Wafer bonding positioning assembly

Abstract

A wafer bonding positioning assembly, including a positioning assembly, a shell, a gas cylinder, a lifting plate and a bearing table, the positioning assembly includes a top rod, a pressing assembly and an inclined plate I, the bottom end of the top rod is fixedly connected with the execution part of a motor I, and the top end is provided with the inclined plate I, the execution end of the pressing assembly is arranged on the inclined plate I, the lower wafer is positioned by the inclined plate II and placed on the bearing table, then the upper wafer is placed on the bearing plate and positioned by the inclined plate I, and then the upper wafer is aligned with the lower wafer and falls, in the process of falling of the upper wafer, the upper wafer is pressed downward by the turning plate, the process of falling of the upper wafer is accelerated, the sliding phenomenon caused by the air film to the wafer is reduced, and the accuracy of wafer stacking bonding is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer alignment and positioning technology, specifically a wafer bonding positioning component. Background Technology

[0002] The alignment device disclosed in CN220290780U is capable of precisely aligning two wafers, including a receiving assembly and an alignment assembly. The receiving assembly includes a receiving platform for holding and adsorbing the first wafer. The alignment assembly includes multiple aligning units, multiple receiving units, and a lifting drive unit. The multiple aligning units and multiple receiving units are arranged alternately around the periphery of the receiving platform along its circumference. The lifting drive unit drives the multiple aligning units and multiple receiving units to move synchronously in the vertical direction.

[0003] The aforementioned prior art uses two inclined planes with different directions to position the upper wafer relative to the lower wafer. However, during the process of the upper wafer falling to the lower wafer when the receiving component is withdrawn, the upper inclined plane loses its positioning function for the upper wafer, and an air film is formed between the upper and lower wafers. This can easily cause the wafer to slip during the falling process, reducing the positioning accuracy of the two wafers. Utility Model Content

[0004] The purpose of this invention is to provide a wafer bonding and positioning component to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A wafer bonding positioning assembly includes a positioning component, a housing, a cylinder, a lifting plate, and a support platform. The housing has an internal cavity. The lifting plate is vertically and movably mounted in the cavity via the cylinder. At least three positioning components are arranged in a circumferential array on the lifting plate. A motor I of the positioning component is fixedly mounted on the lifting plate. The support platform covers the opening of the cavity and has through slots equal in number to the number of positioning components for the actuating ends of the positioning components to pass through. The positioning component also includes a push rod, a pressing component, and an inclined plate I. The bottom end of the push rod is fixedly connected to the actuating part of the motor I, and the top end is provided with the inclined plate I. The actuating end of the pressing component is disposed on the inclined plate I.

[0006] Furthermore, the pressing assembly includes a flap, a spring, rack I, a gear, and a motor II as the actuating end. The flap is rotatably mounted on the inclined panel I with its rotation axis located at the lower edge of the flap. The outer side of the flap is flush with the inclined panel I. One end of the spring is fixed to the inner side of the flap, and the other end is fixed to the rack I. The rack I is slidably mounted on the end of the push rod and meshes with the gear rotatably mounted on the push rod. The gear is poweredly connected to the motor II.

[0007] Furthermore, the positioning component also includes a receiving plate, which is horizontally and movably installed at the end of the top rod, and the receiving plate is located at the bottom end of the inclined plate I and slides in cooperation with the inclined plate I. A rack II is fixedly connected to the receiving plate, and the rack II meshes with a gear. The teeth of the rack I and the rack II are arranged opposite to each other.

[0008] Furthermore, the positioning component also includes an inclined plate II, which is fixed to the side of the inclined plate I.

[0009] Compared with the prior art, the beneficial effects of this utility model are: This invention uses inclined plate II to position the lower wafer and place it on the support platform. Then, the upper wafer is placed on the receiving plate and positioned by inclined plate I. The upper wafer is then aligned with the lower wafer and lowered. During the descent of the upper wafer, a flip plate is used to press the upper wafer down, accelerating the descent process, reducing the slippage of the wafer caused by the air film, and improving the accuracy of wafer stacking and bonding. Attached Figure Description

[0010] Figure 1 This is an isometric schematic diagram of the present invention; Figure 2 This is a cross-sectional structural diagram of the present invention; Figure 3 This utility model Figure 2 A partial view of section A in the middle; Figure 4 This is an isometric view of the pressing component of this utility model; Figure 5 This is an isometric view of the rear view of the pressure component of this utility model.

