Chip package compression plate device

Abstract

This utility model belongs to the field of chip packaging technology, specifically a chip packaging pressure plate device, including a base plate, a fixing frame fixedly connected to the top of the base plate; a first pressure plate provided at the bottom of the fixing frame; a fixing block fixedly connected to the top of the base plate; a first motor fixedly connected to the top of the base plate; a first threaded rod rotatably connected between two fixing blocks; transmission wheels fixedly connected to the ends of the two first threaded rods near the first motor; sliding blocks threadedly connected to the side walls of the two first threaded rods; a substrate provided on the top of the sliding block; this utility model controls the rotation of the two first threaded rods by setting the first motor, thereby making the position of the substrate adjustable, enhancing the flexibility of the packaging pressure plate device, helping to solve the problem of difficult chip placement in traditional chip packaging pressure plate devices, and improving the work efficiency of workers.

Description

Technical Field

[0001] This utility model belongs to the field of chip packaging technology, specifically a chip packaging pressure plate device. Background Technology

[0002] Chip packaging, the outer casing used to house semiconductor integrated circuit chips, serves to place, fix, seal, and protect the chip, as well as enhance its electrothermal performance. It also acts as a bridge between the internal world of the chip and external circuits. The contacts on the chip are connected to the pins of the package casing by wires, and these pins are then connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role in CPUs and other LSI integrated circuits.

[0003] The existing chip packaging press plate device has a relatively fixed structure and lacks the ability to be flexibly adjusted. Whenever chip packaging is required, the staff needs to place the chip between the press plates, which is easily blocked by the components of the press plate device, affecting work efficiency and easily causing problems with inaccurate chip placement.

[0004] Therefore, this utility model provides a chip packaging pressure plate device. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: The chip packaging pressure plate device of this utility model includes a base plate, a fixing frame fixedly connected to the top of the base plate; a first pressure plate provided at the bottom of the fixing frame; a fixing block fixedly connected to the top of the base plate, and two fixing blocks are arranged correspondingly; a first motor fixedly connected to the top of the base plate; a first threaded rod rotatably connected between the two fixing blocks; a transmission wheel fixedly connected to the end of each of the two first threaded rods near the first motor, and a transmission track provided between the two transmission wheels; a side wall of one of the transmission wheels fixedly connected to the output end of the first motor; a sliding block threadedly connected to the side wall of each of the two first threaded rods; a substrate provided on the top of the sliding block; This step, by setting the first motor to control the rotation of the two first threaded rods, makes the position of the substrate adjustable, enhances the flexibility of the packaging pressure plate device, helps to solve the problem of difficult chip placement in traditional chip packaging pressure plate devices, and helps to improve the work efficiency of the staff.

[0007] Preferably, a second motor is fixedly connected to the top of the base plate; a transmission rod is fixedly connected to the output end of the second motor; a first helical gear is fixedly connected to the side wall of the transmission rod, and a second helical gear meshes with the side wall of the first helical gear; a second threaded rod is fixedly connected to the side wall of the second helical gear, and the second threaded rod is rotatably connected inside the sliding block; a limiting block is fixedly connected to the bottom of the substrate, the limiting block is set according to the internal size of the sliding block, and the limiting block and the second threaded rod are threadedly connected; this step, by setting the second motor, the first helical gear and the second helical gear, increases the movable direction of the substrate, further improving the flexibility of the chip packaging platen device, so that the substrate can be completely detached from the bottom of the fixing frame, providing convenience for the chip placement work of the staff, and helping to improve the chip placement efficiency of the staff.

[0008] Preferably, a limiting rod is fixedly connected to the top of the first pressure plate, and multiple limiting rods are arranged correspondingly; a limiting shaft is fixedly connected to the top of the multiple limiting rods; a fixed platform is provided on the top of the first pressure plate, and a sliding groove is opened at the bottom of the fixed platform, and the sliding groove is set to correspond to the size of the limiting rod and the limiting shaft; a buffer spring is fixedly connected between the first pressure plate and the fixed platform, and multiple buffer springs are set to correspond to the position of the limiting rod; this step buffers the stress between the first pressure plate and the chip by setting buffer springs to avoid the chip being damaged by impact, and restricts the movement posture of the first pressure plate by setting limiting rods, limiting shafts, and fixed platforms to prevent the first pressure plate from falling off or tilting, thereby enhancing the stability of the device.

