A tabletting structure for semiconductor packages

Abstract

The utility model discloses a tablet pressing structure for semiconductor packaging, including the packaging seat, the one side of packaging seat top is equipped with the assembly slot, the inside of assembly slot is provided with the movable placing plate, the center of placing board is placed with the annular encapsulation cover, the other side fixed establishment of packaging seat top is equipped with the L type frame, the bottom fixed mounting of L type frame is equipped with the second electric push rod, the telescopic end fixed mounting of second electric push rod is equipped with the tablet pressing subassembly, tablet pressing subassembly with annular encapsulation cover position is in alignment. The utility model discloses through the second electric push rod and promotes tablet pressing subassembly to press down, can press down semiconductor wafer to the inside of annular encapsulation cover, in the process of pressing down, through the cooperation of annular pressure sensor and flexible airbag in tablet pressing subassembly, not only can intuitively observe the pressing degree, can also effectively protect semiconductor wafer through flexible airbag, reduced the semiconductor wafer damage problem caused in the tablet pressing process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a pressing structure for semiconductor packaging. Background Technology

[0002] During the manufacturing process of semiconductor wafers, they need to be pressed into the interior of a packaging tank for assembly. This assembly typically involves using a pressing structure to press the semiconductor wafer into the interior of a ring-shaped package.

[0003] We have found that existing pressing structures for semiconductor wafer pressing generally use rigid contact with the semiconductor wafer during the pressing process, and there is no pressure monitoring during the pressing process, which can easily cause excessive pressure on the semiconductor wafer and damage it. To address this, we have designed a pressing structure for semiconductor packaging. Utility Model Content

[0004] The purpose of this invention is to provide a pressing structure for semiconductor packaging to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a pressing structure for semiconductor packaging, including a packaging base, an assembly groove is provided on one side of the top of the packaging base, a movable placement plate is provided inside the assembly groove, an annular packaging sleeve is placed at the center of the placement plate, an L-shaped frame is fixedly provided on the other side of the top of the packaging base, a second electric push rod is fixedly installed at the bottom end of the L-shaped frame, a pressing assembly is fixedly installed at the telescopic end of the second electric push rod, and the pressing assembly is aligned with the annular packaging sleeve.

[0006] Preferably, an electric slide rail is fixedly installed at the bottom of the assembly slot, and a slide block is slidably connected to the surface of the electric slide rail. The top of the slide block is fixedly connected to one side of the bottom of the placement plate.

[0007] Preferably, a first electric push rod is fixedly installed on both sides of the inner wall of the assembly groove, and an arc-shaped clamping block is fixedly installed on the telescopic end of the two first electric push rods. The two arc-shaped clamping blocks are clamped on both sides of the annular encapsulation sleeve.

[0008] Preferably, the tablet pressing assembly includes an upper fixing plate and a lower fixing plate. The center of the upper fixing plate is fixedly connected to the telescopic end of the second electric push rod. An installation groove is provided at the center of the bottom end of the upper fixing plate. A connecting column is inserted into the installation groove. The bottom end of the connecting column is fixedly connected to the center of the lower fixing plate. An annular pressure sensor is fixedly installed between the connecting column and the installation groove.

[0009] Preferably, the bottom end of the upper fixing plate is provided with multiple circular grooves distributed in a ring, and T-shaped limiting posts are inserted into the interior of each of the multiple circular grooves. The bottom end of the T-shaped limiting post is fixedly connected to the top end of the lower fixing plate.

[0010] Preferably, a flexible airbag is fixedly installed at the bottom end of the lower fixing plate, and an inflation nozzle communicating with the inflation end of the flexible airbag is opened on one side of the lower fixing plate. An electromagnetic valve is fixedly installed inside the inflation nozzle.

[0011] Preferably, a groove is provided on one side of the encapsulation base, and a high-pressure air pump is fixedly installed inside the groove. The output end of the high-pressure air pump is connected to the air inlet through a conduit, and a honeycomb cover plate is hinged to one side of the groove.

[0012] The technical effects and advantages of this utility model are as follows: By pushing the pressing assembly downward with the second electric push rod, the semiconductor wafer can be pressed into the interior of the annular packaging sleeve. During the pressing process, through the cooperation of the annular pressure sensor and the flexible airbag in the pressing assembly, not only can the pressure be observed intuitively, but the flexible airbag can also effectively protect the semiconductor wafer, reducing the problem of semiconductor wafer damage caused during the pressing process. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a pressing structure for semiconductor packaging according to the present invention.

