A semiconductor processing apparatus

Abstract

The utility model discloses a kind of semiconductor processing devices, belong to the technical field of semiconductor packaging, including rack, rack top end side wall is provided with mould a, rack top end side wall is fixed with multiple symmetrically distributed support rod, multiple support rod one end is commonly fixed with top plate, top plate one side is provided with mould b, mould b is located directly above mould a, mould a one side is provided with compatible bearing frame, mould b is compatible with bearing frame;The utility model is through the setting of auxiliary assembly, can be extruded with bearing frame, so that bearing frame can be moved after being forced to be lifted upwards, to facilitate staff to take the semiconductor after injection molding packaging is completed, to effectively improve the packaging work efficiency of semiconductor, and also can avoid the situation that it is difficult to take bearing frame due to epoxy resin adhesion appears, overall practicality is stronger.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor processing apparatus. Background Technology

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Their conductivity is easily controlled, making them suitable as components for information processing. To prevent dust from adhering to the semiconductor surface and causing damage, a protective film is usually applied to the semiconductor. Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product models and functional requirements. Packaging technology is used for packaging and sealing, which means wrapping the semiconductor chip with a certain material to protect it from external environmental influences. This step is also designed to protect the "light, thin, short, and small" characteristics of the object. Packaging technology can be broadly divided into sealing and molding methods: sealing refers to attaching ceramic plates or metal covers for sealing; molding refers to melting and then curing plastic epoxy materials for sealing. Of these two methods, sealing is rarely used nowadays, and molding using epoxy resin molding compounds is more common. As for the method of filling semiconductors with resin, molding technology can be further divided into transfer molding and compression molding. Today, we will first briefly understand the packaging technology, and then delve into the molding method.

[0003] Comparing with patent document publication number CN218535384U, a semiconductor processing device includes a housing. An upper mold and a lower mold are respectively disposed at the top and bottom of the housing. A motor is fixedly connected to the bottom of the housing, and a turntable is fixedly connected to the top of the motor. The bottom of the lower mold is disposed at the top of the turntable, and several modules are fixedly connected to the top of the lower mold. An injection molding box is fixedly connected to one side of the housing. An injection molding tube is inserted into the bottom of the injection molding box, and an injection molding machine is inserted into the injection molding tube. This invention has the following advantages: the adhesive in the injection molding box enters the injection molding machine through the injection molding tube. By rotating the motor, the turntable rotates, causing the lower mold on the turntable to rotate. This allows the modules to sequentially reach the bottom of the injection molding machine, enabling the modules on the lower mold to be dispensed sequentially, thus allowing multiple semiconductors to be packaged. "Currently, there are various semiconductor packaging methods, among which the molding method using epoxy resin plastic is more common. However, when packaging semiconductors, the adhesive of epoxy resin has a certain degree of stickiness, which causes some incompleteness when workers handle the packaged semiconductors. This affects the packaging effect, resulting in a low pass rate. Moreover, it is difficult to package multiple semiconductors at once, which cannot meet the packaging needs of workers."

[0004] Therefore, it is necessary to provide a semiconductor processing apparatus to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor processing apparatus to solve the problems of poor semiconductor injection molding effect and poor integrity during handling in the above-mentioned background art.

[0006] To achieve the above objectives, the present invention provides the following solution to the aforementioned technical problems: A semiconductor processing apparatus includes a frame, a mold a is provided on the top side wall of the frame, a plurality of symmetrically distributed support rods are fixed on the top side wall of the frame, a top plate is fixed to one end of the plurality of support rods, a mold b is provided on one side of the top plate, the mold b is located directly above the mold a, a matching carrier frame is provided on one side of the mold a, the mold b is matched with the carrier frame, an auxiliary component matched with the carrier frame is provided on one side of the frame, an injection tube a is provided on one side of the frame and connected to one side of the mold a, and a plurality of symmetrically distributed carrier rods are fixed on the top side wall of the frame, with one side of the carrier frame contacting one side of the carrier rods.

[0007] As a further embodiment of this utility model, the auxiliary component includes two bearing seats that are symmetrically distributed and fixed to the bottom side wall of the frame. The two bearing seats are rotatably connected to a bidirectional threaded rod on their adjacent side walls. Two symmetrically distributed through slots are provided on one side wall of the frame. A clamping plate is slidably connected inside the through slots. The bidirectional threaded rod is threadedly connected to one side of the clamping plate. A bracket is fixed to one side wall of the frame. A drive motor is fixed to the top side wall of the bracket. One end of the output shaft of the drive motor is coaxially fixed to one end of the bidirectional threaded rod.

