnection requirements of the intelligent power module, which can be achieved by subsequently casting metal pillars 2 to replace the current bonding wires.
[0076] S702. Molten metal is poured into the conductive channel 102 using a casting technique to form a metal pillar 2 extending into the upper core cavity 101, so as to electrically connect the metal pillar 2 to the chip located in the upper core cavity 101.
[0077] In this embodiment of the invention, the metal pillar 2 can be formed by pouring molten metal into the conductive channel 102 and then cooling it. The metal pillar 2 can be made of gold, silver, or aluminum. This allows the metal pillar 2 to be embedded in the conductive channel 102 and to be electrically connected to the chip.
[0078] In some embodiments, the chip can be fixed to the first ceramic substrate 1 by soldering. For example, the solder can be one of Sn80Ag20 (80% tin + 20% silver by weight), SnAg3Cu0.5 (96.5% tin + 3% silver + 0.5% copper by weight), or PbSn10Ag2 (88% lead + 10% tin + 2% silver by weight). A vacuum reflow soldering device is used, with the soldering temperature set between 260°C and 300°C (inclusive), for example, the soldering temperature can be 270°C, and the soldering time set between 40 and 180 seconds (inclusive), for example, the soldering time can be 60 seconds.
[0079] S703, A first metal-clad ceramic substrate 3 and a second metal-clad ceramic substrate 4 are provided, and the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to the two end faces of the first ceramic substrate 1 for electrical connection with the chip.
[0080] In one or more embodiments, the method may further include: providing a first ceramic body 31 and a first metal layer 32, and obtaining the first metal-clad ceramic substrate 3 using a direct copper bonding process. And / or, A second ceramic body 41 and a second metal layer 42 are provided, and the second metal-clad ceramic substrate 4 is obtained by a direct copper bonding process.
[0081] In this embodiment of the invention, the first ceramic body 31 and / or the second ceramic body 41 can both be manufactured using 3D printing. The first metal layer 32 and / or the second metal layer 42 can be made of one of the following materials: gold, copper, and aluminum. Using a direct copper bonding process to obtain the first metal-clad ceramic substrate 3 and / or the second metal-clad ceramic substrate 4 can improve the structural robustness of the first metal-clad ceramic substrate 3 and / or the second metal-clad ceramic substrate 4.
[0082] In summary, this utility model discloses a method for manufacturing a ceramic packaging structure. The method includes firstly forming a first ceramic substrate 1 by 3D printing. The first ceramic substrate 1 has upper core cavities 101 formed on its two end faces, which are shaped to fit a chip. A conductive channel 102 is also provided in the first ceramic substrate 1, communicating with the upper core cavity 101. Then, molten metal is poured into the conductive channel 102 using a casting technique to form metal pillars 2 extending into the upper core cavity 101, thereby electrically connecting the metal pillars 2 to the chip located in the upper core cavity 101. Finally, a first metal-clad ceramic substrate 3 and a second metal-clad ceramic substrate 4 are provided, and the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4 are respectively attached to the two end faces of the first ceramic substrate 1 for electrical connection with the chip. Therefore, conductive channels 102 with widths on the order of hundreds of micrometers can be printed using 3D printing technology. Metal pillars 2 embedded in the conductive channels 102 within the first ceramic substrate 1 can replace wire bonding, thus achieving electrical connections between chips. This eliminates the need to reserve space for wire bonding, allowing the chip to directly contact the first metal-clad ceramic substrate 3 and the second metal-clad ceramic substrate 4, significantly improving the chip's heat transfer efficiency.
[0083] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0084] It will be readily apparent to those skilled in the art that any combination of the above embodiments is feasible. Therefore, any combination of the above embodiments is an implementation scheme of this utility model. However, due to space limitations, this specification will not describe them in detail here.
[0085] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.
[0086] Similarly, it should be understood that, in order to simplify the present invention and aid in understanding one or more of the various aspects of the invention, in the description of exemplary embodiments of the present invention above, various features of the present invention are sometimes grouped together in a single embodiment, figure, or description thereof.
[0087] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.
Claims
1. A ceramic package structure, characterized by, The ceramic encapsulation structure includes: A first ceramic substrate has upper core cavities formed on its two end faces, wherein the upper core cavities are shaped to fit the chip, and a conductive channel is also provided in the first ceramic substrate, wherein the conductive channel is connected to the upper core cavity. A metal pillar, which is embedded in the conductive channel and is used to electrically connect to the chip; A first metal-clad ceramic substrate and a second metal-clad ceramic substrate are respectively attached to the two end faces of the first ceramic substrate for electrical connection with the chip.
2. The ceramic package structure of claim 1, wherein, When the number of the first ceramic substrates is at least two, the ceramic packaging structure further includes: At least one double-layer metal-coated ceramic substrate, wherein the double-layer metal-coated ceramic substrate is disposed between two adjacent first ceramic substrates.
3. The ceramic packaging structure of claim 1, wherein, A first mounting hole is provided on the end face of the first ceramic substrate near the first metal-clad ceramic substrate; The ceramic packaging structure further includes a first connecting layer, which is located in the first mounting hole and is used to weld to the first metal-coated ceramic substrate.
4. The ceramic package structure of claim 3, wherein, The number of the first mounting holes is at least two, and the at least two first mounting holes are respectively located near the two side edges of the first ceramic substrate.
5. The ceramic packaging structure according to claim 1, characterized in that, A second mounting hole is provided on the end face of the first ceramic substrate near the second metal-clad ceramic substrate; The ceramic packaging structure further includes a second connecting layer located in the second mounting hole for welding to the second metal-clad ceramic substrate.
6. The ceramic packaging structure of claim 5, wherein, The number of the second mounting holes is at least two, and the at least two second mounting holes are respectively located near the two side edges of the first ceramic substrate.
7. An intelligent power module, characterized by The intelligent power module includes: The ceramic encapsulation structure as described in any one of claims 1-6; A chipset, wherein at least two chips are disposed within the upper core cavity and conform to the shape of the upper core cavity, wherein the chips are electrically connected to the first metal-clad ceramic substrate and the second metal-clad ceramic substrate, respectively.
8. The intelligent power module according to claim 7, characterized in that The chipset includes a control chip and a power chip, with the power chip and the control chip located on opposite ends of the first ceramic substrate.
9. The intelligent power module according to claim 8, characterized in that The intelligent power module includes a first solder layer, wherein the first solder layer fills the end face of the control chip away from the first ceramic substrate, for soldering to the first metal-clad ceramic substrate or the second metal-clad ceramic substrate.
10. The intelligent power module according to claim 8, characterized by The intelligent power module includes a second solder layer, which fills the end face of the power chip away from the first ceramic substrate, for soldering to the first metal-clad ceramic substrate or the second metal-clad ceramic substrate.