Three-axis robot and silicon wafer transfer device

Abstract

The utility model discloses a kind of three-axis manipulator, the three-axis manipulator is used for the transfer of silicon wafer degumming tool, comprising: X-axis mechanism;Y-axis mechanism, the Y-axis mechanism is slidably connected with the X-axis mechanism;Z-axis mechanism, the Z-axis mechanism is slidably connected with the Y-axis mechanism;Pick-and-place mechanism, the pick-and-place mechanism includes the mounting seat slidably connected with the Z-axis mechanism, at least two first clamping jaws are set on the mounting seat, the top plate on the opposite side of the mounting seat and silicon wafer, first driving mechanism is set on the mounting seat for driving the top plate towards or away from silicon wafer movement;Also disclosed is a silicon wafer transfer device with the above three-axis manipulator, the device can realize degumming tool full-automatic handling and full-automatic unloading between degumming and inserting piece cleaning all-in-one machine, realize degumming section and inserting piece section without manual intervention, between degumming and inserting piece Quick switching, improve production efficiency, reduce labor cost.

Description

Technical Field

[0001] This utility model relates to silicon wafer production equipment, and more particularly to a three-axis robotic arm and a silicon wafer transfer device. Background Technology

[0002] Silicon wafers are obtained by wire cutting silicon rods or blocks. During wire cutting, the silicon rods or blocks need to be glued to the wafer holder for fixation. After cutting, the silicon wafers need to be de-adhesived. The de-adhesive method involves placing the fixture containing the silicon wafers into a de-adhesive tank filled with liquid and heating it to separate the silicon wafers from the wafer holder. After separation, the silicon wafers need to be further transferred to an insertion tank for subsequent insertion operations. Currently, the handling of the fixtures in the de-adhesive process is mainly handled by robotic arms. However, existing robotic arms can only perform simple movement of the fixtures and cannot detach the silicon wafers from the fixtures. Furthermore, during the detachment process, there are periods when the silicon wafers are not simultaneously held by the fixtures and the cleaning tank, which can easily cause the wafers to tip over in the cleaning tank, resulting in breakage. Therefore, after the robotic arm transfers the fixtures to the insertion tank, worker intervention is often required to detach the silicon wafers from the fixtures before the robotic arm removes the fixtures. This process significantly impacts production efficiency and increases labor costs. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, this utility model provides a three-axis robot and silicon wafer transfer device. This device can realize fully automatic handling and unloading of degumming fixtures between degumming and wafer insertion cleaning integrated machines, realize rapid switching between degumming and wafer insertion without manual intervention, improve production efficiency and reduce labor costs.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] In a first aspect, the present invention discloses a three-axis robotic arm for transferring silicon wafer debonding fixtures, comprising:

[0006] X-axis mechanism;

[0007] The Y-axis mechanism is slidably connected to the X-axis mechanism;

[0008] The Z-axis mechanism is slidably connected to the Y-axis mechanism;

[0009] The pick-and-place mechanism includes a mounting base slidably connected to the Z-axis mechanism, at least two first grippers disposed on the mounting base, a top plate located on the side of the mounting base opposite to the silicon wafer, and a first drive mechanism disposed on the mounting base for driving the top plate to move toward or away from the silicon wafer.

[0010] By setting a top plate on the pick-and-place mechanism, the top plate is controlled by the first drive mechanism to move toward or away from the silicon wafer. Thus, when the silicon wafer is separated from the tooling, the top plate can press the silicon wafer tightly to prevent it from tipping over in the cleaning tank and ensure the quality of the silicon wafer.

[0011] Preferably, the top plate has an elastic layer on the side opposite to the silicon wafer, and the elastic layer can be made of silicone foam. Providing an elastic layer on the top plate prevents damage to the silicon wafer when the top plate presses against it.

[0012] Preferably, the picking and placing mechanism includes two first driving mechanisms, each of which is a cylinder arranged vertically. The two first driving mechanisms are connected to opposite ends of the top plate. Having one first driving mechanism at each end of the top plate ensures more stable control of the top plate and a more uniform force applied to the silicon wafer.

[0013] Preferably, the picking and placing mechanism includes four first grippers, which are arranged in pairs facing each other. One end of each first gripper is slidably connected to the mounting base, and the other end of each first gripper extends away from the mounting base and is bent into a hook.

