Anti-static composite carrier tape for chip-on-board components

Abstract

The utility model relates to the composite carrier tape field's embedded type guide chip element's anti -static composite carrier tape, including long strip's base tape layer and cover layer, the base tape layer is equipped with the recess along its length direction, the bottom surface of base tape layer is provided with the functional layer, the functional layer is by insulating film and conductive film lamination and is constituted, the conductive film forms a layer continuous static electricity guide discharge network in the functional layer inside, the recess is provided with the embedded guide piece for carrying out positioning and embedding to its pin after putting in the chip element, the bottom of embedded guide piece extends and forms conductive contact portion penetrating the base tape layer, the conductive film is provided with the lead -in point in the position corresponding to each conductive contact portion, and the conductive contact portion and lead -in point physical contact and electrically connected, the edge of base tape layer is provided with a plurality of guide holes at equal intervals, and the conductive film is communicated with the inboard of guide hole, breaks the passive protection mode of only relying on the anti -static coating of the existing carrier tape, realizes the initiative of guiding out static.

Description

Technical Field

[0001] This utility model relates to the field of composite carrier tapes, and in particular to antistatic composite carrier tapes for embedded conductive chip elements. Background Technology

[0002] In the production, transportation, and storage of semiconductor chips, composite carrier tapes serve as crucial packaging and carrier components, playing a vital role in protecting chip components from physical damage and maintaining their cleanliness and electrical performance stability. With the continuous increase in chip integration, the growing number of pins, and the increasingly precise spacing, higher demands are placed on the protective performance and adaptability of carrier tapes. Composite carrier tapes typically consist of a baseband layer and a cover layer. Grooves are created in the baseband layer to accommodate and fix the chip components, while the cover layer forms a sealed space after packaging, isolating the chip from external environmental factors such as dust and moisture. This ensures that the chip remains in a stable storage state throughout the process, making it a core packaging carrier connecting production, testing, and assembly stages in the chip industry chain.

[0003] Existing carrier tape anti-static designs mostly rely on the surface anti-static coating of the baseband layer or cover layer, which is a passive anti-static solution. It can only suppress the accumulation of static charge on the carrier tape itself, but cannot effectively discharge static electricity generated by chip components, especially their pins. When the chip pins rub or come into contact with the inner wall of the carrier tape groove, static charge is easy to accumulate at the pins, which may break down the precision circuits inside the chip and cause irreversible electrical damage. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides an antistatic composite carrier tape for embedded conductive chip elements, which can effectively solve the technical problem of static electricity not being able to be discharged after it is generated.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] An antistatic composite carrier tape for embedded conductive chip components includes a long strip-shaped base layer and a cover layer. The base layer has multiple grooves spaced apart along its length to accommodate chip components. The cover layer is heat-sealed onto the upper surface of the base layer to seal the openings of the grooves. A functional layer is provided on the bottom surface of the base layer. The functional layer is composed of an insulating film and a conductive film stacked together. The conductive film forms a continuous electrostatic discharge network inside the functional layer. An embedded guide plate is provided in the groove for positioning and embedding the pins of the chip component after it is placed in. Its shape matches the pin shape of the chip component to be accommodated. The bottom of the embedded guide plate extends downward through the base layer to form a conductive contact. The conductive film has a conductive point at the position corresponding to each conductive contact. The conductive contact and the conductive point are in physical contact and electrically connected. Several guide holes are provided at equal intervals along the edge of the base layer. The conductive film communicates with the inside of the guide holes.

[0007] Furthermore, the functional layer is provided with conductive wings at its edge, which extend to the inside of the guide hole. The conductive film is in physical contact with and electrically connected to the conductive wings.

[0008] Furthermore, the end of the conductive contact portion is electrically connected to the conductive film's contact point by hot pressing or conductive adhesive.

[0009] Furthermore, the conductive film is a metal foil or a carbon-based conductive ink printing layer.

[0010] Furthermore, a reinforcing layer is laminated on the upper surface of the base layer, which is composed of multiple bundles of high-strength fiber yarns arranged parallel to each other along the length of the base layer.

