Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel, an adhesive layer and a directional sound emitting device. The display panel comprises a first substrate and a light emitting device layer which are arranged in a stack. The adhesive layer is arranged on a side of the first substrate away from the light emitting device layer. The directional sound emitting device is arranged on a side of the adhesive layer away from the display panel. The directional sound emitting device comprises a second substrate, a first electrode, a plurality of support columns, a second electrode and a third substrate which are arranged in sequence away from the adhesive layer. The first electrode, the plurality of support columns and the second electrode jointly define a plurality of vibration cavity structures.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the development of display technology, consumers are not only demanding high-quality and clear images from display devices, but are also increasingly focusing on sound output effects. They tend to prefer display devices that can achieve perfect integration of sound and image, seamlessly blending the displayed image with the played sound. Utility Model Content

[0003] This application provides a display module and display device that can improve the yield rate.

[0004] In a first aspect, embodiments of this application provide a display module, including: The display panel includes a first substrate and a light-emitting device layer stacked together. An adhesive layer is disposed on the side of the first substrate opposite to the light-emitting device layer; and, A directional sound-emitting device is disposed on the side of the adhesive layer away from the display panel, and includes a second substrate, a first electrode, a plurality of support pillars, a second electrode and a third substrate stacked sequentially away from the adhesive layer. The first electrode, the plurality of support pillars and the second electrode together define a plurality of cavity structures.

[0005] Secondly, embodiments of this application provide a display module, including: Display panel, A directional sound-emitting device is disposed on one side of the backlight surface of a display panel, comprising a second substrate, a first electrode, a plurality of support pillars, a second electrode and a third substrate stacked sequentially away from the display panel, wherein the first electrode, the plurality of support pillars and the second electrode together define a plurality of cavity structures. The thickness of the third substrate is greater than that of the second substrate.

[0006] In some embodiments, the second substrate and the first electrode constitute a first component of the directional sound-emitting device; The third substrate, the second electrode, and multiple support pillars constitute the second component of the directional sound-emitting device.

[0007] Thirdly, embodiments of this application provide a display device, which includes the display module in any of the foregoing embodiments.

[0008] This application provides a display module and display device. The display module utilizes a second substrate and a third substrate to independently form two structural components of a directional sound-emitting device relative to the display panel. These components are then fixed together through bonding and adhesion. Based on this, the directional sound-emitting device can be located on the backlight surface of the display panel, and there is no need to fabricate conductor structures on both sides of the first substrate. This improves the yield rate of the display module and reduces the adverse effects of the directional sound-emitting device on the display effect, as well as the adverse effects of the light-emitting device layer on the structural design of the directional sound-emitting device.

[0009] Furthermore, this design can form a cavity after the display panel and the directional sound-emitting device are fixed together, thereby improving the adverse effects of the bonding design between the display panel and the directional sound-emitting device on the cavity structure and improving the reliability of the directional sound-emitting device. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a cross-sectional structural diagram of a display module provided in an embodiment of this application; Figure 2 This is a schematic diagram illustrating the positional relationship between the first electrode, the display panel, and the support column in a display module according to an embodiment of this application. Figure 3 This is a cross-sectional structural diagram of the first component in a display module provided in an embodiment of this application; Figure 4 This is a cross-sectional structural diagram of a second component in a display module provided in an embodiment of this application; Figure 5 This is a cross-sectional structural diagram of a display panel in a display module provided in an embodiment of this application; Figure 6 This is a top view of another display module provided in an embodiment of this application; Figure 7 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 8 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 9 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 10This is a cross-sectional structural diagram of the second component in a display module provided in an embodiment of this application; Figure 11 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 12 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 13 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 14 This is a top view of another display module provided in an embodiment of this application; Figure 15 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 16 This is a cross-sectional structural diagram of another display module provided in an embodiment of this application; Figure 17 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment of this application; Figures 18a to 18e This is a schematic diagram of the process structure of a method for manufacturing a display module provided in an embodiment of this application; Figure 19 This is a flowchart illustrating another method for manufacturing a display module provided in this application embodiment; Figure 20a and Figure 20b This is a schematic diagram of the process structure of another method for manufacturing a display module provided in this application embodiment; Figure 21a and Figure 21b This is a schematic diagram of the process structure of another method for manufacturing a display module provided in this application embodiment; Figures 22a to 22d This is a schematic diagram of the process structure of another method for manufacturing a display module provided in this application embodiment; Figure 23a and Figure 23b This is a schematic diagram of the process structure of another method for manufacturing a display module provided in this application embodiment; Figure 24 This is a schematic diagram of the process structure of another method for manufacturing a display module provided in this application embodiment; Figure 25 This is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0012] Marker explanation: 100. Display module; 200. Display device; 10. Display panel; 11. First substrate; 12. Light-emitting device layer; 121. Light-emitting structure; 13. Array layer; 131. Pixel circuit; 20. Directional sound-emitting device; 21. Second substrate; 22. First electrode; 221. Electrode body; 222. Auxiliary electrode; 223. First sub-electrode; 224. Second sub-electrode; 23. Support column; 24. Second electrode; 25. Third substrate; 26. Vibration cavity structure; 27. Adhesive part; 28. First insulating layer; 29. ​​Second insulating layer; 30. Adhesive layer; 41. Cover plate; 42. Optical adhesive layer; 43. Polarizing layer; 44. Touch layer; 45. Support layer; 46. Heat dissipation layer; 47. Encapsulation layer; 51. First substrate; 52. Second substrate; 53. First protective layer; 54. Second protective layer; A1, Zone 1; A2, Zone 2; A3, Bend Zone; A4, Non-Bend Zone; J1, First Component; J2, Second Component; X, first direction; Y, thickness direction. Detailed Implementation

[0013] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0014] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0015] Firstly, please refer to Figure 1This application provides a display module 100, which includes a display panel 10, an adhesive layer 30, and a directional sound-emitting device 20. The display panel 10 includes a first substrate 11 and a light-emitting device layer 12 stacked together. The adhesive layer 30 is disposed on the side of the first substrate 11 away from the light-emitting device layer 12, and the directional sound-emitting device 20 is disposed on the side of the adhesive layer 30 away from the display panel 10. The directional sound-emitting device 20 includes a second substrate 21, a first electrode 22, a plurality of support pillars 23, a second electrode 24, and a third substrate 25 arranged sequentially away from the adhesive layer 30. The first electrode 22, the plurality of support pillars 23, and the second electrode 24 together define a plurality of cavity structures 26.

[0016] The display module 100 is used in subsequent fabrication to form a display device. The display panel 10 is the core component of the display module 100. The display panel 10 includes a first substrate 11 and a light-emitting device layer 12. The first substrate 11 supports the light-emitting device layer 12, which is the main structure in the display panel 10 that provides the light-emitting display effect. This application does not limit the specific light-emitting form of the display panel 10. For example, the light-emitting device layer 12 may include organic light-emitting materials to achieve an organic light-emitting display effect. Alternatively, the light-emitting device layer 12 may include micro-light-emitting diodes to achieve a micro-light-emitting display effect.

[0017] It should be noted that, in addition to the first substrate 11 and the light-emitting device layer 12, the display panel 10 may also include multiple film layer structures. The specific film layer composition of the display panel 10 is not limited in the embodiments of this application. Optionally, the display panel 10 may also include an array layer 13, an encapsulation layer 47, and a touch layer 44, etc.

[0018] The directional sound-generating device 20 enables directional audio transmission. Based on the parametric array principle, it uses ultrasound as the carrier signal and leverages the unique nonlinear effect of ultrasound to generate highly directional audible sound. This achieves spatial distribution control and source location control of audible sound waves propagating through the air. After propagating a certain distance, the audio signal is demodulated, forming a highly directional audible sound signal, thus achieving the effect of directional audio signal propagation.

[0019] The directional sound-emitting device 20 is disposed on the side of the first substrate 11 away from the light-emitting device layer 12, that is, the directional sound-emitting device 20 is disposed on the backlight side of the display panel 10. In the directional sound-emitting device 20, the support column 23 is sandwiched between the first electrode 22 and the second electrode 24 so that the three together define a cavity structure 26. The first electrode 22 is fixed to the second substrate 21. The second substrate 21 is fixed to the display panel 10 by the adhesive layer 30. The second substrate 21, the adhesive layer 30 and the display panel 10 together constitute a diaphragm to change the propagation path of the sound wave and realize the directional propagation of the sound.

[0020] It should be noted that the specific dimensions and shape of the support column 23, as well as the arrangement of multiple support columns, are not limited in this embodiment. Optionally, please refer to... Figure 2 The figure shows the positional relationship between the support column 23, the first electrode 22, and the display panel 10 in one embodiment. The support column 23 is cylindrical, and multiple support columns 23 are arranged in an array. The first electrode 22, the second electrode 24, and some adjacent support columns 23 together define a cavity structure 26, and the different cavity structures 26 are interconnected.

[0021] In related technologies, the directional sound-emitting device 20 is disposed on the light-emitting side of the display panel 10, that is, the directional sound-emitting device 20 is located on the side of the light-emitting device layer 12 away from the first substrate 11. This is because the directional sound-emitting device 20 includes a resonant cavity. If the directional sound-emitting device 20 and the display panel 10 are fabricated independently and then bonded together, the resonant cavity is prone to deformation due to bonding stress and other factors during the bonding process, which affects the reliability of sound emission. Therefore, the formation of the directional sound-emitting device 20 often requires the display panel 10. In this case, the first substrate 11 needs to be formed first. Since both the display panel 10 and the directional sound-emitting device 20 include conductive structures, if the directional sound-emitting device 20 is located on the backlight side of the display panel 10, conductive structures need to be formed on both sides of the first substrate 11. However, for existing manufacturing processes, the yield rate of the scheme with conductive structures formed on both sides is low, making it difficult to achieve large-scale mass production. Therefore, the directional sound-emitting device 20 is often located on the light-emitting side of the display panel 10. However, this approach can negatively impact the display effect, such as making the support pillar 23 visible, creating a boundary of different refractive indices due to the cavities, leading to total internal reflection, or affecting the transmittance of the display module 100, causing a decrease in brightness. Furthermore, to meet display requirements, the directional sound-emitting device 20 may need to avoid at least part of the structure in the light-emitting device layer 12, which will also affect the size of the directional sound-emitting device 20 and thus its performance.

[0022] To improve the above problems, this application embodiment changes the film layer composition in the display module 100 and adjusts the corresponding preparation process, so that the directional sound-emitting device 20 is located on the backlight side of the display panel 10, thereby meeting the preparation requirements of the display module 100 while reducing the adverse effects of the directional sound-emitting device 20 on the display effect and the adverse effects of the light-emitting device layer 12 on the size of the directional sound-emitting device 20.

[0023] Specifically, the second substrate 21 is located on the side of the first electrode 22 facing the display panel 10. The second substrate 21 can meet the preparation requirements of the first electrode 22. That is, in the preparation process, the second substrate 21 is formed first, and then the first electrode 22 is formed on one side of the second substrate 21. Thus, the preparation of the second substrate 21 and the first electrode 22 does not require the first substrate 11 in the display panel 10.

[0024] The third substrate 25 is located on the side of the second electrode 24 away from the display panel 10. The third substrate 25 can meet the preparation requirements of the second electrode 24. That is, in the preparation process, the third substrate 25 is formed first, and then the second electrode 24 is formed on one side of the third substrate 25. Thus, the preparation of the third substrate 25 and the second electrode 24 does not require the first substrate 11 in the display panel 10.

