Water flow based slicing type silicon wafer loading mechanism

Abstract

This utility model discloses a water-flow-based silicon wafer slicing mechanism, including a feeding frame, a feeding conveyor belt mounted on top of the frame, and a robotic arm. A stainless steel microporous mesh belt is fixedly installed on the inner wall of the feeding frame, located on the right side of the feeding conveyor belt. This utility model achieves non-destructive slicing of stacked silicon wafers through real-time monitoring by an industrial camera and precise positioning by an infrared sensor. During operation, the processor precisely controls the operation of the slicing structure based on image data acquired by the industrial camera, adjusting the nozzle position. The flexible contact characteristics of the high-pressure water flow completely avoid edge damage to the silicon wafers that may be caused by mechanical slicing, making it particularly suitable for processing ultra-thin silicon wafers. Furthermore, the flat nozzle can intelligently adjust the spray angle and pressure for different stacking states, ensuring stable and reliable slicing results. Finally, the stainless steel microporous mesh belt and water collection tank form a closed-loop water circulation system, ensuring both slicing efficiency and efficient water resource utilization.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and more specifically, to a silicon wafer feeding mechanism based on water flow slicing. Background Technology

[0002] In the silicon wafer processing of semiconductor manufacturing and the photovoltaic industry, automated wafer loading and slitting are crucial production steps. Traditional silicon wafer slitting methods mainly employ mechanical clamping or pneumatic separation technology. These methods have significant limitations in practical applications: mechanical clamping easily creates stress concentration at the edges of the silicon wafer, leading to microcracks or edge chipping; pneumatic separation can cause wafer breakage due to uneven adsorption forces, especially when processing ultra-thin silicon wafers. In addition, existing technologies have limited separation precision for multilayer silicon wafers, making it difficult to adapt to the flexible production needs of silicon wafers of different thicknesses and sizes.

[0003] As semiconductor devices become increasingly miniaturized and silicon wafer thickness continues to decrease, traditional slicing methods can no longer meet the current industry's requirements for high-precision, low-damage slicing processes. Although some improved technologies have been developed, such as vibration separation or electrostatic separation, these solutions either have low separation efficiency, complex equipment structures, high maintenance costs, and cannot guarantee stable slicing quality. Utility Model Content

[0004] The purpose of this invention is to provide a water-flow slicing silicon wafer feeding mechanism to solve the related problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution;

[0006] A water-flow slicing silicon wafer loading mechanism includes a loading frame and a loading conveyor belt and a robotic arm mounted on top of it. A stainless steel micro-perforated mesh belt is fixedly installed on the inner wall of the loading frame, located on the right side of the loading conveyor belt. A gantry frame is fixedly installed on the loading frame, and a slicing structure is set on the gantry frame. An industrial camera, a storage module, a signal transmission module, and a processor are fixedly installed on the gantry frame. The slicing structure, industrial camera, storage module, and signal transmission module are all connected to the processor. The industrial camera is used to acquire image data of the bottom overlapping silicon wafer group and transmit the data to the processor. The processor compares the acquired image data with the data in the storage module to determine the slicing status and control the opening and closing of the slicing structure.

[0007] The segmented structure includes an assembly frame mounted on the front of the gantry frame. A load-bearing frame is slidably mounted on the inner wall of the assembly frame. An electric push rod is fixedly mounted on the back of the assembly frame. The output shaft of the electric push rod passes through the assembly frame and is mounted on the load-bearing frame. A liquid pump is fixedly mounted on the load-bearing frame. Evenly distributed flat nozzles are rotatably connected to the back of the load-bearing frame. Evenly distributed drive motors are fixedly mounted on the load-bearing frame. The output shaft of the drive motors is connected to the flat nozzles. A diversion box is fixedly mounted on the load-bearing frame. The diversion box is connected to the liquid pump through a pipe. Evenly distributed diversion hoses are fixedly mounted on the diversion box. The other end of the diversion hoses is connected to the flat nozzles. The electric push rod, the liquid pump, and the drive motors are all signal-connected to a processor. The processor controls the opening and closing of the liquid pump, the drive motor, and the electric push rod according to the background settings.

[0008] As a further description of the above technical solution: an infrared sensor is fixedly installed on the gantry frame. The infrared sensor is connected to the processor and is used to sense the position of the overlapping silicon wafers and transmit the signal to the processor.

[0009] As a further description of the above technical solution: a water collection tank is fixedly installed on the inner wall of the feeding frame, and the water collection tank is located at the bottom of the stainless steel microporous mesh belt.

