Silicon wafer alignment mechanism and silicon wafer feeding equipment

Abstract

This utility model belongs to the technical field of battery cell loading machines, and particularly relates to a silicon wafer alignment mechanism and silicon wafer loading equipment. The silicon wafer alignment mechanism includes: a driving component and a plurality of alignment components; the driving component is connected to the alignment components to drive the alignment components to move and align the corresponding silicon wafers; the alignment components include: a pair of opposing clamping plates; the driving component is adapted to drive the two clamping plates to move closer or further apart, so as to align the silicon wafers between them when the two plates are close together, thereby realizing that the alignment components can align multiple silicon wafers at the same time.

Description

Technical Field

[0001] This utility model belongs to the technical field of battery cell feeding machines, and particularly relates to a silicon wafer alignment mechanism and silicon wafer feeding equipment. Background Technology

[0002] During the manufacturing process of silicon wafers, feeding and conveying are required. During the feeding process, the silicon wafers may tilt, so they need to be straightened. However, the relevant technologies cannot straighten multiple silicon wafers at the same time, resulting in low efficiency of conveying and straightening.

[0003] Therefore, due to the inability to simultaneously align multiple silicon wafers, resulting in low efficiency in conveying and aligning, it is necessary to design a silicon wafer aligning mechanism and silicon wafer feeding equipment.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one silicon wafer alignment mechanism and silicon wafer feeding equipment.

[0006] In a first aspect, embodiments of this disclosure provide a silicon wafer alignment mechanism, comprising: Driver components, and several correction components; The driving component is connected to the correction component to drive the correction component to move and correct the corresponding silicon wafer; The correction component includes: a pair of opposing clamps; The drive assembly is adapted to move the two clamping plates closer or further apart, so as to align the silicon wafer between them when the two plates are close together.

[0007] In one optional implementation, two adjacent straightening components are grouped together. In the two straightening components in the same group, the shapes of the adjacent clamps of different straightening components are adapted, that is, the protrusion provided on the side wall of one clamp is adapted to the recess provided on the side wall of the other clamp, so that when the two clamps are close together, the protrusion is embedded into the corresponding recess.

[0008] In one alternative embodiment, at least two screw holes are provided on the protrusion of the clamping plate, and when the two clamping plates are close to the protrusion and inserted into the corresponding recess, all the screw holes on the two clamping plates are in a straight line.

[0009] In one alternative embodiment, the top surface of the clamp is provided with a plurality of pins, and the top of the pins is provided with silicone.

[0010] In one optional implementation, the drive component includes: a drive motor; The drive motor is mounted on the bracket, and a driven wheel is rotatably mounted on the bracket; The output end of the drive motor is connected to a roller, and a belt is provided between the roller and the driven wheel.

[0011] In one alternative embodiment, the belt is connected to side plates on opposite sides, and two clamps in a straightening assembly are connected to the top surfaces of different side plates.

[0012] In one optional embodiment, the bracket is provided with a guide rail, and a slider is connected to the bottom of the side plate, the slider being slidably connected to the guide rail; The guide rail is located below the belt.

[0013] In one alternative embodiment, the bracket is provided with a slide rail located above the belt, and the portion of the clamp extending from the corresponding side plate contacts the top surface of the slide rail.

[0014] Secondly, embodiments of this disclosure also provide a silicon wafer loading device, comprising: The feeding device, the conveying device, and the aforementioned silicon wafer alignment mechanism; The silicon wafer alignment mechanism is located at the conveying device, and the feeding device is configured to feed silicon wafers to the conveying device, and then the silicon wafer alignment mechanism aligns the silicon wafers on the conveying device.

[0015] In one optional implementation, the silicon wafer alignment mechanism includes: Driver components, and several correction components; The driving component is connected to the correction component to drive the correction component to move and correct the corresponding silicon wafer; The correction component includes: a pair of opposing clamps; The clamping plate is connected to the drive assembly; The drive assembly is adapted to move the two clamping plates closer or further apart, so as to align the silicon wafer between them when the two plates are close together; Two adjacent straightening components form a group. In the two straightening components in the same group, the shapes of the adjacent clamps of different straightening components are adapted, that is, the protrusion provided on the side wall of one clamp is adapted to the recess provided on the side wall of the other clamp, so that when the two clamps are close, the protrusion is embedded into the corresponding recess. At least two screw holes are provided on the protrusion of the clamping plate. When the two clamping plates are close to the protrusion and inserted into the corresponding recess, all the screw holes on the two clamping plates are in a straight line.

[0016] The beneficial effects of this utility model are that the silicon wafer alignment mechanism includes: a driving component and a plurality of alignment components; the driving component is connected to the alignment components to drive the alignment components to move in order to align the corresponding silicon wafers; the alignment components include: a pair of opposing clamping plates; the driving component is adapted to drive the two clamping plates to move closer or further apart, so as to align the silicon wafer between the two when the two plates are close together, thereby realizing that the alignment components can align multiple silicon wafers at the same time.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a silicon wafer alignment mechanism provided in an embodiment of this disclosure; Figure 2 An exploded view of a silicon wafer alignment mechanism provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of a corrected movement direction provided in an embodiment of the present disclosure.

