Silicon wafer processing equipment

Abstract

This utility model discloses a silicon wafer processing apparatus, including a debonding system, a wafer insertion system, and a cleaning system connected sequentially in the silicon wafer movement direction; a silicon wafer transfer mechanism is provided between the debonding system and the wafer insertion system; the silicon wafer transfer mechanism includes a debonding fixture and a three-axis robot; the debonding fixture includes a frame, a clamping member disposed within the frame, the clamping member being able to slide along a first preset path on the frame, a supporting member disposed within the frame and below the clamping member, the supporting member being able to slide along a second preset path on the frame, an opening and closing mechanism disposed at the end of the frame for controlling the movement of the clamping member and the supporting member, and a first rod and a second rod respectively disposed on the frame and the opening and closing mechanism; the three-axis robot can transfer the debonding fixture in a closed state through the first rod, and can open and transfer the debonding fixture through the second rod. This silicon wafer processing apparatus can connect multiple process segments such as debonding, wafer insertion, and cleaning to form an automated operation, reducing the workload of workers, improving processing efficiency, and reducing processing costs.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing, and in particular to a silicon wafer processing apparatus. Background Technology

[0002] Current silicon wafer processing technology generally involves: first, slicing silicon ingots; then, attaching the sliced ​​wafers to a wafer holder; finally, a debinding process to separate the wafers from the wafer holder. The debinded wafers are then inserted into a wafer inserter via an insertion machine. The wafer holder is then placed in a cleaning machine for cleaning. Debinding, insertion, and cleaning are three separate processes. The connection between these different stages requires manual intervention to transfer the wafers, which is inefficient. This manual transfer process also increases the risk of wafer breakage. Therefore, the current silicon wafer production process incurs high labor and material costs, necessitating improvements to existing silicon wafer processing equipment to reduce production costs for enterprises. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, this utility model provides a silicon wafer processing device that can connect multiple process segments such as debonding, wafer insertion, and cleaning into an automated operation, thereby reducing the workload of workers, improving processing efficiency, and reducing processing costs.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a silicon wafer processing device, characterized in that it includes a debonding system, an insertion system, and a cleaning system connected sequentially in the silicon wafer moving direction; a silicon wafer transfer mechanism is provided between the debonding system and the insertion system; the silicon wafer transfer mechanism includes a debonding fixture and a three-axis robot; the debonding fixture includes a frame, at least two clamping members disposed within the frame, the clamping members being slidable along a first preset path on the frame, at least one support member disposed within the frame and below the clamping members, the support member being slidable along a second preset path on the frame, an opening and closing mechanism disposed at the end of the frame for controlling the movement of the clamping members and the support member, a first rod and a second rod respectively disposed on the frame and the opening and closing mechanism, the three-axis robot being able to transfer the debonding fixture in a closed state via the first rod, and being able to open and transfer the debonding fixture via the second rod.

[0005] Furthermore, the opening and closing mechanism includes a first plate that slides vertically on the outside of the frame, the first plate being able to drive the clamping member to slide along a first preset path, a second plate that is located on the inside of the frame and fixedly connected to the first plate, and a connecting rod that is located on the inside of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the supporting member.

[0006] Furthermore, the frame includes opposing side plates, each side plate having a first path hole for the clamping member to pass through, the first path hole forming a first preset path for the clamping member to slide; the side plate also has a second path hole, the second path hole forming a second preset path for the support member to slide; the second plate has a third path hole, the third path hole forming a third preset path for the connecting rod to slide.

[0007] Furthermore, the three-axis manipulator includes an X-axis mechanism, a Y-axis mechanism slidably connected to the X-axis mechanism, a Z-axis mechanism slidably connected to the Y-axis mechanism, and a pick-and-place mechanism slidably connected to the Z-axis mechanism. The pick-and-place mechanism is used to lift the degumming fixture.

[0008] Furthermore, the pick-and-place mechanism includes a mounting component slidably connected to the Z-axis mechanism, at least two first grippers disposed on the mounting component, a top plate located on the side of the mounting component opposite to the silicon wafer, and a first drive mechanism disposed on the mounting component for driving the top plate to move toward or away from the silicon wafer.