[0011] Furthermore, the covering layer is provided with a positioning part corresponding to the groove opening, and the positioning part is a hollow buffer cavity.

[0012] Furthermore, the bottom surface of the groove is provided with an upwardly protruding shock-absorbing support strip.

[0013] Compared with existing technologies, the beneficial effects of this invention are as follows: It constructs an active, full-path anti-static protection system, transforming chip pins into the starting point of the anti-static system. By establishing a direct connection between the chip pins and the anti-static system through interlocking contacts, it provides an initial conduction node for the discharge of static charge. This breaks the passive protection mode of existing carrier tapes that rely solely on their own anti-static coating, achieving active static discharge. The conductive film forms a continuous network structure within the functional layer, ensuring that static charge can be conducted quickly and uniformly in the discharge network, avoiding local static charge accumulation. Compared with the discrete conductive areas in existing carrier tapes, the continuous static discharge network significantly improves the efficiency and stability of static charge conduction, ensuring the continuity and reliability of the discharge process. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present utility model;

[0015] Figure 2 This is an exploded view of the present invention;

[0016] Figure 3 This is a schematic diagram of the present invention after the chip has been placed;

[0017] Figure 4 This is a schematic diagram of the insulating film and the conductive film in this utility model;

[0018] Figure 5 This is a schematic diagram of the guide hole and conductive wing in this utility model;

[0019] The numbers in the diagram are: 1-base layer, 2-groove, 201-shock-absorbing support strip, 3-covering layer, 301-positioning part, 302-buffer cavity, 4-insulating film, 5-conductive film, 6-interlocking guide plate, 601-conductive contact part, 7-guide hole, 8-conductive wing. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] The following is combined Figures 1-5 The antistatic composite carrier tape for the embedded conductive chip element of this utility model is described in detail below:

[0022] An antistatic composite carrier tape for embedded conductive chip components includes a long strip-shaped base layer 1 and a cover layer 3. The base layer 1 has multiple grooves 2 spaced apart along its length to accommodate chip components. The cover layer 3 is heat-sealed onto the upper surface of the base layer 1 to close the openings of the grooves 2. A functional layer is provided on the bottom surface of the base layer 1. The functional layer is composed of an insulating film 4 and a conductive film 5 stacked together. The conductive film 5 forms a continuous electrostatic discharge network inside the functional layer. An embedded guide plate 6 is provided in the groove 2 for positioning and embedding the pins of the chip component after it is placed in. Its shape matches the pin shape of the chip component to be accommodated. The bottom of the embedded guide plate 6 extends downward through the base layer 1 to form a conductive contact 601. The conductive film 5 has a conductive point at the position corresponding to each conductive contact 601. The conductive contact 601 is in physical contact with the conductive point and is electrically connected. A number of guide holes 7 are provided at equal intervals along the edge of the base layer 1. The conductive film 5 communicates with the inner side of the guide holes 7.

[0023] An active, end-to-end anti-static protection system was constructed. By setting up a mating conductive plate 6, the chip pins are cleverly transformed into the starting point of the anti-static system while achieving precise positioning and fixation. The shape of the mating conductive plate 6 precisely matches the shape of the chip component pins. When the chip is placed in the groove 2, the mating conductive plate 6 can form a tight mating with the pins. This not only effectively limits the displacement of the chip within the groove 2, avoiding scratch damage between the pins and the inner wall of the groove 2 during transportation, and ensuring the integrity and electrical performance of the pin plating, but also establishes a direct connection between the chip pins and the anti-static system through the mating contact, providing an initial conduction node for the discharge of static charge. This breaks the passive protection mode of the existing carrier tape that relies solely on its own anti-static coating, realizing a transformation from passive anti-static to active anti-static.

