Chip debubbling load fixture

Abstract

The utility model discloses a chip debubbling loading clamp relates to infrared detector technical field, aims at solving the technical problem that the mode of variable temperature baking can only remove part of the cavity in the chip. Its technical scheme main points are: including clamp base plate, all be provided with a support plate in four corner positions of clamp base plate, four the support plate fixedly connected with clamp top plate, the surface of clamp base plate is provided with the bottom support recess groove for fixing photosensitive chip, the external support recess groove is formed between clamp base plate and clamp top plate, all be provided with the rectangular window for discharging bubble around external support recess groove, the slide groove is seted up on the clamp top plate, the slide groove is connected with the blocking layer of sliding. The utility model discloses the purpose lies in providing a kind of chip debubbling loading clamp.

Description

Technical Field

[0001] This utility model relates to chips, and more specifically, to a chip debubbling and loading fixture. Background Technology

[0002] Infrared focal plane array chips require flip-chip interconnects to connect individual photosensitive chips to indium pillars in the readout circuit in a one-to-one correspondence. After the infrared chips are flip-chip soldered, underfill adhesive must be filled in the interlayer between the photosensitive chip and the readout circuit to protect the indium pillars and improve chip reliability. However, air bubbles are easily generated during the filling process, forming voids.

[0003] Currently, in the field of bottom filling of infrared chips, most methods use variable temperature baking after filling to remove filling voids. However, according to actual experimental results, this method can only remove some voids in the chip, and it has extremely high requirements for temperature control and changes in the viscosity of the filling adhesive, which is not easy to control in actual production.

[0004] Therefore, a new technical solution is urgently needed to solve the above-mentioned technical problems. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a chip debubbling and loading fixture.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a chip debubbling and loading fixture, characterized in that: it includes a fixture base plate, a support plate is provided at each of the four corners of the fixture base plate, a fixture top plate is fixedly connected to the four support plates, a bottom support groove for fixing a photosensitive chip is opened on the surface of the fixture base plate, an external support groove is formed between the fixture base plate and the fixture top plate, a rectangular window for venting air bubbles is opened around the external support groove, a sliding groove is opened on the fixture top plate, and a blocking layer is slidably connected to the sliding groove.

[0007] By adopting the above technical solution: the bottom support groove is used to fix the photosensitive chip, and the external support groove is used to fix the readout circuit. The two work together to fix and support the infrared chip, which can effectively avoid the risk of the chip falling off during the vacuum degassing process. The barrier layer is a separate rectangular sheet structure, which can prevent the filler glue from overflowing under the action of centrifugation during the centrifugal degassing process. At the same time, the bottom filler air bubbles are discharged into the rectangular window under the action of centrifugal force, which promotes the reliability of the infrared chip itself and also suppresses the occurrence of imaging patterns in the infrared imaging image.

[0008] The present invention is further configured such that: the surfaces of the clamp top plate and the blocking layer are provided with a plurality of positioning components, the positioning components include a positioning hook provided on the surface of the clamp top plate, a positioning ring provided on the positioning hook, a positioning block fixedly connected to the bottom of the positioning ring, and positioning guide rods provided on both sides of the positioning block, and a connecting component slidably connecting the two positioning guide rods.

[0009] The present invention is further configured such that: the connecting component includes a connecting base, and connecting grooves are provided on both opposite sides of the connecting base; the connecting grooves are slidably connected to the positioning guide rod; a connecting spring is fixedly connected to one side of the positioning block; and one end of the connecting spring is fixedly connected to the inner wall of the connecting base.

[0010] The present invention is further configured such that: a first fixing hole is provided on each of the opposite sides of the top plate of the clamp, and a second fixing hole is provided on each of the opposite sides of the blocking layer, wherein the first fixing hole corresponds to and is connected to the second fixing hole on the same side.

[0011] The present invention is further configured such that: an adjustment assembly is slidably connected to the fixture base plate, the adjustment assembly includes an adjustment plate slidably connected to the fixture base plate, an adjustment cam is abutted against the bottom of the adjustment plate, an adjustment motor is drivenly connected to the adjustment cam, and the adjustment motor is fixed to the fixture base plate by an adjustment seat bolt.

[0012] The present invention is further configured such that a supporting cylinder is provided at the bottom of the fixture base plate.

[0013] The present invention has the following advantages: 1. The bottom support groove and the external support groove work together to fix and support the infrared chip.