[0009] Furthermore, at least one of the first grippers is provided with a full basket detection mechanism, the full basket detection mechanism including a first sliding piece slidably connected to the first gripper, a first sensor disposed on the top of the first sliding piece, a first detector disposed on the first gripper and opposite to the first sensor, and an elastic member disposed vertically between the first sliding piece and the first gripper; in the initial state, the first detection part of the first sliding piece is located within the gripping space of the first gripper;

[0010] At least one of the first grippers is provided with a basket pressure detection mechanism, the basket pressure detection mechanism including a second sliding plate slidably connected to the first gripper, a second sensor disposed on the top of the second sliding plate, and a second detector disposed on the first gripper and opposite to the second sensor; in the initial state, the second detection part of the second sliding plate is located below the first gripper.

[0011] Furthermore, the degumming system includes:

[0012] The degumming and feeding mechanism is used to move the degumming fixture loaded with the material to be processed to the feeding position;

[0013] At least one debinding tank is used to separate the silicon wafer from the crystal holder in the material to be processed;

[0014] The debinding and unloading mechanism is used to transfer the crystal tray and tooling to the unloading position.

[0015] Furthermore, the insert system includes a transmission mechanism located at the rear end of the degumming system, an insert mechanism located at the rear end of the transmission mechanism, and a basket transfer mechanism located between the insert mechanism and the cleaning system.

[0016] Furthermore, the flower basket transfer mechanism includes:

[0017] A first guide rail, at least three working platforms arranged along its length below the first guide rail, an empty basket platform and a full basket platform respectively provided on both sides of the working platform, and the number of empty basket platforms and the number of full basket platforms are both less than the number of working platforms, and a first robotic arm is provided on the first guide rail, the first robotic arm being used to move the flower basket between the platforms.

[0018] A second guide rail is provided below the second guide rail, comprising at least one empty basket return line, an empty basket conveyor line, a full basket conveyor line, and at least one full basket feeding line. Each empty basket return line is connected to an empty basket platform, the empty basket conveyor line is connected to the remaining empty basket platforms, the full basket conveyor line is connected to the full basket platform, and the full basket feeding line is connected to a washing machine. A second robotic arm is provided on the second guide rail, which is used to move the basket between the full basket conveyor line and the full basket feeding line, and between the empty basket return line and the empty basket conveyor line.

[0019] Furthermore, the cleaning system includes:

[0020] A single-arm overhead crane is used to transfer baskets filled with silicon wafers via the wafer insertion system to the cleaning system.

[0021] A cleaning tank is used to clean residues from the surface of silicon wafers.

[0022] The flower basket transfer vehicle is used to move flower baskets between various cleaning tanks, or between the cleaning tank and the unloading platform, or between the cleaning tank and the empty basket return line.

[0023] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0024] 1. By connecting the degumming system, inserting system, and cleaning system sequentially to form an integrated device, the space occupied by the device can be significantly reduced compared to the existing separate degumming machine, inserting machine, and cleaning machine.

[0025] 2. A silicon wafer transfer mechanism is provided between the debonding system and the wafer insertion system. This mechanism includes a debonding fixture and a three-axis robot. The debonding fixture includes a frame, a clamping member within the frame that can slide along a first preset path on the frame, a support member within the frame and below the clamping member that can slide along a second preset path on the frame, and an opening / closing mechanism at the end of the frame for controlling the movement of the clamping member and the support member. A first rod and a second rod are respectively provided on the frame and the opening / closing mechanism. The three-axis robot can transfer the closed debonding fixture via the first rod and can open and transfer the debonding fixture via the second rod. Due to the above-mentioned silicon wafer transfer mechanism, automated transfer of silicon wafers between the debonding system and the wafer insertion system is achieved, avoiding manual intervention, improving production efficiency, reducing labor costs, and increasing product yield.

[0026] 3. A basket transfer mechanism is provided between the wafer insertion mechanism and the cleaning system. This basket transfer mechanism has a simple structure and reasonable layout, which can realize automated basket transfer, avoid manual intervention, improve basket transfer efficiency, and meet the needs of expanding the production capacity of silicon wafer production equipment.