[0008] As a further embodiment of this utility model, two symmetrically distributed mounting frames are fixed to one side wall of the frame, and the clamping plate is slidably connected to one side of the mounting frame.

[0009] As a further embodiment of this utility model, the sidewalls of the two clamping plates adjacent to each other are provided with chamfered slopes, and one side of the support frame is provided with a chamfered slope, wherein the chamfered slopes of the clamping plates are adapted to the chamfered slopes of the support frame.

[0010] As a further embodiment of this utility model, an adjustment component adapted to the mold b is provided on one side of the top plate, a mounting frame is fixed to the top side wall of the top plate, a cylinder is fixed to the inner side wall of the mounting frame, an mounting bracket is fixed to the top side wall of the mold b, the output end of the cylinder is fixed to one side wall of the mounting bracket, and a plurality of symmetrically distributed guide rods are fixed to the top side wall of the mounting bracket, the guide rods being slidably connected through the side wall of the top plate.

[0011] As a further embodiment of this utility model, a limiting ring is fixed at one end of the guide rod, and the diameter of the limiting ring is greater than the diameter of the guide rod.

[0012] As a further embodiment of this utility model, a booster pump is fixed to one side wall of the frame, the output end of the booster pump is connected to one end of the injection tube a, and the input end of the booster pump is fixed to an injection tube b connected thereto.

[0013] As a further embodiment of this utility model, a sealing groove is provided on one side wall of mold a, and a sealing gasket is fixed on one side wall of mold b, the sealing gasket being adapted to the sealing groove.

[0014] As a further embodiment of this utility model, a control system is provided on one side of the frame. The control system includes a programmable logic controller (PLC) and a pressure sensor, a position sensor, and a drive module that are electrically connected to it.

[0015] The pressure sensor is installed inside the cavity of mold a and mold b to monitor the resin pressure in real time during the injection molding process.

[0016] The position sensor is located at the end of the piston rod of the cylinder and is used to detect the mold closing and opening positions of mold b.

[0017] The drive module is electrically connected to the drive motor, cylinder and booster pump respectively, and is used to receive control commands from the PLC and drive the corresponding components to move.

[0018] The control system is configured to perform the encapsulation process according to the following timing logic:

[0019] After receiving the mold closing signal, the control cylinder moves to drive mold b to move down and close with mold a, and the position sensor confirms that the mold is closed in place.

[0020] After the mold is closed, the booster pump is started to inject epoxy resin into the mold cavity through injection tube a. At the same time, the injection pressure is monitored in real time by the pressure sensor. When the pressure reaches the set threshold and remains stable, the injection stops.

[0021] After injection molding, the pressure holding stage begins, and the pressure holding time is controlled by a PLC preset program.

[0022] After the pressure holding is completed, the control cylinder lifts mold b to complete the mold opening;

[0023] After the mold is opened, the control drive motor is started, which drives the bidirectional threaded rod to rotate, causing the clamping plate to move inward and lift the support frame to the position where the part can be removed.

[0024] Compared with the prior art, the beneficial effects of this utility model are:

[0025] (1) By setting the auxiliary components, this utility model can be squeezed and driven with the support frame, so that the support frame can be lifted up and moved after being subjected to force, which makes it convenient for the staff to pick up the semiconductor after injection molding and packaging, effectively improving the packaging efficiency of semiconductors, and also avoiding the situation that it is difficult to pick up the support frame due to epoxy resin adhesion, which is highly practical.

[0026] (2) By adjusting the setting of the components, this utility model can accurately and stably adjust the distance between mold a and mold b, thereby improving the working efficiency of semiconductor injection molding and packaging. Moreover, it can perform packaging processing on multiple semiconductors at one time, which can better meet the needs of injection molding and packaging of a large number of semiconductors and has strong practicality. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0028] Figure 1 This is a three-dimensional view of the overall structure of this utility model;

[0029] Figure 2 This is a top view of the structure of this utility model;

[0030] Figure 3 This is a partial bottom view of the structure of this utility model;

[0031] Figure 4 This is a schematic diagram of the structure at point b of the mold of this utility model;

[0032] Figure 5 This is a partial side view of the structure of this utility model;

[0033] Figure 6 for Figure 5 Enlarged schematic diagram of the structure of region A in the middle;

[0034] Figure 7 This is a schematic diagram of the partial explosion structure of this utility model.