[0014] Figure 2 This is a schematic cross-sectional view of a pressing assembly for semiconductor packaging according to the present invention.

[0015] Figure 3 This is a schematic diagram of the connection structure between the placement plate and the assembly groove of a pressing structure for semiconductor packaging according to this utility model.

[0016] In the diagram: 1. Encapsulation base; 2. Groove; 3. High-pressure air pump; 4. Honeycomb cover plate; 5. Assembly groove; 6. Placement plate; 7. Pressing assembly; 701. Upper fixing plate; 702. Lower fixing plate; 703. Flexible airbag; 704. Inflation nozzle; 705. Mounting groove; 706. Annular pressure sensor; 707. Connecting column; 708. Circular groove; 709. T-shaped limiting column; 8. First electric push rod; 9. Arc-shaped clamping block; 10. L-shaped frame; 11. Second electric push rod; 12. Annular encapsulation sleeve; 13. Electric slide rail; 14. Slide base. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] This utility model provides, for example Figure 1-3 The diagram shows a pressing structure for semiconductor packaging, including a packaging base 1. A mounting groove 5 is provided on one side of the top of the packaging base 1. A movable placement plate 6 is provided inside the mounting groove 5. An annular packaging sleeve 12 is placed at the center of the placement plate 6. An L-shaped frame 10 is fixedly provided on the other side of the top of the packaging base 1. A second electric push rod 11 is fixedly installed at the bottom end of the L-shaped frame 10. A pressing assembly 7 is fixedly installed at the telescopic end of the second electric push rod 11. The pressing assembly 7 is aligned with the annular packaging sleeve 12.

[0019] Specifically, by pushing the pressing assembly 7 downwards with the second electric push rod 11, the semiconductor wafer can be pressed into the interior of the annular package sleeve 12.

[0020] according to Figure 1 , Figure 2 and Figure 3 As shown, this utility model discloses a pressing structure for semiconductor packaging. An electric slide rail 13 is fixedly installed at the bottom of the assembly groove 5. A slide block 14 is slidably connected to the surface of the electric slide rail 13. The top of the slide block 14 is fixedly connected to one side of the bottom of the placement plate 6.

[0021] The inner walls of the assembly groove 5 are fixedly installed with first electric push rods 8 on both sides. The telescopic ends of the two first electric push rods 8 are fixedly installed with arc-shaped clamping blocks 9. The two arc-shaped clamping blocks 9 are clamped on both sides of the annular encapsulation sleeve 12.

[0022] Specifically, the first electric push rod 8 pushes the arc-shaped clamping block 9 to move, and the arc-shaped clamping block 9 can clamp and fix the annular encapsulation sleeve 12.

[0023] according to Figure 1 , Figure 2 and Figure 3 As shown, this utility model discloses a pressing structure for semiconductor packaging. The pressing assembly 7 includes an upper fixing plate 701 and a lower fixing plate 702. The center of the upper fixing plate 701 is fixedly connected to the telescopic end of the second electric push rod 11. An installation groove 705 is provided at the center of the bottom end of the upper fixing plate 701. A connecting post 707 is inserted into the installation groove 705. The bottom end of the connecting post 707 is fixedly connected to the center of the lower fixing plate 702. An annular pressure sensor 706 is fixedly installed between the connecting post 707 and the installation groove 705.

[0024] Specifically, the installed ring pressure sensor 706 can detect the pressure in real time during tablet pressing, preventing excessive pressure from damaging the semiconductor wafer.

[0025] The bottom end of the upper fixing plate 701 is provided with multiple circular grooves 708 distributed in a ring. T-shaped limiting posts 709 are inserted into the interior of each of the multiple circular grooves 708. The bottom end of the T-shaped limiting post 709 is fixedly connected to the top end of the lower fixing plate 702.

[0026] Specifically, the cooperation between the circular groove 708 and the T-shaped limiting post 709 ensures that the lower fixing plate 702 is subjected to uniform force during the pressing process.

[0027] A flexible airbag 703 is fixedly installed at the bottom end of the lower fixing plate 702. An inflation nozzle 704 is provided on one side of the lower fixing plate 702, which is connected to the inflation end of the flexible airbag 703. A solenoid valve is fixedly installed inside the inflation nozzle 704.

[0028] A groove 2 is provided on one side of the encapsulation base 1. A high-pressure air pump 3 is fixedly installed inside the groove 2. The output end of the high-pressure air pump 3 is connected to the air inlet 704 through a conduit. A honeycomb cover plate 4 is hinged to one side of the groove 2.

