A frame magazine of a semiconductor package carrier

Abstract

The utility model provides a kind of frame material box of semiconductor packaging carrier, including frame body, its inside hollow and four sides of front and back and left and right are all openwork;Several carriers, with the parallel array interval arrangement of frame body inside upper and lower surface of frame body, carrier surface is structured with open hole;At least two stop body, protrude and set in one end top surface of carrier;Slot, be equipped with on the side wall of the left and right two faces of frame body, the direction of slot opening is consistent with the extension direction of carrier, slot is matched with carrier to supply carrier to lie flat into the inside of frame body.The utility model frame body four sides openwork design, allow cleaning fluid or hot gas to flow freely from front and back and left and right four directions, improve the efficiency and uniformity of cleaning and drying, avoid dead angle, multiple carriers are arranged in array form with interval, can accommodate multiple carriers simultaneously, realize batch processing, improve operation efficiency, conducive to transfer batch carrier, reduce manual operation time.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically, it demonstrates a frame box for a semiconductor packaging carrier. Background Technology

[0002] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is diced into small wafers, and then the diced wafers are glued onto the corresponding lead frames. Then, ultra-fine metal wires or conductive resin are used to connect the bonding pads of the wafers to the corresponding pins of the substrate to form the required circuit. Then, the individual wafers are encapsulated and protected with a specific shell. After packaging, finished product testing is carried out. It usually goes through processes such as incoming inspection, testing, and packaging, and finally is stored and shipped.

[0003] After packaging, the long, rectangular carriers usually need to be cleaned and dried. Currently, this is done by personnel cleaning them one by one, which is not only difficult to clean thoroughly but also inefficient and not conducive to the baking and transfer of the carriers. Utility Model Content

[0004] The purpose of this invention is to provide a frame box for a semiconductor packaging carrier that is easy to use and improves operational efficiency.

[0005] The technical solution is as follows: A frame cassette for a semiconductor packaging carrier, comprising: The frame is hollow inside and has openwork on all four sides (front, back, left, and right). Several carriers are arranged in an array at intervals inside the frame, parallel to the top and bottom surfaces of the frame, and the surface of the carriers is perforated; At least two obstructions protrude from the top surface of one end of the carrier; The slots are located on the side walls of the left and right sides of the frame. The slots are opened in the same direction as the extension direction of the carrier. The slots match the carrier so that the carrier can be placed flat inside the frame.

[0006] In addition, the above embodiments of this utility model may also have the following additional technical features: According to one embodiment of this utility model, the left and right sides of the carrier are provided with mirror-symmetrical sealing bodies, and the top surface of the sealing bodies is provided with several slots, which are arranged side by side with the slots. The slots can serve as auxiliary fixing structures, working in conjunction with the slots to further restrict the position of the carrier, prevent the carrier from shaking or shifting during the cleaning process, and ensure that each carrier is in the optimal cleaning and drying position.

[0007] Based on the above scheme, the top surfaces of the left and right sides of the carrier are constructed as concave stepped surfaces, forming a height difference between the stepped surfaces and the middle surface of the carrier. The bottom surfaces of the slots and the card slots are flush with the stepped surfaces. The design of the carrier ensures that the edges of the carrier remain horizontal with the stepped surfaces when placed, avoiding tilting or instability, ensuring even force distribution on the carrier, and preventing damage.

[0008] According to one embodiment of this utility model, the front and rear ends of the carrier are both constructed with semi-circular notches. This facilitates the insertion of fingers / tools by operators or robotic arms, allowing for easy handling of the carrier and reducing operational difficulty and time.

[0009] According to one embodiment of this utility model, upper limit bodies are also provided on the side walls of the left and right sides of the frame, with a gap between the upper limit bodies and the carrier. This serves as a height limiting mechanism, ensuring that each carrier does not exceed its maximum height, which is beneficial for uniform washing and drying.

[0010] According to one embodiment of this utility model, the upper and lower surfaces of the frame are provided with a plurality of through holes. This increases ventilation and drainage channels on the upper and lower surfaces of the frame, improving cleaning and drying efficiency.

