Wafer automatic centering and edge detection device

Abstract

The utility model provides a kind of wafer transmission piece automatic centering edge detection device, the transfer seat plate integration vacuum adsorption and transverse limiting function of this device, ensure the initial stability of wafer in transmission process;Multi-direction adjusting mechanism is through multistage cylinder and three-axis rotation structure, can carry out the precise angle and attitude adjustment to wafer, adapt to different process requirement;Clamping mechanism adopts the cooperation of push plate driven by cylinder and limiting side plate on transfer seat plate, realize the accurate centering of wafer and centering, ensure the accuracy of subsequent detection;Lifting rotary mechanism is through the design of unique square column outer cylinder and cylindrical inner core, both ensure lifting stability, also realize the high-speed smooth rotation of wafer, provide ideal condition for optical detection;The whole system is through transverse ring belt series connection each station, layout is compact, motion path optimization, significantly improve the efficiency and precision of wafer processing, meet the stringent requirements of high precision and high reliability for semiconductor manufacturing.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing equipment, and more particularly to an automatic centering and edge-finding detection device for wafer transfer. Background Technology

[0002] Patent document CN119324165A discloses a linkage-type wafer edge-finding and positioning mechanism, which includes a trajectory substrate and a wafer chuck mounted on the center of the trajectory substrate. A centering turntable is installed between a transmission substrate and the trajectory substrate. A second servo motor is installed on one side of the bottom of the transmission substrate. The drive end of the second servo motor is connected to a drive gear located above the transmission substrate. The drive gear meshes with a driven gear mounted on the bottom of the centering turntable. Several linkage components are evenly distributed along the circumference on the centering turntable. The mechanism uses linkage-type grippers to position the wafer by fitting the wafer's center with the wafer's shape accuracy via a single axis. It can simultaneously handle 6-inch and 8-inch wafer operations. However, this edge-finding and positioning mechanism has a single function, cannot automatically transfer wafers, and its positioning and detection functions are completed at a single station, which may cause interference. It also lacks wafer attitude adjustment capabilities, resulting in poor reliability and long-term stability in detection. Therefore, it is necessary to optimize its structure to overcome the above-mentioned defects. Utility Model Content

[0003] The purpose of this invention is to provide an automatic centering and edge-finding detection device for wafer transfer.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] An automatic centering and edge-finding detection device for wafer transfer includes:

[0006] The transfer base plate is arranged horizontally and installed on the top of the assembly stand via a horizontal slide rail. It can move along the horizontal slide rail. The top of the transfer base plate is provided with an adsorption port connected to the vacuum equipment via a pipeline. The transfer base plate is also equipped with a limiting side plate adapted to the shape of the wafer side. The transfer base plate provides vertical support and adsorption positioning for the bottom of the wafer, and the limiting side plate provides horizontal limiting for the side of the wafer.

[0007] A transverse belt is arranged in the transverse direction. Its two ends are respectively installed in the assembly frame through synchronous pulleys. The synchronous pulleys are connected to the transverse motor through the transmission structure. The transverse motor drives the transverse belt to reciprocate in the transverse direction in the assembly frame through the synchronous pulleys. The transfer seat plate is connected to the transverse belt through the transfer support plate and is carried by the transverse belt to move together.

[0008] The clamping base plate is arranged horizontally and has a vertical guide column at its bottom. The vertical guide column is connected to the assembly stand through a linear guide rail. The bottom of the clamping base plate is also connected to the piston rod of the vertical cylinder. The cylinder body of the vertical cylinder is installed in the assembly stand, and its piston rod is parallel to the vertical guide column. The vertical cylinder drives the clamping base plate to move along the vertical guide column.

[0009] A clamping pusher plate is located above the clamping base plate and is adapted to the shape of the wafer side. Its bottom is engaged with the clamping guide groove through roller bearings and can move along the clamping guide groove. There is a pair of clamping guide grooves, each of which is installed on the top of the clamping base plate and is parallel to the transverse slide rail. The clamping pusher plate is engaged with the piston rod of the clamping cylinder. The cylinder body of the clamping cylinder is installed on the clamping base plate, and its piston rod is parallel to the clamping guide groove. The clamping pusher plate is moved by the clamping cylinder.