[0035] The attached diagram lists the components represented by each number as follows:

[0036] 1. Frame; 2. Mold a; 3. Support rod; 4. Top plate; 5. Mold b; 6. Bearing frame; 7. Auxiliary components; 71. Bearing seat; 72. Double-threaded rod; 73. Through groove; 74. Clamping plate; 75. Bracket; 76. Drive motor; 8. Injection tube a; 9. Bearing rod; 10. Mounting frame; 11. Adjustment component; 111. Mounting bracket; 112. Cylinder; 113. Mounting bracket; 114. Guide rod; 12. Restricting ring; 13. Booster pump; 14. Injection tube b; 15. Sealing groove; 16. Sealing gasket. Detailed Implementation

[0037] The present invention will be further described below with reference to the embodiments.

[0038] Please see Figure 1-7 This utility model provides a semiconductor processing apparatus, including a frame 1. A mold a2 is provided on the top side wall of the frame 1. A plurality of symmetrically distributed support rods 3 are fixed on the top side wall of the frame 1. One end of the plurality of support rods 3 is jointly fixed to a top plate 4. A mold b5 is provided on one side of the top plate 4. The mold b5 is located directly above the mold a2. A matching carrier frame 6 is provided on one side of the mold a2. The mold b5 is compatible with the carrier frame 6. An auxiliary component 7 compatible with the carrier frame 6 is provided on one side of the frame 1. An injection tube a8 connected to one side of the mold a2 is provided on one side of the frame 1. A plurality of symmetrically distributed carrier rods 9 are fixed on the top side wall of the frame 1. One side of the carrier frame 6 is in contact with one side of the carrier rod 9. The carrier rods 9 provide support for the carrier frame 6 and prevent the carrier frame 6 from shaking or shifting when placing semiconductors for injection molding.

[0039] Further as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, it is worth noting that the auxiliary component 7 includes two symmetrically distributed bearing seats 71 fixed to the bottom side wall of the frame 1. The two adjacent side walls of the two bearing seats 71 are rotatably connected to a bidirectional threaded rod 72. Two symmetrically distributed through slots 73 are opened on one side wall of the frame 1. A clamping plate 74 is slidably connected inside the through slots 73. The bidirectional threaded rod 72 is threadedly connected to one side of the clamping plate 74. A bracket 75 is fixed to one side wall of the frame 1. A drive motor 76 is fixed to the top side wall of the bracket 75. One end of the output shaft of the drive motor 76 is coaxially fixed to one end of the bidirectional threaded rod 72. Through the setting of the auxiliary component 7, it can perform extrusion transmission with the support frame 6, so that the support frame 6 can be lifted upward and moved after being subjected to force. This makes it convenient for the staff to pick up the semiconductor after injection molding and packaging, effectively improving the efficiency of semiconductor packaging. Moreover, it can also avoid the situation where it is difficult to pick up the support frame 6 due to epoxy resin adhesion. It has strong practicality.

[0040] Further as Figure 1 and Figure 3As shown, it is worth noting that two symmetrically distributed mounting frames 10 are fixed on one side wall of the frame 1. The clamping plate 74 is slidably connected to one side of the mounting frame 10. By sliding the clamping plate 74 on one side of the mounting frame 10, it can not only guide the clamping plate 74, but also improve the stability and smoothness of the clamping plate 74 when it moves.

[0041] This solution includes the following working process: When semiconductor packaging is required, the carrier 6 carrying the semiconductor is first placed at mold a2. Driven by cylinder 112, mold b5 is moved downwards under pressure until the sealing gasket 16 is engaged with the sealing groove 15, thus ensuring that mold b5 and mold a2 are in a fitted state. Epoxy resin is then introduced into booster pump 13 through injection tube b14. Driven by booster pump 13, the pressurized epoxy resin is introduced into mold a2 and mold b5 through injection tube a8, thereby completing the packaging process. After the semiconductor injection molding and packaging work at carrier 6 is completed, the mold b5 is separated from the mold a2 by the drive of cylinder 112. The bidirectional threaded rod 72 rotates synchronously by the drive motor 76. The threaded transmission between the bidirectional threaded rod 72 and the clamping plate 74 causes the clamping plate 74 to move along the through groove 73 after being subjected to force. The inclined surface of the clamping plate 74 is pressed against the inclined surface of the carrier 6, causing the carrier 6 to move upward under the pressure. The operator can then remove the lifted carrier 6.

