Semiconductor wet bench with gas safety venting system

Abstract

This utility model relates to the field of semiconductor processing technology, and in particular to a semiconductor wet process equipment with a gas safety emission system. It includes a housing, an exhaust system for the ambient temperature processing area, enabling rapid and simultaneous ventilation in different areas within the entire ambient temperature processing area, and a high-temperature exhaust system for the high-temperature processing area. This high-temperature exhaust system includes a high-temperature suction zone, which, after the process tank cover is opened, quickly removes most of the evaporated gases from the high-temperature process. A third and fourth suction zone further facilitates the rapid removal of the remaining evaporated gases from the high-temperature processing area. This combined approach achieves rapid removal of high-temperature steam during high-temperature processes, preventing personnel from coming into contact with high concentrations of acidic or alkaline gases on their hands or faces when handling wafers at close range, thus avoiding the risk of skin burns or respiratory damage and eliminating safety hazards.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a semiconductor wet process equipment with a gas safety emission system. Background Technology

[0002] Semiconductor wet process equipment removes, cleans, or modifies materials on the wafer surface through chemical solutions and physical processes (such as spraying, ultrasound, and heating).

[0003] Semiconductor wet process equipment has several process tanks for tank cleaning. Existing equipment often has centralized ventilation and exhaust ports at the top, which can achieve ventilation and exhaust inside the equipment. However, the ventilation speed is slow, and the overall equipment height is too high, making it unsuitable for most workshops and lacking versatility. Furthermore, when high-temperature processes are used, a large amount of high-temperature acid and alkaline gases will volatilize and overflow from the process tanks, easily polluting the working area and spreading throughout the work area. Existing ventilation and exhaust structures cannot quickly remove high-temperature steam. When wafers need to be handled at close range, personnel may be directly exposed to the steam diffusion path, leading to contact with high concentrations of acid and alkaline gases on their hands or faces, causing skin burns or respiratory damage, posing a safety hazard. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a semiconductor wet process equipment with a gas safety emission system that is highly versatile and can achieve both rapid ventilation and rapid extraction of high-temperature steam under high-temperature processes.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: a semiconductor wet process equipment with a gas safety emission system, the innovation of which is: including The box body has a vertical main partition inside, which divides the inner cavity of the box into a front working room and a rear working room that are not connected to each other. The front working room is equipped with a high temperature processing area and a normal temperature processing area, and each high temperature processing area or normal temperature processing area is equipped with at least one process tank. Each of the ambient temperature processing work areas is connected to an exhaust ventilation system. The exhaust system includes a first exhaust pipe and a first exhaust pump. A first suction area is provided on the top side of the process tank in the middle of the rear working chamber, near the room temperature processing working area. A second suction area is also provided at the top of the rear working chamber, near the room temperature processing working area. The first suction area and the second suction area are connected. The first exhaust pump is connected to the second suction area through the first exhaust pipe. A high-temperature exhaust system is provided, with each of the high-temperature processing work areas connected to one of the high-temperature exhaust systems. The high-temperature exhaust mechanism includes a second exhaust pipe, a second exhaust pump, and a high-temperature suction zone. A third suction zone is provided on the top side of the process tank near the high-temperature processing work area in the middle of the rear working chamber. A fourth suction zone is also provided at the top of the rear working chamber near the high-temperature processing work area, and the third and fourth suction zones are connected. A high-temperature suction zone is also provided on the top side of the process tank within the high-temperature processing work area, and the third and high-temperature suction zones are connected. The second exhaust pump is connected to the third suction zone through the second exhaust pipe.

[0006] Furthermore, the main partition has a first air intake that connects to the first air intake zone and a second air intake that connects to the second air intake zone near the ambient temperature processing area. The main partition plate is provided with a third air intake that connects to the third air intake zone and a fourth air intake that connects to the fourth air intake zone near the high-temperature processing work area; The first, third, and fourth air intakes are all equipped with grilles, which can improve air circulation and heat dissipation efficiency.