[0025] Based on the above, it can be seen that the first electrode 22 and the second electrode 24 are formed independently by means of the second substrate 21 and the third substrate 25, respectively. The fabrication of the two electrode structures does not require the use of the first substrate 11 in the display panel 10, that is, there is no need to form other conductor structures on the side of the first substrate 11 away from the light-emitting device layer 12, which helps to improve the yield of the display module 100.

[0026] Furthermore, to meet the need for fixing the directional sound-emitting device 20 to the display panel 10, this embodiment of the application also adds an adhesive layer 30. The adhesive layer 30 is located between the first substrate 11 and the second substrate 21 to achieve the bonding and fixing of the display panel 10 and the directional sound-emitting device 20. The adhesive layer 30 can be directly in contact with the first substrate 11, or other film layers can be included between the adhesive layer 30 and the first substrate 11. The relationship between the adhesive layer 30 and the second substrate 21 is similar. This embodiment of the application does not limit this, as long as the adhesive layer 30 can achieve the relative fixing of the display panel 10 and the directional sound-emitting device 20.

[0027] It should be noted that the method of forming the support post 23 is not limited in this application embodiment. For example, the support post 23 can be formed on the first electrode 22, that is, after the first electrode 22 is formed, the support post 23 is formed on the side of the first electrode 22 away from the second substrate 21. Alternatively, the support post 23 can be formed on the second electrode 24, that is, after the second electrode 24 is formed, the support post 23 is formed on the side of the second electrode 24 away from the third substrate 25.

[0028] Next, this application embodiment will describe the fabrication process of the display module 100. During the fabrication process, functional film layers such as a light-emitting device layer 12 can be formed on one side of the first substrate 11 to independently form the display panel 10. A first electrode 22 is formed on one side of the second substrate 21 to independently form a portion of the structure of the directional sound-emitting device 20. A second electrode 24 is formed on the third substrate 25 to independently form the remaining portion of the structure of the directional sound-emitting device 20. In this process, the support pillar 23 can be optionally formed on the first electrode 22 to be formed together with the second substrate 21 and the first electrode 22, or it can be optionally formed on the second electrode 24 to be formed together with the third substrate 25 and the second electrode 24.

[0029] The first substrate 11 and the second substrate 21 are then fixed together using adhesive layer 30 to achieve relative fixation between a portion of the directional sound-emitting device 20 and the display panel 10. Finally, the second electrode 24 is bonded and fixed to the first electrode 22, thereby defining and forming a vibration cavity. This design allows the vibration cavity to be formed after the display panel 10 and the directional sound-emitting device 20 are bonded together, thereby mitigating the adverse effects of the bonding design between the display panel 10 and the directional sound-emitting device 20 on the vibration cavity structure 26 and improving the reliability of the directional sound-emitting device 20.

[0030] In summary, in this embodiment, the display module 100 utilizes the second substrate 21 and the third substrate 25 to allow both structural components of the directional sound-emitting device 20 to be formed independently relative to the display panel 10, and then achieves relative fixation between the three components through bonding and adhesive methods. Based on this, the directional sound-emitting device 20 can be located on the backlight surface of the display panel 10, and it is not necessary to fabricate conductor structures on both sides of the first substrate 11, thereby improving the yield rate of the display module 100 and reducing the adverse effects of the directional sound-emitting device 20 on the display effect and the adverse effects of the light-emitting device layer 12 on the structural design of the directional sound-emitting device 20.

[0031] Furthermore, this design can form a cavity after the display panel 10 and the directional sound-emitting device 20 are fixed together, thereby improving the adverse effects of the bonding design between the display panel 10 and the directional sound-emitting device 20 on the cavity structure 26 and improving the reliability of the directional sound-emitting device 20.

[0032] In some embodiments, please refer to Figures 1 to 4 The second substrate 21 and the first electrode 22 constitute the first component J1 of the directional sound-emitting device 20, and the third substrate 25, the second electrode 24, and the plurality of support pillars 23 constitute the second component J2 of the directional sound-emitting device 20. In other words, during the fabrication process, the support pillars 23 are formed on the second electrode 24 to form a part of the structure of the directional sound-emitting device 20 together with the third substrate 25 and the second electrode 24.

[0033] In this embodiment, the first component J1, the second component J2, and the display panel 10 are formed independently. The first component J1 is then bonded and fixed to the display panel 10, and the second component J2 is then connected and fixed to the first component J1. This allows the directional sound-emitting device 20 to be located on the backlight side of the display panel 10, reducing the mutual influence between the directional sound-emitting device 20 and the light-emitting device layer 12, thus balancing the structural integrity of the directional sound-emitting device 20 and the display effect of the display module 100. Furthermore, it allows the vibration cavity to be formed after the display panel 10 and the first component J1 are bonded, thereby improving the structural reliability of the vibration cavity and enhancing the directional sound-emitting effect of the display module 100.

[0034] Furthermore, by positioning the support column 23 outside the first component J1, the adverse effects of the bonding process between the display panel 10 and the first component J1 on the support column 23 are reduced, and the risk of relative positional changes between different support columns 23 is reduced, thereby further improving the structural reliability of the cavity and enhancing the directional sound emission effect of the display module 100.

[0035] In some embodiments, the thickness of the second substrate 21 is less than the thickness of the third substrate 25. Here, "thickness" refers to the maximum thickness, that is, the maximum thickness of the second substrate 21 is less than the maximum thickness of the third substrate 25.

[0036] The second substrate 21 is located on the side of the first electrode 22 facing the display panel 10. Besides supporting the first electrode 22 to meet the independent fabrication requirements of the first electrode 22, the second substrate 21 also forms a diaphragm together with other film layers during the operation of the display module 100 to meet the needs of directional sound generation. Furthermore, the thickness of the second substrate 21 affects the thickness of the diaphragm, and during directional sound generation, the diaphragm thickness affects the sound propagation effect. If the diaphragm is too thick, it will reduce the transient response, leading to problems such as sound delay.

[0037] Therefore, in this embodiment of the application, the thickness of the second substrate 21 is reduced so that the thickness of the second substrate 21 is less than the thickness of the third substrate 25, thereby reducing the overall thickness of the diaphragm, thus meeting the vibration requirements of directional sound generation, improving the response rate, and reducing sound delay.

[0038] In some embodiments, the thickness of the first substrate 11 is greater than the thickness of the second substrate 21. Here, "thickness" refers to the maximum thickness, that is, the maximum thickness of the first substrate 11 is greater than the maximum thickness of the second substrate 21.

[0039] The first substrate 11 can support part of the film layer structure in the display panel 10. Its thickness and dimensions often need to take into account many factors, so it is difficult to change. Depending on the actual needs, the first substrate 11 can be a single-layer structure, that is, the first substrate 11 includes only a single film layer, or the first substrate 11 can be a multi-layer structure, that is, the first substrate 11 includes multiple stacked film layers.

[0040] In this embodiment, the thickness of the second substrate 21 is further limited to be less than that of the first substrate 11, making the second substrate 21 an ultra-thin substrate. This reduces the overall thickness of the diaphragm, thereby meeting the vibration requirements for directional sound generation, improving the response rate, and reducing sound delay.

[0041] In some embodiments, the second substrate 21 is a single-layer structure, that is, the second substrate 21 includes only a single film layer. This design helps to further reduce the thickness of the second substrate 21.

[0042] In some embodiments, such as Figure 3 As shown, the thickness of the second substrate 21 is H1, which satisfies: 8μm ≤ H1 ≤ 16μm. For example, H1 is one of 8μm, 10μm, 12μm, 14μm, and 16μm.

[0043] In this embodiment, by setting the thickness H1 of the second substrate 21 to no more than 16 μm, the adverse effect of the presence of the second substrate 21 on the overall thickness of the diaphragm is reduced, thereby improving the response rate and reducing sound delay. Furthermore, the thickness H1 of the second substrate 21 is set to no less than 8 μm to meet the support requirements of the second substrate 21 for the first electrode 22. This design can balance the response rate of directional sound generation with the molding requirements of independently fabricating the first electrode 22.

[0044] In some alternative embodiments, the thickness of the second substrate 21 is less than the thickness of the adhesive layer 30.

[0045] In this embodiment, by setting the thickness of the second substrate 21 to be less than the thickness of the adhesive layer 30, the overall thickness of the diaphragm is reduced by the ultra-thin design of the second substrate 21, thereby improving the response rate of directional sound generation. On the other hand, the adhesive material in the adhesive layer 30 can be used to help adjust the damping coefficient of the diaphragm, thereby rapidly attenuating residual vibrations, reducing stray sound interference, and improving directional performance.

[0046] In some embodiments, such as Figure 1As shown, the display module 100 further includes a cover plate 41 disposed on the side of the light-emitting device layer 12 facing away from the first substrate 11. In the thickness direction Y of the display module 100, the distance between the surface of the cover plate 41 facing away from the first substrate 11 and the surface of the first electrode 22 facing the first substrate 11 is H2, where H2 ≤ 200 μm. Exemplarily, H2 is one of 100 μm, 120 μm, 150 μm, 160 μm, 180 μm, and 200 μm.

[0047] The cover plate 41 is disposed on the side of the display panel 10 away from the directional sound-emitting device 20, that is, the cover plate 41 is located on the light-emitting side of the display panel 10, and the cover plate 41 can cover and protect the display panel 10. For directional sound emission, the cover plate 41 and the film layer located between the first electrode 22 and the cover plate 41 can together form a diaphragm, and the distance H2 is the thickness of the diaphragm. Therefore, in this embodiment, the second substrate 21 is thinned so that the distance H2 is no greater than 200 μm, meeting the vibration requirements of directional sound emission, improving the response rate, and reducing sound delay.

[0048] In some embodiments, please refer to Figure 5 The light-emitting device layer 12 includes organic light-emitting materials. In other words, the display panel 10 is an organic light-emitting display panel 10.

[0049] Compared to other types of display panels 10, such as liquid crystal display panels 10, organic light-emitting materials constitute multiple structures in the organic light-emitting display panel 10, excluding the backlight module. Therefore, it can achieve a thinner and lighter design, meeting the thickness requirements of the diaphragm. Furthermore, organic light-emitting materials are solid materials; compared to liquid or crystalline soft materials, solid materials have better sound transmission performance and correspondingly lower sound loss. Therefore, in this embodiment, the light-emitting device layer 12 includes organic light-emitting materials, achieving an innovative combination of the organic light-emitting display panel 10 and the directional sound-emitting device 20. This not only helps improve the response rate of directional sound emission but also helps reduce sound loss during directional sound transmission, thereby improving sound quality.

[0050] In some embodiments, the first substrate 11 includes a flexible material. By providing the first substrate 11 with a flexible material, the flexible display or foldable display requirements of the display module 100 can be met. Optionally, the material of the first substrate 11 includes polyimide.

[0051] During the manufacturing process of the display module 100, since the first substrate 11 includes a flexible material, the first substrate 11 often cannot be directly manufactured. It needs to be formed on an additional substrate by means of coating or other methods. Then, multiple film layer structures such as the light-emitting device layer 12 are formed on the side of the first substrate 11 away from the additional substrate to form the display panel 10. Then, the first substrate 11 is separated from the additional substrate.

