A semiconductor frame basket assembly

Abstract

The utility model relates to a kind of semiconductor frame basket assembly, the basket assembly includes basket, the basket is metal basket;Several encapsulated semiconductor frames are stacked and placed in basket, for semiconductor frame group;The basket assembly further includes briquetting;The briquetting is placed in basket, and is pressed on semiconductor frame group. It is reasonable in design, simple structure, and the pressure is exerted to several encapsulated semiconductor frames stacked and placed in basket, effectively prevent the edge warping of encapsulated semiconductor frame in natural cooling process.

Description

Technical Field

[0001] This utility model relates to semiconductors, specifically to a semiconductor frame basket assembly. Background Technology

[0002] The encapsulated (molded) semiconductor frame is placed in a basket and allowed to cool naturally before being transferred to the lead-cutting process. During the natural cooling process, the encapsulated (molded) semiconductor frame may warp due to stress. Utility Model Content

[0003] In view of the above problems, the present invention relates to a semiconductor frame basket assembly.

[0004] The technical solution of this utility model: A semiconductor frame basket assembly includes a basket, which is a metal basket; a plurality of packaged semiconductor frames are stacked inside the basket to form a semiconductor frame group; the basket assembly also includes a pressure block; the pressure block is placed inside the basket and presses against the semiconductor frame group.

[0005] Further refining the above technical solution, the semiconductor frame is a square frame, and the basket is a square basket that matches the semiconductor frame. The basket is composed of a front plate, a rear plate, a left plate, a right plate, and a bottom plate connected together. The front plate of the basket has an open middle section, and the upper part of the rear plate of the basket has a square hole in the center, which is a handle. The lower part of the rear plate of the basket has several heat dissipation holes.

[0006] Further refining the above technical solution, the basket assembly also includes an auxiliary pressure plate; the auxiliary pressure plate is placed inside the basket and padded on the semiconductor frame assembly, and the auxiliary pressure plate fully covers the semiconductor frame assembly.

[0007] To further refine the above technical solution, the auxiliary pressure plate consists of two half-plates; the two half-plates are respectively installed on the left and right plates of the basket.

[0008] To further refine the above technical solution, a notch is provided in the middle of the left and right plates of the basket, and sliding grooves are provided on both sides of the notch. Guide posts are provided on the upper and lower sides of the half plate, and the guide posts are placed in the sliding grooves, which are open.

[0009] To further refine the above technical solution, a handle is provided on the main body of the pressing block, facilitating its movement.

[0010] The advantages of this invention are that it is reasonably designed and has a simple structure. It applies pressure to several packaged semiconductor frames stacked in a basket, which effectively prevents the packaged semiconductor frames from warping during the natural cooling process. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the semiconductor frame basket assembly structure.

[0012] Figure 2 It is a 3D model of a basket.

[0013] Figure 3 It is a 3D diagram of the pressed block.

[0014] The diagram shows a semiconductor frame 1, a basket 2, a front plate 2-1, a rear plate 2-2, a left plate 2-3, a right plate 2-4, a bottom plate 2-5, a handle 2-6, a pressure block 3, a handle 3-1, an auxiliary pressure plate 4, and a half plate 4-1. Detailed Implementation

[0015] Semiconductor frame 1 is a square frame; like Figure 1-3 As shown, a semiconductor frame basket assembly includes a basket 2, a pressure block 3, and an auxiliary pressure plate 4. The basket 2 is a metal basket and is a square basket that matches the semiconductor frame 1. The basket 2 is composed of a front plate 2-1, a rear plate 2-2, a left plate 2-3, a right plate 2-4, and a bottom plate 2-5 connected together. The front plate 2-1 of the basket has an open middle opening, and the upper part of the rear plate 2-2 of the basket has a square hole in the center, which is the handle part 2-6. Several heat dissipation holes are distributed in the lower part of the rear plate 2-2 of the basket. The pressure block 3 has a handle 3-1 on its main body. The auxiliary pressure plate 4 is composed of two half plates 4-1. The two half plates 4-1 are respectively installed on the left plate 2-3 and the right plate 2-4 of the basket. The left plate 2-3 and the right plate 2-4 of the basket have a notch in the middle, and the notch has a sliding groove on both sides. The half plates 4-1 have guide posts on the upper and lower sides, which are placed in the sliding grooves and have openings. In use, several semiconductor frames 1 are stacked on the basket 2 to form a semiconductor frame group. The two half plates 4-1 are pulled upward to move them upward. When the guide posts on both sides of the two half plates 4-1 exit the slide groove, the two half plates 4-1 are flipped inward to form an auxiliary pressure plate 4. The auxiliary pressure plate 4 is placed on the semiconductor frame group to fully cover the semiconductor frame group. The pressure block 2 is placed on the auxiliary pressure plate 4 and pressure is applied.

[0016] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A semiconductor frame basket assembly, the basket assembly comprising a basket, the basket being a metal basket; and a plurality of packaged semiconductor frames stacked within the basket to form a semiconductor frame assembly; characterized in that, The basket assembly also includes a pressure block; the pressure block is placed inside the basket and presses against the semiconductor frame assembly.

2. A semiconductor frame basket assembly as claimed in claim 1, wherein, The semiconductor frame is a square frame, and the basket is a square basket that matches the semiconductor frame. The basket is composed of a front plate, a rear plate, a left plate, a right plate, and a bottom plate connected together. The front plate of the basket has an open middle section, and the upper part of the rear plate of the basket has a square hole in the center, which is the handle. The lower part of the rear plate of the basket has several heat dissipation holes.

3. The semiconductor frame basket assembly of claim 1, wherein, The basket assembly also includes an auxiliary pressure plate; the auxiliary pressure plate is placed inside the basket and padded on the semiconductor frame assembly, and the auxiliary pressure plate fully covers the semiconductor frame assembly.

4. A semiconductor frame basket assembly as claimed in claim 3, wherein, The auxiliary pressure plate consists of two half-plates; the two half-plates are respectively installed on the left and right plates of the basket.

5. A semiconductor frame basket assembly as claimed in claim 4, wherein, The basket has a notch in the middle of the left and right plates, and a sliding groove on both sides of the notch. Guide posts are provided on the upper and lower sides of the half plate, and the guide posts are placed in the sliding groove. The sliding groove has an opening.

6. The semiconductor frame basket assembly of claim 1, wherein, The main body of the pressing block is equipped with a handle.

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