[0009] Preferably, the first pressure plate has cooling holes inside, and the plurality of cooling holes are arranged in a corresponding manner; a threaded connector is fixed to the side wall of the first pressure plate, and the plurality of threaded connectors are arranged at the positions corresponding to the cooling holes. This step, by setting the cooling holes and threaded connectors, allows the first pressure plate to be connected to a cooling pipe, which increases the functionality of the device, helps to avoid the chip being damaged by heat during the packaging process, and helps to reduce safety hazards.

[0010] Preferably, the side wall of the fixing frame is provided with a pipeline groove, and the two pipeline grooves are arranged in a corresponding manner; this step, by setting the pipeline groove as the opening path for cooling pipes and lines, avoids pipes getting tangled in the device components, improves the practicality of the device, and helps to avoid the situation where the components get stuck.

[0011] Preferably, a placement frame is fixed to the side wall of the fixed frame, and the two placement frames are arranged in a corresponding manner; this step, by setting the placement frame to support the cooling pipe, prevents the pipe from falling and obstructing the normal operation of the device components, which is beneficial to maintaining the stability of the device.

[0012] Preferably, a second pressure plate is provided at the bottom of the fixing frame; this step of setting up the second pressure plate by fixing the frame is beneficial to realize the same device packaging of chips of different sizes, and enhances the applicability of the device.

[0013] The beneficial effects of this utility model are as follows: 1. The chip packaging pressure plate device of this utility model, by setting a first motor to control the rotation of two first threaded rods, makes the position of the substrate adjustable, enhances the flexibility of the packaging pressure plate device, helps to solve the problem of difficult chip placement in traditional chip packaging pressure plate devices, and helps to improve the work efficiency of workers.

[0014] 2. The chip packaging platen device of this utility model increases the movable direction of the substrate by setting a second motor, a first helical gear and a second helical gear, which further improves the flexibility of the chip packaging platen device, so that the substrate can be completely detached from the bottom of the fixing frame, which provides convenience for the chip placement work of the staff and helps to improve the chip placement efficiency of the staff. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings.

[0016] Figure 1 This is a perspective view of the present invention; Figure 2 This is a schematic diagram of the sliding block in this utility model; Figure 3 This is a schematic diagram of the structure of the base plate in this utility model; Figure 4 This is a schematic diagram of the structure of the fixing frame in this utility model; Figure 5 This is a structural schematic diagram of the fixed platform in this utility model.

[0017] In the diagram: 1. Base plate; 11. Fixing frame; 12. First pressure plate; 13. Fixing block; 14. First motor; 15. First threaded rod; 16. Transmission wheel; 17. Transmission track; 18. Sliding block; 19. Base plate; 2. Second motor; 21. Transmission rod; 22. First helical gear; 23. Second helical gear; 24. Second threaded rod; 25. Limiting block; 3. Limiting rod; 31. Limiting shaft; 32. Fixing platform; 33. Buffer spring; 4. Cooling hole; 41. Threaded connector; 5. Pipeline groove; 6. Placement frame; 7. Second pressure plate. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0019] Specific implementation examples are given below.