[0014] Preferably, at least one of the first grippers is provided with a full basket detection mechanism, the full basket detection mechanism including a first sliding piece slidably connected to the first gripper, a first sensor disposed on the top of the first sliding piece, a first detector disposed on the first gripper and opposite to the first sensor, and an elastic member disposed vertically between the first sliding piece and the first gripper; in the initial state, the first detection part of the first sliding piece is located within the gripping space of the first gripper.

[0015] Preferably, at least one of the first grippers is provided with a basket pressure detection mechanism, the basket pressure detection mechanism including a second sliding plate slidably connected to the first gripper, a second sensor disposed on the top of the second sliding plate, and a second detector disposed on the first gripper and opposite to the second sensor; in the initial state, the second detection part of the second sliding plate is located below the first gripper.

[0016] Preferably, the picking and placing mechanism further includes a crystal tray gripping assembly, which includes at least two second grippers and a second drive mechanism connected to the second grippers for controlling the opening and closing of the second grippers.

[0017] Preferably, the X-axis mechanism includes a first bracket, a first guide rail extending along the X-axis direction on the first bracket, and a first rack parallel to the first guide rail; the Y-axis mechanism includes a second bracket, a first slider cooperating with the first guide rail on the second bracket, a first gear cooperating with the first rack, an X-axis drive mechanism for driving the first gear, a second guide rail and a second rack extending along the Y-axis direction on the second bracket; the Z-axis mechanism includes a third bracket, a second slider cooperating with the second guide rail on the third bracket, a second gear cooperating with the second rack, a Y-axis drive mechanism for driving the second gear, a third slider extending along the Z-axis direction on the second bracket, a third guide rail cooperating with the third slider on the mounting base, a third gear on the second bracket, a Z-axis drive mechanism for driving the third gear, and a third guide rail cooperating with the third gear on the mounting base.

[0018] Secondly, the present invention discloses a silicon wafer transfer device, including a three-axis manipulator and a silicon wafer debonding fixture. The three-axis manipulator is as described above. The silicon wafer debonding fixture includes a frame, a clamping member disposed within the frame, a support member disposed within the frame and located below the clamping member, an opening and closing mechanism disposed at the end of the frame for controlling the clamping member and the support member to move along the width direction of the frame, and a first rod and a second rod respectively disposed on the frame and the opening and closing mechanism for the three-axis manipulator to grasp. The three-axis manipulator can lift the opening and closing mechanism through the second rod to open the debonding fixture.

[0019] Preferably, the opening and closing mechanism includes a first plate that is slidably disposed on the outside of the frame in a vertical direction, the first plate being able to drive the clamping member to slide along the first preset path, a second plate disposed on the inside of the frame and fixedly connected to the first plate, and a connecting rod disposed on the inside of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the supporting member.

[0020] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0021] 1. By setting a top plate on the pick-and-place mechanism, the top plate is controlled by the first drive mechanism to move toward or away from the silicon wafer, so that when the silicon wafer is separated from the tooling, the top plate can press the silicon wafer tightly to prevent the silicon wafer from tipping over in the cleaning tank and ensure the quality of the silicon wafer.

[0022] 2. By setting up a full basket detection mechanism and a pressure basket detection mechanism on the gripper, the three-axis robot can automatically hook the silicon wafer debonding fixture, avoid damage to the silicon wafer, and improve the quality of the silicon wafer.

[0023] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the transfer device structure in an embodiment of this utility model;

[0026] Figure 2 yes Figure 1 Main view;

[0027] Figure 3 yes Figure 1 Side view;

[0028] Figure 4 This is a schematic diagram of the pick-and-place mechanism in an embodiment of this utility model;

[0029] Figure 5 This is a front view of the pick-and-place mechanism in an embodiment of this utility model;

[0030] Figure 6 This is a schematic diagram of a silicon wafer debonding fixture according to an embodiment of this utility model.

