A multilayer substrate storage device and semiconductor production apparatus

Abstract

The utility model provides a kind of multilayer substrate storage device and semiconductor production equipment, belong to semiconductor production equipment technical field, device includes multiple trays and multiple detection components, the tray is set installation site, and the installation site of two adjacent upper and lower is staggered distribution along horizontal direction;The detection component is used to detect whether the corresponding tray is placed with substrate;When applying, the wafer transfer robot can accurately dock the required tray, take or place wafer, without interference to cause substrate damage, can effectively solve the deficiency of traditional structure. By horizontally staggering installation site, and setting the gap to keep the target tray and detection component between no obstruction, so that the detection component can accurately, quickly obtain the information whether there is substrate on target tray, can ensure the reliability of detection result.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a multilayer substrate memory device and semiconductor manufacturing equipment. Background Technology

[0002] In semiconductor manufacturing, air contains a large amount of gases such as oxygen, nitrogen, and water vapor. For example, oxygen reacts with semiconductor materials like silicon during high-temperature processes. The thermal oxidation process in chip manufacturing is used to grow a high-quality silicon dioxide film on the silicon wafer surface. The presence of impurities other than oxygen, such as hydrogen, can affect the quality and performance of the silicon dioxide film. The quality of this film is crucial for subsequent photolithography, etching, and other processes, as well as the chip's electrical performance. Water vapor is also a harmful impurity. In semiconductor device manufacturing processes, such as metal deposition, water vapor can cause an oxide layer to form between the metal and semiconductor layers, affecting the metal-semiconductor contact performance, increasing contact resistance, and thus reducing chip performance and reliability. Additionally, other particulate impurities in the air can also affect process quality; therefore, a vacuum environment is typically used in semiconductor manufacturing processes.

[0003] After the substrate completes its current process, the vacuum chamber needs to be de-vacuumed, and then the substrate needs to be removed and replaced, followed by re-vacuuming, which disrupts the process rhythm and reduces production efficiency. To address this, engineers developed a vacuum interconnection system that connects multiple vacuum chambers to reduce the impact of vacuum levels. In this system, multiple substrates are stored in a vertically spaced stacked manner, allowing multiple substrates to be fed into the system at once, avoiding disruption of the internal vacuum environment. During the process, the substrate only needs to be switched between the various vacuum chambers.

[0004] In existing technologies, using a single transmissive or reflective sensor to detect the presence or absence of a substrate in the storage mechanism makes it difficult to confirm the presence or absence of a substrate in each layer, especially when applied to glass substrates. Therefore, misjudgments can easily occur during substrate handling, leading to malfunctions. Utility Model Content

[0005] The present invention aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, in a first aspect, the present invention provides a multilayer substrate storage device capable of detecting the presence or absence of a substrate in each layer, thus overcoming the shortcomings of traditional structures.

[0006] Secondly, this utility model proposes a semiconductor manufacturing equipment that utilizes the aforementioned multilayer substrate memory device.

[0007] A multilayer substrate storage device according to a first aspect embodiment of the present invention includes:

[0008] Multiple trays are stacked at intervals in a vertical direction, and each tray is provided with a mounting position for placing a substrate. Two adjacent mounting positions are staggered in a horizontal direction.

[0009] Multiple detection components are provided, each corresponding to a tray, to detect whether a substrate is placed on the corresponding tray;

[0010] When there are other trays between the detection component and the corresponding tray, each tray between the two is provided with a clearance opening so that the detection component can pass through the clearance opening over the intermediate tray and the substrate placed on it to detect the corresponding tray.

[0011] The multilayer substrate storage device according to the embodiments of the present invention has at least the following beneficial effects:

[0012] In this embodiment, a multi-layer substrate storage device is provided with a detection component for each tray. The detection component is used to detect whether a substrate is placed on the tray. In application, the substrate transfer robot can accurately dock with the required tray to pick up or place the substrate without interference that could damage the substrate. This effectively solves the shortcomings of traditional structures.