[0052] In this case, the side of the first substrate 11 facing away from the light-emitting device layer 12 will experience local warping after it is separated from the additional substrate. Based on this, if the first electrode 22 is directly formed on the side of the first substrate 11 facing away from the light-emitting device layer 12, it will be difficult to form the first electrode 22 due to the uneven surface of the first substrate 11, which will lead to increased manufacturing costs and reduced yield.

[0053] In view of this, the embodiments of this application change the composition of the film layer of the display module 100 and adjust the manufacturing process so that the first electrode 22 is not directly formed on the first substrate 11, but first forms the first component J1 together with the second substrate 21, and then the first component J1 is bonded and fixed to the display panel 10. The bonding process often has low requirements for the flatness of the surface of the first substrate 11. Therefore, this design can improve the manufacturing yield and help reduce the manufacturing cost.

[0054] In some embodiments, please refer to Figure 6 The display module 100 includes a first region A1 and a second region A2 surrounding the first region A1. A light-emitting device layer 12 is located within the first region A1, and a directional sound-emitting device 20 is at least partially located within the first region A1. Figure 5 In the diagram, the boundary between the first zone A1 and the second zone A2 is indicated by a dashed line.

[0055] The first area A1 is the display area of ​​the display module 100, and the second area A2 is the non-display area of ​​the display module 100, with the second area A2 surrounding the first area A1. Optionally, the shapes of the first area A1 and the second area A2 are matched. For example, the first area A1 has a circular structure, while the second area A2 has a ring structure. Alternatively, the first area A1 can have a square structure, while the second area A2 has a square ring structure.

[0056] The light-emitting device layer 12 is located in the first region A1. Since the directional sound-emitting device 20 is located on the backlight side of the display panel 10, the directional sound-emitting device 20 has little impact on the light emission effect of the light-emitting device layer 12. Therefore, the directional sound-emitting device 20 does not need to avoid the light-emitting device layer 12. Based on this, in this embodiment, the directional sound-emitting device 20 is at least partially located in the first region A1, that is, the directional sound-emitting device 20 and the light-emitting device layer 12 are overlapped in the thickness direction Y of the display module 100. This allows at least a portion of the directional sound-emitting device 20 to be located in the central area of ​​the display module 100, thereby reducing the volume difference caused by different placement positions of the display module 100 and improving the user experience.

[0057] It should be noted that the directional sound-emitting device 20 may be entirely located within the first region A1, or it may be only partially located within the first region A1. This embodiment of the application does not impose any limitations on this. Optionally, the directional sound-emitting device 20 may be partially located within the first region A1 and partially located within the second region A2. This design helps to increase the overall size of the directional sound-emitting device 20, thereby improving the sound emission performance of the display module 100.

[0058] also, Figure 1 The structure shown is only to illustrate the stacking method between different film layers, and does not constitute a limitation on the orthographic projection relationship of different film layers on the first substrate 11.

[0059] In some embodiments, such as Figures 1 to 5 As shown, the display module 100 also includes an array layer 13 disposed between the light-emitting device layer 12 and the first substrate 11. The light-emitting device layer 12 includes a plurality of light-emitting structures 121, and the array layer 13 includes a plurality of pixel circuits 131. Different pixel circuits 131 drive different light-emitting structures 121 to emit light.

[0060] The array layer 13 is the core control layer in the display panel 10. The array layer 13 includes a semiconductor layer, multiple conductor layers, and an insulating layer located between adjacent conductor layers or between adjacent conductor layers and a semiconductor layer. Multiple pixel circuits 131 are integrated within the array layer 13. The light-emitting device layer 12 includes multiple light-emitting structures 121. Different pixel circuits 131 are used to control different light-emitting structures 121 to achieve the light-emitting display function. Figure 5 Only one thin-film transistor in pixel circuit 131 is shown in the image.

[0061] In this embodiment, considering that the array layer 13 includes a conductor structure and the first electrode 22 is also a conductor structure, two substrate structures, a first substrate 11 and a second substrate 21, are provided between the array layer 13 and the first electrode 22. The array layer 13 and the first electrode 22 are fabricated independently by means of the two substrate structures, so that it is not necessary to form conductor structures on both sides of a single substrate structure, thereby reducing the fabrication cost and improving the fabrication yield.

[0062] In some embodiments, such as Figure 1 As shown, the display module 100 also includes a cover plate 41 disposed on the side of the light-emitting device layer 12 away from the first substrate 11, and an optical adhesive layer 42 located on the side of the cover plate 41 facing the first substrate 11.

[0063] Both the cover plate 41 and the optical adhesive layer 42 are located on the side of the display panel 10 away from the directional sound-emitting device 20. The optical adhesive layer 42 is located between the cover plate 41 and the display panel 10 to achieve bonding and fixation between the display panel 10 and the cover plate 41. Furthermore, during the bonding and fixation process between the display panel 10 and the cover plate 41, the display panel 10 will be subjected to stress compression. If the directional sound-emitting device 20 remains relatively fixed to the display panel 10 at this time, the stress will be transmitted from the display panel 10 to the directional sound-emitting device 20, thereby adversely affecting the cavity structure 26 and affecting the sound emission reliability of the display module 100.

[0064] However, in this embodiment, the film composition of the display module 100 is adjusted so that the first component J1 and the second component J2 in the directional sound-emitting device and the display panel 10 can be formed independently. Based on this, the first component J1 can be bonded to the display panel 10 first, and then the display panel 10 can be connected and fixed to the cover plate 41 through the optical adhesive layer 42. Finally, the first component J1 and the second component J2 are assembled. In this way, the cavity structure 26 has not yet been formed during the bonding process between the display panel 10 and the cover plate 41. Therefore, the cavity structure 26 will not be subjected to stress compression from the display panel 10, which helps to improve the structural reliability of the directional sound-emitting device 20.

[0065] It should be noted that, in addition to the aforementioned film layer structure, the display module 100 may also include various other film layer structures, and this application embodiment does not impose any limitations on this. Optionally, the display module 100 further includes a polarizing layer 43, which is located between the optical adhesive layer 42 and the light-emitting device layer 12. The polarizing layer 43 is a core optical component in the display panel 10 used to control the direction of light propagation. It can convert natural light into linearly polarized light and regulate the ability of light to penetrate the display module 100.

[0066] In some embodiments, please refer to Figure 7The display module 100 also includes a touch layer 44, which is located between the polarizing layer 43 and the light-emitting device layer 12.

[0067] In this embodiment, the directional sound-emitting device 20 is not located on the side of the touch layer 44 away from the first substrate 11. The touch layer 44 and the directional sound-emitting device 20 are located on different sides of the first substrate 11. This design makes the directional sound-emitting device 20 no longer block the touch layer 44, thereby helping to improve the touch accuracy of the display module 100.

[0068] In some embodiments, the thickness of the adhesive layer 30 is less than the thickness of the optical adhesive layer 42. Here, "thickness" refers to the maximum thickness, meaning that the maximum thickness of the adhesive layer 30 is less than the maximum thickness of the optical adhesive layer 42.

[0069] The adhesive layer 30 is an adhesive film layer used to fix the display panel 10 and the directional sound-emitting device 20 relative to each other. The optical adhesive layer 42 is an adhesive film layer used to fix the display panel 10 and the cover plate 41 relative to each other. In order to reduce the thickness of the diaphragm, the adhesive layer 30 in this embodiment is thinned so that the thickness of the adhesive layer 30 is less than the thickness of the optical adhesive layer 42. This reduces the adverse effect of the presence of the adhesive layer 30 on the diaphragm thickness, thereby meeting the vibration requirements of directional sound emission, improving the response rate, and reducing sound delay.

[0070] In some embodiments, the thickness of the adhesive layer 30 is H3, where H3 satisfies: 15μm ≤ H3 ≤ 25μm. For example, H3 is one of 15μm, 18μm, 20μm, 22μm, and 25μm.

[0071] In this embodiment, by setting the thickness H3 of the adhesive layer 30 to no more than 25 μm, the adverse effects of the adhesive layer 30 on the overall thickness of the diaphragm are reduced, thereby improving the response rate and reducing sound delay. Furthermore, the thickness H3 of the adhesive layer 30 is set to no less than 15 μm to meet the bonding requirements between the display panel 10 and the directional sound-emitting device 20, improving the positional reliability between them. This design balances the response rate of directional sound emission with the overall structural reliability of the display panel 10.

[0072] The specific material composition of the optical adhesive layer 42 and the adhesive layer 30 is not limited in the embodiments of this application; they may include the same material or different materials. Optionally, the adhesive layer 30 and the optical adhesive layer 42 may include the same material, which helps to reduce manufacturing costs.

[0073] In some embodiments, the cover plate 41 comprises a flexible material.

[0074] In this embodiment, by providing the cover plate 41 with a flexible material, it helps to realize the needs of flexible or foldable display. On the other hand, the flexible material in the cover plate 41 can help generate a larger sound pressure level (SPL) during the sound generation process. That is, the cover plate 41 can help increase the sound intensity or energy, thereby enhancing the sound generation effect.

[0075] In some embodiments, such as Figure 7 As shown, the display module 100 also includes an adhesive portion 27 disposed between the first electrode 22 and the second electrode 24 and located on the outer periphery of the support column 23.

[0076] As described above, the first electrode 22 and the second substrate 21 constitute the first component J1, and the second electrode 24, the second substrate 21, and the support pillar 23 also constitute the first component J1. After the first component J1 is bonded and fixed to the display panel 10, the second component J2 is then connected and fixed to the first component J1. However, during the connection and fixing process of the first component J1 and the second component J2, the contact area between the support pillar 23 and the first component J1 is relatively small due to the limited size of the support pillar 23. Therefore, if the connection and fixing of the first component J1 and the second component J2 is achieved solely through the contact between the support pillar 23 and the first component J1, it is easy to cause a risk of poor connection between the first component J1 and the second component J2.

[0077] In view of this, this embodiment adds an adhesive portion 27. The adhesive portion 27 and the support column 23 are both located between the first electrode 22 and the second electrode 24. The adhesive portion 27 enables the bonding and fixing of the first component J1 and the second component J2, thereby improving the relative positional reliability between them and enhancing the impact resistance of the display module 100. Furthermore, this embodiment also positions the adhesive portion 27 on the outer periphery of the plurality of support columns 23, so that the adhesive portion 27 is relatively located at the edge region, thereby reducing the adverse effects of the adhesive portion 27 on the cavity structure 26 formed by the first electrode 22, the second electrode 24, and the support column 23, and improving the directional sound emission performance.

[0078] The specific size and shape of the adhesive portion 27 are not limited in the embodiments of this application. Optionally, the adhesive portion 27 has a ring-shaped structure in the orthographic projection of the second substrate 21, that is, the adhesive portion 27 can be arranged to surround and enclose multiple support pillars 23, which can increase the size of the adhesive portion 27, thereby further improving the fixing reliability between the first component J1 and the second component J2.

[0079] Furthermore, the present application embodiment does not limit the positional relationship between the adhesive portion 27 and the first electrode 22 and the second electrode 24. Optionally, the orthographic projection of the adhesive portion 27 on the second substrate 21 is located within the orthographic projection of the first electrode 22 and the second electrode 24 on the second substrate 21. In this way, the adhesive portion 27 can completely contact and bond with the first component J1 and the second component J2, thereby improving the bonding effect of the adhesive portion 27 relative to the first component J1 and the second component J2.