[0027] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the silicon wafer processing device in an embodiment of this utility model;

[0030] Figure 2 This is a schematic diagram of the silicon wafer transfer mechanism in an embodiment of this utility model;

[0031] Figure 3 This is a schematic diagram of the degumming fixture in an embodiment of this utility model;

[0032] Figure 4 This is a schematic diagram of the pick-and-place mechanism in an embodiment of this utility model;

[0033] Figure 5 This is a schematic diagram of the flower basket transfer mechanism in an embodiment of this utility model;

[0034] Figure 6 This is a top view of the flower basket transfer device in an embodiment of this utility model;

[0035] Figure 7 A schematic diagram of the connection between the full basket conveyor line and the full basket platform in this embodiment of the utility model;

[0036] Figure 8 This is a schematic diagram of the flower basket lying flat on the full basket conveyor line in an embodiment of this utility model.

[0037] The reference numerals in the above figures are as follows: 1. Degumming system; 11. Degumming feeding mechanism; 12. Degumming tank; 13. Degumming unloading mechanism;

[0038] 2. Insertion system; 21. Transmission mechanism; 22. Insertion mechanism; 23. Basket transfer mechanism; 231. First guide rail; 232. Second guide rail; 233. Working platform; 234. Empty basket platform; 235. Full basket platform; 236. Empty basket return line; 237. Empty basket conveyor line; 238. Full basket conveyor line; 239. Full basket feeding line; 2310. First robotic arm; 2311. Second robotic arm; 2312. First flipping mechanism; 2313. Second flipping mechanism;

[0039] 3. Cleaning system; 31. Single-arm overhead crane; 32. Cleaning tank; 33. Flower basket transfer trolley;

[0040] 4. Silicon wafer transfer mechanism; 41. Debonding fixture; 411. Frame; 412. Clamping component; 413. Support component; 414. Opening and closing mechanism; 4141. First plate; 4142. Second plate; 4143. Connecting rod; 42. Three-axis robot; 421. X-axis mechanism; 422. Y-axis mechanism; 423. Z-axis mechanism; 424. Picking and placing mechanism; 4241. Mounting component; 4242. First gripper; 4243. Full basket detection mechanism; 4244. Compressed basket detection mechanism; 4245. Top plate; 4246. First drive mechanism; 4247. Second drive mechanism; 4248. Third drive mechanism; 4249. Crystal tray gripping assembly;

[0041] 5. Flower basket. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0043] Example 1: See Figure 1As shown, a silicon wafer processing apparatus includes a debonding system 1, a wafer insertion system 2, and a cleaning system 3, which are sequentially connected by screws in the direction of silicon wafer movement. A silicon wafer transfer mechanism 4 is provided between the debonding system 1 and the wafer insertion system 2. This silicon wafer processing apparatus can connect multiple process stages such as debonding, wafer insertion, and cleaning into an automated operation, reducing the workload of workers, improving processing efficiency, and reducing processing costs.

[0044] The degumming system 1 includes a degumming loading mechanism 11, a degumming tank 12, and a degumming unloading mechanism 13. The degumming loading mechanism 11 is used to transfer the degumming fixture 41, loaded with the material to be processed, to the loading position. Specifically, the degumming loading mechanism 11 can be one of a trolley, an AGV, a conveyor line, or a robotic arm. The degumming tank 12 includes a spray tank, a lactic acid tank, and an ultrasonic rinsing tank. The number and order of the various tanks can be determined according to different production capacity and process requirements. The spray tank is used to spray water onto the silicon wafers to be degummed, initially cleaning the silicon sludge and other residues on the surface of the wafers. The lactic acid tank is used to separate the silicon wafers from the wafer holders. The ultrasonic cleaning tank 32 is used for further cleaning the silicon wafers. The degumming unloading mechanism 13 is used to transfer the wafer holders and fixtures to their respective unloading positions. The degumming unloading mechanism 13 can also be one of a trolley, an AGV, a conveyor line, or a robotic arm.

