Wafer positioning mechanism with two-stage lifting and three-axis rotating structure

Abstract

The utility model provides a kind of wafer positioning mechanism with two-stage lifting and three-axis rotation structure, it includes support bearing assembly, primary lifting assembly, secondary lifting assembly, transverse rotating assembly, longitudinal rotating assembly, vertical rotating assembly and wafer suction assembly, the wafer positioning mechanism uses transverse parallel arrangement to primary cylinder and secondary cylinder, and install secondary cylinder in the subsidence installation platform bottom of primary carrier, substantially reduce the space occupation of mechanism in vertical direction, so that overall structure is more compact, avoid mutual interference with surrounding mechanism, and realize greater lifting stroke range in limited space, realize transverse rotary motion by transverse motor drive transverse carrier, longitudinal motor drive longitudinal carrier realizes longitudinal rotary motion, vertical motor drive vertical carrier realizes vertical rotary motion, the superposition of three-axis rotary motion makes that wafer can realize accurate positioning of any space angle, fully satisfy the demand of multi-angle wafer detection equipment.

Description

Technical Field

[0001] This utility model relates to integrated circuit manufacturing equipment, and more particularly to a wafer positioning mechanism with a two-stage lifting and three-axis rotation structure. Background Technology

[0002] Patent document CN115424959A discloses a wafer dicing positioning system, which includes a rotating support unit, a detection unit, and a control unit. The rotating support unit supports the diced wafer and drives its rotation. The detection unit detects the dicing position and includes a transmitter and a receiver. The transmitter is adapted to emit a continuous linear detection beam, and the receiver is adapted to receive the detection beam and detect the detection parameters of the beam. The control unit is electrically connected to the rotating support unit and the detection unit, and is used to drive the rotating support unit to rotate the diced wafer, drive the transmitter to emit the detection beam, drive the receiver to receive and detect the detection beam, and determine whether the location of the detection beam is the dicing position based on whether the detection parameters change. Based on the dicing position, the control unit rotates the diced edge of the wafer to a preset position. This wafer positioning system can accurately detect the dicing position of the wafer and fix the diced edge of the wafer in the preset position. However, this wafer positioning system only achieves single-axis rotation through a rotating support unit, and cannot adjust the spatial angle of the wafer in other directions, making it difficult to meet the all-round inspection requirements of modern semiconductor testing for multi-faceted wafer morphology. Therefore, it is necessary to optimize its structure to overcome the above-mentioned shortcomings. Utility Model Content

[0003] The purpose of this invention is to provide a wafer positioning mechanism with a two-stage lifting and three-axis rotation structure.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A wafer positioning mechanism with a two-stage lifting and three-axis rotation structure, comprising:

[0006] A support-bearing assembly having an assembly space;

[0007] A primary lifting assembly is installed in the support and bearing assembly and can move up and down within the support and bearing assembly.

[0008] The secondary lifting component is installed in the primary lifting component and can move up and down together with the primary lifting component, or it can move up and down independently in the primary lifting component.

[0009] A lateral rotation component is installed in the secondary lifting component and can move up and down together with the secondary lifting component, and can also move laterally independently in the secondary lifting component.

[0010] A longitudinal rotation component is installed in a transverse rotation component. It can move up and down and rotate laterally together with the transverse rotation component, and can also rotate independently during the longitudinal rotation.

[0011] A vertical rotating component is installed in a longitudinal rotating component and can move up and down, rotate laterally and rotate longitudinally together with the longitudinal rotating component. It can also rotate vertically independently in the longitudinal rotating component.

[0012] The wafer holding assembly is installed in the vertical rotating assembly. It can hold and position the wafer and move up and down, rotate laterally, rotate vertically and rotate vertically together with the vertical rotating assembly.

[0013] Specifically, the support and load-bearing components include:

[0014] The support frame is composed of assembled plates and installed in the equipment frame through connectors.