[0010] A multi-directional adjustment mechanism is installed in the assembly stand and corresponds to the position of the transfer plate and the clamping plate. It has a wafer carrying space inside. The transfer plate transfers the wafer it carries to the multi-directional adjustment mechanism, which adjusts the orientation of the wafer. The clamping push plate and the limiting side plate clamp and center the wafer side. After the clamping and centering operation is completed, the vertical cylinder can drive the clamping plate and the clamping plate to descend. The multi-directional adjustment mechanism places the wafer in the transfer plate and then descends. The transfer plate carries the wafer to continue moving.

[0011] A wafer inspection mechanism is installed in the assembly stand and corresponds to the position of the transfer plate. The transfer plate transfers the wafer to the wafer inspection mechanism.

[0012] The lifting and rotating mechanism is installed in the assembly stand and corresponds to the position of the transfer plate and the wafer inspection mechanism. It has a wafer carrying space inside, which can receive the wafer in the transfer plate and carry the wafer to rotate in the wafer inspection mechanism, where the wafer inspection mechanism performs edge trimming and defect inspection on the wafer.

[0013] Specifically, the multi-directional adjustment mechanism includes:

[0014] The primary cylinder has its cylinder body installed in the assembly stand, and its piston rod extends vertically upward and engages with the primary carrier. The primary cylinder drives the primary carrier to move up and down.

[0015] The secondary cylinder has its cylinder body installed in the primary carrier and can move up and down together with the primary carrier. Its piston rod extends vertically upward and engages with the secondary carrier. The secondary carrier is driven by the secondary cylinder to move up and down independently.

[0016] The transverse carrier is mounted in the secondary carrier via a transverse rotating shaft and is connected to the power output shaft of the transverse motor via a transmission toothed belt. The transverse motor is mounted in the secondary carrier and can move up and down together with the secondary carrier. Its power output shaft extends transversely and can drive the transverse carrier to rotate laterally.

[0017] The longitudinal carrier is mounted in the transverse carrier via a longitudinal rotating shaft and is connected to the power output shaft of the longitudinal motor via a transmission toothed belt. The longitudinal motor is mounted in the transverse carrier and can rotate laterally together with the transverse carrier. Its power output shaft extends longitudinally and can drive the longitudinal carrier to rotate longitudinally.

[0018] A vertical carrier frame is installed in a longitudinal carrier frame via a vertical rotating shaft and is connected to the power output shaft of a vertical motor via a transmission gear. The vertical motor is installed in the longitudinal carrier frame and can rotate longitudinally together with the longitudinal carrier frame. Its power output shaft extends vertically and can drive the vertical carrier frame to rotate vertically.

[0019] The suction and positioning tray is installed in a vertical carrier and can rotate vertically with the carrier. It is connected to the vacuum equipment through pipelines. The side of the transfer seat plate is also provided with a clearance notch adapted to the shape of the suction and positioning tray. The suction and positioning tray can rise from the clearance notch and adsorb and position the center of the wafer in the transfer seat plate to avoid interference with the adjustment process of the suction and positioning tray. The clamping push plate and the limiting side plate perform clamping and centering operations on the wafer carried by the suction and positioning tray. After the clamping and centering operations are completed, the suction and positioning tray places the wafer in the transfer seat plate and then descends. The moving seat plate adsorbs and positions the side of the wafer and carries the wafer to continue moving.

[0020] Wafer inspection facilities include:

[0021] The scanning top mount is installed in the assembly stand and corresponds to the position of the transfer plate;

[0022] The scanning base is installed in the assembly stand and corresponds to the position of the transfer plate. A scanning space is formed between the scanning base and the scanning top. After the centering operation, the wafer side is transferred into the scanning space by the transfer plate.