[0042] As can be seen from the above working process, the auxiliary component 7 can be squeezed and driven with the support frame 6, so that the support frame 6 can be lifted upward and moved after being subjected to force, which makes it convenient for the staff to pick up the semiconductor after injection molding and packaging, effectively improving the efficiency of semiconductor packaging. It can also avoid the situation where it is difficult to pick up the support frame 6 due to epoxy resin adhesion, which is highly practical. Furthermore, by adjusting the component 11, the distance between mold a2 and mold b5 can be precisely and stably adjusted, thereby improving the efficiency of semiconductor injection molding and packaging. Moreover, it can package multiple semiconductors at one time, which can better meet the needs of injection molding and packaging a large number of semiconductors, making it highly practical.

[0043] Further as Figure 4 , Figure 5 and Figure 6As shown, it is worth noting that the side walls of the two adjacent clamping plates 74 are both chamfered, and one side of the support frame 6 is also chamfered. The chamfered surfaces of the clamping plates 74 and the support frame 6 are adapted to each other. This adaptation ensures that the clamping plates 74 and the support frame 6 are in a relatively stable state during the extrusion transmission, thus preventing jamming during the extrusion transmission.

[0044] Further as Figure 2 and Figure 4 As shown, it is worth noting that an adjustment component 11 adapted to the mold b5 is provided on one side of the top plate 4. A mounting bracket 111 is fixed to the top side wall of the top plate 4, and a cylinder 112 is fixed to the inner side wall of the mounting bracket 111. An mounting frame 113 is fixed to the top side wall of the mold b5. The output end of the cylinder 112 is fixed to one side wall of the mounting frame 113. A plurality of symmetrically distributed guide rods 114 are fixed to the top side wall of the mounting frame 113. The guide rods 114 are slidably inserted through one side wall of the top plate 4. By setting the adjustment component 11, the distance between the mold a2 and the mold b5 can be precisely and stably adjusted, thereby improving the efficiency of semiconductor injection molding and packaging. Moreover, it can perform packaging and processing operations on multiple semiconductors at one time, which can better meet the needs of injection molding and packaging of a large number of semiconductors, and has strong practicality.

[0045] Further as Figure 3 and Figure 4 As shown, it is worth noting that a limiting ring 12 is fixed at one end of the guide rod 114. The diameter of the limiting ring 12 is larger than the diameter of the guide rod 114. By setting the limiting ring 12, the guide rod 114 can be prevented from falling off during movement, effectively improving the safety of the guide rod 114 during movement.

[0046] Further as Figure 1 and Figure 3 As shown, it is worth noting that a booster pump 13 is fixed to one side wall of the frame 1. The output end of the booster pump 13 is connected to one end of the injection tube a8, and the input end of the booster pump 13 is fixed to the injection tube b14. By setting up the booster pump 13, the speed at which epoxy resin enters the mold a2 and mold b5 can be accelerated, which is beneficial to improving the efficiency of semiconductor injection molding and packaging and preventing the molding effect from being affected by the slow injection speed of epoxy resin.

[0047] Further as Figure 2 and Figure 3As shown, it is worth noting that a sealing groove 15 is provided on one side wall of mold a2, and a sealing gasket 16 is fixed on one side wall of mold b5. The sealing gasket 16 is adapted to the sealing groove 15. By setting the sealing groove 15 and the sealing gasket 16, the sealing effect when mold a2 and mold b5 fit together can be improved, thereby preventing the epoxy resin from leaking during semiconductor injection molding and significantly improving the sealing performance when mold a2 and mold b5 are bonded together.

[0048] Furthermore, a control system is installed on one side of the frame 1. The control system includes a programmable logic controller (PLC) and pressure sensors, position sensors, and drive modules electrically connected to it. The PLC is preferably a Siemens S7-1200 series, which is connected to each sensor and actuator through digital input / output modules. The pressure sensor is a MikroPiranha series miniature pressure sensor, embedded in the side wall of the mold cavity. The position sensor is an Omron E2E series proximity switch, installed at the end of the cylinder piston rod stroke. The drive module is a solid-state relay group, which controls the start, stop, and speed adjustment of the drive motor, cylinder solenoid valve, and booster pump motor, respectively.

[0049] Pressure sensors are installed inside the cavities of molds a2 and b5 to monitor the resin pressure during the injection molding process in real time.

[0050] A position sensor is located at the end of the piston rod of cylinder 112 to detect the mold closing and opening positions of mold b5;

[0051] The drive module is electrically connected to the drive motor 76, cylinder 112 and booster pump 13 respectively, and is used to receive control commands from the PLC and drive the corresponding components to move.

[0052] The control system is configured to perform the encapsulation process according to the following timing logic:

[0053] After receiving the mold closing signal, the control cylinder 112 drives the mold b5 to move down and close with the mold a2, and the position sensor confirms that the mold is closed in place.