[0015] The primary lifting assembly includes:

[0016] A primary cylinder, the cylinder body of which is mounted in a support frame, and its piston rod extends vertically upward;

[0017] The primary carrier is mounted on the piston rod of the primary cylinder, and the primary cylinder drives the primary carrier to move up and down.

[0018] The secondary lifting assembly includes:

[0019] The secondary cylinder has its cylinder body installed in the primary carrier and can move up and down together with the primary carrier. Its piston rod extends vertically upward.

[0020] The secondary carrier is mounted on the piston rod of the secondary cylinder, and the secondary cylinder drives the secondary carrier to move up and down independently.

[0021] The lateral rotation component includes:

[0022] A transverse motor is installed in the secondary frame and can move up and down together with the secondary frame. Its power output shaft extends laterally.

[0023] The transverse carrier is mounted in the secondary carrier via a transverse rotating shaft and is connected to the power output shaft of the transverse motor via a transmission toothed belt. The transverse motor drives the transverse carrier to perform transverse rotational motion.

[0024] The longitudinal rotation component includes:

[0025] A longitudinal motor is installed in a transverse frame and can rotate laterally together with the transverse frame. Its power output shaft extends longitudinally.

[0026] The longitudinal carrier is mounted in the transverse carrier via a longitudinal rotating shaft and is connected to the power output shaft of the longitudinal motor via a transmission toothed belt. The longitudinal motor drives the longitudinal carrier to rotate longitudinally.

[0027] The vertical rotation component includes:

[0028] A vertical motor is installed in a longitudinal frame and can rotate longitudinally together with the longitudinal frame. Its power output shaft extends vertically.

[0029] The vertical carrier is installed in the longitudinal carrier via a vertical rotating shaft and is connected to the power output shaft of the vertical motor via a transmission gear. The vertical motor drives the vertical carrier to rotate vertically.

[0030] Wafer pick-and-place components include:

[0031] The suction and positioning plate is installed in the vertical carrier and can rotate vertically together with the vertical carrier. It is connected to the vacuum equipment through pipeline and the suction and positioning plate adsorbs and positions the crystals.

[0032] The advantages of this utility model are:

[0033] This wafer positioning mechanism employs a unique design that arranges the primary and secondary cylinders in a horizontal parallel configuration, with the secondary cylinders mounted at the bottom of the recessed mounting platform of the primary carrier. This significantly reduces the vertical space occupied by the mechanism, resulting in a more compact overall structure and preventing interference with surrounding mechanisms. Through the coordinated work of the primary and secondary cylinders, a larger lifting range is achieved within a limited space. The horizontal motor drives the horizontal carrier for horizontal rotation, the vertical motor drives the vertical carrier for vertical rotation, and the vertical motor drives the vertical carrier for vertical rotation. The superposition of these three rotational movements enables precise positioning of the wafer at any spatial angle, fully meeting the needs of multi-angle wafer inspection equipment. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the wafer positioning mechanism with a two-stage lifting and three-axis rotation structure proposed in this utility model;

[0035] Figure 2 This is a structural schematic diagram of the support and bearing assembly, the primary lifting assembly, and the secondary lifting assembly;

[0036] Figure 3 This is a front structural diagram of the horizontal rotation component, the vertical rotation component, the vertical rotation component, and the wafer holding component;

[0037] Figure 4 This is a schematic diagram of the back structure of the horizontal rotation component, the vertical rotation component, the vertical rotation component, and the wafer clamping component. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0039] like Figures 1-4 As shown, the wafer positioning mechanism with a two-stage lifting and three-axis rotation structure proposed in this utility model includes a support and bearing assembly, a primary lifting assembly, a secondary lifting assembly, a lateral rotation assembly, a longitudinal rotation assembly, a vertical rotation assembly, and a wafer clamping assembly. The support and bearing assembly has an assembly space. The primary lifting assembly is installed in the support and bearing assembly and can move up and down within the support and bearing assembly. The secondary lifting assembly is installed in the primary lifting assembly and can move up and down together with the primary lifting assembly, and can also move up and down independently within the primary lifting assembly. The lateral rotation assembly is installed in the secondary lifting assembly and can move up and down together with the secondary lifting assembly. It can independently perform lateral rotation in the secondary lifting assembly. The vertical rotation assembly is installed in the lateral rotation assembly and can perform lifting and lateral rotation together with the lateral rotation assembly. It can also independently perform vertical rotation during the vertical rotation. The vertical rotation assembly is installed in the vertical rotation assembly and can perform lifting, lateral rotation, and vertical rotation together with the vertical rotation assembly. It can also independently perform vertical rotation in the vertical rotation assembly. The wafer holding assembly is installed in the vertical rotation assembly and can hold and position the wafer. It can also perform lifting, lateral rotation, vertical rotation, and vertical rotation together with the vertical rotation assembly.