[0013] By horizontally offsetting the mounting positions and setting clearance openings to ensure no obstruction between the target tray and the detection component, the detection component can accurately and quickly obtain information about whether there is a substrate on the target tray, thus ensuring the reliability of the detection results.

[0014] According to some embodiments of the present invention, the tray is provided with a detection port in the mounting position, and the detection component includes a reflective sensor and a reflector. The reflective sensor is located above the plurality of trays, and the reflector is disposed at the lower end of the corresponding tray and covers the detection port.

[0015] According to some embodiments of the present invention, the tray is provided with a detection port in the mounting position, and the detection component includes a reflective sensor and a reflector. The reflective sensor is located below the plurality of trays, and the reflector is disposed at the bottom of the corresponding tray above the tray and covers the detection port.

[0016] According to some embodiments of the present invention, when there are other trays between the detection component and the corresponding tray, the clearance opening of the other tray at least partially overlaps with the horizontal projection of the detection port.

[0017] According to some embodiments of the present invention, some of the detection components are located above the plurality of trays, and some of the detection components are located below the plurality of trays.

[0018] According to some embodiments of this utility model, each pair of adjacent mounting positions are staggered by the same distance along a first direction.

[0019] According to some embodiments of the present invention, some of the detection components are spaced apart along the second direction.

[0020] According to some embodiments of the present invention, the multilayer substrate storage device further includes a cavity, the interior of which defines a chamber, the tray is disposed within the chamber, and the signal transmitting end of the detection component is disposed outside the cavity.

[0021] According to some embodiments of this utility model, photoelectric glass is disposed in the cavity facing the signal transmitting end.

[0022] The semiconductor manufacturing equipment according to the second aspect of the present invention includes a multilayer substrate memory device with any of the above-described structures.

[0023] The semiconductor manufacturing equipment according to the embodiments of the present invention has at least the following beneficial effects:

[0024] The semiconductor manufacturing equipment of this embodiment, by applying the above-mentioned multilayer substrate storage device, sets up a detection component for each tray. The detection component is used to detect whether a substrate is placed on the tray. In application, the wafer transfer robot can accurately dock with the required tray to pick up or place wafers without interference that could damage the substrates, thus effectively solving the shortcomings of traditional structures.

[0025] By horizontally offsetting the mounting positions and setting clearance openings to ensure no obstruction between the target tray and the detection component, the detection component can accurately and quickly obtain information about whether there is a substrate on the target tray, thus ensuring the reliability of the detection results.

[0026] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and some of these additional aspects and advantages will become apparent from the description or may be learned by practice of the invention. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0028] Figure 1 This is a schematic diagram showing a correspondence between the tray and the detection component in this utility model;

[0029] Figure 2This is a schematic diagram of one detection component in this utility model;

[0030] Figure 3 This is a schematic diagram of one installation of the tray and the detection component in this utility model;

[0031] Figure 4 for Figure 3 A structural diagram from another perspective;

[0032] Figure 5 This is a schematic diagram of the overall structure of this utility model;

[0033] Figure 6 This is a schematic diagram of a traditional testing method. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0037] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0038] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] In semiconductor manufacturing, air contains a large amount of gases such as oxygen, nitrogen, and water vapor. For example, oxygen reacts with semiconductor materials like silicon during high-temperature processes. The thermal oxidation process in chip manufacturing is used to grow a high-quality silicon dioxide film on the silicon wafer surface. The presence of impurities other than oxygen, such as hydrogen, can affect the quality and performance of the silicon dioxide film. The quality of this film is crucial for subsequent photolithography, etching, and other processes, as well as the chip's electrical performance. Water vapor is also a harmful impurity. In semiconductor device manufacturing processes, such as metal deposition, water vapor can cause an oxide layer to form between the metal and semiconductor layers, affecting the metal-semiconductor contact performance, increasing contact resistance, and thus reducing chip performance and reliability. Additionally, other particulate impurities in the air can also affect process quality; therefore, a vacuum environment is typically used in semiconductor manufacturing processes.