[0020] like Figures 1 to 5 As shown, a chip packaging pressure plate device according to an embodiment of the present invention includes a base plate 1, a fixing frame 11 fixedly connected to the top of the base plate 1; a first pressure plate 12 disposed at the bottom of the fixing frame 11; a fixing block 13 fixedly connected to the top of the base plate 1, and the two fixing blocks 13 are arranged correspondingly; a first motor 14 fixedly connected to the top of the base plate 1; a first threaded rod 15 rotatably connected between the two fixing blocks 13; transmission wheels 16 fixedly connected to the ends of the two first threaded rods 15 near the first motor 14, and a transmission track 17 disposed between the two transmission wheels 16; the side wall of one of the transmission wheels 16 is fixedly connected to the output end of the first motor 14; a sliding block 18 is threadedly connected to the side wall of the two first threaded rods 15; a substrate 19 is disposed on the top of the sliding block 18; during operation, the operator can adjust the position of the sliding block 18 and the substrate 19 disposed on the top of the sliding block 18 by driving the first motor 14, thereby adjusting the substrate 19 to the bottom of the first pressure plate 12. During the process, the operator can first First, the chip to be packaged is placed on top of the substrate 19. Then, the first motor 14 is driven. Since the output end of the first motor 14 is fixedly connected to one of the transmission wheels 16, and a transmission track 17 is provided between the two transmission wheels 16, the two first threaded rods 15 will rotate with the output of the first motor 14. The two first threaded rods 15 are symmetrically arranged and are threadedly connected to the sliding block 18. With the rotation of the two first threaded rods 15, the sliding block 18 will move in the horizontal direction. In addition, the base plate 1 plays a role in overall fixation, the fixing frame 11 plays a role in fixing the first pressure plate 12, and the fixing block 13 plays a role in fixing the first threaded rods 15. This step, by setting the first motor 14 to control the rotation of the two first threaded rods 15, makes the position of the substrate 19 adjustable, enhances the flexibility of the packaging pressure plate device, helps to solve the problem of difficult chip placement in traditional chip packaging pressure plate devices, and helps to improve the work efficiency of the staff.

[0021] like Figures 1 to 3As shown, a second motor 2 is fixedly connected to the top of the base plate 1; a transmission rod 21 is fixedly connected to the output end of the second motor 2; a first helical gear 22 is fixedly connected to the side wall of the transmission rod 21, and a second helical gear 23 meshes with the side wall of the first helical gear 22; a second threaded rod 24 is fixedly connected to the side wall of the second helical gear 23, and the second threaded rod 24 is rotatably connected to the inside of the sliding block 18; a limiting block 25 is fixedly connected to the bottom of the base plate 19, the limiting block 25 is set according to the internal size of the sliding block 18, and the limiting block 25 and the second threaded rod 24 are threadedly connected; during operation, the operator can increase the movable direction of the base plate 19 by driving the second motor 2. During the process, whenever the second motor 2 fixed to the top of the base plate 1 is driven, the transmission rod 21 fixed to the output end of the second motor 2 will rotate, because the side wall of the transmission rod 21... A first helical gear 22 is fixedly connected to the side wall of a second threaded rod 24, and a second motor 2 is fixedly connected to the side wall of the second threaded rod 24. The first helical gear 22 and the second helical gear 23 are meshed. With the drive of the second motor 2, the second threaded rod 24 will rotate inside the sliding block 18. At the same time, since the limiting block 25 is set to correspond to the internal structure of the sliding block 18 and the limiting block 25 is threadedly connected to the second threaded rod 24, the substrate 19 will move under the action of the second motor 2. This step increases the movable direction of the substrate 19 by setting the second motor 2, the first helical gear 22 and the second helical gear 23, and further improves the flexibility of the chip packaging plate device. This allows the substrate 19 to be completely detached from the bottom of the fixing frame 11, which provides convenience for the chip placement work of the staff and helps to improve the chip placement efficiency of the staff.

[0022] like Figure 4 and Figure 5As shown, a limiting rod 3 is fixedly connected to the top of the first pressure plate 12, and multiple limiting rods 3 are arranged correspondingly; a limiting shaft 31 is fixedly connected to the top of the multiple limiting rods 3; a fixed platform 32 is provided on the top of the first pressure plate 12, and a sliding groove is provided on the bottom of the fixed platform 32, and the sliding groove is set to correspond to the size of the limiting rod 3 and the limiting shaft 31; a buffer spring 33 is fixedly connected between the first pressure plate 12 and the fixed platform 32, and multiple buffer springs 33 are set to correspond to the position of the limiting rod 3; during operation, whenever the first pressure plate 12 contacts the top of the chip, the multiple buffer springs 33 fixed between the first pressure plate 12 and the fixed platform 32 can be compressed by force. The method buffers the stress between the two, preventing the pressure of the first pressure plate 12 from acting rapidly on the top of the chip. Because the fixed stage 32 is sized to correspond to the limiting rod 3 and the limiting shaft 31, the limiting rod 3, the limiting shaft 31, and the fixed stage 32 can restrict the movement of the first pressure plate 12 through contact. This step uses a buffer spring 33 to buffer the stress between the first pressure plate 12 and the chip, preventing the chip from being damaged by impact. By setting the limiting rod 3, the limiting shaft 31, and the fixed stage 32 to restrict the movement of the first pressure plate 12, the device prevents the first pressure plate 12 from falling off or tilting, thus enhancing its stability.