[0040] In this embodiment, the support and load-bearing assembly includes a support frame 100, which is composed of assembled plates and installed in the equipment frame through connectors.

[0041] The primary lifting assembly includes a primary cylinder 210 and a primary carrier 220. The cylinder body of the primary cylinder is installed in the support frame, and its piston rod extends vertically upward. The primary carrier is installed on the piston rod of the primary cylinder, and the primary cylinder drives the primary carrier to perform lifting and lowering movements.

[0042] The secondary lifting assembly includes a secondary cylinder 310 and a secondary carrier 320. The cylinder body of the secondary cylinder is installed in the primary carrier and can move up and down together with the primary carrier. Its piston rod extends vertically upward. The secondary carrier is installed on the piston rod of the secondary cylinder and is driven by the secondary cylinder to move up and down independently.

[0043] In this embodiment, the side of the primary carrier bends downward to form a recessed mounting platform 221. The cylinder body of the secondary cylinder is installed at the bottom of the recessed mounting platform, so that the secondary cylinder and the primary cylinder are arranged side by side in the horizontal direction, which can reduce the vertical space occupation.

[0044] In this embodiment, the support frame is also provided with a vertical guide rod 110. The secondary frame cooperates with the vertical guide rod through a linear bearing, and the vertical guide rod guides the lifting process of the secondary frame.

[0045] The lateral rotation assembly includes a lateral motor 410 and a lateral carrier 420. The lateral motor is installed in the secondary carrier and can move up and down together with the secondary carrier. Its power output shaft extends laterally. The lateral carrier is installed in the secondary carrier through a lateral rotating shaft and is connected to the power output shaft of the lateral motor through a transmission toothed belt. The lateral motor drives the lateral carrier to perform lateral rotation. This lateral rotation refers to the rotation about the lateral rotating shaft as the axis.

[0046] The longitudinal rotation assembly includes a longitudinal motor 510 and a longitudinal carrier 520. The longitudinal motor is installed in the transverse carrier and can rotate laterally together with the transverse carrier. Its power output shaft extends longitudinally. The longitudinal carrier is installed in the transverse carrier via a longitudinal rotating shaft and is connected to the power output shaft of the longitudinal motor via a transmission toothed belt. The longitudinal motor drives the longitudinal carrier to rotate longitudinally. This longitudinal rotation refers to the rotational motion with the longitudinal rotating shaft as the axis.

[0047] The vertical rotation assembly includes a vertical motor 610 and a vertical carrier 620. The vertical motor is installed in the longitudinal carrier and can rotate longitudinally together with the longitudinal carrier. Its power output shaft extends vertically. The vertical carrier is installed in the longitudinal carrier through a vertical rotating shaft and is connected to the power output shaft of the vertical motor through a transmission gear. The vertical motor drives the vertical carrier to rotate vertically. This vertical motion refers to the rotational motion with the vertical rotating shaft as the axis.

[0048] The wafer adsorption and positioning assembly includes an adsorption and positioning disk 700, which is installed in a vertical carrier and can rotate vertically together with the vertical carrier. It is connected to a vacuum device through a pipeline, and the adsorption and positioning disk adsorbs and positions the wafer.

