Wafer assisted debonding and retrieval apparatus

Abstract

The utility model relates to a technical field of semiconductor, concretely relates to a wafer auxiliary degumming wafer taking device. Wafer auxiliary degumming wafer taking device includes wafer bottom support mechanism, the wafer bottom support mechanism includes: base, the surface of base is provided with the arc slot extending along the first direction, a plurality of separating components are arranged in the above of arc slot along the first direction interval, and every separating component extends along the second direction, at least one of a plurality of separating components can move along the first direction, a plurality of separating components are used for separating arc slot into a plurality of areas to accommodate a plurality of wafers, wherein, the first direction is the length direction of base, and the second direction is the width direction of base. The utility model supports the wafer to keep always downward state after getting off from cutting machine, does not need to carry out the turning operation, thereby avoid the problem of traditional method because of turning the wafer and leads to the shaking, the collision and the stress concentration.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a wafer-assisted debinding and wafer-removing device. Background Technology

[0002] Silicon carbide (SiC) single crystals, as the core representative of third-generation semiconductor materials, have demonstrated irreplaceable application advantages over traditional silicon-based materials in high-voltage, high-frequency, high-temperature, and high-power scenarios such as power modules for new energy vehicles, traction converters for rail transit, power transmission and transformation equipment for smart grids, radio frequency devices for 5G base stations, and high-temperature resistant electronic systems for aerospace. They have become a key basic material supporting the upgrading of high-end equipment.

[0003] In the wire EDM process of silicon carbide crystals, the crystal must first be fixed in place. First, a special adhesive is used to bond one end of the silicon carbide crystal to one end of a graphite block. Then, the other end of the graphite block is bonded to a fixture. Through this multi-layered connection structure of "crystal-adhesive-graphite block-adhesive-fixture," a stable assembly of the crystal on the fixture is achieved. After fixing, the fixture is inverted and installed on the wire EDM machine with the silicon carbide crystal facing downwards. The steel wire cuts the crystal in an "upward" direction. After the cutting process, the fixture containing the cut crystal must be removed from the wire EDM machine. During removal, the fixture must be flipped so that the cut crystal faces upwards. Finally, the graphite block portion bonded to the crystal is cut with a utility knife to separate the crystal from the fixture.

[0004] The current processing flow has the following problems: shaking damage during flipping and unloading: After the crystal is cut into multiple wafers, there is a natural gap between the wafers; during the process of the fixture being removed from the wire cutter and flipped, the wafer is prone to slight shaking. This shaking will cause uneven stress on the bonding interface between the wafer and the graphite block, which will lead to chipping or cracks at the bonding area, resulting in wafer damage. Utility Model Content

[0005] The purpose of this invention is to provide a wafer-assisted debonding and wafer-removal device to solve or improve one or more technical problems existing in the prior art.

[0006] The embodiments of this utility model are implemented as follows:

[0007] This utility model provides a wafer-assisted debinding and wafer-removal device, including a wafer base mechanism; the wafer base mechanism includes:

[0008] The base has an arc-shaped groove extending in a first direction on its surface;

[0009] Multiple partition members are spaced apart above the arcuate groove along the first direction, and each partition member extends along a second direction; at least one of the multiple partition members is movable along the first direction; the multiple partition members are used to divide the arcuate groove into multiple regions to accommodate multiple wafers;

[0010] Wherein, the first direction is the length direction of the base, and the second direction is the width direction of the base.

[0011] In an optional embodiment, the plurality of separating components include two fixed separating members and a plurality of movable separating members; the two fixed separating members are respectively fixed at both ends of the arc-shaped groove in the first direction, and each movable separating member can move along the first direction. The plurality of movable separating members cooperate with the two fixed separating members to divide the arc-shaped groove into the plurality of regions.

[0012] In an optional embodiment, the wafer base mechanism further includes two guide rails, each of which extends along the first direction and is respectively disposed on both sides of the base in the second direction; each of the movable separators is slidably connected to the two guide rails one-to-one at both ends in the second direction.

[0013] In an optional embodiment, the two guide rails are respectively disposed on two opposite side walls of the base; the movable partition is U-shaped, the crossbeam portion of the U-shaped structure spans across the arc-shaped groove, and the bottom ends of the two vertical arms of the U-shaped structure are slidably connected to the two guide rails one by one.

[0014] In an optional embodiment, the wafer base mechanism further includes locking components, with at least one locking component provided on each of the movable partitions. Each locking component can abut against or disengage from one of the guide rails, and all the locking components on each movable partition cooperate to lock or release the corresponding movable partition. The locking components are bolts or screws.