[0045] The wafer insertion system 2 includes a transmission mechanism 21 located at the rear end of the debinding system 1, a wafer insertion mechanism 22 located at the rear end of the transmission mechanism 21, and a basket transfer mechanism 23 located between the wafer insertion mechanism 22 and the cleaning system 3. The transmission mechanism 21 receives silicon wafers transferred by a three-axis robotic arm 42 and transfers them to the wafer insertion mechanism 22. During the transfer process, the wafers are sequentially slicing, changing from a vertical to a horizontal position, and performing double-wafer detection, fragment detection, and fragment rejection. The wafer insertion mechanism 22 receives the silicon wafers transferred by the transmission mechanism 21 and inserts them into the basket 5.

[0046] See Figure 5As shown, the flower basket transfer mechanism 23 includes a first guide rail 231 and a second guide rail 232 arranged in parallel. Below the first guide rail 231 and on the side of the first guide rail 231 opposite to the second guide rail 232, three working platforms 233 are provided, spaced apart along the length of the first guide rail 231. Below the first guide rail 231, two empty basket platforms 234 and two full basket platforms 235 are also provided. The two empty basket platforms 234 and two full basket platforms 235 are arranged alternately, so that each working platform 233 has one empty basket platform 234 and one full basket platform 235 on each side. Below the second guide rail 232, there is an empty basket return line 236, an empty basket conveyor line 237, two full basket conveyor lines 238, and a full basket feeding line 239. The empty basket return line 236 is connected to one of the empty basket platforms 234, the empty basket conveyor line 237 is connected to the other empty basket platform 234, the full basket conveyor line 238 is connected to the full basket platform 235, and the full basket feeding line 239 is connected to the cleaning system 3. A first robot arm 2310 is provided on the first guide rail 231, which is used to move the basket 5 between the platforms. A second robot arm 2311 is provided on the second guide rail 232, which is used to move the basket 5 between the full basket conveyor line 238 and the full basket feeding line 239, and between the empty basket return line 236 and the empty basket conveyor line 237.

[0047] The distance between adjacent empty basket platforms 234 and the working platform 233, and the distance between adjacent full basket platforms 235 and the working platform 233 are set to be equal. The first robotic arm 2310 is provided with two gripping positions, so that the two gripping positions can simultaneously grip the flower baskets 5 on two adjacent platforms. This allows for the simultaneous movement of empty and full baskets in a single transport operation, improving movement efficiency.

[0048] See Figure 6 As shown, the empty basket return line 236 and the empty basket conveyor line 237 are equipped with a first flipping mechanism 2312 at one end facing the empty basket platform 234. The first flipping mechanism 2312 is used to flip the basket 5 on the feeding position of the empty basket return line 236 or the empty basket conveyor line 237 from a flat state to a vertical state on the empty basket platform 234. The first flipping mechanism 2312 allows the basket 5 to be directly flipped from the empty basket return line 236 or the empty basket conveyor line 237 to the empty basket platform 234. (See also...) Figure 7 , 8As shown, the full basket conveyor line 238 is equipped with a second flipping mechanism 2313 at one end facing the full basket platform 235. The second flipping mechanism 2313 is used to flip the flower basket 5, which is in a vertical position on the full basket platform 235, to a flat position on the receiving position of the full basket conveyor line 238. Similarly, the second flipping mechanism 2313 can directly flip the flower basket 5 from the full basket platform 235 to the full basket conveyor line 238.

[0049] See Figure 2 As shown, the silicon wafer transfer mechanism 4 includes a debonding fixture 41 and a three-axis robot 42. The debonding fixture 41 is used to load the workpiece to be processed. The workpiece to be processed includes a wafer tray and a silicon wafer bonded to the wafer tray. The three-axis robot 42 is used to open the debonding fixture 41, transfer the debonding fixture 41, and transfer the wafer tray.

[0050] See Figure 3 As shown, the degumming fixture 41 includes a frame 411, two clamping members 412 disposed opposite to each other within the frame 411 along its width direction, two supporting members 413 disposed opposite to each other within the frame 411 along its width direction, the supporting members 413 being located below the clamping members 412, two opening and closing mechanisms 414 respectively disposed at both ends of the frame 411, and two first rods and two second rods respectively disposed on the frame 411 and the opening and closing mechanism 414. Both ends of the clamping members 412 are located within one opening and closing mechanism 414, and both ends of the supporting members 413 are also located within one opening and closing mechanism 414. The movement of one clamping member 412 and one supporting member 413 is simultaneously controlled by the two oppositely disposed opening and closing mechanisms 414. The clamping member 412 slides along a first preset path on the frame 411 under the action of the opening and closing mechanism 414, and the supporting member 413 slides along a second preset path on the frame 411 under the action of the opening and closing mechanism 414. The three-axis robot 42 can transfer the degumming fixture 41 in a closed state through the first rod, and can open and transfer the degumming fixture 41 through the second rod.