[0024] The bottom of the embedded conductive chip 6 extends downward and penetrates the conductive contact 601 formed by the baseband layer 1, forming a reliable physical contact and electrical connection with the electrostatic discharge network composed of the conductive thin film 5 inside the functional layer. This establishes an intermediate conduction path for static charge from the chip pins to the electrostatic discharge network. The conductive thin film 5 forms a continuous network structure inside the functional layer, ensuring that static charge can be conducted quickly and uniformly in the discharge network, avoiding local static charge accumulation. Compared with the discrete conductive areas in existing carrier tapes, the continuous electrostatic discharge network significantly improves the efficiency and stability of static charge conduction, ensuring the continuity and reliability of the discharge process.

[0025] The conductive film 5 in the functional layer is connected to the inner side of the guide hole 7 at the edge of the baseband layer 1, providing a final grounding path for electrostatic discharge. During the use of the carrier tape, the guide hole 7 cooperates with the guide shaft of the automated equipment to achieve precise transport of the carrier tape. The connection between the conductive film 5 and the inner side of the guide hole 7 allows the static charge in the electrostatic discharge network to be transferred to the guide shaft through the guide hole 7, and then conducted to the grounding system of the automated equipment, and finally guided to the ground, forming a complete electrostatic discharge path from the chip pins, the embedded guide plate 6, the conductive contact 601, the electrostatic discharge network, the guide hole 7, the external grounding equipment, and the ground. This full-path anti-static system achieves active capture, efficient conduction, and thorough discharge of static electricity from the chip, fundamentally eliminating the risk of static charge accumulation at the chip pins, effectively protecting the electrical performance stability of the precision circuits inside the chip, and ensuring the structural integrity of the chip during the transfer process through the positioning function of the embedded guide plate 6, significantly improving the overall protection capability and practical value of the carrier tape.

[0026] The functional layer is provided with conductive wing edges 8, which extend to the inner side of the guide hole 7. The conductive film 5 is in physical contact with and electrically connected to the conductive wing edges 8. The conductive wing edges 8 can extend to the inner side of the guide hole 7 more precisely and form a larger contact area with the hole wall, reducing contact resistance and ensuring no loss of static charge during conduction. On the other hand, the structural strength of the conductive wing edges 8 is higher than that of the conductive film 5, which can prevent damage to the connection between the conductive film 5 and the guide hole 7 due to friction and compression between the guide shaft and the guide hole 7 during long-term transport of the carrier tape. This ensures the long-term integrity of the static discharge path and enhances the stability and durability of the whole-path anti-static system.

[0027] The end of the conductive contact 601 is electrically connected to the conductive contact point of the conductive film 5 via hot pressing or conductive adhesive. Hot pressing ensures a tight fit between the conductive contact 601 and the contact point, eliminating contact gaps and forming a stable electrical connection. Using conductive adhesive creates a conductive dielectric layer at the interface, filling tiny gaps and fixing the relative position of the conductive contact 601 and the contact point through adhesion, preventing loosening due to vibration during transport or use. Both connection methods ensure a reliable electrical connection between the conductive contact 601 and the contact point, allowing static charge to be quickly transferred from the chip pins through the embedded conductive piece 6 to the electrostatic discharge network of the conductive film 5, preventing static charge accumulation between the conductive contact 601 and the contact point and improving the discharge efficiency of the anti-static system. Either connection method can be selected based on the specific application.

[0028] The conductive film 5 can be a metal foil or a carbon-based conductive ink printing layer. Metal foils, such as copper foil and aluminum foil, have extremely low resistivity and excellent conductivity, enabling rapid conduction of static charges. This makes them suitable for high-precision chips with extremely high anti-static requirements, ensuring that static charges generated at chip pins are discharged instantly, minimizing the risk of electrostatic damage. Carbon-based conductive ink printing layers, on the other hand, offer advantages such as low cost, good flexibility, and ease of large-area printing. They can form a continuous conductive network on the surface of the insulating film 4 through printing processes, making them suitable for scenarios with moderate anti-static requirements and sensitivity to carrier tape costs. Both materials can meet the core requirement of forming a continuous electrostatic discharge network in the conductive film 5, and can be flexibly selected based on chip type, protection level, and production cost budget.