[0031] The reference numerals in the above figures are as follows: 1. X-axis mechanism; 11. First support; 12. First guide rail; 13. First rack; 2. Y-axis mechanism; 21. Second support; 22. First slider; 23. First gear; 24. X-axis drive mechanism; 25. Second guide rail; 26. Second rack; 3. Z-axis mechanism; 31. Third support; 32. Second slider; 33. Second gear; 34. Y-axis drive mechanism; 35. Third slider; 36. Third gear; 37. Z-axis drive mechanism; 38. Third rack; 39. Stabilizing wheel; 310. Fixed Column; 311, Third guide rail; 4, Picking and placing mechanism; 41, Mounting base; 411, Mounting plate; 412, Column; 42, First gripper; 421, Full basket detection mechanism; 422, Pressure basket detection mechanism; 43, Top plate; 44, First drive mechanism; 45, Third drive mechanism; 46, Crystal tray gripping assembly; 461, Second gripper; 462, Second drive mechanism; 5, Silicon wafer debonding fixture; 51, Frame; 52, Clamping component; 53, Support component; 54, Opening and closing mechanism; 541, First plate; 542, Second plate; 543, Connecting rod. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Example 1: See Figures 1-2 As shown, a three-axis robot is used for the transfer of silicon wafer debonding fixture 5, including an X-axis mechanism 1, a Y-axis mechanism 2 slidably connected to the X-axis mechanism 1, a Z-axis mechanism 3 slidably connected to the Y-axis mechanism 2, and a pick-and-place mechanism 4 slidably connected to the Z-axis mechanism 3.

[0034] See Figure 1 , 2 As shown in Figure 3, the X-axis mechanism 1 includes a first support 11, a first guide rail 12 extending along the X-axis direction and disposed on the first support 11, and a first rack 13 arranged parallel to the first guide rail 12. The first support 11 can be a long strip-shaped profile. A first origin detector and a first limit sensor are also provided on the first support 11. The first origin detector is used for initializing the position of the device along the X-axis direction. The first limit sensor is used to monitor the position of the pick-and-place mechanism 4 along the X-axis direction to prevent it from disengaging from the X-axis mechanism 1 or interfering with the operation of other mechanisms of the device.

[0035] The Y-axis mechanism 2 includes a second bracket 21, a first slider 22 mounted on the second bracket 21 and cooperating with the first guide rail 12, a first gear 23 cooperating with the first rack 13, an X-axis drive mechanism 24 for driving the first gear 23, and a second guide rail 25 and a second rack 26 mounted on the second bracket 21 and extending along the Y-axis direction. The X-axis drive mechanism 24 can be a motor. A second origin detector and a second limit sensor are also provided on the second bracket 21. The second origin detector is used for initializing the position of the device along the Y-axis. The second limit sensor is used to monitor the position of the pick-and-place mechanism 4 along the Y-axis, preventing it from disengaging from the Y-axis mechanism 2 or interfering with the operation of other mechanisms of the device.

[0036] The Z-axis mechanism 3 includes a third support 31, a second slider 32 mounted on the third support 31 and cooperating with the second guide rail 25, a second gear 33 cooperating with the second rack 26, a Y-axis drive mechanism 34 for driving the second gear 33, a third slider 35 mounted on the second support 21 and extending along the Z-axis direction, a third gear 36 mounted on the second support 21, and a Z-axis drive mechanism 37 for driving the third gear 36. Similarly, the Y-axis drive mechanism 34 and the Z-axis drive mechanism 37 can also be motors.

[0037] In a preferred embodiment, two fixing posts 310 are symmetrically arranged at both ends of the third bracket 31 along the X-axis direction, and the fixing posts 310 are detachably connected to the third bracket 31. Each fixing post 310 is provided with a third slider 35. By adjusting the position of the fixing post 310, the position of the column 412 can be adjusted, so that the third rack 38 on the column 412 can better mesh with the third gear 36.

[0038] In a preferred embodiment, the third support 31 is further provided with a plurality of stabilizing wheels 39, which are located on the side of the column 412 opposite to the third rack 38. By providing stabilizing wheels 39, shaking can be prevented from occurring in the silicon wafer debonding fixture 5 due to the large stroke of the column 412.

[0039] See Figure 4 As shown, the pick-and-place mechanism 4 includes a mounting base 41 slidably connected to the Z-axis mechanism 3, four first grippers 42 disposed on the mounting base 41, a top plate 43 located on the side of the mounting base 41 opposite to the silicon wafer, and a first drive mechanism 44 disposed on the mounting base 41 for driving the top plate 43 to move toward or away from the silicon wafer.

[0040] The mounting base 41 includes a mounting plate 411, which has a first surface and a second surface facing each other. A column 412 is provided on the first surface of the mounting plate 411. A third guide rail 311, which cooperates with the third slider 35 and extends along the Z-axis, is provided on the column 412. A third rack 38, which cooperates with the third gear 36 and is parallel to the third guide rail 311, is also provided. The number of columns 412 is the same as the number of sliders in the Z-axis mechanism 3.