[0023] The lifting and rotating mechanism includes:

[0024] The assembly base plate is arranged horizontally and installed in the assembly stand through the connector. The assembly base plate has an assembly notch on its edge. The assembly notch is in the shape of an orthogonal double notch. A guide frame is installed on its inner wall. The guide frame is bent to form an orthogonal angle and is connected to the assembly base plate through the connector. Guide end plates are installed at both ends of the guide frame. Each guide end plate extends vertically and has a guide column arranged vertically on its inner wall.

[0025] The support column is arranged vertically, with a square column structure on the outer wall and a cylindrical structure on the inside. The outer wall of the support column is equipped with matching support wheels at opposite corners. Each matching support wheel consists of a pair of roller bearings forming an orthogonal angle and abuts against the outer wall of the guide column, so that the support column can be raised and lowered along the guide column by matching support wheels. The bottom of the guide frame is equipped with a drive cylinder. The piston rod of the drive cylinder is parallel to the guide column and is connected to the support column through a connector. The drive cylinder drives the support column to rise and fall along the guide column.

[0026] The positioning core is located inside the support cylinder and is arranged vertically. Its two ends are respectively connected to the two ends of the support cylinder through bearings. It can rise and fall together with the support cylinder and can rotate independently in the support cylinder. An adsorption turntable is installed on the top of the positioning core. The adsorption turntable is connected to the vacuum equipment through a vacuum tube arranged in the positioning core. A drive motor is installed on the side of the support cylinder. The power output shaft of the drive motor is connected to the bottom of the positioning core through a pulley transmission structure. The drive motor drives the positioning core to rotate. After the centering operation, the adsorption turntable rises from the clearance notch and adsorbs and positions the center of the wafer carried by the transfer plate. It also carries the side of the wafer to rotate in the scanning space. The scanning top seat and scanning base perform edge detection and defect detection on the wafer.

[0027] The advantages of this utility model are:

[0028] The device's transfer base plate integrates vacuum adsorption and lateral limiting functions to ensure the initial stability of the wafer during transport. The multi-directional adjustment mechanism, through multi-stage cylinders and a three-axis rotation structure, enables precise angle and orientation adjustments of the wafer to adapt to different process requirements. The clamping mechanism, using a cylinder-driven push plate in conjunction with the limiting side plate on the transfer base plate, achieves precise wafer alignment and centering, ensuring the accuracy of subsequent inspections. The lifting and rotating mechanism, through a unique square outer cylinder and cylindrical inner core design, ensures both lifting stability and high-speed, stable wafer rotation, providing ideal conditions for optical inspection. The entire system connects each station via a lateral conveyor belt, featuring a compact layout and optimized motion paths, significantly improving the efficiency and accuracy of wafer processing while reducing errors and contamination risks caused by manual intervention, meeting the stringent requirements of semiconductor manufacturing for high precision and high reliability. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the automatic centering and edge-finding detection device for wafer transfer proposed in this utility model;

[0030] Figure 2 This is one of the partial structural schematic diagrams of the device;

[0031] Figure 3 This is the second partial structural schematic diagram of the device;

[0032] Figure 4 This is a schematic diagram of the multi-directional adjustment mechanism;

[0033] Figure 5 This is one of the partial structural schematic diagrams of a multi-directional adjustment mechanism;

[0034] Figure 6 This is the second partial structural schematic diagram of the multi-directional adjustment mechanism;

[0035] Figure 7 This is the third schematic diagram of the internal structure of the multi-directional adjustment mechanism;

[0036] Figure 8 This is a front structural diagram of the lifting and rotating mechanism;

[0037] Figure 9 This is a schematic diagram of the rear structure of the lifting and rotating mechanism;

[0038] Figure 10 This is a cross-sectional structural diagram of the lifting and rotating mechanism. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0040] like Figures 1-10 As shown, the automatic centering and edge-finding detection device for wafer transfer proposed in this utility model includes:

[0041] The transfer plate 110 is arranged in a horizontal direction and is installed on the top of the assembly stand via a horizontal slide rail 111. It can move along the horizontal slide rail. The top of the transfer plate is provided with an adsorption port connected to a vacuum device via a pipeline. The transfer plate is also equipped with a limiting side plate 112 that is adapted to the shape of the wafer side. The transfer plate provides vertical support and adsorption positioning for the bottom of the wafer, and the limiting side plate provides horizontal limiting for the side of the wafer.