[0007] Furthermore, the box body is arranged horizontally, including a box frame and multiple box panels. The box panels include a front panel, a right side panel, a left side panel, a top panel and a rear panel. The two adjacent working areas in the front working chamber are separated by a vertical secondary partition. The middle of the box frame is also provided with auxiliary crossbars and auxiliary sidebars at the same height, and the auxiliary sidebars are not lower than the top of the process slot. A horizontally arranged snap-fit ​​plate is provided on the right side inside the high-temperature processing work area. The snap-fit ​​plate includes a vertical plate near the right side plate, and an upper horizontal plate and a lower horizontal plate fixedly installed on the same side of the vertical plate. The upper horizontal plate and the lower horizontal plate are both located between the vertical plate and the right side plate. The snap-fit ​​plate, the front plate, the right side plate, and the main partition plate form the high-temperature air suction zone. A first ventilation opening is also provided on the main partition plate between the vertical plate and the right side plate. The vertical plate is set on the auxiliary horizontal bar, and the lower horizontal plate is set on the auxiliary side bar. The bottom of the lower horizontal plate is provided with a snap-fit ​​block, and the top of the auxiliary side bar is provided with a snap-fit ​​groove. The upper horizontal plate is also provided with a clearance groove that just avoids the right front vertical bar of the box frame. An air suction vent is also provided in the middle of the vertical plate.

[0008] Furthermore, a transverse long partition is installed at the upper part of the rear working chamber; A third cover is installed on the transverse partition to completely cover the third air intake and the first ventilation opening. The third cover and the right side plate, the transverse partition and the main partition form the third air intake area. A second ventilation opening is also provided on the transverse partition to connect the third air intake area. A first partition is provided on the transverse long partition near the right side plate. The first partition is located in the middle of the fourth air intake. A fourth cover is installed on the side of the first partition away from the right side plate. The fourth air intake area is formed between the transverse long partition, the right side plate, the top plate, the rear plate, the main partition, the first partition and the fourth cover. The fourth air intake area is connected to the fourth air intake. The fourth air intake area and the third air intake area are connected through the second ventilation opening. A first cover is installed on the lower left side of the transverse long partition. The transverse long partition, the first cover and the main partition form the first air suction area, and the first air suction area completely includes the first air suction port. A second box body that completely covers the second air intake is also installed on the main partition. A second partition is also provided on the horizontal long partition near the left side plate. The second partition, the horizontal long partition, the left side plate, the top plate, the rear plate and the main partition form the second air intake area. A ventilation duct is installed between the second partition and the second box body. A third ventilation opening is also provided on the horizontal long partition to connect the first air intake area and the second air intake area. The first air intake area and the second air intake area are connected through the third ventilation opening. Furthermore, when organic solvents are used for wafer processing inside the process tank in the high-temperature processing area, the clamping plate is made of stainless steel; when acidic or alkaline solvents are used for wafer processing inside the process tank in the high-temperature processing area, the clamping plate is made of plastic. Different clamping plates can be quickly selected according to actual needs to improve the stability of equipment operation during the processing.

[0009] Furthermore, the left and right sides of the rear panel are respectively provided with a first installation port and a second installation port that connect the second air intake area and the fourth air intake area, and a first exhaust pipe is installed at the first installation port on the rear side of the box, and a second exhaust pipe is installed at the second installation port on the rear side of the box.

[0010] The advantages of this utility model are: In this structure, an exhaust system is installed in the ambient temperature processing area, with the second suction zone and the first suction zone positioned vertically within the exhaust system. This allows for rapid, simultaneous ventilation of different areas within the ambient temperature processing area. A high-temperature exhaust system is installed in the high-temperature processing area, with an additional high-temperature suction zone. After the process tank cover is opened, the high-temperature suction zone quickly removes most of the evaporated gases from the high-temperature process. The third and fourth suction zones then rapidly remove the remaining small amount of evaporated gases from the high-temperature processing area. This combined approach ensures rapid removal of high-temperature steam during high-temperature processes, preventing personnel from coming into contact with high concentrations of acidic or alkaline gases on their hands or faces when handling wafers at close range, thus avoiding the risk of skin burns or respiratory damage and mitigating safety hazards.

[0011] When organic solvents are used for wafer processing in the high-temperature processing tank, stainless steel clamping plates are required. When acid or alkali solvents are used for wafer processing in the high-temperature processing tank, plastic clamping plates are required. Different clamping plates can be quickly selected according to actual needs to improve the stability of equipment operation during processing and the application scenarios.

[0012] The first and second air ducts are both installed on the rear side of the enclosure, which reduces the overall storage space height requirement of this structure and makes it more versatile. Attached Figure Description

[0013] Figure 1 This is an overall structural diagram of the present invention.

[0014] Figure 2 This is a partial three-dimensional structure of the present utility model. Figure 1 .

[0015] Figure 3 This is a partial three-dimensional structure of the present utility model. Figure 2 .

[0016] Figure 4 This is a partial three-dimensional structure of the present utility model. Figure 3 .

[0017] Figure 5 This is an enlarged view of part of the structure of this utility model. Detailed Implementation

[0018] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0019] like Figure 1-5 The semiconductor wet process equipment shown includes a housing 1, an exhaust system 2, and a high-temperature exhaust system 3.

