A silicon wafer blowing shaping device

Abstract

The utility model relates to photovoltaic cell piece production technical field discloses a kind of blowing shaping device for silicon wafer, including rack and shaping component installed on rack;Shaping component includes at least two shaping plates distributed in upper and lower and connected with each other, and the shaping side of each shaping plate is sequentially arranged with several shaping teeth, shaping plate is opened with the blowing port and air inlet that are connected, air inlet is connected with external air supply source, blowing port is opened in the shaping side of shaping plate, to separate the silicon wafer that is adhered by blowing;Rack is equipped with first driving part, and the power output end of first driving part is connected with shaping plate, to make first driving part drive shaping plate reciprocating motion, to make shaping tooth close or far from silicon wafer edge to shape silicon wafer.The blowing shaping device adopts double-row shaping structure, shaping effect is good, and blowing effect is good, can make two silicon wafers that are adhered quickly separate again to shape, improve the card problem of silicon wafer annealing process automation, reduce the fragment rate, improve production line efficiency.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic cell production technology, specifically to a blowing and shaping device for silicon wafers. Background Technology

[0002] In the manufacturing process of solar cells, silicon wafers are often carried in quartz boats. Several wafers are inserted into the grooves of the quartz boat, and then a robotic arm with a suction cup removes the wafers from the boat for subsequent processing. However, the wafers on the quartz boat are often misaligned and need to be reshaped to prevent jamming. Furthermore, the annealing process in solar cell manufacturing requires bonding adjacent wafers together for annealing. After high-temperature annealing, the attraction between the bonded wafers increases. Therefore, directly reshaping the wafers on the quartz boat would crush them. Thus, a blower system is used to separate the bonded wafers before reshaping.

[0003] Then, as shown in publication number CN214588752U, a silicon wafer shaping and groove cleaning device for a quartz boat has only a single-row shaping structure, which results in long shaping time and poor shaping effect. Moreover, the existing shaping device does not have a blowing structure and usually uses an external blowing device, which also has an unsatisfactory blowing effect. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a blower shaping device for silicon wafers.

[0005] Based on this, the present invention discloses a silicon wafer blowing and shaping device, including a frame and a shaping component mounted on the frame; the shaping component includes at least two shaping plates that are distributed vertically and connected to each other, and a plurality of shaping teeth are arranged sequentially on the shaping side of each shaping plate. The shaping plate also has a blowing port and an air inlet that are connected to each other. The air inlet is connected to an external air source, and the blowing port is opened on the shaping side of the shaping plate to blow away the silicon wafers that are attached together.

[0006] The frame is equipped with a first driving component, the power output end of which is connected to a shaping plate, so that the first driving component drives the shaping plate to reciprocate, thereby making the shaping teeth approach or move away from the edges of several silicon wafers to shape the silicon wafers.

[0007] Preferably, the frame is further equipped with an X-axis guide rail assembly, and the shaping plate is slidably connected to the X-axis guide rail assembly. The first driving member drives the shaping plate to reciprocate along the guide rail of the X-axis guide rail assembly in the X-axis direction, so as to make the shaping teeth approach or move away from the edges of several silicon wafers to shape the silicon wafers.

[0008] More preferably, the frame includes a mounting plate, and the mounting plate of the frame has a mounting cavity below it; the shaping component is mounted above the mounting plate, while the X-axis guide rail assembly is mounted between the mounting plate and the lower shaping plate, and the first driving component is mounted in the mounting cavity.

[0009] More preferably, the power output end of the first driving member is connected to a first connecting rod, the upper end of the first connecting rod is connected to a sliding plate, the sliding plate is provided with a track groove, the bottom of the lower shaping plate is connected to a moving rod, and the lower end of the moving rod can move along the track groove;

[0010] The top surface of the mounting plate is also equipped with a first Y-axis guide rail assembly, and the slide plate is slidably connected to the first Y-axis guide rail assembly.

[0011] More preferably, the mounting plate has an elongated hole extending along the Y-axis, and the upper end of the first connecting rod passes through the elongated hole and connects to the sliding plate.

[0012] More preferably, the track groove is opened along the X-axis direction, or the track groove is opened at an angle on the XOY plane.

[0013] More preferably, a second driving component is also installed in the mounting cavity. One end of the second driving component is connected to the fixed end of the first driving component, and the other end of the second driving component is connected to a second connecting rod. The upper end of the second connecting rod is fixedly connected to the mounting plate.