[0042] A transverse belt 120 is arranged in the transverse direction. Its two ends are respectively installed in the assembly frame through synchronous pulleys 121. The synchronous pulleys are connected to the transverse motor 122 through a transmission structure. The transverse motor drives the transverse belt to reciprocate in the transverse direction in the assembly frame through the synchronous pulleys. The transfer seat plate is connected to the transverse belt through a transition support plate and is carried by the transverse belt to move together.

[0043] The clamping base plate 130 is arranged horizontally, and its bottom is provided with a vertical guide column 131. The vertical guide column is engaged with the assembly stand through a linear guide rail. The bottom of the clamping base plate is also engaged with the piston rod of the vertical cylinder 132. The cylinder body of the vertical cylinder is installed in the assembly stand, and its piston rod is parallel to the vertical guide column. The vertical cylinder drives the clamping base plate to move along the vertical guide column.

[0044] A clamping pusher plate 140 is located above the clamping base plate and is adapted to the shape of the wafer side. Its bottom is engaged with the clamping guide groove 142 through a roller bearing 141, and can move along the clamping guide groove. There is a pair of clamping guide grooves, each of which is installed on the top of the clamping base plate and is parallel to the transverse slide rail. The clamping pusher plate is engaged with the piston rod of the clamping cylinder 143. The cylinder body of the clamping cylinder is installed on the clamping base plate, and its piston rod is parallel to the clamping guide groove. The clamping pusher plate is moved by the clamping cylinder.

[0045] The device also includes a multi-directional adjustment mechanism, a wafer inspection mechanism, and a lifting and rotating mechanism. The multi-directional adjustment mechanism is installed in the assembly stand and corresponds to the position of the transfer plate and the clamping plate. It has a wafer-carrying space inside. The transfer plate transfers the wafers it carries to the multi-directional adjustment mechanism, which adjusts the orientation of the wafers. The clamping push plate and the limiting side plate perform clamping and centering operations on the sides of the wafers. After the clamping and centering operations are completed, the vertical cylinder can drive the clamping plate and the clamping plate to descend, thus completing the multi-directional adjustment. The mechanism lowers after placing the wafer in the transfer plate, which then carries the wafer to continue moving. The wafer inspection mechanism is installed in the assembly stand and corresponds to the position of the transfer plate. The transfer plate transfers the wafer to the wafer inspection mechanism. The lifting and rotating mechanism is installed in the assembly stand and corresponds to the positions of the transfer plate and the wafer inspection mechanism. It has a wafer carrying space inside, which can receive the wafer in the transfer plate and carry the wafer to rotate in the wafer inspection mechanism. The wafer inspection mechanism performs edge trimming and defect inspection on the wafer.

[0046] In this embodiment, the multi-directional adjustment mechanism includes:

[0047] Primary cylinder 210, the cylinder body of which is installed in the assembly stand, the piston rod of which extends vertically upward and engages with primary carrier 211, the primary cylinder drives the primary carrier to move up and down.

[0048] The secondary cylinder 220 has its cylinder body installed in the primary carrier and can move up and down together with the primary carrier. Its piston rod extends vertically upward and engages with the secondary carrier 221. The secondary cylinder drives the secondary carrier to move up and down independently. In this embodiment, the secondary carrier is connected to the vertical guide rod 222, which is provided in the assembly stand, through a linear bearing. The vertical guide rod guides the lifting process of the secondary carrier.