[0051] The frame 411 includes two opposing side plates and a connecting rod connecting the two side plates. Two first path holes are provided on the side plates. The end of the clamping member 412 passes through the first path hole. The first path hole restricts the clamping member 412 to move along a first preset path. Two second path holes are also provided on the side plates, and the end of the support member 413 passes through the second path holes. The second path holes restrict the support member 413 to move along a second preset path. The second path holes are horizontally arranged second oblong holes. The two second oblong holes are symmetrically arranged along the width direction of the frame 411. At least two connecting rods are provided, respectively located at the two top corners of the side plates. Preferably, four connecting rods are provided, respectively located at the four corners of the side plates. A support frame spans across the two top connecting rods, and the support frame has positioning posts for positioning the crystal tray. The top of the frame 411 has a first opening, through which the material to be processed enters the degumming fixture 41. The bottom of the frame 411 has a second opening, through which the silicon wafer separated from the crystal holder can be placed onto the support platform.

[0052] In a preferred embodiment, the clamping member 412 is a cylindrical member, with bearings or steel sleeves at both ends, allowing the clamping member 412 to rotate within the side plate and the opening / closing mechanism 414. An elastic layer is provided on the surface of the clamping member 412. This elastic layer can be made of silicone foam tubing, which is resistant to acids and alkalis and has high-temperature resistance. The elastic layer on the clamping member 412 prevents damage to the silicon wafer when the clamping member 412 applies clamping force.

[0053] The opening and closing mechanism 414 includes a first plate 4141, a second plate 4142, a connecting rod 4143, and a sliding assembly. The first plate 4141 is located on the outside of the side plate and is slidably connected to the frame 411 via the sliding assembly. Two first oblong holes are symmetrically arranged on the first plate 4141 along the width direction of the frame 411. The first oblong holes are opposite to the first path holes, and the end of the clamping member 412 passes through the first path hole and is disposed within the first oblong hole. The first path hole includes a first inclined hole and a vertical hole extending downward from the bottom of the first inclined hole. The first inclined hole is inclined downward from the side of the side plate away from the middle of the frame 411. A vertical hole is provided at the bottom of the first inclined hole, which can be used to limit the clamping member 412. When the clamping member 412 is located within the vertical hole, the clamping member 412 is in a closed state, that is, the opposing clamping member 412 is used to clamp the silicon wafer inside it. The vertical hole locks the horizontal position of the clamping member 412, thereby ensuring stable clamping of the silicon wafer. The second plate 4142 is located inside the side plate. The second plate 4142 is fixedly connected to the first plate 4141. Two third path holes are symmetrically provided on the second plate 4142 along the width direction of the frame 411, and one end of the connecting rod 4143 is slidably disposed in the third path hole. The third path hole is used to restrict the movement of the connecting rod 4143 along a third preset path. The third path hole is a second inclined hole parallel to the first inclined hole. One end of the connecting rod 4143 is provided with a third waist-shaped hole, and the connecting rod 4143 is sleeved on the support member 413 through the third waist-shaped hole. The other end of the connecting rod 4143 is slidably disposed in the second inclined hole. The middle of the connecting rod 4143 is rotatably connected to the frame 411 via a pivot. The sliding assembly includes a guide rail disposed vertically on the frame 411 and a slider disposed on the first plate 4141 that cooperates with the guide rail.

[0054] See Figure 2 As shown, the three-axis robot 42 includes an X-axis mechanism 421, a Y-axis mechanism 422 slidably connected to the X-axis mechanism 421, a Z-axis mechanism 423 slidably connected to the Y-axis mechanism 422, and a pick-and-place mechanism 424 slidably connected to the Z-axis mechanism 423. The pick-and-place mechanism 424 is used to lift the degumming fixture 41.