[0014] A second Y-axis guide rail assembly is also installed between the second driving component and the mounting plate. The second driving component moves along the guide rail of the second Y-axis guide rail assembly in the Y-axis direction to drive the first driving component to move together in the Y-axis direction, thereby performing fine shaping on the silicon wafer.

[0015] More preferably, the second driving component is a cylinder, with the cylinder barrel end connected to the fixed end of the first driving component and the piston end of the cylinder connected to the second connecting rod.

[0016] Preferably, a plurality of the shaping teeth are arranged sequentially at intervals along the shaping side of each shaping plate; the air outlet is opened within the interval between adjacent shaping teeth.

[0017] Preferably, the number of X-axis guide rail assemblies is two sets, and the two sets of X-axis guide rail assemblies are symmetrically distributed.

[0018] Compared with the prior art, the present invention has at least the following beneficial effects:

[0019] The silicon wafer blowing and shaping device also adopts a double-row shaping structure (i.e., two shaping plates distributed vertically), which can greatly improve the shaping efficiency and the shaping effect is more perfect, making the edges of several silicon wafers neater and improving the card problem.

[0020] Furthermore, the silicon wafer shaping device features interconnected air inlets and outlets on the shaping plate, with the outlets located on the shaping side of the plate. This allows external air to pass through the air inlets and outlets before being directly blown onto the wafer, resulting in effective airflow and rapid separation of the two wafers bonded together during the annealing process. After separation, the wafers are shaped, preventing them from being unable to be shaped due to tight bonding. This improves the automation of the silicon wafer annealing process by addressing card issues and avoids the risk of breakage caused by directly shaping bonded wafers, reducing the breakage rate and increasing production line efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a silicon wafer shaping device in operation according to this embodiment.

[0022] Figure 2 This is a three-dimensional structural diagram of a silicon wafer blowing and shaping device according to this embodiment.

[0023] Figure 3 This is a three-dimensional structural diagram of a shaping component of a silicon wafer blowing shaping device according to this embodiment.

[0024] Figure 4 This is a three-dimensional structural schematic diagram of a silicon wafer shaping device from another perspective in this embodiment.

[0025] Figure 5 This is a three-dimensional structural schematic diagram of a silicon wafer shaping device from another perspective in this embodiment.

[0026] Figure 6 This is a schematic diagram of the connection structure of the shaping plate, the sliding plate, and the first driving component of a silicon wafer blowing and shaping device according to this embodiment.

[0027] Reference numerals: Shaping component 1; Shaping plate 11; Shaping teeth 111; Air outlet 112; Air inlet 113; Slide plate 2; Track groove 21; Moving rod 22; X-axis guide rail assembly 3; First Y-axis guide rail assembly 4; Second Y-axis guide rail assembly 5; Frame 6; Mounting plate 61; Elongated hole 611; Mounting cavity 62; First drive component 7; First connecting rod 71; Second drive component 8; Second connecting rod 81; Silicon wafer 9. Detailed Implementation

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Example

[0030] This embodiment provides a silicon wafer shaping device using a blower. See [link to relevant documentation]. Figure 1-3 The system includes a frame 6 and a shaping assembly 1 mounted on the frame 6. The shaping assembly 1 includes at least two shaping plates 11 arranged vertically, with one side of each shaping plate 11 connected to the other. The other side of each shaping plate 11 (i.e., the shaping side) has a plurality of shaping teeth 111 arranged sequentially along the length direction of the shaping plate 11 (i.e., along the Y-axis direction). Figure 3 As shown), for use in shaping or regularizing several silicon wafers 9 (e.g. Figure 1 As shown), this air-blowing shaping device aligns the edges of several silicon wafers 9 neatly. The device employs a double-row shaping structure (i.e., two shaping plates 11 distributed vertically), which significantly improves shaping efficiency and yields a more refined shaping effect, resulting in neater edges for the silicon wafers 9. This reduces the number of times the wafers jam, thus mitigating the jamming problem.

[0031] Furthermore, the shaping plate 11 also has a connected air inlet 113 (such as... Figure 2 (as shown) and air outlet 112 (as shown) Figure 3 As shown, the air inlet 113 is connected to an external air source via an air inlet duct, while the air outlet 112 is located on the shaping side of the shaping plate 11. Thus, before shaping the silicon wafer 9, the external air source blows directly onto the silicon wafer 9 through the air inlet duct, air inlet 113, and air outlet 112. This provides good airflow and allows the two silicon wafers 9 bonded together by the high-temperature annealing process to separate quickly. After separation, the silicon wafer 9 is shaped to prevent it from being unable to be shaped due to tight bonding. This improves the carding problem in the automated silicon wafer annealing process and avoids the risk of breakage caused by directly shaping the two bonded silicon wafers 9, reducing the breakage rate and improving production line efficiency.