[0011] According to one embodiment of this utility model, both the frame and the carrier are made of Teflon. They can withstand the high temperatures during the drying process without deformation or degradation, thus extending the lifespan of the material box.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. The frame is designed with open sides, allowing cleaning fluid or hot air to flow freely from the front, back, left and right directions, reducing flow resistance and ensuring that the cleaning fluid can fully contact the surface of the carrier to rinse away residual contaminants. At the same time, the hot air can circulate evenly during drying, improving the efficiency and uniformity of cleaning and drying, and avoiding dead corners. 2. Multiple carriers are arranged in an array at intervals, which can accommodate multiple carriers (such as long strip carriers) at the same time, realize batch processing, improve work efficiency, facilitate the transfer of batch carriers, and reduce manual operation time; 3. The slot extends in the same direction as the carrier and matches the carrier, so that the carrier can smoothly and quickly put into and take out the frame, simplifying the operation steps and reducing the intensity of manual labor. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a frame box for a semiconductor packaging carrier according to Embodiment 1 of this utility model; Figure 2 for Figure 1 A diagram from another perspective; Figure 3 for Figure 1 The diagrams in the text refer to the sealing body and the upper limit body. Figure 4 This is a schematic diagram of a frame box for a semiconductor packaging carrier according to Embodiment 2 of this utility model; Figure 5 for Figure 4 The diagrams in the image show the relevant information about the slots and card slots. The relevant markings in the attached diagram are: 1-frame, 2-carrier, 3-block, 4-slot, 5-sealing, 6-upper limit body; 11-through hole, 21-cutout, 22-step surface, 23-notch groove, 51-slot. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Example 1 See Figure 1 and Figure 2 As shown in the figure, this utility model embodiment proposes a frame box for a semiconductor packaging carrier, including a hollow frame 1, and the frame 1 has a hollow design on all four sides (front, back, left, and right). That is to say, the frame structure can be composed of two plates and four pillars. The frame 1 has a cuboid structure. The hollow design of the frame 1 on all four sides can save materials and allow cleaning fluid or hot air to flow freely from the four directions, reducing flow resistance and ensuring that the cleaning fluid can fully contact the carrier surface to rinse away residual contaminants. At the same time, the hot air can circulate evenly during drying, improving the efficiency and uniformity of cleaning and drying, and avoiding dead corners.

[0016] Several carriers 2 are set inside the frame 1. These carriers 2 are parallel to the top and bottom surfaces of the frame 1 and are arranged in an array at intervals inside the frame 1. The surface of the carrier 2 is for the vehicle to be placed flat. Several perforations 21 are constructed on the surface of the carrier 2, and at least two blocks 3 are protruding from the top surface of one end of the carrier 2 to prevent the vehicle from accidentally sliding out from one side of the carrier.

[0017] Slots 4 are provided on the side walls of the left and right sides of the frame 1. The opening direction of the slots 4 is consistent with the length extension direction of the carrier 2. The carrier 2 matches the slots 4 on both sides so that the carrier can be inserted into the frame 1. Generally speaking, the width of the frame is designed to be slightly smaller than the width of the carrier, so that the two sides of the carrier can be locked in the slots. Of course, if the width of the carrier is smaller than the width of the frame, the carrier can also be placed on the surface of the carrier for use.

[0018] When in use, insert the carrier horizontally into the slot until the end of the carrier is restricted by the stop, and then the frame box can be transferred to realize batch carrier operation.

[0019] See Figure 1 As shown, semi-circular notches 23 are constructed in the middle of the front and rear sides of the carrier 2. On the one hand, this provides a user-friendly design, making it easy for operators or robotic arms to insert their fingers / tools, easily pick up and put down the carrier, reduce the difficulty and time of operation, and improve work efficiency; on the other hand, the notches increase the openness of the carrier edges, promote the circulation of cleaning fluid and air, reduce cleaning dead corners, and ensure cleaning effect.