[0055] The X-axis mechanism 421 includes a first bracket, a first guide rail 231 extending along the X-axis direction on the first bracket, and a first rack arranged parallel to the first guide rail 231.

[0056] The Y-axis mechanism 422 includes a second bracket, a first slider disposed on the second bracket and cooperating with the first guide rail 231, a first gear cooperating with the first rack, an X-axis drive mechanism for driving the first gear, and a second guide rail 232 and a second rack disposed on the second bracket and extending along the Y-axis direction.

[0057] The Z-axis mechanism 423 includes a third bracket, a second slider disposed on the third bracket and cooperating with the second guide rail 232, a second gear cooperating with the second rack, a Y-axis drive mechanism for driving the second gear, a third slider disposed on the second bracket and extending along the Z-axis direction, a third gear disposed on the second bracket, and a Z-axis drive mechanism for driving the third gear.

[0058] See Figure 4 As shown, the pick-and-place mechanism 424 includes a mounting member 4241 slidably connected to the Z-axis mechanism 423, four first grippers 4242 disposed on the mounting member 4241, a top plate 4245 located on the side of the mounting member 4241 opposite to the silicon wafer, and a first drive mechanism 4246 disposed on the mounting member 4241 for driving the top plate 4245 to move toward or away from the silicon wafer. An elastic layer, which is made of silicone foam, is provided on the side of the top plate 4245 opposite to the silicon wafer.

[0059] The mounting component 4241 includes a mounting plate having a first surface and a second surface facing each other. A column is provided on the first surface of the mounting plate. A third guide rail is provided on the column, which cooperates with the third slider and extends along the Z-axis direction. A third rack cooperates with the third gear and is parallel to the third guide rail.

[0060] Four first grippers 4242 are located at the four corners of the mounting plate. One end of each first gripper 4242 is slidably connected to the mounting member 4241, and the other end of each first gripper 4242 extends away from the mounting member 4241 and is bent into a hook. Four third drive mechanisms 4248 are provided on the first surface of the mounting plate, each third drive mechanism 4248 controlling the sliding of one of the first grippers 4242. A guide mechanism is also provided between the first gripper 4242 and the mounting member 4241, allowing the first gripper 4242 to slide along the Y-axis under the action of the third drive mechanism 4248, thereby controlling the hook of the first gripper 4242 to hook onto the first or second rod on the degumming fixture 41.

[0061] In a preferred embodiment, the pick-and-place mechanism 424 further includes a full basket detection mechanism 4243. Two of the four first grippers 4242, located on opposite sides along the length of the de-adhesive fixture 41, are each equipped with a full basket detection mechanism 4243. The full basket detection mechanism 4243 includes a first sliding piece slidably connected to the first gripper 4242, a first sensor disposed on the top of the first sliding piece, a first detector disposed on the first gripper 4242 and opposite to the first sensor, and an elastic member disposed vertically between the first sliding piece and the first gripper 4242. In the initial state, the first detection portion of the first sliding piece is located within the gripping space of the first gripper 4242. The first detector is normally open; when the pick-and-place mechanism 424 is not gripping the de-adhesive fixture 41, the first detection portion at the bottom of the first sliding piece is higher than the hook under the action of the elastic member. When the pick-and-place mechanism 424 picks up the silicon wafer debonding fixture 41, the first sliding piece moves downward under the action of the silicon wafer debonding fixture 41, increasing the distance between the first detector and the first sensor, so that the first detector cannot receive the signal from the first sensor. At this time, it is proven that the pick-and-place mechanism 424 has picked up the debonding fixture 41.

[0062] Two additional first grippers 4242 are each equipped with a basket-pressing detection mechanism 4244. Each basket-pressing detection mechanism 4244 includes a second sliding plate slidably connected to the first gripper 4242, a second sensor located on top of the second sliding plate, and a second detector located on the first gripper 4242 opposite to the second sensor. In the initial state, the second detection part of the second sliding plate is located below the first gripper 4242. When the pick-and-place mechanism 424 presses the basket, the second detection part is lifted upwards. At this time, the second detector detects the signal from the second sensor, and the control mechanism can thereby control the three-axis robotic arm to stop its downward movement, thus preventing the pick-and-place mechanism 424 from damaging the silicon wafer.