[0020] The box 1 is arranged horizontally and includes a box frame 11 and multiple box panels. A top box is also provided on the top of the box 1. A vertical main partition 12 is provided inside the box 1, thereby dividing the inner cavity of the box 1 into a front row working room and a rear row working room that are not connected to each other. The front row working room is provided with a high temperature processing working area and a normal temperature processing working area.

[0021] Each high-temperature processing area or room-temperature processing area is equipped with at least one process tank 4. The process tank 4 is covered with a tank cover and contains chemical liquid. The process tank 4 in the high-temperature processing area is specifically used to perform the high-temperature processing process of wafers. A large amount of high-temperature evaporation gas will be generated during the preparation process. The process tank 4 in the room-temperature processing area is specifically used to perform the room-temperature processing process of wafers.

[0022] The enclosure includes a front panel 13, a right side panel 14, a left side panel, a top panel 15, and a rear panel. The ambient temperature processing area on the left side and the high temperature processing area on the right side of the front working chamber are separated by a vertical secondary partition. The front panel 13 is also equipped with two switchable doors that connect the high temperature processing area and the ambient temperature processing area, respectively.

[0023] The box frame 11 has a right front vertical bar 19 at the high temperature processing work area. There are also auxiliary horizontal bars 16 and auxiliary side bars 17 at the same height in the middle. The auxiliary side bars 17 are not lower than the top of the process slot 4.

[0024] A horizontal partition 18 is installed at the upper part of the rear working room.

[0025] Each ambient temperature processing work area is connected to an exhaust ventilation system 2.

[0026] The exhaust system 2 includes a first exhaust pipe 21 and a first exhaust pump. A first suction area is provided on the top side of the process tank 4 near the ambient temperature processing area in the middle of the rear working chamber. A second suction area is also provided at the top of the rear working chamber near the ambient temperature processing area. The first suction area and the second suction area are connected. The first exhaust pump is located outside the housing 1 and is connected to the second suction area through the first exhaust pipe 21.

[0027] Each high-temperature processing work area is connected to a high-temperature exhaust system 3.

[0028] The high-temperature exhaust mechanism 3 includes a second exhaust pipe 31, a second exhaust pump, and a high-temperature suction zone 35. A third suction zone is provided on the top side of the process tank 4 near the high-temperature processing work area in the middle of the rear working chamber. A fourth suction zone is also provided at the top of the rear working chamber near the high-temperature processing work area. The third and fourth suction zones are connected. A high-temperature suction zone 35 is also provided on the top side of the process tank 4 in the high-temperature processing work area. The third and high-temperature suction zones 35 are connected. The second exhaust pump is located outside the housing 1 and is connected to the third suction zone through the second exhaust pipe 31.

[0029] On the main partition 12, near the normal temperature processing work area, there is a first air inlet 22 that connects to the first air inlet zone and a second air inlet 23 that connects to the second air inlet zone, and the first air inlet 22 is located below the second air inlet 23.

[0030] The main partition 12 has a third air inlet 32 ​​that connects to the third air inlet zone and a fourth air inlet 33 that connects to the fourth air inlet zone near the high-temperature processing work area, and the third air inlet 32 ​​is located below the fourth air inlet 33.

[0031] The first, third, and fourth air intakes are all equipped with grilles.

[0032] A horizontally positioned snap-fit ​​plate 34 is provided on the right side inside the high-temperature processing work area.

[0033] The snap-fit ​​plate 34 includes a vertical plate 341 located near the right side plate 14, and an upper horizontal plate 342 and a lower horizontal plate 343 fixedly installed on the same side of the vertical plate 341. Both the upper and lower horizontal plates 342 and 343 are positioned between the vertical plate 341 and the right side plate 14. This snap-fit ​​plate 34, together with the front plate 13, the right side plate 14, and the main partition plate 12, forms a high-temperature air intake zone 35. A first ventilation opening 36 is also provided on the main partition plate 12 between the vertical plate 341 and the right side plate 14. The lower horizontal plate 343 is located in the lower-middle part of the vertical plate 341, allowing the bottom end of the vertical plate 341 to extend below the lower horizontal plate 343, thereby improving the stability of the snap-fit ​​plate 34 when snapped into the high-temperature processing area.

[0034] A rectangular groove 344 is also provided at the bottom of the vertical plate 341 on the side near the auxiliary crossbar 16, so that the vertical plate 341 can be mounted on the auxiliary crossbar 16 through the rectangular groove 344. The lower horizontal plate 343 is mounted on the auxiliary side rod 17. A gap is left between the front side of the lower horizontal plate 343 and the front side of the vertical plate 341 to accommodate the right front vertical rod 19. The bottom of the lower horizontal plate 343 is provided with a snap-fit ​​block, and the top of the auxiliary side rod 17 is provided with a corresponding snap-fit ​​groove.