[0015] In an optional embodiment, the two fixing separators are respectively arc-shaped protrusions integrally formed at both ends of the arc-shaped groove.

[0016] In an optional embodiment, the arc-shaped top wall of the arc-shaped protrusion structure is connected to the arc-shaped side wall of the arc-shaped protrusion structure on the side near the plurality of movable separators by a smooth transition.

[0017] In an optional embodiment, the inner surface of the arc-shaped groove is provided with a wafer support pad made of soft rubber; and / or, each of the separating components is provided with a soft rubber portion on one or both sides in the first direction, the soft rubber portion being used to contact the wafer.

[0018] In an optional embodiment, a clamping mechanism is further included, which is disposed above the wafer support mechanism and includes: a clamping guide rail; a clamping body slidably connected to the clamping guide rail; and a plurality of graphite blocks, one end of each graphite block being connected to the clamping body and the other end being used to connect to the wafer.

[0019] In an optional embodiment, a laser cutting mechanism is also included, comprising: a gantry; a transmitter guide rail fixed to the gantry; a transmitter base slidably disposed on the transmitter guide rail along a first direction; and a laser transmitter fixed to the transmitter base for emitting laser light to cut graphite blocks.

[0020] The wafer-assisted debinding and pick-up device provided in this application, through the configuration of a base with an arc-shaped groove and multiple separating components, constitutes a highly adaptable and stable wafer support system. This wafer support system ensures that the wafer remains face down after exiting the dicing machine, eliminating the need for flipping and thus avoiding the shaking, collision, and stress concentration problems caused by wafer flipping in traditional methods. Through the coordinated operation of the arc-shaped groove and multiple separating components, the device can provide stable and customized accommodating space for wafers of different thicknesses, ensuring precise positioning and no loosening of the wafer during transfer and subsequent processing. This design not only effectively eliminates the risk of wafer chipping and cracking during flipping but also significantly improves operational safety, laying a solid foundation for subsequent non-contact laser debinding processes and overall improving the wafer pick-up yield and process reliability. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the wafer base mechanism of the wafer-assisted debonding and wafer-removing device in an embodiment of this utility model.

[0023] Figure 2 This is a schematic diagram of the clamping mechanism of the wafer-assisted debonding and wafer-removing device in an embodiment of this utility model.

[0024] Figure 3 This is a schematic diagram of the laser cutting mechanism of the wafer-assisted debonding and wafer-removing device in an embodiment of this utility model.

[0025] Figure 4This is a schematic diagram of the wafer-assisted debonding and wafer-removing device in an embodiment of the present invention.

[0026] icon:

[0027] 10-Chip base mechanism; 11-Base; 12-Arc groove

[0028] 13-Fixed partition 14-Modible partition 15-Guide rail

[0029] 16-Locking component 20-Chip 30-Clamping mechanism

[0030] 31-Clamp guide rail; 32-Clamp body; 33-Graphite block

[0031] 40-Laser cutting mechanism; 41-Gantry frame; 42-Emitter guide rail

[0032] 43-Emitter base 44-Laser emitter 131-Curved top wall

[0033] 132-Arc-shaped sidewall Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] Please refer to Figures 1 to 4 Some embodiments of this application provide a wafer-assisted debonding and removal device, including a wafer base mechanism 10; the wafer base mechanism 10 includes: a base 11, the surface of which has an arcuate groove 12 extending along a first direction; a plurality of partition members, spaced apart above the arcuate groove 12 along the first direction, and each partition member extending along a second direction; at least one of the plurality of partition members is movable along the first direction; the plurality of partition members are used to divide the arcuate groove 12 into a plurality of regions to accommodate a plurality of wafers 20; wherein, the first direction is the length direction of the base 11, and the second direction is the width direction of the base 11.

[0040] It is understood that at least one of the plurality of separating components can move along the first direction, covering a variety of implementation scenarios: including the case where only one of the plurality of separating components can move along the first direction, the case where any number of two or more of the plurality of separating components can move, and the case where all separating components can move along the first direction. Furthermore, the wafer-assisted debonding and removal device of this utility model is not limited to the application scenario of silicon carbide wafers. It has good adaptability to wafer types such as sapphire wafers, silicon wafers, and gallium nitride wafers, which also require stable support and low-damage debonding and removal after cutting. The arc-shaped groove 12 extends along the first direction, that is, the axial direction of the arc-shaped groove extends along the first direction.