[0080] In some embodiments, the display module 100 includes a first region A1 and a second region A2 located on the periphery of the first region A1, the light-emitting device layer 12 is located in the first region A1, and the adhesive portion 27 is located in the second region A2.

[0081] In this embodiment, the adhesive portion 27 is not located in the first region A1, but in the second region A2. This allows the directional sound-emitting device to form more support pillars 23 in the first region A1, thereby increasing the number of cavity structures 26 and helping to improve the directional sound-emitting effect.

[0082] In some embodiments, the first electrode 22 receives a constant voltage signal, and the second electrode 24 receives a variable voltage signal. The constant voltage signal refers to a signal whose voltage remains constant, while the variable voltage signal refers to a signal whose voltage changes.

[0083] During the operation of the display module 100, since the distance between the first electrode 22 and the array layer 13 in the display panel 10 is relatively close, if the signal voltage in the first electrode 22 changes, it is easy for the signal voltage in at least part of the conductor layer in the array layer 13 to change due to signal coupling, thereby causing display abnormalities and other problems.

[0084] Therefore, in this embodiment, the first electrode 22 is configured to receive a constant voltage signal, so that the signal voltage within the first electrode 22 remains constant. This reduces its influence on the signal coupling of at least a portion of the conductor layers in the array layer 13, reduces the risk of screen flicker, and improves the display accuracy of the display module 100. Furthermore, in this embodiment, the second electrode 24 is configured to receive a variable voltage signal, thereby meeting the control requirements of different sound wave signals and realizing directional sound generation. This design can balance the display accuracy of the display module 100 with the directional sound generation requirement.

[0085] In some embodiments, the first electrode 22 is grounded.

[0086] In this embodiment, the grounding configuration enables the first electrode to maintain a constant voltage, thereby reducing its influence on signal coupling to at least a portion of the conductor layers in the array layer 13 and improving display accuracy. Furthermore, by grounding the first electrode 22, a good conductive path is established, enabling electrostatic discharge and reducing the risk of circuit damage or breakdown in the display module 100, thus improving the operational reliability of the display module 100.

[0087] In some embodiments, the display module 100 further includes an array layer 13 disposed between the light-emitting device layer 12 and the first substrate 11. The light-emitting device layer 12 includes a plurality of light-emitting structures 121, and the array layer includes a plurality of pixel circuits 131. Different pixel circuits 131 drive different light-emitting structures 121 to emit light. The distance between the array layer 13 and the first electrode 22 in the thickness direction Y of the display module 100 is H4, where H4 ≤ 60 μm. Exemplarily, H4 is one of 40 μm, 45 μm, 50 μm, 55 μm, and 60 μm.

[0088] In this embodiment, by setting the distance H4 between the array layer 13 and the first electrode 22 to no more than 60 μm, the thickness of the diaphragm is reduced, thereby improving the response rate of directional sound generation. Furthermore, considering the relatively close distance between the array layer 13 and the first electrode 22, this embodiment also sets the first electrode 22 to receive a constant voltage signal, thereby reducing the signal coupling effect of the first electrode 22 on at least a portion of the conductor layers in the array layer 13, reducing the risk of screen flicker, and improving the display accuracy of the display module 100.

[0089] In some embodiments, please refer to Figure 8 The display module 100 also includes a first insulating layer 28 disposed between the first electrode 22 and the second electrode 24.

[0090] The first insulating layer 28 is a film structure comprising insulating material. The first insulating layer 28 is located between the first electrode 22 and the second electrode 24. The first insulating layer 28 can have various positional configurations, which are not limited in this embodiment. For example, in the thickness direction Y of the display module 100, at least a portion of the first insulating layer 28 is at the same height as the support pillar 23. Further, the orthographic projection of the first insulating layer 28 onto the second substrate 21 is located outside the orthographic projection of the support pillar 23 onto the second substrate 21. Alternatively, the first insulating layer 28 can be located on the side of the support pillar 23 facing or away from the second substrate 21.

[0091] In this embodiment of the application, by providing a first insulating layer 28 between the first electrode 22 and the second electrode 24, the first electrode 22 and the second electrode 24 are insulated and separated. This reduces the risk of the first electrode 22 and the second electrode 24 coming into contact due to vibration deformation when the directional sound-generating device 20 is vibrating, thereby improving the operational reliability of the directional sound-generating device 20.

[0092] In some embodiments, in the thickness direction Y of the display module 100, the first insulating layer 28 is located on one side of the support pillar 23, and the orthographic projection of the second substrate 21 of the support pillar 23 is located within the orthographic projection of the first insulating layer 28 on the second substrate 21.

[0093] This design helps to increase the size and area of ​​the first insulating layer 28, allowing it to cover a larger area of ​​at least one of the first electrode 22 and the second electrode 24. This further reduces the risk of short circuits between the first electrode 22 and the second electrode 24 due to vibration deformation, improving the operational reliability of the directional sound-emitting device 20. Furthermore, one of the first electrode 22 and the second electrode 24 can be spaced apart from the support column 23 via the first insulating layer 28. This allows the first insulating layer 28 to buffer the compressive stress exerted by the support column 23 on the electrode structure, improving the operational reliability of the electrode structure and extending the service life of the display module 100.

[0094] In some embodiments, please refer to Figure 9 and Figure 10 The first insulating layer 28 supports the pillar 23 on the side opposite to the second substrate 21.

[0095] In this embodiment, the third substrate 25, the second electrode 24, the first insulating layer 28, and the support pillar 23 constitute the second component J2. This design allows the support pillar 23 to be connected to the first insulating layer 28 instead of directly to the second electrode 24, thereby reducing the adverse effects of the formation and connection process of the support pillar 23 on the second electrode 24 and improving the product yield.

[0096] In some alternative embodiments, please refer to Figure 11 The display module 100 also includes a second insulating layer 29 disposed between the first electrode 22 and the second electrode 24. In the thickness direction Y of the display module 100, the first insulating layer 28 and the second insulating layer 29 are respectively disposed on both sides of the support column 23.

[0097] In some embodiments, the height of the support column 23 in the thickness direction Y of the display module 100 is H5, where H5 satisfies: 5μm ≤ H5 ≤ 20μm. For example, H5 is one of 5μm, 10μm, 15μm, and 20μm.

[0098] In this embodiment, by setting the height H5 of the support column 23 to be no less than 5 μm, the cavity structure 26 has a certain volume size, thereby enhancing the directional sound generation performance. Furthermore, the height H5 of the support column 23 is set to be no more than 20 μm to meet the vibration requirements of the cavity structure 26, thus demonstrating strong practicality.

[0099] In some embodiments, the dimension of the support column 23 in the first direction X is L1, where L1 satisfies: 100μm ≤ L1 ≤ 500μm, and the first direction X intersects the thickness direction Y. Optionally, the first direction X is perpendicular to the thickness direction Y. Exemplarily, L1 is one of 100μm, 200μm, 300μm, 400μm, and 500μm.

[0100] The support column 23 can have various shapes, such as cylindrical or prismatic, and this embodiment does not limit this. The dimension L1 of the support column 23 in the first direction X is the dimension of the support column 23 in the plane parallel to the third substrate 25. By setting L1 to not less than 100 μm, the support column 23 has a certain strength to meet the vibration requirements. At the same time, setting L1 to not more than 500 μm avoids the adverse effects of the support column 23 on the overall weight of the display module 100 and helps to form more cavity structures 26, thereby enhancing the directional sound emission performance.

[0101] The material composition of the support column 23 is not limited in this embodiment. Optionally, the material of the support column 23 may include organic adhesive.

[0102] In some embodiments, the sheet resistance of the first electrode 22 is R, where R ≤ 100 mΩ / sq. Exemplarily, R is one of 50 mΩ / sq, 60 mΩ / sq, 80 mΩ / sq, 90 mΩ / sq, and 100 mΩ / sq. Sheet resistance is a physical quantity that measures the resistance per unit area of ​​a thin film or thin layer of conductive material.

[0103] In some related technologies, the directional sound-emitting device 20 is located on the light-emitting side of the display panel 10. In order to meet the display requirements, the electrode structure in the directional sound-emitting device 20 needs to be made of a transparent conductive material such as indium tin oxide. However, this design will result in the electrode structure having a large resistance, which will make it have a low conductivity, thus causing problems such as sound emission delay.

[0104] However, in this embodiment, by changing the film composition of the display module 100 and the manufacturing process of the display module 100, the directional sound-emitting device 20 can be located on the backlight side of the display panel 10. Based on this, the material selection of the first electrode 22 does not need to consider factors such as transmittance. Furthermore, the first electrode 22 can be made of a material with low resistance, so that the sheet resistance R of the first electrode 22 is not greater than 100mΩ / sq, thereby improving the response rate corresponding to directional sound emission and improving the delay problem.

[0105] In some embodiments, the first electrode 22 has a non-transparent structure; further optionally, the first electrode 22 comprises a metallic material. This design helps to increase the conductivity of the first electrode 22, thereby improving the response rate corresponding to directional sound emission and mitigating delay issues.

[0106] The specific material composition of the first electrode 22 is not limited in the embodiments of this application. In some embodiments, the material of the first electrode 22 includes at least one of titanium, aluminum, silver, indium tin oxide, copper, nickel, molybdenum, chromium, iron, gold, indium, and gallium. Further optionally, the first electrode 22 includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer stacked together, i.e., the first electrode 22 is a three-layer composite structure composed of Ti-Al-Ti. Alternatively, the first electrode 22 includes a first indium tin oxide layer, a silver metal layer, and a second indium tin oxide layer stacked together, i.e., the first electrode 22 is a three-layer composite structure composed of ITO-Ag-ITO. Alternatively, the first electrode 22 includes a copper metal layer and a nickel metal layer stacked together, i.e., the first electrode 22 is a Cu-Ni bilayer composite structure. Alternatively, the first electrode 22 includes a first molybdenum metal layer, an aluminum metal layer, and a second molybdenum metal layer stacked together, i.e., the first electrode 22 is a three-layer composite structure composed of Mo-Al-Mo. The material designs mentioned above all help to reduce the resistance of the first electrode 22 and increase its conductivity, thereby improving the response rate of directional sound generation and mitigating the delay problem.

[0107] In some embodiments, please refer to Figure 12 The first electrode 22 includes an electrode body 221 and an auxiliary electrode 222 located on the side of the electrode body 221 away from the second substrate 21. The electrode body 221 has a body portion and an edge portion surrounding the periphery of the body portion, and the auxiliary electrode 222 is located on the edge portion.

[0108] The electrode body 221 is the main part of the first electrode 22 that performs the electrode function. The body portion is the main component of the electrode body 221, and the edge portion is located on the outer periphery of the body portion and is integrally connected to the body portion. The auxiliary electrode 222 is disposed on the edge portion and is stacked with the electrode body 221.

[0109] In this embodiment, the stacked arrangement of the electrode body 221 and the auxiliary electrode 222 helps to reduce the overall resistance of the first electrode 22, thereby increasing the conductivity of the first electrode 22, which in turn improves the response rate corresponding to directional sound emission and alleviates the delay problem. Furthermore, the auxiliary electrode 222 is disposed at the edge of the electrode body 221. In addition, the auxiliary electrode 222 can also be used to electrically connect with other signal traces and transmit the corresponding signals to the electrode body 221, thereby reducing the difficulty of signal transmission.