[0049] The transverse carrier 230 is mounted in the secondary carrier via a transverse rotating shaft and is connected to the power output shaft of the transverse motor 231 via a transmission toothed belt. The transverse motor is mounted in the secondary carrier and can move up and down together with the secondary carrier. Its power output shaft extends transversely and can drive the transverse carrier to rotate laterally.

[0050] The longitudinal carrier 240 is mounted in the transverse carrier via a longitudinal rotating shaft and is connected to the power output shaft of the longitudinal motor 241 via a transmission toothed belt. The longitudinal motor is mounted in the transverse carrier and can rotate laterally together with the transverse carrier. Its power output shaft extends longitudinally and can drive the longitudinal carrier to rotate longitudinally.

[0051] The vertical carrier 250 is installed in the longitudinal carrier via a vertical rotating shaft and is connected to the power output shaft of the vertical motor 251 via a transmission gear. The vertical motor is installed in the longitudinal carrier and can rotate longitudinally together with the longitudinal carrier. Its power output shaft extends vertically and can drive the vertical carrier to rotate vertically.

[0052] The suction and positioning tray 260 is installed in a vertical carrier and can rotate vertically together with the vertical carrier. It is connected to the vacuum equipment through a pipeline. The side of the transfer seat plate is also provided with a clearance notch adapted to the shape of the suction and positioning tray. The suction and positioning tray can rise from the clearance notch and adsorb and position the center of the wafer in the transfer seat plate to avoid interference with the adjustment process of the suction and positioning tray. The clamping push plate and the limiting side plate perform clamping and centering operations on the wafer carried by the suction and positioning tray. After the clamping and centering operations are completed, the suction and positioning tray places the wafer in the transfer seat plate and then descends. The moving seat plate adsorbs and positions the side of the wafer and carries the wafer to continue moving.

[0053] Wafer inspection facilities include:

[0054] Scanning top mount 310, which is installed in the assembly stand and corresponds to the position of the transfer base plate;

[0055] The scanning base 320 is installed in the assembly stand and corresponds to the position of the transfer plate. A scanning space is formed between the scanning base and the scanning top. After the centering operation, the wafer side is transferred into the scanning space by the transfer plate.

[0056] The lifting and rotating mechanism includes:

[0057] The assembly base plate 410 is arranged horizontally and installed in the assembly stand through the connector. The edge of the assembly base plate has an assembly notch 411, which is an orthogonal double-sided notch shape. A guide frame 412 is installed on its inner wall. The guide frame is bent to form an orthogonal angle and is connected to the assembly base plate through the connector. Guide end plates 413 arranged opposite to each other are installed at both ends of the guide frame. Each guide end plate extends vertically and a guide column 414 arranged vertically is set on its inner wall.

[0058] The supporting cylinder 420 is arranged vertically, with a square column structure on its outer wall and a cylindrical structure on its interior. The outer wall of the supporting cylinder is provided with matching support rollers 421 at opposite corners. Each matching support roller consists of a pair of roller bearings forming an orthogonal angle and abuts against the outer wall of the guide column, so that the supporting cylinder can be raised and lowered along the guide column by the matching support rollers. The bottom of the guide frame is provided with a drive cylinder 422. The piston rod of the drive cylinder is parallel to the guide column and is connected to the supporting cylinder through a connector. The drive cylinder drives the supporting cylinder to rise and fall along the guide column.

[0059] The positioning core 430 is located inside the support cylinder and is arranged vertically. Its two ends are respectively connected to the two ends of the support cylinder through bearings. It can be raised and lowered together with the support cylinder and can rotate independently in the support cylinder. An adsorption turntable 431 is installed on the top of the positioning core 430. The adsorption turntable is connected to the vacuum equipment through a vacuum tube arranged in the positioning core 430. A drive motor 432 is installed on the side of the support cylinder. The power output shaft of the drive motor is connected to the bottom of the positioning core 430 through a pulley transmission structure. The drive motor drives the positioning core 430 to rotate. After the centering operation, the adsorption turntable rises from the clearance notch and adsorbs and positions the center of the wafer carried by the transfer plate. It also carries the side of the wafer to rotate in the scanning space. The scanning top seat and scanning base perform edge detection and defect detection on the wafer. The specific structure and operating principle of the scanning top seat and scanning base adopt existing technology, so they are not described in detail.