[0023] like Figure 5 As shown, the first pressure plate 12 has cooling holes 4 inside, and multiple cooling holes 4 are arranged in a corresponding manner; a threaded connector 41 is fixed to the side wall of the first pressure plate 12, and multiple threaded connectors 41 are arranged corresponding to the positions of the cooling holes 4; during operation, the operator can use the threaded connector 41 to connect the cooling pipe to the first pressure plate 12, so that the coolant passes through the multiple cooling holes 4, and finally cools the chip; this step, by setting the cooling holes 4 and the threaded connector 41, allows the first pressure plate 12 to be connected to the cooling pipe, which increases the functionality of the device, helps to avoid the chip being damaged by heat during the packaging process, and helps to reduce safety hazards.

[0024] like Figure 4 As shown, a pipe groove 5 is provided on the side wall of the fixing frame 11, and the two pipe grooves 5 are arranged in a corresponding manner. During operation, when the operator connects the cooling pipe to the first pressure plate 12, the cooling pipe can pass through the pipe groove 5 to avoid the pipe from getting tangled with the device components. This step improves the practicality of the device by setting the pipe groove 5 as the opening path for the cooling pipe and line, thus avoiding the pipe from getting tangled with the device components and helping to prevent the components from getting stuck.

[0025] like Figure 4As shown, a placement frame 6 is fixedly connected to the side wall of the fixed frame 11, and the two placement frames 6 are arranged correspondingly. During operation, after the cooling pipe passes through the pipeline groove 5, the two placement frames 6 fixed to the side wall of the fixed frame 11 can provide support for the pipe respectively. This step, by setting the placement frame 6 to support the cooling pipe, avoids the pipe from falling and obstructing the normal operation of the device components, which is beneficial to maintaining the stability of the device.

[0026] like Figure 4 As shown, a second pressure plate 7 is provided at the bottom of the fixing frame 11. During operation, the second pressure plate 7 is different in size from the first pressure plate 12. The operator can use the second pressure plate 7 to perform packaging operations on chips of different sizes. This step of setting up the second pressure plate 7 through the fixing frame 11 is conducive to achieving the same device packaging of chips of different sizes, thus enhancing the applicability of the device.