[0110] In some embodiments, please refer to Figure 13 The first electrode 22 includes a first sub-electrode 223 and a second sub-electrode 224 spaced apart. The orthographic projections of the first sub-electrode 223 and the second sub-electrode 224 on the second substrate 21 overlap with the orthographic projection of the second electrode 24 on the second substrate 21.

[0111] The first sub-electrode 223 and the second sub-electrode 224 are two independent electrode structures. Optionally, the first sub-electrode 223 and the second sub-electrode 224 are made of the same material. Based on this, the first sub-electrode 223 and the second sub-electrode 224 can be formed together in the same process, thereby simplifying the preparation process and reducing the preparation cost.

[0112] In this embodiment, by configuring the first electrode 22 to include two independent sub-electrodes, and having each sub-electrode overlap with the first electrode 22, both the first sub-electrode 223 and the second sub-electrode 224 can form an electric field with the second electrode 24, thereby achieving directional sound generation. This design helps to achieve a stereo surround sound effect, thereby improving the user's sensory experience.

[0113] In some embodiments, please refer to Figure 13 and Figure 14 The display module 100 has multiple non-bending areas A4 arranged side by side in the first direction X, and bending areas A3 located between adjacent non-bending areas A4. The first direction X intersects the thickness direction Y of the display module 100. The first sub-electrode 223 and the second sub-electrode 224 are spaced apart in the first direction X. The second sub-electrode 224 is located outside the bending area A3 and is located in different non-bending areas A4.

[0114] The display module 100 provided in this application embodiment can realize the folding display function. On this basis, the first sub-electrode 223 and the second sub-electrode 224 are respectively located in different non-bending areas A4 and both are located outside the bending area A3, so that when the display module 100 is folded and deformed, the first sub-electrode 223 and the second sub-electrode 224 will not deform accordingly, thereby improving the structural reliability of the first electrode 22. At the same time, the first electrode 22 can also be made of a material with high hardness and low resistance, thereby reducing the difficulty of material selection for the first electrode 22 and helping to reduce costs.

[0115] In some embodiments, please refer to Figure 15 The display module 100 also includes a support layer 45 disposed between the first substrate 11 and the adhesive layer 30.

[0116] As can be seen from the foregoing, the first substrate 11 can be formed on an additional substrate. After the display panel 10 is fabricated, the first substrate 11 needs to be separated from the additional substrate. Then, a support layer 45 can be formed on the side of the first substrate 11 away from the light-emitting device layer 12. The support layer 45 provides support for the first substrate 11. At the same time, the surface of the first substrate 11 is prone to warping due to separation from the additional substrate, while the surface of the support layer 45 is usually relatively flat. Therefore, by adding the support layer 45, it helps to reduce the bonding difficulty between the display panel 10 and the first component J1 in the subsequent bonding process, and improves the relative positional reliability between the display panel 10 and the directional sound-emitting device 20.

[0117] In some embodiments, the orthographic projection of the support layer 45 onto the first substrate 11 coincides with the orthographic projection of the adhesive layer 30 onto the first substrate 11. This design helps to increase the contact area between the support layer 45 and the adhesive layer 30, thereby further improving the relative positional reliability between the display panel 10 and the directional sound-emitting component.

[0118] In some embodiments, please refer to Figure 16 The display module 100 also includes a heat dissipation layer 46 disposed on the side of the third substrate 25 opposite to the second substrate 21.

[0119] In this embodiment, the heat dissipation layer 46 is disposed on the side of the directional sound-emitting device 20 away from the display panel 10. The heat dissipation layer 46 can provide a certain heat dissipation effect for the directional sound-emitting device 20, thereby improving the operating performance and enhancing its operational reliability. At the same time, by disposing the heat dissipation layer 46 on one side of the third substrate 25, it also helps to achieve the isolation and buffering requirements of the directional sound-emitting device 20 relative to the back plate structure in the display module 100, reducing the impact of external shocks on the directional sound-emitting device 20.

[0120] In some embodiments, the heat dissipation layer 46 includes an insulating material. In this design, the heat dissipation layer 46 not only provides heat dissipation and buffering but also acts as an electromagnetic shield, thereby reducing signal interference affecting the directional sound-emitting device 20 and improving its operational reliability.

[0121] Secondly, embodiments of this application provide a display module 100, which includes a display panel 10 and a directional sound-emitting device 20. The directional sound-emitting device 20 is disposed on the backlight side of the display panel 10 and includes a second substrate 21, a first electrode 22, a plurality of support pillars 23, a second electrode 24, and a third substrate 25 arranged sequentially away from the display panel 10. The first electrode 22, the plurality of support pillars 23, and the second electrode 24 together define a plurality of cavity structures 26. The thickness of the third substrate 25 is greater than the thickness of the second substrate 21.

[0122] The display module 100 is used in subsequent fabrication to form a display device, and the display panel 10 is the core component of the display module 100. This application does not limit the specific light emission form of the display panel 10. For example, the display panel 10 may include organic light-emitting materials to achieve an organic light-emitting display effect. Alternatively, the display panel 10 may include micro-light-emitting diodes to achieve a micro-light-emitting display effect.

[0123] The directional sound-generating device 20 enables directional audio transmission. Based on the parametric array principle, it uses ultrasound as the carrier signal and leverages the unique nonlinear effect of ultrasound to generate highly directional audible sound. This achieves spatial distribution control and source location control of audible sound waves propagating through the air. After propagating a certain distance, the audio signal is demodulated, forming a highly directional audible sound signal, thus achieving the effect of directional audio signal propagation.

[0124] A directional sound-emitting device 20 is disposed on the backlight side of the display panel 10. In the directional sound-emitting device 20, a support column 23 is sandwiched between the first electrode 22 and the second electrode 24 so that the three together define a vibration cavity. The first electrode 22 is fixed to the second substrate 21, and the second substrate 21 is fixed to the display panel 10. The second substrate 21 and the display panel 10 and other film structures together constitute a diaphragm to change the propagation path of the sound wave and realize the directional propagation of the sound.

[0125] In related technologies, the directional sound-emitting device 20 is disposed on the light-emitting side of the display panel 10. This is because the directional sound-emitting device 20 includes a resonant cavity. If the directional sound-emitting device 20 and the display panel 10 are fabricated independently and then bonded together, the resonant cavity is prone to deformation during the bonding process due to factors such as bonding stress, which affects the reliability of sound generation. Therefore, the formation of the directional sound-emitting device 20 often requires the support of the display panel 10. In this case, the first substrate 11 of the display panel 10 needs to be formed first. Since both the display panel 10 and the directional sound-emitting device 20 include conductive structures, if the directional sound-emitting device 20 is located on the backlight side of the display panel 10, conductive structures need to be formed on both sides of the first substrate 11. However, for existing manufacturing processes, the yield rate of the scheme with conductive structures formed on both sides is low, making large-scale mass production difficult. Therefore, the directional sound-emitting device 20 is often located on the light-emitting side of the display panel 10. However, this approach can negatively impact the display effect, such as causing the support pillar 23 to become visible, or creating an interface with different refractive indices due to the cavities, leading to total internal reflection, or affecting the transmittance of the display module 100, resulting in decreased brightness. Furthermore, to meet display requirements, the directional sound-emitting device 20 may need to avoid at least part of the structure of the light-emitting device layer 12 in the display panel 10, which will also affect the size of the directional sound-emitting device 20 and thus its performance.

[0126] To improve the above problems, this application embodiment changes the film layer composition in the display module 100 and adjusts the corresponding preparation process, so that the directional sound-emitting device 20 is located on the backlight side of the display panel 10, thereby meeting the preparation requirements of the display module 100 while reducing the adverse effects of the directional sound-emitting device 20 on the display effect and the adverse effects of the light-emitting device layer 12 on the size of the directional sound-emitting device 20.

[0127] Specifically, the second substrate 21 is located on the side of the first electrode 22 facing the display panel 10. The second substrate 21 can meet the preparation requirements of the first electrode 22. That is, in the preparation process, the second substrate 21 is formed first, and then the first electrode 22 is formed on one side of the second substrate 21. Thus, the preparation of the second substrate 21 and the first electrode 22 does not require the first substrate 11 in the display panel 10.

[0128] The third substrate 25 is located on the side of the second electrode 24 away from the display panel 10. The third substrate 25 can meet the preparation requirements of the second electrode 24. That is, in the preparation process, the third substrate 25 is formed first, and then the second electrode 24 is formed on one side of the third substrate 25. Thus, the preparation of the third substrate 25 and the second electrode 24 does not require the first substrate 11 in the display panel 10.

[0129] Based on the above, it can be seen that the first electrode 22 and the second electrode 24 are formed independently using the second substrate 21 and the third substrate 25, respectively. The fabrication of the two electrode structures does not require the use of the first substrate 11 in the display panel 10, that is, it is not necessary to form conductor structures on both sides of the first substrate 11, which helps to improve the yield of the display module 100.

[0130] Furthermore, besides supporting the first electrode 22 to meet the need for independent fabrication of the first electrode 22, the second substrate 21 also serves to form a diaphragm together with other film layers during the operation of the display module 100 to meet the requirements of directional sound generation. In this regard, the thickness of the second substrate 21 affects the thickness of the diaphragm, and during directional sound generation, the thickness of the diaphragm affects the sound propagation effect. If the diaphragm is too thick, it will reduce the transient response, leading to problems such as sound delay.

[0131] Therefore, in this embodiment of the application, the thickness of the second substrate 21 is reduced so that the thickness of the second substrate 21 is less than the thickness of the third substrate 25, thereby reducing the overall thickness of the diaphragm, thus meeting the vibration requirements of directional sound generation, improving the response rate, and reducing sound delay.

[0132] It should be noted that the method of forming the support post 23 is not limited in this application embodiment. For example, the support post 23 can be formed on the first electrode 22, that is, after the first electrode 22 is formed, the support post 23 is formed on the side of the first electrode 22 away from the second substrate 21. Alternatively, the support post 23 can be formed on the second electrode 24, that is, after the second electrode 24 is formed, the support post 23 is formed on the side of the second electrode 24 away from the third substrate 25.

[0133] Next, this application embodiment will describe the fabrication process of the display module 100. During the fabrication process, functional film layers such as a light-emitting device layer 12 can be formed on one side of the first substrate 11 to independently form the display panel 10. A first electrode 22 is formed on one side of the second substrate 21 to independently form a portion of the structure of the directional sound-emitting device 20. A second electrode 24 is formed on the third substrate 25 to independently form the remaining portion of the structure of the directional sound-emitting device 20. In this process, the support pillar 23 can be optionally formed on the first electrode 22 to be formed together with the second substrate 21 and the first electrode 22, or it can be optionally formed on the second electrode 24 to be formed together with the third substrate 25 and the second electrode 24.

[0134] The first substrate 11 and the second substrate 21 are then fixed to achieve relative fixation between a portion of the structure in the directional sound-emitting device 20 and the display panel 10. Finally, the second electrode 24 and the first electrode 22 are bonded and fixed to define and form a vibration cavity. This design allows the vibration cavity to be formed after the display panel 10 and the directional sound-emitting device 20 are bonded together, thereby mitigating the adverse effects of the bonding design between the display panel 10 and the directional sound-emitting device 20 on the vibration cavity structure 26 and improving the reliability of the directional sound-emitting device 20.