[0060] The method of using the above-mentioned automatic centering and edge-finding detection device for wafer transfer includes:

[0061] The wafer is placed onto the transfer plate by the preceding equipment. The suction port at the top of the transfer plate activates a vacuum to vertically support and position the bottom of the wafer, while the limiting side plates on the plate laterally limit and initially fix the wafer. Then, the transverse motor starts and drives the transverse belt via a synchronous pulley. The transverse belt, through a transfer support plate, moves the transfer plate and the wafer along a transverse slide rail, transporting the wafer above the multi-directional adjustment mechanism. The primary and secondary cylinders of the multi-directional adjustment mechanism actuate to drive the suction and positioning plate upwards, passing through the clearance notch on the transfer plate to suction and position the center of the wafer, which is then transferred. The vacuum on the mounting plate is released, and the orientation of the wafer is adjusted by the suction and positioning plate. The vertical cylinder pushes the clamping mounting plate upward along the vertical guide post, so that the clamping mounting plate and clamping push plate reach the working height. The clamping cylinder then pushes the clamping mounting plate to move along the clamping guide groove, so that the clamping push plate and the limiting side plate on the transfer mounting plate cooperate with each other to complete the clamping and centering operation of the wafer side carried by the suction and positioning plate. After centering is completed, the vacuum on the suction and positioning plate is released, the transfer mounting plate restarts vacuum adsorption to hold the bottom of the wafer, the vertical cylinder retracts to drive the clamping mounting plate and clamping plate downward to reset, and the multi-directional adjustment mechanism also descends to return the suction and positioning plate to the standby position.

[0062] The transverse motor restarts and drives the transverse belt, causing the transfer base plate and the centered wafer on it to continue moving along the transverse slide rail, transferring the wafer into the scanning space of the wafer inspection mechanism; then the drive cylinder of the lifting and rotating mechanism moves to push the support cylinder to rise along the guide column, so that the top adsorption turntable passes through the clearance notch to adsorb and position the center of the wafer, and then the vacuum of the transfer base plate is released; the drive motor starts and drives the positioning core column and adsorption turntable to rotate through the pulley transmission structure, so that the wafer rotates in the scanning space formed by the scanning top seat and the scanning base, and the wafer inspection mechanism completes the edge detection and defect detection;

[0063] After the inspection is completed, the drive cylinder moves the support cylinder and the wafer down, and the transfer plate restarts to vacuum and hold the bottom of the wafer; the transverse motor drives the transverse belt to move the transfer plate to the unloading position, where the subsequent equipment takes away the wafer; finally, the transfer plate returns to the initial loading position, and all components are reset to prepare for the processing of the next wafer.

[0064] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A wafer automatic centering and edge detection device, characterized in that, include: The transfer plate is arranged in a transverse direction and is installed on the top of the assembly stand via a transverse slide rail. It can move along the transverse slide rail. The top of the plate is provided with an adsorption port connected to a vacuum device via a pipeline. The transfer plate is also equipped with a limiting side plate that is adapted to the shape of the wafer side. A transverse belt is arranged in the transverse direction. Its two ends are respectively installed in the assembly frame through synchronous pulleys. The synchronous pulleys are connected to the transverse motor through a transmission structure. The transfer seat plate is connected to the transverse belt through a transfer support plate. The clamping base plate is arranged horizontally and has a vertical guide column at its bottom. The vertical guide column is engaged with the assembly stand through a linear guide rail. The bottom of the clamping base plate is also engaged with the piston rod of the vertical cylinder. The cylinder body of the vertical cylinder is installed in the assembly stand, and its piston rod is parallel to the vertical guide column. A clamping pusher plate is located above the clamping base plate and is adapted to the shape of the wafer side. Its bottom is engaged with the clamping guide groove through roller bearings and can move along the clamping guide groove. There is a pair of clamping guide grooves, each of which is installed on the top of the clamping base plate and is parallel to the transverse slide rail. The clamping pusher plate is engaged with the piston rod of the clamping cylinder. The cylinder body of the clamping cylinder is installed on the clamping base plate, and its piston rod is parallel to the clamping guide groove. A multi-directional adjustment mechanism is installed in the assembly stand and corresponds to the positions of the transfer plate and the clamping plate. It has a wafer carrying space inside. A wafer inspection mechanism is installed in the assembly stand and corresponds to the position of the transfer plate; The lifting and rotating mechanism is installed in the assembly stand and corresponds to the position of the transfer seat plate and the wafer inspection mechanism. It has a wafer carrying space inside.