[0041] In at least one embodiment, firstly, by utilizing the adaptability of the arc groove 12 to the shape of the wafer 20, a fitting support base is provided for the wafer 20, avoiding the problems of the wafer 20 being suspended at the edge and unevenly stressed, which are easily caused by traditional planar support; secondly, the partitioning components extending along the second direction and spaced apart along the first direction can divide the arc groove 12 into independent accommodating areas, realizing the synchronous separation and placement of multiple wafers and preventing the wafers 20 from rubbing and colliding with each other; most importantly, the design of at least one movable partitioning component can flexibly adjust the spacing between adjacent areas according to the size requirements of wafers 20 of different thicknesses, breaking the limitation of traditional fixed-spacing support structures that can only adapt to a single specification of wafer 20, and significantly improving the compatibility of the device with multi-specification wafer 20 processing scenarios.

[0042] As described above, the wafer-assisted debonding and pick-up device provided in this application, through the configuration of a base 11 with an arc-shaped groove 12 and multiple separating components, constitutes a highly adaptable and stable wafer 20 support system. This wafer 20 support system ensures that the wafer 20 remains face down after being removed from the dicing machine, eliminating the need for flipping. This avoids the shaking, collision, and stress concentration problems caused by flipping the wafer 20 in traditional methods. Through the coordinated operation of the arc-shaped groove 12 and multiple separating components, the device provides a stable and customized accommodating space for wafers 20 of different thicknesses, ensuring that the wafer 20 remains precisely positioned and free from loosening during transfer and subsequent processing. This design not only effectively eliminates the risk of chipping or cracking of the wafer 20 during flipping but also significantly improves operational safety, laying a solid foundation for subsequent non-contact laser debonding processes and overall improving the yield and process reliability of wafer 20 pick-up.

[0043] In some embodiments of this application, the plurality of separating components include two fixed separating members 13 and a plurality of movable separating members 14. The two fixed separating members 13 are respectively fixed at both ends of the arc-shaped groove 12 in the first direction, and each movable separating member 14 can move along the first direction. The plurality of movable separating members 14 cooperate with the two fixed separating members 13 to divide the arc-shaped groove 12 into multiple regions. In at least one embodiment, by fixing the two fixed separating members 13 to both ends of the arc-shaped groove 12 along the first direction, a stable boundary is first provided for the end region of the arc-shaped groove 12 to prevent the wafer 20 from slipping off both ends of the arc-shaped groove 12. At the same time, a reference is provided for the spacing adjustment of the movable separating members 14 to ensure that the spacing adjustment of each accommodating region is more accurate. Secondly, the plurality of movable separating members 14 that can move along the first direction can flexibly allocate the space of each accommodating region within the reference range of the fixed separating members 13 according to the actual thickness of the wafer 20. This can meet the uniform separation requirements of wafers 20 of the same batch and thickness, and also adapt to the differentiated support requirements of wafers 20 of different batches and thicknesses.

[0044] In some embodiments of this application, the wafer support mechanism 10 further includes two guide rails 15, each extending along the first direction and respectively disposed on both sides of the base 11 in the second direction; each movable partition 14 is slidably connected to the two guide rails 15 at both ends in the second direction. In at least one embodiment, the addition of guide rails 15 extending along the first direction and respectively disposed on both sides of the base 11 in the second direction provides precise guidance for the movement of the movable partition 14, ensuring that the movable partition 14 can only slide along the first direction, avoiding its offset or tilting in the second direction during movement, and preventing uneven force on the wafer 20 due to the offset of the movable partition 14; secondly, compared with unguided free movement, the guide rail sliding connection structure can significantly reduce the frictional resistance when the movable partition 14 moves, making the spacing adjustment operation smoother and reducing the operating intensity of the operator; in addition, the two guide rails on both sides form support for the two ends of the movable partition 14, enhancing the structural stability of the movable partition 14 when supporting the wafer 20.