[0135] In summary, in this embodiment, the display module 100 utilizes the second substrate 21 and the third substrate 25 to allow both structural components of the directional sound-emitting device 20 to be formed independently relative to the display panel 10, and then achieves relative fixation between the three components through bonding and adhesive methods. Based on this, the directional sound-emitting device 20 can be located on the backlight surface of the display panel 10, and it is not necessary to fabricate conductor structures on both sides of the first substrate 11, thereby improving the yield rate of the display module 100 and reducing the adverse effects of the directional sound-emitting device 20 on the display effect and the adverse effects of the light-emitting device layer 12 on the structural design of the directional sound-emitting device 20.

[0136] Furthermore, this design allows for the formation of a vibration cavity after the display panel 10 and the directional sound-emitting device 20 are fixed together. This mitigates the adverse effects of the bonding design between the display panel 10 and the directional sound-emitting device 20 on the cavity structure 26, thereby improving the reliability of the directional sound-emitting device 20. In addition, this embodiment also features a thinning design for the second substrate 21, making its thickness less than that of the third substrate 25. This reduces the overall thickness of the diaphragm, thereby meeting the vibration requirements of directional sound emission, improving the response rate, and reducing sound delay.

[0137] In some embodiments, the second substrate 21 and the first electrode 22 constitute a first component J1 of the directional sound-emitting device 20, and the third substrate 25, the second electrode 24, and a plurality of support pillars 23 constitute a second component J2 of the directional sound-emitting device 20. In other words, during the fabrication process, the support pillars 23 are formed on the second electrode 24 to together with the third substrate 25 and the second electrode 24 to form a part of the structure of the directional sound-emitting device 20.

[0138] In this embodiment, the first component J1, the second component J2, and the display panel 10 are formed independently. The first component J1 is then connected and fixed to the display panel 10, and the second component J2 is then connected and fixed to the first component J1. This allows the directional sound-emitting device 20 to be located on the backlight side of the display panel 10, reducing the mutual interference between the directional sound-emitting device 20 and the display panel 10, while maintaining both the structural integrity of the directional sound-emitting device 20 and the display effect of the display module 100. Furthermore, the vibration cavity is formed after the display panel 10 and the first component J1 are bonded together, thereby improving the structural reliability of the vibration cavity and enhancing the directional sound-emitting effect of the display module 100.

[0139] Furthermore, by positioning the support column 23 outside the first component J1, the adverse effects of the bonding process between the display panel 10 and the first component J1 on the support column 23 are reduced, and the risk of relative positional changes between different support columns 23 is reduced, thereby further improving the structural reliability of the cavity and enhancing the directional sound emission effect of the display module 100.

[0140] In some embodiments, the display panel 10 includes a first substrate 11 and a light-emitting device layer 12 located on the side of the first substrate 11 opposite to the second substrate 21. The display module 100 also includes an adhesive layer 30 disposed between the first substrate 11 and the second substrate 21.

[0141] To meet the need for fixing the directional sound-emitting device 20 to the display panel 10, this embodiment of the application further provides an adhesive layer 30. The adhesive layer 30 is located between the first substrate 11 and the second substrate 21 to achieve the bonding and fixing of the display panel 10 and the directional sound-emitting device 20. The adhesive layer 30 can be directly in contact with the first substrate 11, or other film layers can be included between the adhesive layer 30 and the first substrate 11. The relationship between the adhesive layer 30 and the second substrate 21 is similar. This embodiment of the application does not limit this, as long as the adhesive layer 30 can achieve the relative fixing of the display panel 10 and the directional sound-emitting device 20.

[0142] In some embodiments, the thickness of the first substrate 11 is greater than the thickness of the second substrate 21. Here, "thickness" refers to the maximum thickness, that is, the maximum thickness of the first substrate 11 is greater than the maximum thickness of the second substrate 21.

[0143] The first substrate 11 can support part of the film layer structure in the display panel 10. Its thickness and dimensions often need to take into account many factors, so it is difficult to change. Depending on the actual needs, the first substrate 11 can be a single-layer structure, that is, the first substrate 11 includes only a single film layer, or the first substrate 11 can be a multi-layer structure, that is, the first substrate 11 includes multiple stacked film layers.

[0144] In this embodiment, the thickness of the second substrate 21 is further limited to be less than that of the first substrate 11, making the second substrate 21 an ultra-thin substrate. This reduces the overall thickness of the diaphragm, thereby meeting the vibration requirements for directional sound generation, improving the response rate, and reducing sound delay.

[0145] In some embodiments, the second substrate 21 is a single-layer structure, that is, the second substrate 21 includes only a single film layer. This design helps to further reduce the thickness of the second substrate 21.

[0146] In some embodiments, the thickness of the second substrate 21 is H1, where H1 satisfies: 8μm ≤ H1 ≤ 16μm. Exemplarily, H1 is one of 8μm, 10μm, 12μm, 14μm, and 16μm.

[0147] In this embodiment, by setting the thickness H1 of the second substrate 21 to no more than 16 μm, the adverse effect of the presence of the second substrate 21 on the overall thickness of the diaphragm is reduced, thereby improving the response rate and reducing sound delay. Furthermore, the thickness H1 of the second substrate 21 is set to no less than 8 μm to meet the support requirements of the second substrate 21 for the first electrode 22. This design can balance the response rate of directional sound generation with the molding requirements of independently fabricating the first electrode 22.

[0148] In some alternative embodiments, the thickness of the second substrate 21 is less than the thickness of the adhesive layer 30.

[0149] In this embodiment, by setting the thickness of the second substrate 21 to be less than the thickness of the adhesive layer 30, the overall thickness of the diaphragm is reduced by the ultra-thin design of the second substrate 21, thereby improving the response rate of directional sound generation. On the other hand, the adhesive material in the adhesive layer 30 can be used to help adjust the damping coefficient of the diaphragm, thereby rapidly attenuating residual vibrations, reducing stray sound interference, and improving directional performance.

[0150] In some embodiments, the display module 100 further includes a cover plate 41 disposed on the side of the light-emitting device layer 12 facing away from the first substrate 11. In the thickness direction Y of the display module 100, the distance between the surface of the cover plate 41 facing away from the first substrate 11 and the surface of the first electrode 22 facing the first substrate 11 is H2, where H2 ≤ 200 μm. Exemplarily, H2 is one of 100 μm, 120 μm, 150 μm, 160 μm, 180 μm, and 200 μm.

[0151] The cover plate 41 is disposed on the side of the display panel 10 away from the directional sound-emitting device 20, that is, the cover plate 41 is located on the light-emitting side of the display panel 10, and the cover plate 41 can cover and protect the display panel 10. For directional sound emission, the cover plate 41 and the film layer located between the first electrode 22 and the cover plate 41 can together form a diaphragm, and the distance H2 is the thickness of the diaphragm. Therefore, in this embodiment, the second substrate 21 is thinned so that the distance H2 is no greater than 200 μm, meeting the vibration requirements of directional sound emission, improving the response rate, and reducing sound delay.

[0152] In some embodiments, the display panel 10 includes a light-emitting device layer 12, which includes an organic light-emitting material. In other words, the display panel 10 is an organic light-emitting display panel 10.

[0153] Compared to other types of display panels 10, such as liquid crystal display panels 10, organic light-emitting materials constitute multiple structures in the organic light-emitting display panel 10, excluding the backlight module. Therefore, it can achieve a thinner and lighter design, meeting the thickness requirements of the diaphragm. Furthermore, organic light-emitting materials are solid materials; compared to liquid or crystalline soft materials, solid materials have better sound transmission performance and correspondingly lower sound loss. Therefore, in this embodiment, the light-emitting device layer 12 includes organic light-emitting materials, achieving an innovative combination of the organic light-emitting display panel 10 and the directional sound-emitting device 20. This not only helps improve the response rate of directional sound emission but also helps reduce sound loss during directional sound transmission, thereby improving sound quality.

[0154] In some embodiments, the first substrate 11 includes a flexible material. By providing the first substrate 11 with a flexible material, the flexible display or foldable display requirements of the display module 100 can be met. Optionally, the material of the first substrate 11 includes polyimide.

[0155] During the manufacturing process of the display module 100, since the first substrate 11 includes a flexible material, the first substrate 11 often cannot be directly manufactured. It needs to be formed on an additional substrate by means of coating or other methods. Then, multiple film layer structures such as the light-emitting device layer 12 are formed on the side of the first substrate 11 away from the additional substrate to form the display panel 10. Then, the first substrate 11 is separated from the additional substrate.

[0156] In this case, the side of the first substrate 11 facing away from the light-emitting device layer 12 will experience local warping after it is separated from the additional substrate. Based on this, if the first electrode 22 is directly formed on the side of the first substrate 11 facing away from the light-emitting device layer 12, it will be difficult to form the first electrode 22 due to the uneven surface of the first substrate 11, which will lead to increased manufacturing costs and reduced yield.

[0157] In view of this, the embodiments of this application change the composition of the film layer of the display module 100 and adjust the manufacturing process so that the first electrode 22 is not directly formed on the first substrate 11, but first forms the first component J1 together with the second substrate 21, and then the first component J1 is bonded and fixed to the display panel 10. The bonding process often has low requirements for the flatness of the surface of the first substrate 11. Therefore, this design can improve the manufacturing yield and help reduce the manufacturing cost.

[0158] In some embodiments, the display module 100 includes a first region A1 and a second region A2 surrounding the first region A1, the light-emitting device layer 12 is located in the first region A1, and the directional sound-emitting device 20 is at least partially located in the first region A1.

[0159] The first area A1 is the display area of ​​the display module 100, and the second area A2 is the non-display area of ​​the display module 100, with the second area A2 surrounding the first area A1. Optionally, the shapes of the first area A1 and the second area A2 are matched. For example, the first area A1 has a circular structure, while the second area A2 has a ring structure. Alternatively, the first area A1 can have a square structure, while the second area A2 has a square ring structure.

[0160] The light-emitting device layer 12 is located in the first region A1. Since the directional sound-emitting device 20 is located on the backlight side of the display panel 10, the directional sound-emitting device 20 has little impact on the light emission effect of the light-emitting device layer 12. Therefore, the directional sound-emitting device 20 does not need to avoid the light-emitting device layer 12. Based on this, in this embodiment, the directional sound-emitting device 20 is at least partially located in the first region A1, that is, the directional sound-emitting device 20 and the light-emitting device layer 12 are overlapped in the thickness direction Y of the display module 100. This allows at least a portion of the directional sound-emitting device 20 to be located in the central area of ​​the display module 100, thereby reducing the volume difference caused by different placement positions of the display module 100 and improving the user experience.

[0161] It should be noted that the directional sound-emitting device 20 may be entirely located within the first region A1, or it may be only partially located within the first region A1. This embodiment of the application does not impose any limitations on this. Optionally, the directional sound-emitting device 20 may be partially located within the first region A1 and partially located within the second region A2. This design helps to increase the overall size of the directional sound-emitting device 20, thereby improving the sound emission performance of the display module 100.