2. The wafer automatic centering and edge detection device of claim 1, wherein, The multi-directional adjustment mechanism includes: A primary cylinder, the cylinder body of which is mounted in an assembly stand, the piston rod of which extends vertically upward and engages with the primary carrier. The secondary cylinder has its cylinder body installed in the primary carrier and can move up and down together with the primary carrier. Its piston rod extends vertically upward and engages with the secondary carrier. A transverse carrier is mounted in a secondary carrier via a transverse pivot and is connected to the power output shaft of a transverse motor via a transmission toothed belt. The transverse motor is mounted in the secondary carrier and can move up and down together with the secondary carrier. Its power output shaft extends laterally. The longitudinal carrier is mounted in the transverse carrier via a longitudinal rotating shaft and is connected to the power output shaft of the longitudinal motor via a transmission toothed belt. The longitudinal motor is mounted in the transverse carrier and its power output shaft extends longitudinally. A vertical support frame is mounted in a longitudinal support frame via a vertical rotating shaft and is connected to the power output shaft of a vertical motor via a transmission gear. The vertical motor is mounted in the longitudinal support frame and its power output shaft extends vertically. The suction and stationary plate is installed in the vertical frame and can rotate vertically together with the vertical frame. It is connected to the vacuum equipment through pipelines. The side of the transfer seat plate is also provided with a clearance notch adapted to the shape of the suction and stationary plate.

3. The wafer transfer automatic centering and edge detection device of claim 1, wherein, Wafer inspection institutions include: The scanning top mount is installed in the assembly stand and corresponds to the position of the transfer plate; The scanning base is installed in the assembly stand and corresponds to the position of the transfer plate, forming a scanning space between the scanning base and the scanning top.

4. The wafer transfer automatic centering and edge detection device of claim 3, wherein, The lifting and rotating mechanism includes: The assembly base plate is arranged horizontally and installed in the assembly stand through the connector. The assembly base plate has an assembly notch on its edge. The assembly notch is in the shape of an orthogonal double notch. A guide frame is installed on its inner wall. The guide frame is bent to form an orthogonal angle and is connected to the assembly base plate through the connector. Guide end plates are installed at both ends of the guide frame. Each guide end plate extends vertically and has a guide column arranged vertically on its inner wall. The supporting column is arranged vertically. Its outer wall is a square column structure and its interior is a cylindrical structure. The outer wall of the supporting column is provided with matching support rollers at opposite corners. Each matching support roller consists of a pair of roller bearings forming an orthogonal angle and abuts against the outer wall of the guide column. The bottom of the guide frame is provided with a drive cylinder. The piston rod of the drive cylinder is parallel to the guide column and is connected to the supporting column through a connector. The positioning core is located inside the support cylinder and is arranged vertically. Its two ends are respectively connected to the two ends of the support cylinder through bearings. An adsorption turntable is installed on the top of the positioning core. The adsorption turntable is connected to the vacuum equipment through a vacuum tube arranged inside the positioning core. A drive motor is installed on the side of the support cylinder. The power output shaft of the drive motor is connected to the bottom of the positioning core through a pulley transmission structure.

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