[0054] After the mold is closed, the booster pump 13 is started to inject epoxy resin into the mold cavity through the injection tube a8. At the same time, the injection pressure is monitored in real time by the pressure sensor. When the pressure reaches the set threshold and remains stable, the injection stops.

[0055] After injection molding, the pressure holding stage begins, and the pressure holding time is controlled by a PLC preset program.

[0056] After the pressure holding is completed, control cylinder 112 lifts mold b5 to complete the mold opening;

[0057] After the mold is opened, the control drive motor 76 is started, driving the bidirectional threaded rod 72 to rotate, causing the clamping plate 74 to move inward, and lifting the support frame 6 to the position where the part can be removed.

[0058] In summary: the support rod 9 provides support for the support frame 6, preventing it from wobbling or shifting during semiconductor injection molding. The clamping plate 74 slides on one side of the mounting frame 10, guiding it and improving its stability and smoothness during movement. The matching slopes of the clamping plate 74 and the support frame 6 ensure relative stability during compression, preventing jamming. Finally, the limiting ring 12 prevents misalignment during guidance. The guide rod 114 is designed to prevent detachment during movement, thus improving its safety. The booster pump 13 accelerates the entry of epoxy resin into molds a2 and b5, improving the efficiency of semiconductor injection molding and preventing slow injection from affecting the molding process. The sealing groove 15 and sealing gasket 16 enhance the sealing effect when molds a2 and b5 fit together, preventing epoxy resin leakage during semiconductor injection molding and significantly improving the sealing performance between molds a2 and b5.

[0059] The drive motor 76, cylinder 112 and booster pump 13 can all be purchased from the market. The drive motor 76, cylinder 112 and booster pump 13 are all equipped with power supplies. These are mature technologies in the field and have been fully disclosed. Therefore, they will not be described again in the specification.

Claims

1. A semiconductor processing apparatus comprising a gantry, characterized in that, The top side wall of the frame is provided with a mold a, and multiple symmetrically distributed support rods are fixed to the top side wall of the frame. One end of the multiple support rods is fixed to a top plate. A mold b is provided on one side of the top plate. The mold b is located directly above the mold a. A matching carrier frame is provided on one side of the mold a. The mold b is compatible with the carrier frame. An auxiliary component compatible with the carrier frame is provided on one side of the frame. An injection tube a is provided on one side of the frame and communicates with one side of the mold a. Multiple symmetrically distributed carrier rods are fixed to the top side wall of the frame. One side of the carrier frame is in contact with one side of the carrier rod. The auxiliary component includes two bearing seats that are symmetrically distributed and fixed to the bottom side wall of the frame. The two bearing seats are rotatably connected to a bidirectional threaded rod on their adjacent side walls. Two symmetrically distributed through slots are opened on one side wall of the frame. A clamping plate is slidably connected inside the through slots. The bidirectional threaded rod is threaded to one side of the clamping plate. A bracket is fixed to one side wall of the frame. A drive motor is fixed to the top side wall of the bracket. One end of the output shaft of the drive motor is coaxially fixed to one end of the bidirectional threaded rod. The sidewalls of the two clamping plates adjacent to each other are chamfered, and one side of the support frame is chamfered. The chamfered surfaces of the clamping plates are adapted to the chamfered surfaces of the support frame.

2. The semiconductor processing apparatus of claim 1, wherein Two symmetrically distributed mounting frames are fixed to one side wall of the frame, and the clamping plate is slidably connected to one side of the mounting frame.

3. The semiconductor processing apparatus of claim 2, wherein An adjustment component adapted to the mold b is provided on one side of the top plate. A mounting bracket is fixed to the top side wall of the top plate. A cylinder is fixed to the inner side wall of the mounting bracket. An mounting frame is fixed to the top side wall of the mold b. The output end of the cylinder is fixed to one side wall of the mounting frame. A plurality of symmetrically distributed guide rods are fixed to the top side wall of the mounting frame. The guide rods slide through the side wall of the top plate.

4. The semiconductor processing apparatus of claim 3, wherein A limiting ring is fixed to one end of the guide rod, and the diameter of the limiting ring is larger than the diameter of the guide rod.

5. The semiconductor processing apparatus of claim 4, wherein A booster pump is fixed to one side wall of the frame. The output end of the booster pump is connected to one end of the injection molding pipe a. The input end of the booster pump is fixed to an injection molding pipe b that is connected to it.

6. The semiconductor processing apparatus of claim 5, wherein A sealing groove is provided on one side wall of mold a, and a sealing gasket is fixed on one side wall of mold b. The sealing gasket is adapted to the sealing groove.

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