[0040] After the substrate completes its current process, the vacuum chamber needs to be de-vacuumed, and then the substrate needs to be removed and replaced, followed by re-vacuuming, which disrupts the process rhythm and reduces production efficiency. To address this, engineers developed a vacuum interconnection system that connects multiple vacuum chambers to reduce the impact of vacuum levels. In this system, multiple substrates are stored in a vertically spaced stacked manner, allowing multiple substrates to be fed into the system at once, avoiding disruption of the internal vacuum environment. During the process, the substrate only needs to be switched between the various vacuum chambers.

[0041] like Figure 6 As shown, in the relevant prior art, a single transmissive or reflective sensor is used to detect whether there is a substrate on the memory mechanism. It is difficult to confirm whether there is a substrate on each layer, so failures are likely to occur when picking up or putting down the substrate.

[0042] Therefore, this utility model provides a multi-layer substrate storage device that can detect whether there is a substrate in each layer, thus solving the shortcomings of traditional structures.

[0043] Reference Figures 1 to 6The multilayer substrate storage device of this embodiment includes multiple trays 100 and multiple detection components 200. The multiple trays 100 are stacked vertically at intervals, and each tray 100 is provided with a mounting position 101 for placing a substrate, which positions and supports the substrate. Two adjacent mounting positions 101 are staggered horizontally, so that when a substrate is placed into a mounting position 101, the two adjacent substrates are also staggered horizontally. The number of detection components 200 is the same as the number of trays 100, and they are configured in a one-to-one correspondence with the trays 100 to detect whether a substrate is placed on the corresponding tray 100.

[0044] When there are other trays 100 between the detection component 200 and the corresponding tray 100, each tray 100 between the two is provided with a clearance opening 103 so that the detection component 200 can pass through the clearance opening 103 to pass over the middle tray 100 and the substrate placed on it to detect the corresponding tray 100.

[0045] It is understandable that for a single detection component 200, the corresponding tray 100 is the target tray, and the other trays 100 are non-target trays. In a vacuum system, to accurately detect whether there is a substrate on a tray 100, a detection signal is generally emitted from directly above or below. Since the trays 100 are stacked vertically, they will block each other's detection signals. This embodiment, by providing clearance openings 103 on non-target trays, allows the detection component 200 to directly detect the situation on the target tray. Furthermore, because the upper and lower mounting positions 101 are staggered horizontally, by rationally designing the position of the detection component 200, it is also possible to avoid falsely detecting substrate information on non-target trays.

[0046] In summary, the multilayer substrate storage device of this embodiment is equipped with a detection component 200 for each tray 100. The detection component 200 is used to detect whether a substrate is placed on the tray 100. In application, the wafer transfer robot can accurately dock with the required tray 100 to pick up or place the wafer without interference that could damage the substrate. This effectively solves the shortcomings of traditional structures.

[0047] By horizontally offsetting the mounting position 101 and setting the clearance opening 103 to ensure that there is no obstruction between the target tray and the detection component 200, the detection component 200 can accurately and quickly obtain information on whether there is a substrate on the target tray, thus ensuring the reliability of the detection results.

[0048] Reference Figures 1 to 4In some embodiments of this utility model, the tray 100 has a detection port 102 within the mounting position 101, and the detection component 200 is vertically aligned with the detection port 102. Since the mounting position 101 is used to place the substrate, the detection port 102 is placed within the mounting position 101. When a substrate is placed on the target tray, the detection port 102 is covered by the substrate, and the detection component 200 can obtain information about the presence or absence of the substrate through signal feedback.

[0049] Reference Figures 1 to 4 In some embodiments of this utility model, the detection component 200 includes a reflective sensor 201 and a reflector 202, wherein the reflective sensor 201 is used to emit a detection signal and the reflector 202 is used to reflect the detection signal. The feedback signal received by the reflective sensor 201 differs when a substrate is present and when there is no substrate, thereby accurately determining whether there is a substrate on the target tray.