[0010] As a further description of the above technical solution: a pulsed DC ionization rod is fixedly installed on the top of the feeding frame, and the pulsed DC ionization rod is located on the top of the stainless steel microporous mesh belt.

[0011] As a further description of the above technical solution: a vacuum adsorption suction cup is fixedly installed on the inner wall of the feeding frame, the vacuum adsorption suction cup is located inside the stainless steel microporous mesh belt, and the vacuum adsorption suction cup is connected to the processor via signal.

[0012] As a further description of the above technical solution: two guide rods are fixedly installed on the feeding frame, and the guide rods are installed on the top of the feeding frame by bolts and are in an adjustable state.

[0013] Compared with existing technologies, the advantages of this utility model are:

[0014] In this invention, real-time monitoring by an industrial camera and precise positioning by an infrared sensor enable non-destructive slicing of silicon wafers. During operation, the processor precisely controls the operation of the slicing structure and adjusts the nozzle position based on the image data collected by the industrial camera. The flexible contact characteristics of the high-pressure water flow completely avoid edge damage to the silicon wafers that may be caused by mechanical slicing, making it particularly suitable for processing ultra-thin silicon wafers. Secondly, the flat nozzle can intelligently adjust the spray angle and pressure for different stacking states to ensure stable and reliable slicing results. Furthermore, the combination of a stainless steel microporous mesh belt and a water collection tank forms a closed-loop water circulation system, which not only ensures slicing efficiency but also achieves efficient utilization of water resources. Attached Figure Description

[0015] Figure 1 This is a top view of the structure of this utility model;

[0016] Figure 2 This is a side sectional view of the present invention.

[0017] Figure 3 This is a side sectional view of the segmented structure of this utility model;

[0018] Figure 4 This is a three-dimensional structural diagram of the load-bearing frame of this utility model;

[0019] Figure 5 This is a schematic diagram illustrating the principle of this utility model.

[0020] Explanation of the labels in the diagram:

[0021] 1. Feeding frame; 2. Feeding conveyor belt; 3. Robotic arm; 4. Stainless steel microporous mesh belt; 5. Gantry frame; 6. Segmented structure; 601. Assembly frame; 602. Bearing frame; 603. Electric push rod; 604. Liquid pump; 605. Flat nozzle; 606. Drive motor; 607. Diverter box; 7. Industrial camera; 8. Storage module; 9. Signal transmission module; 10. Processor; 11. Infrared sensor; 12. Water collection tank; 13. Pulsed DC ionization rod; 14. Vacuum suction cup; 15. Guide rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model;

[0023] Please see Figures 1-5In this utility model, the silicon wafer feeding mechanism based on water flow slicing includes a feeding frame 1, a feeding conveyor belt 2 and a robot arm 3 installed on top of it. A stainless steel micro-perforated mesh belt 4 is fixedly installed on the inner wall of the feeding frame 1. The stainless steel micro-perforated mesh belt 4 is located on the right side of the feeding conveyor belt 2. A gantry frame 5 is fixedly installed on the feeding frame 1. A slicing structure 6 is set on the gantry frame 5. An industrial camera 7, a storage module 8, a signal transmission module 9 and a processor 10 are fixedly installed on the gantry frame 5. The slicing structure 6, the industrial camera 7, the storage module 8 and the signal transmission module 9 are all connected to the processor 10. The industrial camera 7 is used to acquire image data of the bottom overlapping silicon wafer group and transmit the data to the processor 10. The processor 10 compares the acquired image data with the data in the storage module 8 to determine the slicing status and control the opening and closing of the slicing structure 6. Other compatible sensors can be added to the position of the industrial camera 7 to better realize this function.

[0024] The segmented structure 6 includes an assembly frame 601, which is mounted on the front of the gantry frame 5. A load-bearing frame 602 is slidably mounted on the inner wall of the assembly frame 601. An electric push rod 603 is fixedly mounted on the back of the assembly frame 601. The output shaft of the electric push rod 603 passes through the assembly frame 601 and is mounted on the load-bearing frame 602. A liquid pump 604 is fixedly mounted on the load-bearing frame 602. Evenly distributed flat nozzles 605 are rotatably connected to the back of the load-bearing frame 602. Evenly distributed drive motors 606 are fixedly mounted on the load-bearing frame 602. The output shaft of motor 606 is connected to flat nozzle 605. A diversion box 607 is fixedly installed on the support frame 602. The diversion box 607 is connected to the liquid pump 604 through a pipe. A uniformly distributed diversion hose is fixedly installed on the diversion box 607. The other end of the diversion hose is connected to flat nozzle 605. Electric push rod 603, liquid pump 604 and drive motor 606 are all connected to processor 10. The processor 10 controls the opening and closing of liquid pump 604, drive motor 606 and electric push rod 603 according to the background settings. Liquid pump 604 is connected to an external water pipe.