[0041] Four first grippers 42 are located at the four corners of the mounting plate 411. One end of each first gripper 42 is slidably connected to the mounting base 41, and the other end extends away from the mounting base 41 and is bent into a hook. Four third drive mechanisms 45, which are motors, are provided on the first surface of the mounting plate 411. Each third drive mechanism 45 is used to control the sliding of one of the first grippers 42. A guide mechanism is also provided between the first gripper 42 and the mounting base 41, so that the first gripper 42 slides along the Y-axis under the action of the third drive mechanism 45, thereby controlling the hook of the first gripper 42 to hook onto the first or second rod on the silicon wafer debonding fixture 5.

[0042] In a preferred embodiment, an elastic layer is provided on the side of the top plate 43 opposite to the silicon wafer. The elastic layer is made of silicone foam material. Two first driving mechanisms 44 are arranged opposite each other at both ends of the top plate 43 along the X-axis direction. The first driving mechanism 44 is a cylinder arranged in the vertical direction.

[0043] In a preferred embodiment, the pick-and-place mechanism 4 further includes a full basket detection mechanism 421. Two of the four first grippers 42, located on opposite sides along the length of the silicon wafer debonding fixture 5, are each equipped with a full basket detection mechanism 421. The full basket detection mechanism 421 includes a first sliding piece slidably connected to the first gripper 42, a first sensor disposed on the top of the first sliding piece, a first detector disposed on the first gripper 42 and opposite to the first sensor, and an elastic member disposed vertically between the first sliding piece and the first gripper 42. In the initial state, the first detection portion of the first sliding piece is located within the gripping space of the first gripper 42. The first detector is normally open; when the pick-and-place mechanism 4 is not gripping the silicon wafer debonding fixture 5, the first sliding piece, under the action of the elastic member, causes the first detection portion at the bottom of the first sliding piece to be higher than the hook. When the pick-and-place mechanism 4 picks up the silicon wafer de-adhesive fixture 5, the first sliding plate moves downward under the action of the silicon wafer de-adhesive fixture 5, increasing the distance between the first detector and the first sensor, so that the first detector cannot receive the signal from the first sensor. At this time, it is proven that the pick-and-place mechanism 4 has picked up the silicon wafer de-adhesive fixture 5.

[0044] Two additional first grippers 42 are each equipped with a basket-pressing detection mechanism 422. Each basket-pressing detection mechanism 422 includes a second sliding plate slidably connected to the first gripper 42, a second sensor located on top of the second sliding plate, and a second detector located on the first gripper 42 opposite to the second sensor. In the initial state, the second detection part of the second sliding plate is located below the first gripper 42. When the pick-and-place mechanism 4 presses the basket, the second detection part is lifted upwards. At this time, the second detector detects the signal from the second sensor, and the control mechanism can thereby control the three-axis robotic arm to stop its downward movement, thus preventing the pick-and-place mechanism 4 from damaging the silicon wafer.

[0045] In a preferred embodiment, the picking and placing mechanism 4 further includes a crystal tray gripping assembly 46, which includes at least two second grippers 461 and a second drive mechanism 462 connected to the second grippers 461 for controlling the opening and closing of the second grippers 461.

[0046] See Figure 1 , 2 As shown in Figure 3, a silicon wafer transfer device includes the aforementioned three-axis robot and a silicon wafer de-adhesion fixture 5. The silicon wafer de-adhesion fixture 5 includes a frame 51, a clamping member 52 disposed within the frame 51, a support member 53 disposed within the frame 51 and located below the clamping member 52, an opening and closing mechanism 54 disposed at the end of the frame 51 for controlling the movement of the clamping member 52 and the support member 53 along the width direction of the frame 51, and a first rod and a second rod respectively disposed on the frame 51 and the opening and closing mechanism 54 for the three-axis robot to grasp. The three-axis robot can lift the opening and closing mechanism 54 through the second rod, so that the de-adhesion fixture is in an open state.

[0047] The opening and closing mechanism 54 includes a first plate 541 slidably disposed on the outside of the frame 51 in a vertical direction, the first plate 541 being able to drive the clamping member 52 to slide along the first preset path, a second plate 542 disposed on the inside of the frame 51 and fixedly connected to the first plate 541, and a connecting rod 543 disposed on the inside of the frame 51 and rotatably connected to the frame 51, one end of the connecting rod 543 being driven by the second plate 542 to slide along the third preset path on the second plate 542, and the other end of the connecting rod 543 being connected to the support member 53.