[0014] 2. The barrier layer is a separate rectangular sheet structure, which can prevent the filler adhesive from overflowing under centrifugal force during the centrifugal degassing process.

[0015] 3. The positioning component can position and connect the barrier layer and the top plate of the clamp, and the first fixing hole and the second fixing hole can be connected by the threaded connection of the fixing bolt to further prevent the barrier layer from sliding off.

[0016] 4. By adjusting the components to adapt to different rotational degassing speeds, the rectangular window can maintain different openings, which is conducive to the discharge of bubbles. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of this embodiment;

[0018] Figure 2 This is an example. Figure 1 A magnified view of part A in the diagram;

[0019] Figure 3 This is a plan view of this embodiment;

[0020] Figure 4 This is a three-dimensional structural diagram of the removal of the barrier layer in this embodiment;

[0021] Figure 5 This is a three-dimensional structural diagram of the barrier layer in this embodiment.

[0022] Figure descriptions: 1. Fixture base plate; 2. Support plate; 3. Fixture top plate; 4. Bottom support groove; 5. External support groove; 6. Rectangular window; 7. Slide groove; 8. Blocking layer; 9. Positioning hook; 10. Positioning ring; 11. Positioning block; 12. Positioning guide rod; 13. Connecting base; 14. Connecting groove; 15. Connecting spring; 16. First fixing hole; 17. Second fixing hole; 18. Adjusting plate; 19. Adjusting cam; 20. Adjusting motor; 21. Support cylinder. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to the accompanying drawings.

[0024] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0025] like Figure 1 , Figure 3 and Figure 4 As shown, a chip debubbling and loading fixture includes a fixture base plate 1, with a support plate 2 at each of the four corners of the fixture base plate 1. A fixture top plate 3 is fixedly connected to the four support plates 2. The surface of the fixture base plate 1 has a bottom support groove 4 for fixing the photosensitive chip. An external support groove 5 is formed between the fixture base plate 1 and the fixture top plate 3. Rectangular windows 6 for venting air bubbles are opened around the external support groove 5. A sliding groove 7 is opened on the fixture top plate 3, and a blocking layer 8 is slidably connected to the sliding groove 7.

[0026] The bottom support groove 4 is used to fix the photosensitive chip, and the external support groove 5 is used to fix the readout circuit. Together, they provide a fixed support for the infrared chip, which can effectively avoid the risk of the chip falling off during the vacuum degassing process. The blocking layer 8 is a separate rectangular sheet structure, which can prevent the filler glue from overflowing under the action of centrifugation during the centrifugal degassing process. At the same time, the bottom filler air bubbles are discharged to the rectangular window 6 under the action of centrifugal force, which promotes the reliability of the infrared chip itself and also suppresses the occurrence of imaging patterns in the infrared imaging image.

[0027] like Figures 1 to 2 As shown, the surfaces of the fixture top plate 3 and the blocking layer 8 are provided with several sets of positioning components. The positioning components include positioning hooks 9 set on the surface of the fixture top plate 3, positioning rings 10 set on the positioning hooks 9, positioning blocks 11 fixedly connected to the bottom of the positioning rings 10, positioning guide rods 12 set on both sides of the positioning blocks 11, and the two positioning guide rods 12 are slidably connected to the connecting components. The connecting components include connecting bases 13, connecting grooves 14 are opened on both opposite sides of the connecting bases 13, and the connecting grooves 14 are slidably connected to the positioning guide rods 12 respectively. A connecting spring 15 is fixedly connected to one side of the positioning block 11, and one end of the connecting spring 15 is fixedly connected to the inner wall of the connecting base 13.

[0028] The positioning components consist of two sets. The two positioning hooks 9 of the two sets of positioning components are respectively set at the two corners of the top plate 3 of the fixture. In use, the blocking layer 8 is pushed to slide in the slide groove 7. At the same time, the positioning block 11 is pushed, so that the positioning guide rod 12 slides in the connecting groove 14. The connecting spring 15 is compressed. The movement of the positioning block 11 drives the positioning ring 10 to move accordingly. After the blocking layer 8 is pushed to the designated position, the positioning hook 9 contacts the positioning ring 10. The positioning block 11 is released, so that the connecting spring 15 is relaxed. The positioning guide rod 12 slides to its original position, and the positioning ring 10 abuts against the positioning hook 9 to achieve the effect of positioning and fixing.