[0050] Reference Figures 1 to 4 In some embodiments of this invention, a reflective sensor 201 is located above the tray 100 and emits a detection signal downwards, such as a detection beam. A reflector 202 is disposed at the lower end of the target tray and covers the detection port 102. In one detection mode, when a substrate is placed on the target tray, the detection beam is attenuated (e.g., due to changes in luminous flux) when reflected back by the reflector 202. If no substrate is placed, the beam is attenuated almost entirely or by a very small amount, thereby enabling precise determination of whether a substrate is present on the tray 100.

[0051] In some embodiments, the reflective sensor 201 is a Keyence LV-NH62.

[0052] Alternatively, detection can be performed using a through-beam method, or by using other sensors and judgment mechanisms, such as using the fact that the detection signal is blocked and no feedback signal is received to determine that a substrate is placed on the target tray.

[0053] It is understood that when there is a non-target tray above the target tray in this embodiment, the non-target tray is provided with a clearance opening 103 directly above the detection port 102 to form an unobstructed passage between the reflective sensor 201 and the reflector 202.

[0054] Reference Figures 1 to 4In some embodiments of this invention, the reflective sensor 201 is located below the tray 100, and the reflector 202 is disposed at the bottom of the non-target tray above the target tray. The reflector 202 also covers the detection port 102. Since the upper surface of the tray 100 has a mounting position 101 to support the substrate, and the detection port 102 is located within the mounting position 101, it is inconvenient to place the reflector 202 on the upper surface of the tray 100 when the reflective sensor 201 emits a detection signal from bottom to top. This embodiment achieves reflection and avoids interference with the substrate on the target tray by placing the reflector 202 on the non-target tray above the target tray. It also avoids interference with the substrate on the non-target tray.

[0055] As described in the foregoing embodiments, regardless of whether the detection component 200 emits signals from top to bottom or bottom to top, the detection signal must pass through the detection port 102. Therefore, when there are other non-target trays between the detection component 200 and the target tray, the clearance opening 103 on the non-target tray and the detection port 102 on the target tray satisfy the following relationship: their horizontal projections at least partially overlap. This ensures that an unobstructed detection path is formed between the reflective sensor 201 and the reflector 202.

[0056] In some embodiments of this utility model, each pair of adjacent mounting positions 101 are staggered by the same distance along the first direction to maintain consistency and facilitate the film picking robot to pick up or place films from trays 100 on different layers.

[0057] Reference Figures 1 to 4 In some embodiments of this utility model, some detection components 200 are located above multiple trays 100, and some detection components 200 are located below multiple trays 100. As can be seen from the foregoing embodiments, the more trays 100 there are, the greater the horizontal offset distance between the first and last layers, which increases the overall space size. This embodiment, by placing some detection components 200 above the trays 100 and some below the trays 100, allows the upper and lower trays 100 to be symmetrically arranged vertically, for example, horizontally offset to the same side relative to the middle tray 100. Since the detection components 200 of the upper trays 100 are located above and the detection components 200 of the lower trays 100 are located below, the number of non-target trays between the detection components 200 and the target tray is effectively reduced. This reduces the need for the clearance opening 103 and the total horizontal offset distance between the first layer of trays 100 and the target tray, effectively controlling the overall space size.

[0058] Reference Figures 1 to 4In some embodiments of this utility model, at least some of the detection components 200 are distributed at intervals along the second direction. It is understood that multiple detection components 200 are provided for each tray 100. If all are arranged in a staggered manner along the left and right directions, the required distance for the staggered arrangement of multiple trays 100 in the left and right directions would be larger. If the left and right stagger distance is small, the overall height would increase because the detection components 200 themselves also have a certain size. This embodiment effectively controls the overall space size by arranging the detection components 200 at intervals along the second direction. For example, along the left and right direction, the mounting positions 101 only need to be staggered by a distance sufficient for the detection signal to pass through. This distance can be smaller than the size of the detection component 200. Since the detection components 200 are distributed along the second direction, there will be no interference between the detection components 200.