[0011] In the diagram: 1 Positioning component, 11 Motor I, 12 Top rod, 13 Pressing component, 131 Flip plate, 132 Spring, 133 Rack I, 134 Gear, 135 Motor II, 14 Inclined panel I, 15 Support plate, 16 Rack II, 17 Inclined panel II, 2 Housing, 3 Cylinder, 4 Lifting plate, 5 Support platform. Detailed Implementation

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0013] Example: Please see Figures 1 to 5 This utility model provides a technical solution for a wafer bonding positioning component: A wafer bonding positioning assembly includes a positioning component 1, a housing 2, a cylinder 3, a lifting plate 4, and a support platform 5. The housing 2 has a cavity inside, such as... Figure 2 As shown, the lifting plate 4 is vertically mounted in the cavity via a cylinder 3. At least three positioning components 1 are arranged in a circumferential array on the lifting plate 4. The cylinder 3 controls the height of the positioning components 1 by controlling the height of the lifting plate 4. A motor I11 of each positioning component 1 is fixedly mounted on the lifting plate 4, and the motor I11 controls the rotation of the positioning component 1. A support platform 5 covers the opening of the cavity, and wafers are placed on the support platform 5. The support platform 5 has the same number of through slots as the positioning components 1 for positioning. The actuator of the positioning component 1 passes through it. By controlling the lifting and rotation of the positioning component 1, the positioning and storage of the positioning component 1 are controlled. The positioning component 1 also includes a top rod 12, a pressing component 13, and an inclined plate I 14. The bottom end of the top rod 12 is fixedly connected to the actuator of the motor I 11, and the top end is provided with the inclined plate I 14. The actuator of the pressing component 13 is provided on the inclined plate I 14. The positioning of the upper wafer is achieved through the inclined plate I 14. The actuator of the pressing component 13 applies downward pressure to the upper wafer to accelerate the falling speed of the wafer.

[0014] As a preferred embodiment, such as Figure 3 As shown, the pressing assembly 13 includes a flap 131 as the actuating end, a spring 132, a rack I 133, a gear 134, and a motor II 135. The flap 131 is rotatably mounted on the inclined panel I 14 with its rotation axis located at the lower edge of the flap 131, ensuring that the flap 131 can perform the pressing action. The outer side of the flap 131 is flush with the inclined panel I 14 to prevent any protrusions from scraping against the edge of the upper wafer when it is placed. One end of the spring 132 is fixed to the inner side of the flap 131, and the other end is fixed to the inner side of the spring 132. The rack I 133 is fixedly connected to the end, and the spring 132 provides a buffer when the flip plate 131 presses the upper wafer to avoid excessive downward pressure causing scratches on the surface of the upper wafer. The rack I 133 is slidably mounted on the end of the top rod 12 and meshes with the gear 134 rotatably mounted on the top rod 12. The gear 134 is powered by the motor II 135. The motor II 135 controls the rotation of the gear 134, thereby controlling the movement of the rack I 133, and then controlling the flip plate 131 to flip down and reset through the spring 132.

[0015] As a preferred embodiment, such as Figure 4As shown, the positioning component 1 also includes a receiving plate 15, which is horizontally and movably installed at the end of the top rod 12. The receiving plate 15 is located at the bottom of the inclined plate I 14 and slides in cooperation with the inclined plate I 14. The receiving plate 15 is used to place the wafer. The upper wafer is first positioned on the receiving plate 15, and then the upper wafer is placed on the lower wafer. A rack II 16 is fixedly connected to the receiving plate 15. The rack II 16 meshes with the gear 134. The rotation of the gear 134 controls the extension and retraction of the receiving plate 15. The teeth of the rack I 133 and the rack II 16 are arranged opposite to each other. Through the opposite arrangement of the two racks, the rack I 133 and the rack II 16 form opposite movements during the rotation of the gear 134.

[0016] In a preferred embodiment, the positioning component 1 further includes a slanted panel II 17, which is fixed to the side of the slanted panel I 14 and is used to position the lower wafer.