[0029] like Figure 4 and Figure 5 As shown, the top plate 3 of the clamp is provided with first fixing holes 16 on opposite sides, and the blocking layer 8 is provided with second fixing holes 17 on opposite sides. The first fixing holes 16 correspond to and are connected to the second fixing holes 17 on the same side.

[0030] After the positioning assembly positions and connects the barrier layer 8 and the fixture top plate 3, it is connected to the first fixing hole 16 and the second fixing hole 17 by means of a fixing bolt (not shown in the figure), which further prevents the barrier layer 8 from sliding off during the chip rotation and debubbling process.

[0031] like Figure 1 , Figure 3 and Figure 4 As shown, an adjustment assembly is slidably connected to the fixture base plate 1. The adjustment assembly includes an adjustment plate 18 slidably connected to the fixture base plate 1. An adjustment cam 19 is abutted against the bottom of the adjustment plate 18. An adjustment motor 20 is drivenly connected to the adjustment cam 19. The adjustment motor 20 is fixed to the fixture base plate 1 by adjustment seat bolts.

[0032] The rotation speed program for the degassing process is set to gradually increase, transitioning from low speed to high speed. In the low speed stage, the output shaft of the motor 20 drives the adjusting cam 19 to rotate. The rotation of the adjusting cam 19 controls the adjusting plate 18 to slide on the fixture base plate 1, keeping the rectangular window 6 used for venting bubbles at a small opening. Similarly, in the high speed stage, the adjusting motor 20 makes the adjusting plate 18 slide on the fixture base plate 1, keeping the rectangular window 6 at a large opening or fully open, which is conducive to the complete venting of generated bubbles.

[0033] like Figure 1 , Figure 3 and Figure 4 As shown, a support cylinder 21 is provided at the bottom of the fixture base plate 1; the support cylinder 21 allows the fixture as a whole to be fixed on the rotating tray of the vacuum degassing machine.

[0034] The specific embodiments are merely explanations of this utility model and are not intended to limit it. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this utility model.

Claims

1. A chip debubbling load fixture, characterized by: The fixture includes a base plate (1), with a support plate (2) at each of the four corners of the base plate (1). A top plate (3) is fixedly connected to the four support plates (2). The surface of the base plate (1) has a bottom support groove (4) for fixing the photosensitive chip. An external support groove (5) is formed between the base plate (1) and the top plate (3). A rectangular window (6) for venting air bubbles is opened around the external support groove (5). A sliding groove (7) is opened on the top plate (3). A blocking layer (8) is slidably connected to the sliding groove (7).

2. A chip debubbling load fixture as claimed in claim 1, wherein: The surfaces of the clamp top plate (3) and the blocking layer (8) are provided with a number of positioning components. The positioning components include a positioning hook (9) provided on the surface of the clamp top plate (3). A positioning ring (10) is provided on the positioning hook (9). A positioning block (11) is fixedly connected to the bottom of the positioning ring (10). Positioning guide rods (12) are provided on both sides of the positioning block (11). The two positioning guide rods (12) are slidably connected by a connecting component.

3. A chip debubbling load fixture as claimed in claim 2, wherein: The connecting assembly includes a connecting base (13), and connecting grooves (14) are provided on both sides of the connecting base (13). The connecting grooves (14) are slidably connected to the positioning guide rod (12). A connecting spring (15) is fixedly connected to one side of the positioning block (11), and one end of the connecting spring (15) is fixedly connected to the inner wall of the connecting base (13).

4. A chip debubbling load fixture as claimed in claim 3, wherein: The clamp top plate (3) has a first fixing hole (16) on each of its opposite sides, and the blocking layer (8) has a second fixing hole (17) on each of its opposite sides. The first fixing hole (16) corresponds to and is connected to the second fixing hole (17) on the same side.

5. A chip debubbling load fixture as claimed in claim 4, wherein: An adjustment assembly is slidably connected to the fixture base plate (1). The adjustment assembly includes an adjustment plate (18) slidably connected to the fixture base plate (1). An adjustment cam (19) is abutted against the bottom of the adjustment plate (18). An adjustment motor (20) is drivenly connected to the adjustment cam (19). The adjustment motor (20) is fixed to the fixture base plate (1) by an adjustment seat bolt.

6. A chip debubbling load fixture as claimed in claim 5, wherein: The bottom of the fixture base plate (1) is provided with a supporting cylinder (21).

Images