[0032] Specifically, such as Figure 3 As shown, for each shaping plate 11, a number of shaping teeth 111 are arranged sequentially and spaced apart along the shaping side of the shaping plate 11, and the air blowing port 112 is opened in the interval between adjacent shaping teeth 111; thus, the arrangement of the air blowing port 112 and the shaping teeth 111 is reasonable and compact, which facilitates the separation of silicon wafer 9 by air blowing port 112 before shaping.

[0033] Among them, see Figure 2 The frame 6 is equipped with a first drive component 7 (such as a cylinder) and an X-axis guide rail assembly 3. The power output end of the first drive component 7 is connected to the shaping plate 11, and the shaping plate 11 is slidably connected to the X-axis guide rail assembly 3. Thus, under the driving action of the first drive component 7, the shaping plate 11 reciprocates along the guide rail of the X-axis guide rail assembly 3 in the X-axis direction, so that the shaping teeth 111 approach or move away from the edges of several silicon wafers 9 to achieve the shaping of the silicon wafers 9.

[0034] Preferably, there are two sets of X-axis guide rail assemblies 3, which are symmetrically distributed to enhance the stability and reliability of the shaping plate 11 moving in the X-axis direction.

[0035] In practice, see Figure 1-2 The frame 6 includes a mounting plate 61, with a mounting cavity 62 below the mounting plate 61. The shaping assembly 1 is mounted above the mounting plate 61, while the X-axis guide rail assembly 3 is mounted between the mounting plate 61 and the lower shaping plate 11. The first drive component 7 is mounted within the mounting cavity 62. This top-to-bottom arrangement of the shaping assembly 1, X-axis guide rail assembly 3, and first drive component 7 reduces the overall footprint of the blower shaping device, making its layout more compact.

[0036] Specifically, see Figure 4-6 The mounting plate 61 has an elongated hole 611 extending along the Y-axis direction (e.g., Figure 5 As shown), the power output end of the first driving component 7 is connected to a first connecting rod 71. The upper end of the first connecting rod 71 passes through the elongated hole 611 and is fixedly connected to a sliding plate 2. The sliding plate 2 has a track groove 21 (as shown). Figure 6 As shown), and the bottom of the lower shaping plate 11 is connected to a moving rod 22 (as shown). Figure 6 As shown), the lower end of the moving rod 22 can move along the trajectory of the track groove 21. A first Y-axis guide rail assembly 4 (as shown) is also mounted on the top surface of the mounting plate 61. Figure 4 As shown), the slide plate 2 is slidably connected to the first Y-axis guide rail assembly 4. Furthermore, as... Figure 2 , 6 As shown, the track groove 21 is opened along the X-axis direction, or the track groove 21 is opened at an angle on the XOY plane.

[0037] Therefore, during operation, the power output end of the first driving component 7 pushes the first connecting rod 71 to move in the Y-axis direction within the elongated hole 611, so that the first connecting rod 71 drives the slide plate 2 to move in the Y-axis direction along the guide rail of the first Y-axis guide rail assembly 4. This causes the slide plate 2 to drive the moving rod 22 to move along the track within the track groove 21, thereby causing the moving rod 22 to drive the lower shaping plate 11 to move. Simultaneously, due to the restriction of the moving direction of the lower shaping plate 11 by the X-axis guide rail assembly 3, the lower shaping plate 11 and the entire shaping assembly 1 reciprocate along the X-axis direction of the X-axis guide rail assembly 3, thereby causing the shaping teeth 111 of the shaping plate 11 (such as...) to... Figure 3 (As shown) to regularize or shape silicon wafers 9 by approaching or moving away from the edges of several silicon wafers 9 (e.g.) Figure 1 , 4 (As shown).

[0038] Furthermore, since the pushing force and pushing distance of the power output end of the first driving member 7 on the first connecting rod 71 are relatively limited, only coarse shaping of the edges of several silicon wafers 9 can be achieved under the pushing action of the power output end of the first driving member 7. Therefore, in order to further achieve fine shaping of the edges of several silicon wafers 9 and further improve the shaping effect, the blower shaping device in this embodiment has also been improved as follows:

[0039] See Figure 4-6 A second driving component 8 is also installed within the mounting cavity 62. One end of the second driving component 8 is connected to the fixed end of the first driving component 7, while the other end of the second driving component 8 is connected to a second connecting rod 81 (for example, the second driving component 8 is a cylinder, with the cylinder barrel end connected to the fixed end of the first driving component 7 and the piston end connected to the second connecting rod 81); the upper end of the second connecting rod 81 is fixedly connected to the mounting plate 61. Furthermore, a second Y-axis guide rail assembly 5 (such as...) is also installed between the second driving component 8 and the mounting plate 61. Figure 5 (As shown).