[0059] It is understood that the structural configuration of this embodiment can be combined with the aforementioned embodiments to achieve a better design of the overall space size.

[0060] Reference Figures 1 to 4 In some embodiments of this utility model, the multilayer substrate storage device includes three trays 100 and three detection components 200. From top to bottom, the mounting position 101 on the first tray 100 protrudes 10mm to the right relative to the mounting position 101 on the second tray 100, and the mounting position 101 on the third tray 100 protrudes 10mm to the right relative to the mounting position 101 on the second tray 100. Each tray 100 has a vertically penetrating detection port 102 on the left side of the mounting position 101. The detection ports 102 of the first tray 100 and the third tray 100 are vertically aligned. The detection ports 102 on the second tray 100 are spaced apart from the detection ports 102 of the first tray 100 and the third tray 100 along a direction perpendicular to the angle shown in the figure. If the left-right direction is defined as the length direction of the tray 100, then the detection ports 102 on the second tray 100 are spaced apart from the detection ports 102 of the first tray 100 and the third tray 100 along the width direction of the tray 100.

[0061] A clearance opening 103 is provided at the position directly opposite the detection port 102 of the first tray 100 and the second tray 100. Since the first tray 100 and the second tray 100 are offset by 10mm to the left and right, the detection port 102 of the second tray 100 can be exposed through the clearance opening 103.

[0062] Each detection component 200 includes a reflective sensor 201 and a reflector 202.

[0063] For the detection component 200 corresponding to the first tray 100, the reflective sensor 201 is positioned directly above the detection port 102 of the first tray 100, and the reflector 202 is installed on the lower end face of the detection port 102 of the first tray 100. If no substrate is placed on the first tray 100, the feedback signal (such as luminous flux) reflected back by the reflective sensor 201 through the reflector 202 is basically not reduced. If a substrate (glass substrate) is placed, the feedback signal (luminous flux) will be reduced. According to the test using Keyence LV-NH62, the luminous flux is more than 7000 without a substrate and more than 5000 with a substrate, which can accurately identify the presence of a faulty substrate.

[0064] For the detection component 200 corresponding to the second tray 100, a reflective sensor 201 is positioned above the first tray 100 and vertically aligned with the detection port 102 on the second tray 100. A reflector 202 is positioned on the lower end face of the detection port 102 on the second tray 100. The detection signal emitted by the reflective sensor 201 can pass through the clearance opening 103 on the first tray 100 to reach the detection port 102 on the second tray 100, and then be reflected back by the reflector 202.

[0065] For the detection component 200 corresponding to the third tray 100, a reflective sensor 201 is positioned directly below the detection port 102 of the third tray 100, and a reflector 202 is mounted on the lower end face of the second tray 100 and aligned vertically with the detection port 102 of the third tray 100. The detection signal emitted by the reflective sensor 201 passes through the detection port 102 of the third tray 100 to reach the reflector 202, and is reflected back by the reflector 202.

[0066] In this embodiment, the three trays 100 are horizontally offset to the same side relative to the middle tray 100, resulting in an overall increase of only 10mm in the left-right direction. Compared to a configuration where the three trays 100 are offset along the same side, the increase in size is reduced by half. Furthermore, the three detection components 200 are distributed along the width of the tray 100 and above and below the tray 100, avoiding interference between them and preventing an increase in height due to interference.

[0067] Understandably, when there are more trays 100 and detection components 200, the staggered distribution method and size of the mounting positions 101, as well as the staggered distribution distance of the reflective sensors 201, can be flexibly set as needed.

[0068] Reference Figure 5In some embodiments of this utility model, the multilayer substrate storage device further includes a cavity 300, the cavity 300 defining a chamber 301, a tray 100 disposed within the chamber 301, and a signal transmitting end of the detection component 200 disposed outside the cavity 300. As described in the foregoing embodiments, the signal transmitting end is a reflective sensor 201. By placing the reflective sensor 201 outside the cavity 300, its lifespan is ensured, while avoiding impact on the vacuum level inside the chamber 301.