[0045] In some embodiments of this application, the two guide rails 15 are respectively disposed on two opposite side walls of the base 11; the movable partition 14 has a U-shaped structure, with the crossbeam portion of the U-shaped structure spanning above the arc-shaped groove 12, and the bottom ends of the two vertical arms of the U-shaped structure slidingly connected to the two guide rails 15 one-to-one. In at least one embodiment, the two guide rails 15 are respectively disposed on two opposite side walls of the base 11, so that the guide rails are installed closer to the structural edge of the base 11, avoiding the guide rails occupying the support space above the arc-shaped groove 12, and enhancing the connection stability between the guide rails and the base 11; the movable partition 14 is designed as a U-shaped structure, with the two vertical arms of the U-shaped structure serving as connecting ends to cooperate with the guide rails, so that the movable partition 14 is subjected to more uniform force, and compared with a single-sided connection or a middle connection structure, it can better resist the lateral force that the wafer 20 may generate, preventing the movable partition 14 from deforming.

[0046] In some embodiments of this application, the wafer support mechanism 10 further includes a locking component 16. Each movable partition 14 is provided with at least one locking component 16. Each locking component 16 can abut against or disengage from one of the guide rails 15. All locking components 16 on each movable partition 14 cooperate to lock or release the corresponding movable partition 14. The locking component 16 is a bolt or screw. In at least one embodiment, the configuration of the locking component 16 effectively solves the problem that the movable partition 14 is prone to displacement due to external force after adjustment. By fixing the movable partition 14 in the target position through the locking function, it ensures that the spacing between each receiving area remains stable throughout the entire debonding and wafer removal process, preventing the wafer 20 from being squeezed or loosened due to displacement of the movable partition 14.

[0047] In some embodiments of this application, the two fixed separators 13 are respectively arc-shaped protrusions integrally formed at both ends of the arc-shaped groove 12. In at least one embodiment, the fixing separator 13 is designed as an integrally formed arc-shaped protrusion structure at both ends of the arc-shaped groove 12. First, compared with the assembly structure, the integral forming process eliminates the connection gap between the fixing separator 13 and the base 11, enhances the overall structure and connection strength of the two, and avoids the fixing separator 13 from falling off or shifting due to loose connection, effectively preventing the wafer 20 from slipping off the end. Second, the shape of the arc-shaped protrusion structure matches the arc contour of the arc-shaped groove 12, making the transition between the fixing separator 13 and the arc-shaped groove 12 more natural, avoiding sharp corners formed by structural abrupt changes, and reducing the risk of scratch damage when the wafer 20 contacts the fixing separator 13. In addition, the arc-shaped protrusion structure can form a wrap-around limit on the end of the wafer 20. Compared with the planar fixing separator 13, its contact area with the wafer 20 is larger, the limiting effect is more reliable, and it can effectively resist the impact force along the first direction generated by the wafer 20 during the debonding and removal process. More preferably, the height of the arc-shaped protrusion structure is 5-15mm, and the inner sidewall of the protrusion is designed with a rounded transition, which can effectively prevent the wafer 20 from tipping over and avoid the edge of the wafer 20 being scratched due to sharp corners.

[0048] In some embodiments of this application, the arc-shaped top wall 131 of the arc-shaped protrusion structure and the arc-shaped side wall 132 of the arc-shaped protrusion structure near the plurality of movable separators 14 are connected by a smooth transition. In at least one embodiment, the arc-shaped top wall 131 of the arc-shaped protrusion structure and the arc-shaped side wall 132 near the movable separator 14 are connected by a smooth transition to avoid collisions and scratches between the wafer 20 and the edges and corners of the protrusion structure during placement, adjustment or debonding, thus significantly reducing the risk of brittle damage.

[0049] In some embodiments of this application, the inner surface of the arc-shaped groove 12 is provided with a wafer support made of soft rubber; and / or, each of the separating components is provided with a soft rubber portion on one or both sides in the first direction, the soft rubber portion being used to contact the wafer 20. Specifically, the soft rubber material is silicone or rubber with a Shore hardness of 50-70HA, used to buffer the contact stress between the wafer 20 and the base 11, preventing impact damage to the bottom surface of the wafer 20. In at least one embodiment, by providing a wafer support made of soft rubber on the surface of the arc-shaped groove 12, and providing soft rubber portions on one or both sides of the separating components along the first direction, on the one hand, the elasticity and buffering properties of the soft rubber material are used to form a "flexible buffer layer" between the wafer 20 and the device structure, avoiding direct contact between the wafer 20 and the rigid base 11 and the separating components. When the wafer 20 is subjected to vibration or slight impact, the soft rubber layer can absorb the impact energy, reducing the impact force on the wafer 20; on the other hand, the soft rubber material has a certain friction, which can enhance the positioning stability of the wafer 20 within the arc-shaped groove 12 and the separating area.