[0063] The picking and placing mechanism 424 further includes a crystal tray clamping assembly 4249, which includes at least two second jaws and a second drive mechanism 4247 connected to the second jaws for controlling the opening and closing of the second jaws.

[0064] The cleaning system 3 includes a single-arm trolley 31 for transferring baskets 5 filled with silicon wafers via the wafer insertion system 2 to the cleaning system 3; a cleaning tank 32 for cleaning residues on the surface of the silicon wafers; and a basket transfer trolley 33 for moving baskets 5 between cleaning tanks 32 or between cleaning tanks 32 and unloading platform or between cleaning tanks 32 and empty basket return line 236.

[0065] The process of processing silicon wafers using the aforementioned silicon wafer processing equipment is as follows:

[0066] After slicing, the silicon ingot and the crystal tray are placed in the debinding fixture and then transferred to the loading position by the debinding and loading mechanism.

[0067] After the degumming fixture is positioned at the loading position, the three-axis robot first places the fully loaded degumming fixture into the rinsing tank for rinsing, then into the lactic acid tank for degumming to separate the silicon wafer from the crystal tray, and finally into the ultrasonic cleaning tank for rinsing.

[0068] After degumming is completed, the crystal tray gripping component on the three-axis robotic arm places the rinsed crystal tray into the degumming and unloading mechanism and moves it to the crystal tray unloading position.

[0069] After the wafer tray is removed, the three-axis robot places the debonding fixture onto the transfer mechanism of the wafer insertion system. The robot hooks its gripper onto the second lever of the debonding fixture and slowly moves upward to open it. Simultaneously, the top plate on the robot presses down to contact the silicon wafer, ensuring it does not tilt. Once the debonding fixture reaches the designated height, the conveyor belts on both sides of the transfer mechanism converge, clamping the silicon wafer and transferring it forward to the wafer insertion mechanism. During the transfer process, the wafers are sequentially slicing, changing from a vertical to a horizontal position, and undergoing dual-wafer inspection, fragment inspection, and fragment rejection.

[0070] The wafer insertion mechanism receives silicon wafers and transfers them into the basket. Each time a silicon wafer is inserted, the basket moves upward by one wafer spacing.

[0071] After the silicon wafers are filled into the basket, the basket transfer mechanism simultaneously picks up an empty basket and a full basket, placing the empty basket on the work platform and the full basket on the full basket platform. The basket is then flipped by a second flipping mechanism onto the full basket conveyor line for transport, and finally, a robotic arm places the full basket onto the full basket feeding line for transport to the cleaning system.

[0072] After the full baskets are transported to the designated position on the full basket feeding line, the single-arm crane places the baskets one by one into the designated position in the washing tank until the required number is filled.

[0073] The flower basket transfer vehicle picks up the flower baskets from the trough and places them into the various cleaning troughs in sequence according to the cleaning process.

[0074] After the silicon wafers have been cleaned and dried in the drying tank, the baskets are placed on the unloading platform by a basket transfer trolley. A six-axis robot then moves the baskets to the next process equipment, while empty baskets are moved to the empty basket return line.

[0075] This utility model uses specific embodiments to illustrate the principle and implementation of the utility model. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the utility model. Therefore, the content of this specification should not be construed as a limitation of the utility model.

Claims

1. A silicon wafer processing apparatus, characterized in that, The system includes a debonding system, an insertion system, and a cleaning system connected sequentially in the direction of silicon wafer movement. A silicon wafer transfer mechanism is provided between the debonding system and the insertion system. The silicon wafer transfer mechanism includes a debonding fixture and a three-axis robot. The debonding fixture includes a frame, at least two clamping members disposed within the frame, the clamping members being slidable along a first preset path on the frame, at least one support member disposed within the frame and below the clamping members, the support member being slidable along a second preset path on the frame, an opening and closing mechanism disposed at the end of the frame for controlling the movement of the clamping members and the support member, and a first rod and a second rod respectively disposed on the frame and the opening and closing mechanism. The three-axis robot can transfer the debonding fixture in a closed state via the first rod and can open and transfer the debonding fixture via the second rod.