[0069] In some embodiments of this utility model, a photoelectric glass is provided in the cavity 300 facing the reflective sensor 201, through which the detection signal is allowed to pass, while ensuring the sealing of the cavity 300 at this location.

[0070] It is understood that the present invention mainly proposes a technical concept of setting a detection component 200 for each layer of tray 100 and distributing the detection components 200 above and below the tray 100 and arranging them at intervals along the width direction of the tray 100, so as to control the overall space size of the storage device as much as possible. While solving the substrate detection of each layer of tray 100, it does not increase the overall size of the cavity 300, and facilitates the modification and upgrading of existing equipment.

[0071] An embodiment of this utility model also proposes a semiconductor manufacturing apparatus, including a multilayer substrate memory device with any of the above-described structures.

[0072] It is understood that the semiconductor manufacturing equipment of this embodiment, by applying the above-mentioned multilayer substrate storage device, sets up a detection component 200 for each tray 100. The detection component 200 is used to detect whether a substrate is placed on the tray 100. When applied, the wafer transfer robot can accurately dock with the required tray 100 to pick up or place wafers without interference that could damage the substrate, thus effectively solving the shortcomings of traditional structures.

[0073] By horizontally offsetting the mounting position 101 and setting the clearance opening 103 to ensure that there is no obstruction between the target tray and the detection component 200, the detection component 200 can accurately and quickly obtain information on whether there is a substrate on the target tray, thus ensuring the reliability of the detection results.

[0074] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A multilayer substrate storage device, characterized in that, include: Multiple trays are stacked at intervals in a vertical direction, and each tray is provided with a mounting position for placing a substrate. Two adjacent mounting positions are staggered in a horizontal direction. Multiple detection components are provided, each corresponding to a tray, to detect whether a substrate is placed on the corresponding tray; When there are other trays between the detection component and the corresponding tray, each tray between the two is provided with a clearance opening so that the detection component can pass through the clearance opening over the intermediate tray and the substrate placed on it to detect the corresponding tray.

2. The multilayer substrate storage device according to claim 1, characterized in that, The tray is provided with a detection port in the mounting position. The detection component includes a reflective sensor and a reflector. The reflective sensor is located above the plurality of trays, and the reflector is located at the lower end of the corresponding tray and covers the detection port.

3. The multilayer substrate storage device according to claim 1, characterized in that, The tray is provided with a detection port in the mounting position. The detection component includes a reflective sensor and a reflector. The reflective sensor is located below the plurality of trays, and the reflector is located at the bottom of the corresponding tray above the tray and covers the detection port.

4. The multilayer substrate storage device according to claim 2 or 3, characterized in that, When there are other trays between the detection component and the corresponding tray, the clearance openings of the other trays at least partially overlap with the horizontal projection of the detection port.

5. The multilayer substrate storage device according to claim 1, characterized in that, Some of the detection components are located above the plurality of trays, and some of the detection components are located below the plurality of trays.

6. The multilayer substrate storage device according to claim 1, characterized in that, Each pair of adjacent mounting positions is staggered by the same distance along the first direction.

7. The multilayer substrate storage device according to claim 1, characterized in that, Some of the detection components are spaced apart along the second direction.

8. The multilayer substrate storage device according to claim 1, characterized in that, The multilayer substrate storage device further includes a cavity, the interior of which defines a chamber, the tray is disposed within the chamber, and the signal transmitting end of the detection component is disposed outside the cavity.

9. The multilayer substrate storage device according to claim 8, characterized in that, The cavity is fitted with photoelectric glass at the position opposite the signal transmitting end.

10. A semiconductor manufacturing apparatus, characterized in that, Includes the multilayer substrate storage device as described in any one of claims 1 to 9.

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