[0050] In some embodiments of this application, a clamping mechanism 30 is also included, which is disposed above the wafer support mechanism 10 and includes: a clamping guide rail 31; a clamping body 32 slidably connected to the clamping guide rail 31; and a plurality of graphite blocks 33, one end of each graphite block 33 being connected to the clamping body 32 and the other end being used to connect to the wafer 20. Optionally, the clamp guide rail 31 is fixed to the work platform and is arranged parallel to the arc groove 12 of the wafer support mechanism 10; the bottom of the clamp body 32 is slidably connected to the clamp guide rail 31 via a guide block, and can move along the clamp guide rail 31 to be directly above the wafer support mechanism 10; the top of the graphite block 33 is fixedly connected to the bottom surface of the clamp body 32 via an adhesive, and the bottom end is bonded to the top surface of the silicon carbide wafer 20 via an adhesive, forming a fixed structure of "clamp body 32-graphite block 33-wafer 20"; the wafer 20 can be a cut silicon carbide finished wafer 20, whose bottom surface is in contact with the inner surface of the arc groove 12 of the wafer support mechanism 10, and stable positioning is achieved through the support mechanism during the cutting process. In at least one embodiment, the sliding connection characteristic of the clamp body 32 and the clamp guide rail 31 allows the clamp body 32 to be moved and positioned above the laser processing station or the wafer support mechanism 10, improving the relative positional accuracy between the graphite block 33 and the wafer 20 support.

[0051] In some embodiments of this application, a laser cutting mechanism 40 is also included. The laser cutting mechanism 40 includes: a gantry frame 41; a transmitter guide rail 42 fixed to the gantry frame 41; a transmitter base 43 slidably disposed on the transmitter guide rail 42 along a first direction; and a laser emitter 44 fixed to the transmitter base 43 for emitting laser light to cut the graphite block 33. Specifically, the gantry frame 41 is a frame structure to provide a stable support foundation. The transmitter guide rail 42 is horizontally fixed to the gantry frame 41. The transmitter base 43 is slidably connected to the transmitter guide rail 42 via a slider and can reciprocate along the extension direction of the transmitter guide rail 42. The laser emitter 44 is used to emit a high-energy laser beam, and the focal point of the laser beam can be precisely aligned with the bonding area between the wafer 20 and the graphite block 33, achieving vibration-free cutting of the graphite block 33.

[0052] In the existing technology, after the fixture is flipped, the graphite block needs to be cut with a utility knife to separate the wafer. During the cutting process, external forces (such as fluctuations in the force of holding the knife and the impact between the blade and the graphite block) will generate vibrations. These vibrations are directly transmitted to the bonding interface between the wafer and the graphite block, which will also cause chipping or cracks at the interface, further damaging the wafer. To address the aforementioned technical problems in the existing technology, in at least one embodiment, the laser emitter 44 can move smoothly along a first direction to align with the connection positions of each graphite block 33 and the wafer 20, thereby sequentially cutting multiple graphite blocks 33 and avoiding positioning deviations and uneven force during manual cutting with a traditional utility knife. Secondly, laser cutting adopts a non-contact cutting method, which, compared to the mechanical contact cutting of a traditional utility knife, can effectively eliminate the vibration caused by the impact and friction between the blade and the graphite block 33 during the cutting process, reducing damage such as chipping and cracks caused by vibration transmitted to the wafer 20. At the same time, laser cutting has the advantages of high cutting precision and smooth cut, and can accurately control the cutting depth and range, cutting only the bonded part between the graphite block 33 and the wafer 20, avoiding damage to the wafer 20 itself and ensuring the integrity of the wafer 20. Therefore, high-energy lasers can non-contactly and precisely ablate the graphite bonding layer connecting the wafer 20 and the fixture, effectively avoiding the severe vibration and stress caused by traditional mechanical blade cutting. This effectively eliminates the problem of wafer 20 chipping, microcracks, or breakage caused by physical external forces during the debonding process, significantly improving the yield and safety of the debonding process. The gantry structure 41 ensures the stability of the transmitter guide rail 42 support, providing extremely high positioning and repeatability accuracy for laser processing. It should be noted that the laser cutting technology used in this device for graphite blocks 33 is a mature existing process. For example, invention patent application number 202411080743.4 discloses a laser cutting mechanism 40 for silicon carbide graphite plates, which specifically implements a technical solution for cutting graphite materials using lasers.