[0020] See Figure 3 As shown, upper limit bodies 6 are also installed on the side walls of the left and right sides of the frame 1. The upper limit bodies 6 are adjacent to the baffles 3, and there is a gap between the upper limit bodies 6 and the surface of the carrier 2. The design of the upper limit bodies, as a height limiting mechanism, ensures that each carrier does not exceed the maximum height position, which is conducive to uniform cleaning and drying; the gap allows the cleaning fluid and drying gas to flow between the upper limit bodies and the carrier without affecting the overall flow efficiency, while providing a certain buffer space to prevent the carrier from colliding and being damaged by the upper limit bodies.

[0021] In this embodiment, the frame 1 has several through holes 11 on its upper and lower surfaces. These through holes provide ventilation and drainage channels, allowing liquid to drain quickly during cleaning and enabling hot air convection during drying, thus improving thermal efficiency. The through holes also reduce the weight of the frame, facilitating handling and relocation.

[0022] It should be noted that the frame 1, carrier 2 and other components in this embodiment are all made of Teflon material. This material can withstand the high temperature during the drying process without deformation or degradation, thereby extending the life of the material box. Overall, the Teflon material ensures the durability and reliability of the material box and reduces maintenance costs.

[0023] Example 2 The technical solution in this embodiment is based on the above embodiment 1.

[0024] See Figure 4 and Figure 5 As shown, mirror-symmetrical sealing bodies 5 are provided on the left and right sides of the carrier 2. Several slots 51 are arranged side by side on the top surface of the sealing body 5, and the slots 51 are parallel to the slots 4. The slots serve as auxiliary fixing structures, working in conjunction with the slots to further restrict the position of the carrier's sides, preventing the carrier from shaking or shifting during the cleaning process, and ensuring that each carrier is in the optimal cleaning and drying position.

[0025] The carrier 2 has concave stepped surfaces 22 on its left and right top surfaces, creating a height difference between the stepped surfaces 22 and the middle surface of the carrier 2. Furthermore, the bottom surfaces of the slots 4 and 51 are flush with the stepped surfaces 22. This means that the sides of the carrier pass through the slots and 51 sequentially before resting on the stepped surfaces, while the main body of the carrier rests in the middle. This design, which closely matches the carrier's structure, ensures that the edges of the carrier remain level with the stepped surfaces when placed, preventing tilting or instability, ensuring even force distribution on the carrier, and preventing damage.

[0026] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A frame box for a semiconductor packaging carrier, characterized in that, include: The frame (1) is hollow inside and has openwork on all four sides (front, back, left, and right). Several carriers (2) are arranged in an array at intervals inside the frame (1) parallel to the top and bottom surfaces of the frame (1), and the surface of the carriers (2) is constructed with perforations (21). At least two baffles (3) protrude from the top surface of one end of the carrier (2); Slots (4) are located on the side walls of the left and right sides of the frame (1). The opening direction of slots (4) is consistent with the extension direction of carrier (2). Slots (4) match carrier (2) so that the carrier can be placed flat inside the frame (1).

2. The frame box of a semiconductor packaging carrier according to claim 1, characterized in that, The carrier (2) has a mirror-symmetrical sealing body (5) on its left and right sides. The top surface of the sealing body (5) has several card slots (51) arranged side by side with the slot (4).

3. The frame box of a semiconductor packaging carrier according to claim 2, characterized in that, The top surface of the left and right sides of the carrier (2) is a concave step surface (22). The step surface (22) and the middle surface of the carrier (2) form a height difference. The bottom surface of the slot (4) and the bottom surface of the card slot (51) are flush with the step surface (22).

4. The frame box of a semiconductor packaging carrier according to claim 1, characterized in that, The front and rear ends of the carrier (2) are both constructed with semi-circular notches (23).

5. The frame box of a semiconductor packaging carrier according to claim 1, characterized in that, Upper limit bodies (6) are also provided on the side walls of the left and right sides of the frame (1), and there is a gap between the upper limit bodies (6) and the carrier (2).

6. The frame box of a semiconductor packaging carrier according to claim 1, characterized in that, The frame (1) has several through holes (11) on its upper and lower surfaces.

7. The frame box of a semiconductor packaging carrier according to claim 1, characterized in that, The frame (1) and carrier (2) are both made of Teflon.

Images