[0049] When the mechanism is working, it first uses the coordinated action of the primary and secondary cylinders to precisely position the suction and positioning plate to the target height. Then, according to the testing requirements, the horizontal motor, vertical motor and vertical motor drive the wafer separately or in coordination to achieve precise positioning of the wafer at any angle in three-dimensional space. After the testing is completed, each actuator is reset according to the program control.

[0050] In the description of this utility model, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," "right," "horizontal," "longitudinal," and "vertical" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this utility model is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are only used for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

Claims

1. A wafer positioning mechanism having a two-stage lifting and three-axis rotating structure, characterized in that, include: A support-bearing assembly having an assembly space; A primary lifting assembly is installed in the support and bearing assembly and can move up and down within the support and bearing assembly. The secondary lifting component is installed in the primary lifting component and can move up and down together with the primary lifting component, or it can move up and down independently in the primary lifting component. A lateral rotation component is installed in the secondary lifting component and can move up and down together with the secondary lifting component, and can also move laterally independently in the secondary lifting component. A longitudinal rotation component is installed in a transverse rotation component. It can move up and down and rotate laterally together with the transverse rotation component, and can also rotate independently during the longitudinal rotation. A vertical rotating component is installed in a longitudinal rotating component and can move up and down, rotate laterally and rotate longitudinally together with the longitudinal rotating component. It can also rotate vertically independently in the longitudinal rotating component. The wafer holding assembly is installed in the vertical rotating assembly. It can hold and position the wafer and move up and down, rotate laterally, rotate vertically and rotate vertically together with the vertical rotating assembly.

2. The wafer positioning mechanism with two-stage lifting and three-axis rotating structure according to claim 1, wherein, The support and load-bearing components include: The support frame is composed of assembled plates and installed in the equipment frame through connectors.

3. The wafer positioning mechanism with two-stage lifting and three-axis rotating structure according to claim 2, wherein, The primary lifting assembly includes: A primary cylinder, the cylinder body of which is mounted in a support frame, and its piston rod extends vertically upward; The primary carrier is mounted on the piston rod of the primary cylinder, and the primary cylinder drives the primary carrier to move up and down.

4. The wafer positioning mechanism with two-stage lifting and three-axis rotating structure according to claim 3, wherein, The secondary lifting assembly includes: The secondary cylinder has its cylinder body installed in the primary carrier and can move up and down together with the primary carrier. Its piston rod extends vertically upward. The secondary carrier is mounted on the piston rod of the secondary cylinder, and the secondary cylinder drives the secondary carrier to move up and down independently.

5. The wafer positioning mechanism with two-stage lifting and three-axis rotating structure according to claim 4, wherein, The lateral rotation component includes: A transverse motor is installed in the secondary frame and can move up and down together with the secondary frame. Its power output shaft extends laterally. The transverse carrier is mounted in the secondary carrier via a transverse rotating shaft and is connected to the power output shaft of the transverse motor via a transmission toothed belt.

6. A wafer positioning mechanism with a two-stage lifting and three-axis rotation structure according to claim 5, characterized in that, The longitudinal rotation component includes: A longitudinal motor is installed in a transverse frame and can rotate laterally together with the transverse frame. Its power output shaft extends longitudinally. The longitudinal carrier is mounted in the transverse carrier via a longitudinal rotating shaft and is connected to the power output shaft of the longitudinal motor via a transmission toothed belt.

7. The wafer positioning mechanism with two-stage lifting and three-axis rotating structure according to claim 6, wherein, The vertical rotation component includes: A vertical motor is installed in a longitudinal frame and can rotate longitudinally together with the longitudinal frame. Its power output shaft extends vertically. A vertical support frame is mounted in a longitudinal support frame via a vertical rotating shaft and engages with the power output shaft of a vertical motor via a transmission gear.

8. A wafer positioning mechanism with a two-stage lifting and three-axis rotation structure according to claim 7, characterized in that, Wafer pick-and-place components include: The suction and loading plate is installed in the vertical frame and can rotate vertically together with the vertical frame. It is connected to the vacuum equipment through pipelines.

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