[0025] An infrared sensor 11 is fixedly installed on the gantry frame 5. The infrared sensor 11 is connected to the processor 10. The infrared sensor 11 is used to sense the position of the overlapping silicon wafers and transmit the signal to the processor 10.

[0026] A pulsed DC ionization rod 13 is fixedly installed on the top of the feeding frame 1, and the pulsed DC ionization rod 13 is located on the top of the stainless steel microporous mesh belt 4; a vacuum adsorption suction cup 14 is fixedly installed on the inner wall of the feeding frame 1, and the vacuum adsorption suction cup 14 is located inside the stainless steel microporous mesh belt 4, and the vacuum adsorption suction cup 14 is connected to the processor 10 via signal.

[0027] When silicon wafer loading and slitting operations are required, the loading conveyor belt 2 transports the vertically stacked silicon wafer group to the right to the working position of the robot arm 3. The robot arm 3 grabs the silicon wafer group and transfers it to the top of the stainless steel microporous mesh belt 4, so that the silicon wafer group is located below the gantry frame 5. At this time, the infrared sensor 11 detects the position signal of the silicon wafer group and transmits the data to the processor 10 for positioning calibration.

[0028] The industrial camera 7 captures image data of the silicon wafer assembly in real time and transmits the data to the processor 10. The processor 10 compares the acquired image data with preset parameters in the storage module 8, such as the silicon wafer edge spacing and stacking thickness, calculates the current wafer slab status, and controls the slab structure 6 to start.

[0029] The processor 10 controls the electric push rod 603 to push the support frame 602 to slide along the assembly frame 601, so that the flat nozzle 605 is precisely aligned with the edge of the silicon wafer stack. The drive motor 606 adjusts the spray angle of the flat nozzle 605 according to the silicon wafer stack shape to ensure that the water flow cuts into the gap between the silicon wafers at the optimal incident angle. The liquid pump 604 is started, and the external water flow is evenly distributed to each flat nozzle 605 through the distribution box 607 to form a high-pressure flat water curtain jet. The water flow cuts into the gap from the side of the silicon wafer stack and uses the principle of fluid dynamics to separate the adhered silicon wafers. At the same time, the vacuum suction cup 14 is started to adsorb the bottom silicon wafer to stabilize the wafer separation process.

[0030] The industrial camera 7 continuously acquires images of the silicon wafers after slicing, and the processor 10 analyzes the slicing effect in real time. If residual adhesion is detected, the water pressure or nozzle angle is adjusted to perform secondary slicing. After slicing, the silicon wafers are conveyed to the right by the stainless steel microporous mesh belt 4 and enter the subsequent wafer insertion process.

[0031] The permeable design of the stainless steel microporous mesh belt 4 ensures that residual moisture in the wafers is quickly discharged, while the pulsed DC ionization rod 13 can eliminate electrostatic interference and prevent secondary adsorption of silicon wafers.

[0032] In this invention, real-time monitoring by an industrial camera 7 and precise positioning by an infrared sensor 11 enable non-destructive slicing of silicon wafer stacks. During operation, the processor 10 precisely controls the operation of the slicing structure 6 based on the image data collected by the industrial camera 7, adjusting the nozzle position. The flexible contact characteristics of the high-pressure water flow completely avoid edge damage to the silicon wafers that may be caused by mechanical slicing, making it particularly suitable for processing ultra-thin silicon wafers. Furthermore, the flat nozzle 605 can intelligently adjust the spray angle and pressure for different stacking states to ensure stable and reliable slicing results. In addition, the stainless steel microporous mesh belt 4 and the water collection tank 12 form a closed-loop water circulation system, which not only ensures slicing efficiency but also achieves efficient utilization of water resources.

[0033] Please see Figure 1 and 2The water collection tank 12 is fixedly installed on the inner wall of the feeding frame 1, and the water collection tank 12 is located at the bottom of the stainless steel microporous mesh belt 4.