[0162] In some embodiments, the display module 100 further includes an array layer 13 disposed between the light-emitting device layer 12 and the first substrate 11. The light-emitting device layer 12 includes a plurality of light-emitting structures 121, and the array layer 13 includes a plurality of pixel circuits 131. Different pixel circuits 131 drive different light-emitting structures 121 to emit light.

[0163] The array layer 13 is the core control layer in the display panel 10. The array layer 13 includes a semiconductor layer, multiple conductor layers, and an insulating layer located between adjacent conductor layers or between adjacent conductor layers and a semiconductor layer. The array layer 13 integrates multiple pixel circuits 131, and the light-emitting device layer 12 includes multiple light-emitting structures 121. Different pixel circuits 131 are used to control different light-emitting structures 121 to achieve the light-emitting display function.

[0164] In this embodiment, considering that the array layer 13 includes a conductor structure and the first electrode 22 is also a conductor structure, two substrate structures, a first substrate 11 and a second substrate 21, are provided between the array layer 13 and the first electrode 22. The array layer 13 and the first electrode 22 are fabricated independently by means of the two substrate structures, so that it is not necessary to form conductor structures on both sides of a single substrate structure, thereby reducing the fabrication cost and improving the fabrication yield.

[0165] Thirdly, please refer to Figure 17 As shown in Figure 18, this application embodiment provides a method for manufacturing a display module 100, the method comprising: S100: Forms a display panel.

[0166] Please see Figure 18a In step S100, the display panel 10 includes a first substrate 11 and a light-emitting device layer 12 stacked together, wherein the first substrate 11 is formed before the light-emitting device layer 12, and the first substrate 11 provides support for the fabrication of the light-emitting device layer 12.

[0167] S110: Form the first component.

[0168] Please see Figure 18b In step S110, the first component J1 includes a second substrate 21 and a first electrode 22 stacked together, wherein the second substrate 21 is formed before the first electrode 22, and the second substrate 21 provides support for the fabrication of the first electrode 22. Optionally, the first electrode 22 can be formed by photolithography, that is, by sequentially forming multiple processes such as exposure, development, etching and stripping.

[0169] S120: Form the second component.

[0170] Please see Figure 18cIn step S120, the second component J2 includes a third substrate 25, a second electrode 24, and a plurality of support pillars 23 stacked together. The third substrate 25 is formed before the second electrode 24, and provides support for the fabrication of the second electrode 24. Optionally, the second electrode 24 can be formed using a photolithography process. The plurality of support pillars 23 are formed after the second electrode 24; optionally, the support pillars 23 can be formed using a photolithography process or a dispensing process.

[0171] S130: The display panel is connected and fixed to the first component using an adhesive layer.

[0172] Please see Figure 18d In step S130, the adhesive layer 30 is disposed between the first substrate 11 and the second substrate 21. The adhesive layer 30 may be directly in contact with the first substrate 11, or other film layers may be included between the adhesive layer 30 and the first substrate 11. The relationship between the adhesive layer 30 and the second substrate 21 is similar. This embodiment does not limit this, as long as the adhesive layer 30 can achieve relative fixation between the display panel 10 and the first component J1.

[0173] S140: Connect and fix the first component and the second component.

[0174] Please see Figure 18e In step S140, the first component J1 and the second component J2 are connected and fixed to form a directional sound-emitting device 20. The support column 23 is located between the first electrode 22 and the second electrode 24. The first electrode 22, the second electrode 24, and the multiple support columns 23 together define multiple cavity structures 26. Optionally, the first component J1 and the second component J2 can be connected and fixed by means of an adhesive part 27.

[0175] In this embodiment, the first component J1, the second component J2, and the display panel 10 are formed independently. The first component J1 is then bonded and fixed to the display panel 10, and the second component J2 is then connected and fixed to the first component J1. This allows the directional sound-emitting device 20 to be located on the backlight side of the display panel 10, reducing the mutual influence between the directional sound-emitting device 20 and the light-emitting device layer 12, thus balancing the structural integrity of the directional sound-emitting device 20 and the display effect of the display module 100. Furthermore, it allows the vibration cavity to be formed after the display panel 10 and the first component J1 are bonded, thereby improving the structural reliability of the vibration cavity and enhancing the directional sound-emitting effect of the display module 100.

[0176] It should be noted that the order of steps S100, S110 and S120 is not limited in this embodiment. The order of these three steps can be arbitrarily adjusted according to actual needs, or at least two of the three steps can be performed simultaneously.

[0177] In some embodiments, please refer to Figure 19 As shown in Figure 20, after step S130 and before step S140, the method further includes: S150: A polarizing layer is formed on the side of the light-emitting device layer that is away from the first substrate.

[0178] Please see Figure 20a In step S150, the polarizing layer 43 is formed on the light-emitting side of the display panel 10, which can play a role in controlling the light.

[0179] S160: The cover plate is attached to the side of the polarizing layer away from the first substrate using an optical adhesive layer.

[0180] Please see Figure 20b In step S160, the cover plate 41 is formed on the side of the polarizing layer 43 away from the display panel 10, and is fixed relative to the display panel 10 by the optical adhesive layer 42.

[0181] In this embodiment, the first component J1 is first bonded to the display panel 10, and then the display panel 10 is connected and fixed to the cover plate 41 by the optical adhesive layer 42. Finally, the first component J1 and the second component J2 are assembled. In this way, the cavity structure 26 has not yet been formed during the bonding process between the display panel 10 and the cover plate 41. Therefore, the cavity structure 26 will not be subjected to stress compression from the display panel 10, which helps to improve the structural reliability of the directional sound device 20.

[0182] In some embodiments, after step S100 and before step S130, the following is included: S170: A first protective layer is formed on the side of the light-emitting device layer away from the first substrate.

[0183] Please see Figure 21a In step S170, the first protective layer 53 is located on the light-emitting side of the display panel 10, which can protect the display panel 10.

[0184] Further, please refer to Figure 21b In step S130, the first protective layer 53 will be located on the side of the display panel 10 away from the first component J1.

[0185] After step S130 and before step S150, the method further includes: S180: Remove the first protective layer.

[0186] In step S180, the first protective layer 53 is removed, so that the final display module 100 will not contain the first protective layer 53.

[0187] In this embodiment, the first protective layer 53 can provide protection for the display panel 10 during the bonding process between the first component J1 and the display panel 10, thereby improving the product yield. After the bonding between the first component J1 and the display panel 10 is completed, the first protective layer 53 is removed so that the final display module 100 does not contain the first protective layer 53, which helps to achieve a thinner and lighter design.

[0188] In some embodiments, step S100 includes: S101: A touch layer is formed on the side of the light-emitting device layer away from the first substrate.

[0189] In step S101, the touch layer 44 is formed on the side of the light-emitting device layer 12 away from the first substrate 11 and is used to realize the touch function.

[0190] In this embodiment, the directional sound-emitting device 20 is not located on the side of the touch layer 44 away from the first substrate 11. The touch layer 44 and the directional sound-emitting device 20 are located on different sides of the first substrate 11. This design makes the directional sound-emitting device 20 no longer block the touch layer 44, thereby helping to improve the touch accuracy of the display module 100.

[0191] In some embodiments, step S100 includes: S102: A first substrate is formed on one side of the first substrate.

[0192] Please see Figure 22a In step S102, the first substrate 11 may include a flexible material. The first substrate 11 is formed on the first substrate 51 by processes such as coating and chemical vapor deposition, that is, the first substrate 51 is located on the backlight side of the display panel 10.

[0193] Further, please refer to Figure 22b After step S100 is completed, the first substrate 51 is located on the side of the first substrate 11 away from the light-emitting device layer 12.

[0194] After step S100 and before step S130, the method further includes: separating the first substrate from the first base plate.

[0195] In this embodiment, after the first substrate 51 separates from the first substrate 11, the surface of the first substrate 11 facing away from the light-emitting device layer 12 is prone to warping. Furthermore, directly forming a conductor structure on this surface presents significant manufacturing challenges, impacting cost and yield. Therefore, this embodiment forms the first electrode 22 on the second substrate 21 and bonds the second substrate 21 to the first substrate 11, thus eliminating the need to form the first electrode 22 on the first substrate 11, reducing manufacturing costs and improving yield.

[0196] In some embodiments, step S110 includes: S111: A second substrate is formed on one side of the second substrate.

[0197] Please see Figure 22c In step S111, the second substrate 21 can be an ultrathin substrate, and the second substrate 21 is formed on the second substrate 52 by processes such as coating and chemical vapor deposition.

[0198] Further, please refer to Figure 22d After step S110 is completed, the first substrate 51 is located on the side of the first substrate 11 away from the light-emitting device layer 12.

[0199] After step S110 and before step S130, the method further includes: separating the second substrate 52 from the second substrate 21.

[0200] In this embodiment, to reduce the adverse effect of the second substrate 21 on the diaphragm thickness, the second substrate 21 is configured as an ultra-thin substrate. To meet the molding requirements of the second substrate 21, a second substrate 52 is added during the fabrication of the display module 100 to aid in the formation of the second substrate 21. Subsequently, to meet the bonding requirements between the first component J1 and the display panel 10 and to reduce the impact of the second substrate 52 on the diaphragm thickness, this embodiment further separates the second substrate 21 from the second substrate 52, so that the final display module 100 does not contain the second substrate 52.

[0201] It should be noted that, for the third substrate 25 in step S120, the third substrate 25 can also be fabricated using a substrate structure, and in subsequent steps, the third substrate 25 needs to be separated from the corresponding substrate structure. Alternatively, the third substrate 25 can have a certain thickness or thickness, and on this basis, the third substrate 25 can also be formed directly without the aid of a substrate structure. This application embodiment does not impose any restrictions on this.

[0202] In some embodiments, step S110, and after step S111, further includes: S112: A second protective layer is formed on the side of the first electrode away from the second substrate.

[0203] Please see Figure 23a In step S112, the second protective layer 54 can protect the first electrode 22.

[0204] Further, please refer to Figure 23b In step S160, the second protective layer 54 will be located on the side of the first component J1 away from the display panel 10.

[0205] After step S160 and before step S140, the method further includes: S190: Remove the second protective layer.

[0206] In step S190, the second protective layer 54 is removed, so that the final display module 100 will not contain the second protective layer 54.

[0207] In this embodiment, the second protective layer 54 can provide protection for the first electrode 22 during the bonding and fixing of the first component J1 to the display panel 10 and during the bonding and fixing of the display panel 10 to the cover plate 41, thereby improving the product yield. Before the first component J1 is connected to the second component J2, the second protective layer 54 is removed so that the final display module 100 does not contain the second protective layer 54, which helps to achieve a thinner and lighter design.

[0208] In some embodiments, the thickness of the second protective layer 54 is greater than the thickness of the second substrate 21.

[0209] As can be seen from the foregoing, in order to reduce the adverse effect of the second substrate 21 on the diaphragm thickness, the second substrate 21 can be provided with a smaller thickness. Based on this, the embodiment of this application provides the second protective part with a larger thickness, so that the second protective layer 54 can not only protect the first electrode 22, but also help the second substrate 21 and the first electrode 22 resist peel stress during the separation of the second substrate 52 and the second substrate 21, thereby reducing the degree of deformation of the second substrate 21 and improving the product yield.