[0027] During operation, the operator can adjust the position of the sliding block 18 and the substrate 19 located on top of the sliding block 18 by driving the first motor 14, thereby adjusting the substrate 19 to the bottom of the first pressure plate 12. During this process, the operator can first place the chip to be packaged on top of the substrate 19, and then drive the first motor 14. Since the output end of the first motor 14 is fixedly connected to one of the transmission wheels 16, and a transmission track 17 is provided between the two transmission wheels 16, the two first threaded rods 15 will rotate along with the output of the first motor 14. The two first threaded rods 15 are symmetrically arranged, and each is threadedly connected to the sliding block 18. As the two first threaded rods 15 rotate, the sliding block 18 will move horizontally. Additionally, the base plate 1 provides overall fixation, the fixing bracket 11 fixes the first pressure plate 12, and the fixing block 13 fixes the first threaded rods 15. The operator can increase the movable direction of the base plate 19 by driving the second motor 2. During this process, whenever the second motor 2, fixed to the top of the base plate 1, is driven, the transmission rod 21, fixed to the output end of the second motor 2, will rotate. Since a first helical gear 22 is fixed to the side wall of the transmission rod 21, and the second motor 2 is fixed to the side wall of the second threaded rod 24, and the first helical gear 22 and the second helical gear 23 are meshed... With the drive of the second motor 2, the second threaded rod 24 will rotate inside the sliding block 18. Simultaneously, due to the internal structure of the limiting block 25 corresponding to the sliding block 18, and the threaded connection between the limiting block 25 and the second threaded rod 24, the substrate 19 will move under the action of the second motor 2. Whenever the first pressure plate 12 contacts the top of the chip, the multiple buffer springs 33 fixed between the first pressure plate 12 and the fixed platform 32 can buffer the stress between them through compression, preventing the pressure of the first pressure plate 12 from rapidly acting on the top of the chip. Specifically, due to the size settings of the fixed platform 32 corresponding to the limiting rod 3 and the limiting shaft 31, the limiting rod 3... The limiting shaft 31 and the fixed platform 32 can restrict the movement of the first pressure plate 12 by contact. The operator can connect the cooling pipe to the first pressure plate 12 with the threaded connector 41, so that the coolant passes through multiple cooling holes 4, and finally cools the chip. During the process of connecting the cooling pipe to the first pressure plate 12, the operator can let the cooling pipe pass through the pipeline groove 5 to avoid the pipe from getting tangled with the device components. After the cooling pipe passes through the pipeline groove 5, the two placement racks 6 fixed to the side wall of the fixed frame 11 can provide support for the pipe. The second pressure plate 7 is different in size from the first pressure plate 12. The operator can use the second pressure plate 7 to carry out the packaging of chips of different sizes.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip package compression plate apparatus comprising a base plate (1), characterized in that: A fixing frame (11) is fixedly connected to the top of the base plate (1); a first pressure plate (12) is provided at the bottom of the fixing frame (11); a fixing block (13) is fixedly connected to the top of the base plate (1), and the two fixing blocks (13) are arranged in a corresponding manner; a first motor (14) is fixedly connected to the top of the base plate (1); a first threaded rod (15) is rotatably connected between the two fixing blocks (13); a transmission wheel (16) is fixedly connected to the end of the two first threaded rods (15) near the first motor (14), and a transmission track (17) is provided between the two transmission wheels (16); the side wall of one of the transmission wheels (16) is fixedly connected to the output end of the first motor (14); a sliding block (18) is threadedly connected to the side wall of the two first threaded rods (15); a base plate (19) is provided on the top of the sliding block (18).

2. The chip package compression plate apparatus of claim 1, wherein: A second motor (2) is fixedly connected to the top of the base plate (1); a transmission rod (21) is fixedly connected to the output end of the second motor (2); a first helical gear (22) is fixedly connected to the side wall of the transmission rod (21), and a second helical gear (23) meshes with the side wall of the first helical gear (22); a second threaded rod (24) is fixedly connected to the side wall of the second helical gear (23), and the second threaded rod (24) is rotatably connected to the inside of the sliding block (18); a limiting block (25) is fixedly connected to the bottom of the base plate (19), the limiting block (25) is set according to the internal size of the sliding block (18), and the limiting block (25) and the second threaded rod (24) are threadedly connected.

3. The chip packaging pressure plate device according to claim 1, characterized in that: The top of the first pressure plate (12) is fixedly connected to a limiting rod (3), and multiple limiting rods (3) are arranged in a corresponding manner; the top of multiple limiting rods (3) is fixedly connected to a limiting shaft (31); a fixed platform (32) is provided on the top of the first pressure plate (12), and a sliding groove is provided at the bottom of the fixed platform (32), and the sliding groove is set according to the size of the limiting rod (3) and the limiting shaft (31); a buffer spring (33) is fixedly connected between the first pressure plate (12) and the fixed platform (32), and multiple buffer springs (33) are set according to the position of the limiting rod (3).

4. The chip packaging pressure plate device according to claim 3, characterized in that: The first pressure plate (12) has cooling holes (4) inside, and multiple cooling holes (4) are arranged in a corresponding manner; a threaded connector (41) is fixed on the side wall of the first pressure plate (12), and multiple threaded connectors (41) are arranged in a corresponding manner to the cooling holes (4).

5. The chip packaging pressure plate device according to claim 1, characterized in that: The side wall of the fixing frame (11) is provided with a pipeline groove (5), and the two pipeline grooves (5) are arranged in a corresponding manner.

6. The chip package compression pad apparatus of claim 5, wherein: The mounting bracket (6) is fixedly attached to the side wall of the fixed bracket (11), and the two mounting brackets (6) are arranged in a corresponding manner.

7. The chip package compression pad apparatus of claim 6, wherein: The bottom of the fixing frame (11) is provided with a second pressure plate (7).

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