[0034] In this invention, the water collection tank 12 is fixedly installed at the bottom of the stainless steel microporous mesh belt 4, which can efficiently collect the water flow during silicon wafer slicing, realizing the recycling and reuse of water resources. This design not only reduces water waste but also prevents water droplets from splashing and contaminating the equipment, ensuring a clean working environment. The cooperation between the water collection tank 12 and the stainless steel microporous mesh belt 4 allows wastewater after slicing to be discharged quickly, avoiding residual water stains from affecting subsequent silicon wafer processing.

[0035] Please see Figure 1 Two guide rods 15 are fixedly installed on the feeding frame 1. The guide rods 15 are bolted to the top of the feeding frame 1 and are in an adjustable state.

[0036] In this invention, the spacing of the guide rods 15 can be flexibly adjusted according to the size of silicon wafers of different specifications, ensuring accurate positioning of the silicon wafers during transmission and avoiding offset or jamming. After adjustment, the bolt locking structure can maintain guiding stability, adapt to diverse production needs, and improve the versatility and adaptability of the equipment.

[0037] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A silicon wafer loading mechanism based on water flow slicing, comprising a loading frame (1) and a loading conveyor belt (2) and a robotic arm (3) mounted on top of it, characterized in that: A stainless steel micro-perforated mesh belt (4) is fixedly installed on the inner wall of the feeding frame (1). The stainless steel micro-perforated mesh belt (4) is located on the right side of the feeding conveyor belt (2). A gantry frame (5) is fixedly installed on the feeding frame (1). A segmented structure (6) is provided on the gantry frame (5). An industrial camera (7), a storage module (8), a signal transmission module (9), and a processor (10) are fixedly installed on the gantry frame (5). The segmented structure (6), industrial camera (7), storage module (8), and signal transmission module (9) are all connected to the processor (10) via signals. The industrial camera (7) is used to acquire image data of the bottom overlapping silicon wafer group and transmit the data to the processor (10). The processor (10) compares the acquired image data with the data in the storage module (8) to determine the segmented state and control the opening and closing of the segmented structure (6). The segmented structure (6) includes an assembly frame (601), which is mounted on the front of the gantry frame (5). A bearing frame (602) is slidably mounted on the inner wall of the assembly frame (601). An electric push rod (603) is fixedly mounted on the back of the assembly frame (601). The output shaft of the electric push rod (603) passes through and assembles the frame (601) and is mounted on the bearing frame (602). A liquid pump (604) is fixedly mounted on the bearing frame (602). A uniformly distributed flat nozzle (605) is rotatably connected to the back of the bearing frame (602). A uniformly distributed drive is fixedly mounted on the bearing frame (602). The motor (606) has its output shaft connected to the flat nozzle (605). A diversion box (607) is fixedly installed on the support frame (602). The diversion box (607) is connected to the liquid pump (604) through a pipe. A uniformly distributed diversion hose is fixedly installed on the diversion box (607). The other end of the diversion hose is connected to the flat nozzle (605). The electric push rod (603), the liquid pump (604), and the drive motor (606) are all connected to the processor (10) via signals. The processor (10) controls the opening and closing of the liquid pump (604), the drive motor (606), and the electric push rod (603) according to the background settings.

2. The silicon wafer feeding mechanism based on water flow slicing as described in claim 1, characterized in that: An infrared sensor (11) is fixedly installed on the gantry frame (5). The infrared sensor (11) is connected to the processor (10) and is used to sense the position of the overlapping silicon wafers and transmit the signal to the processor (10).

3. The silicon wafer feeding mechanism based on water flow slicing as described in claim 1, characterized in that: A water collection tank (12) is fixedly installed on the inner wall of the feeding frame (1), and the water collection tank (12) is located at the bottom of the stainless steel microporous mesh belt (4).

4. The silicon wafer feeding mechanism based on water flow slicing as described in claim 1, characterized in that: A pulsed DC ionization rod (13) is fixedly installed on the top of the feeding frame (1), and the pulsed DC ionization rod (13) is located on the top of the stainless steel microporous mesh belt (4).

5. The silicon wafer feeding mechanism based on water flow slicing as described in claim 1, characterized in that: A vacuum suction cup (14) is fixedly installed on the inner wall of the feeding frame (1). The vacuum suction cup (14) is located inside the stainless steel microporous mesh belt (4). The vacuum suction cup (14) is connected to the processor (10) via signal.

6. The silicon wafer feeding mechanism based on water flow slicing as described in claim 1, characterized in that: Two guide rods (15) are fixedly installed on the feeding frame (1). The guide rods (15) are bolted to the top of the feeding frame (1) and are in an adjustable state.

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