[0029] Specifically, the high-pressure air pump 3 can inflate the flexible airbag 703, ensuring that the flexible airbag 703 is in an inflated state during the pressing process.

[0030] The working principle of this utility model is as follows: When using the semiconductor packaging pressing structure, the semiconductor wafer to be pressed is first placed on the top of the annular packaging sleeve 12. Then, the electric slide rail 13 is opened, and the slide block 14 is moved by the electric slide rail 13. The slide block 14 moves the placement plate 6 into the assembly groove 5. Then, the first electric push rod 8 is opened, and the arc-shaped clamping block 9 is moved by the first electric push rod 8. It should be noted that the two first electric push rods 8 are controlled by a synchronous stroke controller, thereby clamping and fixing the annular packaging sleeve 12. Then, the high-pressure air pump 3 and the solenoid valve are opened, and the flexible air bag 703 is inflated by the high-pressure air pump 3. Then, the solenoid valve is closed, and the second electric push rod 11 is opened. The pressing assembly 7 is pushed down by the second electric push rod 11, and the semiconductor wafer is pressed into the annular packaging sleeve 12 by the pressing assembly 7. During the pressing process, the downward pressure is detected in real time by the annular pressure sensor 706, and the semiconductor wafer is effectively protected by the flexible air bag 703.

[0031] Contents not described in detail herein are existing technologies known to those skilled in the art. The specific embodiments described herein are merely illustrative examples illustrating the spirit of this invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this invention or exceeding the scope defined by the appended claims.

Claims

1. A tabletting structure for semiconductor package, comprising a package seat (1), one side of the top of the package seat (1) is provided with an assembly groove (5), the inside of the assembly groove (5) is provided with a movable placing plate (6), characterized in that, An annular encapsulation sleeve (12) is placed at the center of the placement plate (6). An L-shaped frame (10) is fixedly provided on the other side of the top of the encapsulation base (1). A second electric push rod (11) is fixedly installed at the bottom of the L-shaped frame (10). A pressing assembly (7) is fixedly installed at the telescopic end of the second electric push rod (11). The pressing assembly (7) is aligned with the annular encapsulation sleeve (12).

2. A tablet press structure for semiconductor packaging according to claim 1, wherein An electric slide rail (13) is fixedly installed at the bottom of the assembly slot (5). A slide block (14) is slidably connected to the surface of the electric slide rail (13). The top of the slide block (14) is fixedly connected to one side of the bottom of the placement plate (6).

3. A tablet press structure for semiconductor packaging according to claim 2, wherein The inner walls of the assembly groove (5) are fixedly installed with first electric push rods (8) on both sides. The telescopic ends of the two first electric push rods (8) are fixedly installed with arc-shaped clamping blocks (9). The two arc-shaped clamping blocks (9) are clamped on both sides of the annular encapsulation sleeve (12).

4. The tablet press structure for semiconductor packaging according to claim 1, wherein The tablet pressing assembly (7) includes an upper fixing plate (701) and a lower fixing plate (702). The center of the upper fixing plate (701) is fixedly connected to the telescopic end of the second electric push rod (11). An installation groove (705) is provided at the center of the bottom end of the upper fixing plate (701). A connecting post (707) is inserted into the inside of the installation groove (705). The bottom end of the connecting post (707) is fixedly connected to the center of the lower fixing plate (702). A ring pressure sensor (706) is fixedly installed between the connecting post (707) and the installation groove (705).

5. A tablet press structure for semiconductor encapsulation according to claim 4, wherein The bottom end of the upper fixing plate (701) is provided with a plurality of circular grooves (708) distributed in a ring. T-shaped limiting posts (709) are inserted into the interior of each of the circular grooves (708). The bottom end of the T-shaped limiting post (709) is fixedly connected to the top end of the lower fixing plate (702).

6. A tablet press structure for semiconductor packaging according to claim 5, wherein A flexible airbag (703) is fixedly installed at the bottom end of the lower fixing plate (702). An inflation nozzle (704) communicating with the inflation end of the flexible airbag (703) is opened on one side of the lower fixing plate (702). An electromagnetic valve is fixedly installed inside the inflation nozzle (704).

7. The tablet press structure for semiconductor packaging according to claim 1, wherein A groove (2) is provided on one side of the encapsulation base (1). A high-pressure air pump (3) is fixedly installed inside the groove (2). The output end of the high-pressure air pump (3) is connected to the air inlet (704) through a conduit. A honeycomb cover plate (4) is hinged to one side of the groove (2).

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