2. The silicon wafer processing apparatus according to claim 1, characterized in that, The opening and closing mechanism includes a first plate that slides vertically on the outside of the frame, the first plate being able to drive the clamping member to slide along a first preset path, a second plate that is located on the inside of the frame and fixedly connected to the first plate, and a connecting rod that is located on the inside of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the supporting member.

3. The silicon wafer processing apparatus according to claim 2, characterized in that, The frame includes opposing side plates, each side plate having a first path hole for the clamping member to pass through, the first path hole forming a first preset path for the clamping member to slide; the side plate also has a second path hole, the second path hole forming a second preset path for the support member to slide; the second plate has a third path hole, the third path hole forming a third preset path for the connecting rod to slide.

4. The silicon wafer processing apparatus according to claim 1, characterized in that, The three-axis robot includes an X-axis mechanism, a Y-axis mechanism slidably connected to the X-axis mechanism, a Z-axis mechanism slidably connected to the Y-axis mechanism, and a pick-and-place mechanism slidably connected to the Z-axis mechanism. The pick-and-place mechanism is used to lift the degumming fixture.

5. The silicon wafer processing apparatus according to claim 4, characterized in that, The pick-and-place mechanism includes a mounting component slidably connected to the Z-axis mechanism, at least two first grippers disposed on the mounting component, a top plate located on the side of the mounting component opposite to the silicon wafer, and a first drive mechanism disposed on the mounting component for driving the top plate to move toward or away from the silicon wafer.

6. The silicon wafer processing apparatus according to claim 5, characterized in that, At least one of the first grippers is provided with a full basket detection mechanism, the full basket detection mechanism including a first sliding piece slidably connected to the first gripper, a first sensor disposed on the top of the first sliding piece, a first detector disposed on the first gripper and opposite to the first sensor, and an elastic member disposed vertically between the first sliding piece and the first gripper; in the initial state, the first detection part of the first sliding piece is located within the gripping space of the first gripper; At least one of the first grippers is provided with a basket pressure detection mechanism, the basket pressure detection mechanism including a second sliding plate slidably connected to the first gripper, a second sensor disposed on the top of the second sliding plate, and a second detector disposed on the first gripper and opposite to the second sensor; in the initial state, the second detection part of the second sliding plate is located below the first gripper.

7. The silicon wafer processing apparatus according to claim 1, characterized in that, The degumming system includes: The degumming and feeding mechanism is used to move the degumming fixture loaded with the material to be processed to the feeding position; At least one debinding tank is used to separate the silicon wafer from the crystal holder in the material to be processed; The debinding and unloading mechanism is used to transfer the crystal tray and tooling to the unloading position.

8. The silicon wafer processing apparatus according to claim 1, characterized in that, The insert system includes a transmission mechanism located at the rear end of the degumming system, an insert mechanism located at the rear end of the transmission mechanism, and a basket transfer mechanism located between the insert mechanism and the cleaning system.

9. The silicon wafer processing apparatus according to claim 8, characterized in that, The flower basket transfer mechanism includes: A first guide rail, at least three working platforms arranged along its length below the first guide rail, an empty basket platform and a full basket platform respectively provided on both sides of the working platform, and the number of empty basket platforms and the number of full basket platforms are both less than the number of working platforms, and a first robotic arm is provided on the first guide rail, the first robotic arm being used to move the flower basket between the platforms. A second guide rail is provided below the second guide rail, comprising at least one empty basket return line, an empty basket conveyor line, a full basket conveyor line, and at least one full basket feeding line. Each empty basket return line is connected to an empty basket platform, the empty basket conveyor line is connected to the remaining empty basket platforms, the full basket conveyor line is connected to the full basket platform, and the full basket feeding line is connected to a washing machine. A second robotic arm is provided on the second guide rail, which is used to move the basket between the full basket conveyor line and the full basket feeding line, and between the empty basket return line and the empty basket conveyor line.

10. The silicon wafer processing apparatus according to claim 1, characterized in that, The cleaning system includes: A single-arm overhead crane is used to transfer baskets filled with silicon wafers via the wafer insertion system to the cleaning system. A cleaning tank is used to clean residues from the surface of silicon wafers. The flower basket transfer vehicle is used to move flower baskets between various cleaning tanks, or between the cleaning tank and the unloading platform, or between the cleaning tank and the empty basket return line.

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