[0035] The upper horizontal plate 342 is also provided with a clearance groove 345 that just avoids the right front vertical bar 19 of the box frame 11, and the rear sides of the vertical plate 341, the lower horizontal plate 343, and the upper horizontal plate 342 are all closely attached to the main partition plate 12. The vertical plate 341 is also provided with a suction vent 346 in the middle.

[0036] When organic solvents are used for wafer processing inside the process tank 4 in the high-temperature processing work area, the snap-fit ​​plate 34 is made of stainless steel. When acid or alkali solvents are used for wafer processing inside the process tank 4 in the high-temperature processing work area, the snap-fit ​​plate 34 is made of plastic. Different snap-fit ​​plates 34 can be quickly selected according to actual needs to improve the stability of equipment operation during processing and the application scenarios.

[0037] A third cover 37 is installed on the transverse long partition 18 to completely cover the third air intake 32 and the first ventilation opening 36. The third cover 37 and the right side plate 14, the transverse long partition 18 and the main partition 12 form a third air intake zone. A second ventilation opening connected to the third air intake zone is also opened on the transverse long partition 18.

[0038] A first partition 38 is provided on the transverse long partition 18 near the right side plate 14. The first partition 38 is located in the middle of the fourth air intake 33. A fourth cover 39 is installed on the side of the first partition 38 away from the right side plate 14. The transverse long partition 18, the right side plate 14, the top plate 15, the rear plate, the main partition 12, the first partition 38 and the fourth cover 39 form a fourth air intake zone. The fourth air intake zone is connected to the fourth air intake 33. The fourth air intake zone and the third air intake zone are connected through the second ventilation opening.

[0039] A first cover 24 is installed on the lower left side of the transverse long partition 18. The transverse long partition 18, the first cover 24 and the main partition 12 form a first air suction area, and the first air suction area completely includes the first air suction port 22.

[0040] A second housing 25, which completely covers the second air intake 23, is also installed on the main partition 12. A second partition 26 is provided on the transverse long partition 18 near the left side panel. The second partition 26, the transverse long partition 18, the left side panel, the top panel 15, the rear panel and the main partition 12 form a second air intake zone. A ventilation duct is installed between the second partition 26 and the second box 25. A third ventilation opening 27 is also provided on the transverse long partition 18 to connect the first air intake zone and the second air intake zone. The first air intake zone and the second air intake zone are connected through the third ventilation opening 27.

[0041] The left and right sides of the rear panel are respectively provided with a first installation port and a second installation port that connect the second and fourth air intake zones. A first exhaust pipe 21 is installed at the first installation port on the rear side of the housing 1, and a second exhaust pipe 31 is installed at the second installation port on the rear side of the housing 1. By installing both the first exhaust pipe 21 and the second exhaust pipe 31 on the rear side of the housing 1, the overall storage space height requirement of this structure can be reduced, making it highly versatile.

[0042] The working principle of this patent: For the ambient temperature processing work area, the exhaust system 2 is used to quickly achieve synchronous ventilation in different areas of the entire ambient temperature processing work area.

[0043] A high-temperature exhaust system 3 is used in the high-temperature processing work area. After the tank cover of the process tank 4 is opened, most of the evaporated gas in the high-temperature process is quickly extracted through the high-temperature suction zone 35. The remaining small amount of evaporated gas inside the high-temperature processing work area is quickly extracted and ventilated through the third and fourth suction zones. This combination achieves rapid extraction of high-temperature steam under high-temperature processes, avoiding pollution of the working environment. It also avoids the risk of skin burns or respiratory damage to personnel's hands or faces when manually opening the door and handling wafers at close range. This protects the safety of the working environment and avoids potential safety hazards.

[0044] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A semiconductor wet bench having a gas safety venting system, characterized by: include The box body has a vertical main partition inside, which divides the inner cavity of the box into a front working room and a rear working room that are not connected to each other. The front working room is equipped with a high temperature processing area and a normal temperature processing area, and each high temperature processing area or normal temperature processing area is equipped with at least one process tank. Each of the ambient temperature processing work areas is connected to an exhaust ventilation system. The exhaust system includes a first exhaust pipe and a first exhaust pump. A first suction area is provided on the top side of the process tank in the middle of the rear working chamber, near the room temperature processing working area. A second suction area is also provided at the top of the rear working chamber, near the room temperature processing working area. The first suction area and the second suction area are connected. The first exhaust pump is connected to the second suction area through the first exhaust pipe. A high-temperature exhaust system is provided, with each of the high-temperature processing work areas connected to one of the high-temperature exhaust systems. The high-temperature exhaust mechanism includes a second exhaust pipe, a second exhaust pump, and a high-temperature suction zone. A third suction zone is provided on the top side of the process tank near the high-temperature processing work area in the middle of the rear working chamber. A fourth suction zone is also provided at the top of the rear working chamber near the high-temperature processing work area, and the third and fourth suction zones are connected. A high-temperature suction zone is also provided on the top side of the process tank within the high-temperature processing work area, and the third and high-temperature suction zones are connected. The second exhaust pump is connected to the third suction zone through the second exhaust pipe.