[0210] The thickness relationship between the second protective layer 54 and the second substrate 21 is not limited in this embodiment. Optionally, the thickness of the second substrate 21 is H1, and the thickness of the second protective layer 54 is H6, where H6 ≥ 3H1. In this way, the second protective layer 54 can further help the second substrate 21 and the first electrode 22 resist peel stress, thereby reducing the deformation of the second substrate 21 and improving the product yield.

[0211] In some embodiments, please refer to Figure 24 After separating the first substrate from the first substrate, and before step S130, the method further includes forming a support layer on the first substrate away from the light-emitting device layer.

[0212] In this embodiment, the support layer 45 can support the first substrate 11. At the same time, the surface of the first substrate 11 is prone to warping due to separation from the first substrate, while the surface of the support layer 45 is usually relatively flat. Therefore, by adding the support layer 45, it helps to reduce the bonding difficulty in step S130 and improve the relative position reliability between the display panel 10 and the directional sound-emitting device 20.

[0213] Fourthly, please refer to Figure 25 This application provides a display device 200, which includes the display module 100 in any of the foregoing embodiments; and / or, the display module 100 is formed using the preparation method in any of the foregoing embodiments.

[0214] It should be noted that the display device 200 provided in this application embodiment has the beneficial effects of the display module 100 or the preparation method of the display module 100 in any of the foregoing embodiments. For details, please refer to the foregoing description of the display module 100 and the preparation method of the display module 100. This application embodiment does not limit this.

[0215] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0216] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display module, characterized by include: The display panel includes a first substrate and a light-emitting device layer stacked together. An adhesive layer is disposed on the side of the first substrate opposite to the light-emitting device layer; as well as, A directional sound-emitting device is disposed on the side of the adhesive layer away from the display panel, and includes a second substrate, a first electrode, a plurality of support pillars, a second electrode and a third substrate stacked sequentially away from the adhesive layer, wherein the first electrode, the plurality of support pillars and the second electrode together define a plurality of cavity structures.

2. The display module according to claim 1, characterized in that, The second substrate and the first electrode constitute the first component of the directional sound-emitting device; The third substrate, the second electrode, and the plurality of support pillars constitute the second component of the directional sound-emitting device.

3. The display module of claim 1, wherein, The thickness of the second substrate is less than the thickness of the third substrate.

4. The display module of claim 3, wherein, The second substrate has a single-layer structure.

5. The display module of claim 3, wherein, The thickness of the second substrate is H1, which satisfies: 8μm≤H1≤16μm.

6. The display module of claim 3, wherein, The thickness of the second substrate is less than the thickness of the adhesive layer.

7. The display module of claim 3, wherein, The display module further includes a cover plate disposed on the side of the light-emitting device layer away from the first substrate. In the thickness direction of the display module, the distance between the surface of the cover plate away from the first substrate and the surface of the first electrode facing the first substrate is H2, and H2 satisfies: H2≤200μm.

8. The display module of claim 1, wherein, The thickness of the first substrate is greater than the thickness of the second substrate.

9. The display module of claim 1, wherein, The light-emitting device layer includes organic light-emitting materials.

10. The display module of claim 9, wherein, The first substrate comprises a flexible material.

11. The display module of claim 9, wherein, The display module further includes an array layer disposed between the light-emitting device layer and the first substrate. The light-emitting device layer includes multiple light-emitting structures, and the array layer includes multiple pixel circuits. Different pixel circuits drive different light-emitting structures to emit light.

12. The display module of claim 9, wherein, The display module includes a first area and a second area surrounding the first area. The light-emitting device layer is located within the first area, and the directional sound-emitting device is at least partially located within the first area.

13. The display module of claim 12, wherein, The light-emitting device layer includes multiple light-emitting structures, and the orthographic projection of the directional sound-emitting device on the first substrate overlaps with the orthographic projection of the light-emitting structure on the first substrate.

14. The display module of claim 12, wherein, The directional sound-emitting device is located within the second zone.

15. The display module of claim 9, wherein, The display module further includes a cover plate disposed on the side of the light-emitting device layer facing away from the first substrate, and an optical adhesive layer located on the side of the cover plate facing the first substrate.

16. The display module of claim 15, wherein, The display module further includes a polarizing layer, which is located between the optical adhesive layer and the light-emitting device layer.

17. The display module of claim 16, wherein, The display module also includes a touch layer, which is located between the polarizing layer and the light-emitting device layer.

18. The display module of claim 16, wherein, The thickness of the adhesive layer is less than the thickness of the optical adhesive layer.

19. The display module of claim 18, wherein, The thickness of the adhesive layer is H3, and H3 satisfies: 15μm≤H3≤25μm.

20. The display module of claim 18, wherein, The adhesive layer and the optical adhesive layer are made of the same material.

21. The display module of claim 18, wherein, The cover plate comprises a flexible material.

22. The display module of claim 1, wherein, It also includes an adhesive portion disposed between the first electrode and the second electrode and located on the outer periphery of the plurality of support columns.

23. The display module of claim 22, wherein, The adhesive portion has a ring-shaped structure when projected onto the second substrate.

24. The display module of claim 23, wherein, The orthographic projection of the adhesive portion onto the second substrate lies within the orthographic projections of the first electrode and the second electrode onto the second substrate.

25. The display module of claim 24, wherein, The display module includes a first area and a second area surrounding the first area. The light-emitting device layer is located in the first area, and the adhesive portion is located in the second area.

26. The display module of claim 1, wherein, The first electrode receives a constant voltage signal, and the second electrode receives a variable voltage signal.

27. The display module of claim 26, wherein, The first electrode is grounded.

28. The display module of claim 26, wherein, The display module further includes an array layer disposed between the light-emitting device layer and the first substrate. The light-emitting device layer includes multiple light-emitting structures, and the array layer includes multiple pixel circuits. Different pixel circuits drive different light-emitting structures to emit light. In the thickness direction of the display module, the distance between the array layer and the first electrode is H4, where H4 satisfies: H4≤60μm.

29. The display module of claim 1, wherein, The display module further includes a first insulating layer disposed between the first electrode and the second electrode.

30. The display module of claim 29, wherein, In the thickness direction of the display module, the first insulating layer is located on one side of the support pillar, and the first insulating layer is within the orthographic projection of the support pillar onto the second substrate.

31. The display module of claim 30, wherein, The first insulating layer is located on the side of the support column opposite to the second substrate.

32. The display module of claim 31, wherein, The display module further includes a second insulating layer disposed between the first electrode and the second electrode, wherein the first insulating layer and the second insulating layer are disposed on opposite sides of the support column in the thickness direction of the display module.

33. The display module according to claim 29, characterized in that, In the thickness direction of the display module, the height of the support column is H5, and H5 satisfies: 5μm≤H5≤20μm.

34. The display module of claim 33, wherein, The dimension of the support column in the first direction is L1, and L1 satisfies: 100μm≤L1≤500μm, and the first direction intersects the thickness direction.

35. The display module of claim 1, wherein, The sheet resistance of the first electrode is R, and R satisfies the condition that R≤100mΩ / sq.

36. The display module of claim 35, wherein, The first electrode has a non-transparent structure.

37. The display module of claim 35, wherein, The first electrode comprises a metallic material.

38. The display module of claim 35, wherein, The material of the first electrode includes at least one of titanium, aluminum, silver, indium tin oxide, copper, nickel, molybdenum, chromium, iron, gold, indium, and gallium.

39. The display module of claim 35, wherein, The first electrode includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer stacked together.

40. The display module of claim 35, wherein, The first electrode includes an electrode body and an auxiliary electrode located on the side of the electrode body opposite to the second substrate. The electrode body has a body portion and an edge portion surrounding the periphery of the body portion, and the auxiliary electrode is located in the edge portion.

41. The display module of claim 1, wherein, The first electrode includes a first sub-electrode and a second sub-electrode spaced apart, and the orthographic projections of the first sub-electrode and the second sub-electrode on the second substrate overlap with the orthographic projections of the second electrode on the second substrate.

42. The display module of claim 41, wherein, The display module has a plurality of non-bending areas arranged side by side in a first direction and a bending area located between adjacent non-bending areas, the first direction intersecting the thickness direction of the display module; The first sub-pole and the second sub-pole are spaced apart in the first direction. Both the first sub-pole and the second sub-pole are located outside the bending area and are respectively located in different non-bending areas.

43. The display module of claim 41, wherein, The first electrode and the second electrode are made of the same material.

44. The display module of claim 1, wherein, The display module further includes a support layer disposed between the first substrate and the adhesive layer.

45. The display module of claim 44, wherein, The orthographic projection of the support layer onto the first substrate coincides with the orthographic projection of the adhesive layer onto the first substrate.

46. The display module of claim 44, wherein, The display module also includes a heat dissipation layer disposed on the side of the third substrate opposite to the second substrate.

47. The display module of claim 46, wherein, The heat dissipation layer includes an insulating material.

48. A display module, characterized by include: Display panel, A directional sound-emitting device is disposed on one side of the backlight surface of the display panel, comprising a second substrate, a first electrode, a plurality of support pillars, a second electrode and a third substrate stacked sequentially away from the display panel, wherein the first electrode, the plurality of support pillars and the second electrode together define a plurality of cavity structures; The thickness of the third substrate is greater than the thickness of the second substrate.

49. The display module according to claim 48, characterized in that, The second substrate and the first electrode constitute the first component of the directional sound-emitting device; The third substrate, the second electrode, and the plurality of support pillars constitute the second component of the directional sound-emitting device.

50. The display module of claim 48, wherein, The display panel includes a first substrate and a light-emitting device layer located on the side of the first substrate opposite to the second substrate; The display module further includes an adhesive layer disposed between the first substrate and the second substrate.

51. The display module of claim 50, wherein, The thickness of the first substrate is greater than the thickness of the second substrate.

52. The display module of claim 50, wherein, The second substrate has a single-layer structure.

53. The display module according to claim 50, characterized in that, The thickness of the second substrate is H1, which satisfies: 8μm≤H1≤16μm.

54. The display module of claim 50, wherein, The thickness of the second substrate is less than the thickness of the adhesive layer.

55. The display module of claim 50, wherein, The display module further includes a cover plate disposed on the side of the light-emitting device layer away from the first substrate. In the thickness direction of the display module, the distance between the surface of the cover plate away from the first substrate and the surface of the first electrode facing the first substrate is H2, and H2 satisfies: H2≤200μm.

56. The display module of claim 48, wherein, The display panel includes a light-emitting device layer, which includes an organic light-emitting material.

57. The display module of claim 56, wherein, The display panel includes a first substrate located on the light-emitting device layer facing the directional sound-emitting device, the first substrate comprising a flexible material.

58. The display module of claim 57, wherein, The display module includes a first area and a second area surrounding the first area. The light-emitting device layer is located within the first area, and the directional sound-emitting device is at least partially located within the first area.

59. The display module of claim 58, wherein, The light-emitting device layer includes multiple light-emitting structures, and the orthographic projection of the directional sound-emitting device on the first substrate overlaps with the orthographic projection of the light-emitting structure on the first substrate.

60. The display module of claim 58, wherein, The directional sound-emitting device is located within the second zone.

61. The display module of claim 57, wherein, The display module further includes an array layer disposed between the light-emitting device layer and the first substrate. The light-emitting device layer includes multiple light-emitting structures, and the array layer includes multiple pixel circuits. Different pixel circuits drive different light-emitting structures to emit light.

62. A display device comprising: Includes the display module as described in any one of claims 1 to 61.

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