[0048] This utility model uses specific embodiments to illustrate the principle and implementation of the utility model. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the utility model. Therefore, the content of this specification should not be construed as a limitation of the utility model.

Claims

1. A three-axis robotic arm, said three-axis robotic arm being used for the transfer of silicon wafer debonding fixtures, characterized in that, include: X-axis mechanism; The Y-axis mechanism is slidably connected to the X-axis mechanism; The Z-axis mechanism is slidably connected to the Y-axis mechanism; The pick-and-place mechanism includes a mounting base slidably connected to the Z-axis mechanism, at least two first grippers disposed on the mounting base, a top plate located on the side of the mounting base opposite to the silicon wafer, and a first drive mechanism disposed on the mounting base for driving the top plate to move toward or away from the silicon wafer.

2. The tri-axial robot of claim 1, wherein, An elastic layer is provided on the side of the top plate opposite the silicon wafer.

3. The tri-axial robot of claim 1, wherein, The picking and placing mechanism includes two first driving mechanisms, each of which is a cylinder arranged in a vertical direction. The two first driving mechanisms are connected to the two ends of the top plate.

4. The tri-axial robot of claim 1, wherein, The picking and placing mechanism includes four first grippers, which are arranged in pairs facing each other. One end of each first gripper is slidably connected to the mounting base, and the other end of each first gripper extends away from the mounting base and is bent into a hook.

5. The tri-axial robot of claim 4, wherein, At least one of the first grippers is provided with a full basket detection mechanism, the full basket detection mechanism including a first sliding piece slidably connected to the first gripper, a first sensor disposed on the top of the first sliding piece, a first detector disposed on the first gripper and opposite to the first sensor, and an elastic member disposed vertically between the first sliding piece and the first gripper; in the initial state, the first detection part of the first sliding piece is located within the gripping space of the first gripper.

6. The three-axis robot according to claim 1, characterized in that, At least one of the first grippers is provided with a basket pressure detection mechanism, the basket pressure detection mechanism including a second sliding plate slidably connected to the first gripper, a second sensor disposed on the top of the second sliding plate, and a second detector disposed on the first gripper and opposite to the second sensor; in the initial state, the second detection part of the second sliding plate is located below the first gripper.

7. The tri-axial robot of claim 1, wherein, The picking and placing mechanism further includes a crystal tray gripping assembly, which includes at least two second grippers and a second drive mechanism connected to the second grippers for controlling the opening and closing of the second grippers.

8. The three-axis robot according to claim 1, characterized in that, The X-axis mechanism includes a first bracket, a first guide rail extending along the X-axis direction on the first bracket, and a first rack parallel to the first guide rail; the Y-axis mechanism includes a second bracket, a first slider cooperating with the first guide rail on the second bracket, a first gear cooperating with the first rack, an X-axis drive mechanism for driving the first gear, a second guide rail and a second rack extending along the Y-axis direction on the second bracket; the Z-axis mechanism includes a third bracket, a second slider cooperating with the second guide rail on the third bracket, a second gear cooperating with the second rack, a Y-axis drive mechanism for driving the second gear, a third slider extending along the Z-axis direction on the second bracket, a third guide rail cooperating with the third slider on the mounting base, a third gear on the second bracket, a Z-axis drive mechanism for driving the third gear, and a third guide rail cooperating with the third gear on the mounting base.

9. A silicon wafer transfer device, comprising: The invention includes a three-axis robotic arm and a silicon wafer debonding fixture. The three-axis robotic arm is as described in any one of claims 1-8. The silicon wafer debonding fixture includes a frame, a clamping member disposed within the frame, a support member disposed within the frame and located below the clamping member, an opening and closing mechanism disposed at the end of the frame for controlling the clamping member and the support member to move along the width direction of the frame, and a first rod and a second rod respectively disposed on the frame and the opening and closing mechanism for the three-axis robotic arm to grasp. The three-axis robotic arm can lift the opening and closing mechanism through the second rod to open the debonding fixture.

10. The silicon wafer transfer device according to claim 9, characterized in that, The opening and closing mechanism includes a first plate that slides vertically on the outside of the frame, the first plate being able to drive the clamping member to slide along a first preset path, a second plate that is located on the inside of the frame and fixedly connected to the first plate, and a connecting rod that is located on the inside of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the supporting member.

Images