[0017] The working principle of this utility model is as follows: First, the control cylinder 3 is extended, lifting the lifting plate 4 and the positioning component 1 connected to the lifting plate 4. The motor I 11 controls the top rod 12 to rotate and adjust the orientation of the pressing component 13 and the inclined plate I 14, so that they pass through the through slot of the support platform 5. The pressing component 13 works above the support platform 5. At this time, the lower end of the inclined plate II 17 is flush with the upper surface of the support platform 5, and the inclined plate II 17 is not aligned with the center of the lower wafer. The lower wafer is placed on the support platform 5. The top rod 12 rotates synchronously to adjust the orientation of all the inclined plates II 17. Since the positioning components 1 are arranged in a circumferential array, the lower wafer is simultaneously prevented from moving, thus achieving the positioning of the lower wafer. Then, the top rod 12 rotates synchronously to make all the inclined plates I 14 face the center of the lower wafer. At this time, the receiving plate 15 is higher than the upper surface of the lower wafer. The upper wafer is placed on all the inclined plates I 14. On the receiving plate 15, the push rod 12 rotates synchronously again, making the upper wafer unable to move, thus achieving the positioning of the upper wafer. The motor II 135 controls the gear 134 to rotate, causing the rack I 133 to move towards the flip plate 131, driving the flip plate 131 to flip downward and press the upper wafer. At the same time, the gear 134 causes the rack II 16 and the receiving plate 15 connected to the rack II 16 to contract, causing the upper wafer to lose support and fall. During the fall, the upper wafer is subjected to downward pressure due to the action of the spring 132 and the flip plate 131, thereby accelerating the fall speed. When the upper wafer and the lower wafer are in contact, the gear 134 reverses, causing the flip plate 131 and the receiving plate 15 to reset. Then, the cylinder 3 and the motor I 11 are adjusted to make the positioning component 1 return to below the support platform 5.

[0018] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer bonding positioning assembly, comprising a positioning component (1), a housing (2), a cylinder (3), a lifting plate (4), and a support platform (5), wherein the housing (2) has a cavity, the lifting plate (4) is vertically and movably mounted in the cavity via the cylinder (3), at least three positioning components (1) are arranged in a circumferential array on the lifting plate (4), the motor I (11) of the positioning component (1) is fixedly mounted on the lifting plate (4), the support platform (5) covers the opening of the cavity, and the support platform (5) has the same number of through slots as the positioning components (1) for the actuating end of the positioning component (1) to pass through, characterized in that: The positioning component (1) also includes a top rod (12), a pressing component (13) and an inclined plate I (14). The bottom end of the top rod (12) is fixedly connected to the actuator of the motor I (11), and the top end is provided with the inclined plate I (14). The actuator end of the pressing component (13) is provided on the inclined plate I (14).

2. A wafer bonding positioning assembly as claimed in claim 1, wherein: The pressing assembly (13) includes a flap (131), a spring (132), a rack I (133), a gear (134), and a motor II (135) as the actuating end. The flap (131) is rotatably mounted on the inclined panel I (14) with the axis of rotation located at the lower edge of the flap (131). The outer side of the flap (131) is flush with the inclined panel I (14). One end of the spring (132) is fixed to the inner side of the flap (131), and the other end is fixed to the rack I (133). The rack I (133) is slidably mounted on the end of the push rod (12) and meshes with the gear (134) rotatably mounted on the push rod (12). The gear (134) is poweredly connected to the motor II (135).

3. A wafer bonding positioning assembly as claimed in claim 2, wherein: The positioning component (1) also includes a receiving plate (15), which is horizontally and movably installed at the end of the top rod (12). The receiving plate (15) is located at the bottom of the inclined plate I (14) and slides with the inclined plate I (14). A rack II (16) is fixedly connected to the receiving plate (15). The rack II (16) meshes with the gear (134) at the same time. The teeth of the rack I (133) and the rack II (16) are arranged opposite to each other.

4. A wafer bonding positioning assembly as claimed in claim 3, wherein: The positioning component (1) also includes a sloping panel II (17), which is fixed to the side of the sloping panel I (14).

Images