[0029] The upper surface of the baseband layer 1 is laminated with a reinforcing layer, which is composed of multiple bundles of high-strength fiber yarns arranged parallel to each other along the length of the baseband layer 1. This reinforcing layer significantly improves the tensile and bending strength of the baseband layer 1, effectively suppresses deformation of the baseband layer 1 during transport, ensures that the groove 2 maintains a stable shape and size, and prevents the mating relationship between the interlocking guide 6 and the chip pins from loosening due to deformation of the baseband layer 1, thus ensuring the structural stability of the anti-static system. The composite structure of the reinforcing layer does not increase the thickness of the baseband layer 1 excessively, taking into account the thinness of the carrier tape and not affecting its normal use in automated equipment.

[0030] The cover layer 3 is provided with a positioning part 301 corresponding to the opening of the groove 2. The positioning part 301 has a hollow buffer cavity 302 inside, which limits the top of the chip and realizes dual positioning of the chip in the vertical direction, preventing the chip from moving up and down in the groove 2. The hollow buffer cavity 302 inside the positioning part 301 has good elastic deformation capability. When an external impact is applied to the cover layer 3, the buffer cavity 302 can absorb the impact energy through its own deformation, reducing the impact force transmitted to the chip. In particular, it can protect the precision circuit or packaging structure on the top of the chip and prevent the electrical performance of the chip from being damaged due to impact.

[0031] The bottom surface of the groove 2 is provided with an upwardly protruding shock-absorbing support strip 201, which reduces the contact area between the chip and the bottom surface of the groove 2, reduces the static charge generated by friction, and the shock-absorbing support strip 201 is elastic and can undergo slight deformation during vibration to absorb vibration energy, reduce the vibration amplitude of the chip, and prevent the chip from loosening the engagement relationship between the pins and the mating guide 6 due to severe vibration, thus ensuring the stability of the anti-static system.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An antistatic composite carrier tape for embedded conductive chip components, comprising a strip-shaped base layer and a cover layer, wherein the base layer has a plurality of grooves spaced apart along its length for accommodating chip components, and the cover layer is heat-sealed to the upper surface of the base layer to seal the openings of the grooves, characterized in that: The bottom surface of the baseband layer is provided with a functional layer, which is composed of an insulating film and a conductive film stacked together. The conductive film forms a continuous electrostatic discharge network inside the functional layer. A fitting guide is provided in the groove for positioning and fitting the pins of the chip element after it is placed in. Its shape matches the pin shape of the chip element to be accommodated. The bottom of the fitting guide extends downward through the baseband layer and forms a conductive contact. The conductive film is provided with a conductive point at the position corresponding to each conductive contact. The conductive contact and the conductive point are in physical contact and electrically connected. Several guide holes are provided at equal intervals along the edge of the baseband layer. The conductive film communicates with the inside of the guide holes.

2. The anti-static composite tape carrier for a chip-on-board component according to claim 1, wherein: The functional layer is provided with a conductive wing at its edge, which extends to the inside of the guide hole. The conductive film is in physical contact with and electrically connected to the conductive wing.

3. The anti-static composite tape carrier for a chip-on-board component according to claim 1, wherein: The end of the conductive contact portion is electrically connected to the conductive film's conductive point through hot pressing or conductive adhesive.

4. The anti-static composite tape carrier for a chip-on-board component according to any one of claims 1 to 3, wherein: The conductive film is a metal foil or a carbon-based conductive ink printing layer.

5. The anti-static composite tape carrier for a chip-on-board component according to any one of claims 1 to 3, wherein: The upper surface of the base layer is coated with a reinforcing layer, which is composed of multiple bundles of high-strength fiber yarns arranged parallel to each other along the length of the base layer.

6. The anti-static composite tape carrier for a chip-on-board component according to any one of claims 1 to 3, wherein: The covering layer is provided with a positioning part corresponding to the groove opening, and the positioning part is a hollow buffer cavity.

7. The anti-static composite tape carrier for a chip-on-board component according to any one of claims 1 to 3, wherein: The bottom surface of the groove is provided with an upwardly protruding shock-absorbing support strip.

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