[0053] In summary, the wafer-assisted debonding and pick-up device provided in this application, through the configuration of a base 11 with an arc-shaped groove 12 and multiple separating components, constitutes a highly adaptable and stable wafer 20 support system. This wafer 20 support system ensures that the wafer 20 remains face down after being removed from the dicing machine, eliminating the need for flipping operations and thus avoiding the shaking, collision, and stress concentration problems caused by flipping the wafer 20 in traditional methods. Through the coordinated operation of the arc-shaped groove 12 and multiple separating components, the device can provide stable and customized accommodating space for wafers 20 of different thicknesses, ensuring that the wafer 20 remains precisely positioned and free from loosening during transfer and subsequent processing. This design not only effectively eliminates the risk of chipping or cracking of the wafer 20 during flipping but also significantly improves operational safety, laying a solid foundation for subsequent non-contact laser debonding processes and overall improving the yield and process reliability of wafer 20 pick-up.

[0054] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer-assisted debinding and wafer-removing device, characterized in that, Includes a wafer support mechanism (10); the wafer support mechanism (10) includes: The base (11) has an arcuate groove (12) extending in a first direction on its surface; Multiple partition members are spaced apart above the arcuate groove (12) along the first direction, and each partition member extends along the second direction; at least one of the multiple partition members is movable along the first direction; the multiple partition members are used to divide the arcuate groove (12) into multiple regions to accommodate multiple wafers (20); Wherein, the first direction is the length direction of the base (11), and the second direction is the width direction of the base (11).

2. The wafer assisted debond and release apparatus of claim 1, wherein, The plurality of partition components include two fixed partitions (13) and a plurality of movable partitions (14); the two fixed partitions (13) are respectively fixed at both ends of the arc-shaped groove (12) in the first direction, and each movable partition (14) can move along the first direction. The plurality of movable partitions (14) cooperate with the two fixed partitions (13) to divide the arc-shaped groove (12) into the plurality of regions.

3. The wafer assisted debond and release apparatus of claim 2, wherein, The wafer support mechanism (10) also includes: Two guide rails (15), each of which extends along the first direction and is respectively disposed on both sides of the base (11) in the second direction; each of the movable separators (14) is slidably connected to the two guide rails (15) at both ends in the second direction.

4. The wafer assisted debond and release apparatus of claim 3, wherein, The two guide rails (15) are respectively set on the two opposite side walls of the base (11); the movable partition (14) is U-shaped, the crossbeam of the U-shaped structure spans across the arc groove (12), and the bottom ends of the two vertical arms of the U-shaped structure are respectively slidably connected to the two guide rails (15) one by one.

5. The wafer assisted debond and release apparatus of claim 3, wherein, The wafer base mechanism (10) further includes a locking component (16), and each of the movable partitions (14) is provided with at least one of the locking components (16). Each locking component (16) can abut or disengage from one of the guide rails (15). All the locking components (16) on each movable partition (14) cooperate to lock or release the corresponding movable partition (14). The locking component (16) is a bolt or screw.

6. The wafer assisted debond and release apparatus of claim 2, wherein, The two fixed separators (13) are arc-shaped protrusions integrally formed at both ends of the arc-shaped groove (12).

7. The wafer assisted debond and release apparatus of claim 6, wherein, The arc-shaped top wall (131) of the arc-shaped protrusion structure is connected to the arc-shaped side wall (132) of the arc-shaped protrusion structure on the side near the plurality of movable separators (14) by a smooth transition.

8. The wafer-assisted debonding and unloading device according to any one of claims 1-7, characterized in that, The inner surface of the arc groove (12) is provided with a wafer support made of soft rubber material; And / or, Each of the partition components has a soft adhesive portion on one or both sides in a first direction, the soft adhesive portion being used to contact the wafer (20).

9. The wafer assisted debond and release apparatus of any of claims 1-7, wherein, It also includes a clamping mechanism (30), which is disposed above the wafer support mechanism (10) and includes: Fixture guide rail (31); The clamp body (32) is slidably connected to the clamp guide rail (31); Multiple graphite blocks (33), one end of each graphite block (33) is connected to the fixture body (32), and the other end is used to connect to the wafer (20).

10. The wafer assisted debond and release apparatus of claim 9, wherein, It also includes a laser cutting mechanism (40), which comprises: Gantry frame (41); The transmitter guide rail (42) is fixed on the gantry (41); The transmitter base (43) is slidably mounted on the transmitter guide rail (42) along the first direction; A laser emitter (44), fixed to the emitter base (43), is used to emit a laser to cut a graphite block (33).

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