[0040] After the rough shaping is completed, the second drive component 8 is activated, causing it to move along the guide rail of the second Y-axis guide rail assembly 5 in the Y-axis direction. This causes the second drive component 8 to drive the first drive component 7 to move together in the Y-axis direction. In this way, through the cooperation of the second drive component 8 and the first drive component 7, the pushing force and pushing distance of the power output end of the first drive component 7 on the first connecting rod 71 can be further increased. This allows the first drive component 7 to drive the shaping plate 11 to continue to reciprocate in the X-axis direction through the first connecting rod 71, the slide plate 2, and the moving rod 22 in sequence, thereby achieving fine shaping of the silicon wafer 9 and further improving the shaping effect.

[0041] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0042] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A blower shaping device for silicon wafers, characterized in that, The device includes a frame and a shaping assembly mounted on the frame. The shaping assembly includes at least two shaping plates that are distributed vertically and connected to each other. Each shaping plate has a number of shaping teeth arranged sequentially on its shaping side. The shaping plate also has a connected air inlet and an air outlet. The air outlet is connected to an external air source. The air outlet is located on the shaping side of the shaping plate to blow air and separate the bonded silicon wafers. The frame is equipped with a first driving component, the power output end of which is connected to a shaping plate, so that the first driving component drives the shaping plate to reciprocate, thereby making the shaping teeth approach or move away from the edges of several silicon wafers to shape the silicon wafers.

2. The apparatus according to claim 1, wherein The frame is also equipped with an X-axis guide rail assembly. The shaping plate is slidably connected to the X-axis guide rail assembly. The first driving member drives the shaping plate to reciprocate along the guide rail of the X-axis guide rail assembly in the X-axis direction, so that the shaping teeth approach or move away from the edges of several silicon wafers to shape the silicon wafers.

3. The apparatus according to claim 2, wherein The frame includes a mounting plate, and the mounting plate of the frame has a mounting cavity below it; the shaping component is mounted above the mounting plate, and the X-axis guide rail assembly is mounted between the mounting plate and the lower shaping plate, and the first drive component is mounted in the mounting cavity.

4. The apparatus according to claim 3, wherein The power output end of the first driving component is connected to a first connecting rod, the upper end of the first connecting rod is connected to a sliding plate, the sliding plate is provided with a track groove, the bottom of the lower shaping plate is connected to a moving rod, and the lower end of the moving rod can move along the track groove; The top surface of the mounting plate is also equipped with a first Y-axis guide rail assembly, and the slide plate is slidably connected to the first Y-axis guide rail assembly.

5. The apparatus according to claim 4, wherein The mounting plate has an elongated hole extending along the Y-axis, and the upper end of the first connecting rod passes through the elongated hole and connects to the sliding plate.

6. The apparatus according to claim 4, wherein The track groove is opened along the X-axis direction, or the track groove is opened at an angle on the XOY plane.

7. The apparatus according to claim 3, wherein A second driving component is also installed in the mounting cavity. One end of the second driving component is connected to the fixed end of the first driving component, and the other end of the second driving component is connected to a second connecting rod. The upper end of the second connecting rod is fixedly connected to the mounting plate. A second Y-axis guide rail assembly is also installed between the second driving component and the mounting plate. The second driving component moves along the guide rail of the second Y-axis guide rail assembly in the Y-axis direction to drive the first driving component to move together in the Y-axis direction, thereby performing fine shaping on the silicon wafer.

8. The apparatus according to claim 7, wherein The second driving component is a cylinder, with the cylinder barrel end connected to the fixed end of the first driving component and the piston end of the cylinder connected to the second connecting rod.

9. The apparatus according to claim 1, wherein Several of the shaping teeth are arranged sequentially at intervals along the shaping side of each shaping plate; the air outlet is opened within the interval between adjacent shaping teeth.

10. The apparatus according to claim 2, wherein The number of X-axis guide rail assemblies is two sets, and the two sets of X-axis guide rail assemblies are symmetrically distributed.

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