2. A semiconductor wet bench having a gas safe venting system as defined in claim 1, wherein: The main partition has a first air intake that connects to the first air intake zone and a second air intake that connects to the second air intake zone near the ambient temperature processing area. The main partition plate has a third air intake that connects to the third air intake zone and a fourth air intake that connects to the fourth air intake zone, located near the high-temperature processing work area.

3. A semiconductor wet processing apparatus having a gas safety exhaust system according to claim 2, characterized by: The box body is arranged horizontally and includes a box frame and multiple box panels. The box panels include a front panel, a right side panel, a left side panel, a top panel and a rear panel. The two adjacent working areas in the front working chamber are separated by a vertical secondary partition. The middle of the box frame is also provided with auxiliary crossbars and auxiliary sidebars at the same height, and the auxiliary sidebars are not lower than the top of the process slot. A horizontally arranged snap-fit ​​plate is provided on the right side inside the high-temperature processing work area. The snap-fit ​​plate includes a vertical plate near the right side plate, and an upper horizontal plate and a lower horizontal plate fixedly installed on the same side of the vertical plate. The upper horizontal plate and the lower horizontal plate are both located between the vertical plate and the right side plate. The snap-fit ​​plate, the front plate, the right side plate, and the main partition plate form the high-temperature air suction zone. A first ventilation opening is also provided on the main partition plate between the vertical plate and the right side plate. The vertical plate is set on the auxiliary horizontal bar, and the lower horizontal plate is set on the auxiliary side bar. The bottom of the lower horizontal plate is provided with a snap-fit ​​block, and the top of the auxiliary side bar is provided with a snap-fit ​​groove. The upper horizontal plate is also provided with a clearance groove that just avoids the right front vertical bar of the box frame. An air suction vent is also provided in the middle of the vertical plate.

4. A semiconductor wet process equipment with a gas safety emission system according to claim 3, characterized in that: A long horizontal partition is installed at the upper part of the rear working chamber; A third cover is installed on the transverse partition to completely cover the third air intake and the first ventilation opening. The third cover and the right side plate, the transverse partition and the main partition form the third air intake area. A second ventilation opening is also provided on the transverse partition to connect the third air intake area. A first partition is provided on the transverse long partition near the right side plate. The first partition is located in the middle of the fourth air intake. A fourth cover is installed on the side of the first partition away from the right side plate. The fourth air intake area is formed between the transverse long partition, the right side plate, the top plate, the rear plate, the main partition, the first partition and the fourth cover. The fourth air intake area is connected to the fourth air intake. The fourth air intake area and the third air intake area are connected through the second ventilation opening. A first cover is installed on the lower left side of the transverse long partition. The transverse long partition, the first cover and the main partition form the first air suction area, and the first air suction area completely includes the first air suction port. A second box body that completely covers the second air intake is also installed on the main partition. A second partition is also provided on the horizontal long partition near the left side plate. The second partition, the horizontal long partition, the left side plate, the top plate, the rear plate and the main partition form the second air intake zone. A ventilation duct is installed between the second partition and the second box body. A third ventilation opening is also provided on the horizontal long partition to connect the first air intake zone and the second air intake zone. The first air intake zone and the second air intake zone are connected through the third ventilation opening.

5. A semiconductor wet process equipment with a gas safety emission system according to claim 3, characterized in that: When organic solvents are used for wafer processing inside the process tank in the high-temperature processing area, the clamping plate is made of stainless steel. When acidic or alkaline solvents are used for wafer processing inside the process tank in the high-temperature processing area, the clamping plate is made of plastic.

6. A semiconductor wet process equipment with a gas safety emission system according to claim 4, characterized in that: The rear panel has a first installation port and a second installation port on its left and right sides, respectively, which connect the second air intake area and the fourth air intake area. A first exhaust pipe is installed at the first installation port on the rear side of the housing, and a second exhaust pipe is installed at the second installation port on the rear side of the housing.

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