[0021] In the picture: 1. Drive assembly, 11. Drive motor, 12. Driven wheel, 13. Roller, 14. Belt, 15. Side plate, 16. Slider, 17. Guide rail, 18. Slide rail; 2. Alignment component, 21. Clamping plate, 22. Protrusion, 23. Recess, 24. Screw hole, 25. Ejector pin, 26. Silicone; 3 supports. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0024] During the manufacturing process of silicon wafers, feeding and conveying are required. During the feeding process, the silicon wafers may tilt, so they need to be straightened. However, the relevant technologies cannot straighten multiple silicon wafers at the same time, resulting in low efficiency of conveying and straightening.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] like Figure 1 and Figure 2 As shown, at least one disclosed embodiment provides a silicon wafer alignment mechanism, including: a driving component 1 and a plurality of alignment components 2; the driving component 1 is connected to the alignment components 2 to drive the alignment components 2 to move in order to align the corresponding silicon wafers; the alignment components 2 include: a pair of opposing clamping plates 21; the clamping plates 21 are connected to the driving component 1; the driving component 1 is adapted to drive the two clamping plates 21 to move closer or further away from each other, so as to align the silicon wafer between the two when the two plates are close together, thereby realizing that the alignment components 2 can simultaneously align multiple silicon wafers.

[0028] like Figure 1 and Figure 2 As shown, in one optional embodiment, two adjacent straightening components 2 are grouped together. In the two straightening components 2 in the same group, the adjacent clamping plates 21 of different straightening components 2 are adapted in shape, that is, the protrusion 22 provided on the side wall of one clamping plate 21 is adapted to the recess 23 provided on the side wall of the other clamping plate 21, so that when the two clamping plates 21 are close together, the protrusion 22 is embedded into the corresponding recess 23.

[0029] In this embodiment, in each alignment component 2, the right-side clamping plates 21 move in the same direction at the same time, and the left-side clamping plates 21 move in the same direction at the same time, so that each set of alignment components 2 synchronously aligns the silicon wafer at the same time. For example, Figure 3 As shown, when it is necessary to align the silicon wafer, the left clamping plate 21 moves in the F1 direction, and the right clamping plate 21 moves in the F2 direction.

[0030] In this embodiment, a conveying device can be used between the two clamping plates 21 of the same straightening component 2. The conveying device transports silicon wafers via a conveyor belt. The silicone 26 on the top of the ejector pin 25 is aligned with the silicon wafer so that when the two clamping plates 21 are close together, the silicone 26 contacts the silicon wafer to achieve straightening while avoiding damage to the silicon wafer.

[0031] In this embodiment, by adapting the protrusion 22 and the recess 23, the total width of the two clamping plates 21 is reduced. It is only necessary to ensure that the protrusion 22 on each clamping plate 21 meets the requirements for opening two screw holes 24, and the remaining part can be used as the recess 23. After the protrusion 22 and the recess 23 of the two clamping plates 21 are matched, the total width of the two clamping plates 21 will be reduced, resulting in a smaller space occupied. With a fixed space, this design can set more alignment components 2 to meet the requirement of simultaneously aligning more silicon wafers. For example, two sets of four alignment components 2 can be set at the same time to simultaneously align four 210mm*52.2mm silicon wafers (half-wafers).

[0032] like Figure 1 and Figure 2 As shown, in an optional embodiment, at least two screw holes 24 are provided on the protrusion 22 of the clamping plate 21. When the two clamping plates 21 are close to the protrusion 22 and embedded into the corresponding recess 23, all the screw holes 24 on the two clamping plates 21 are in the same straight line, so as to reduce the space occupied by the clamping plate 21.

[0033] In this embodiment, the clamping plate 21 can be more securely connected to the corresponding side plate 15 through the two screw holes 24 to prevent loosening, and the outer screw hole 24 can facilitate adjustment.

[0034] like Figure 1 and Figure 2As shown, in one optional embodiment, the top surface of the clamping plate 21 is provided with a plurality of ejector pins 25, and the top of the ejector pins 25 is provided with silicone 26.

[0035] In this embodiment, silicone 26 can prevent damage to the silicon wafer.

[0036] like Figure 1 and Figure 2 As shown, in one optional embodiment, the drive assembly 1 includes: a drive motor 11; the drive motor 11 is mounted on a bracket 3, and a driven wheel 12 is rotatably mounted on the bracket 3; the output end of the drive motor 11 is connected to a roller 13, and a belt 14 is provided between the roller 13 and the driven wheel 12.

[0037] In this embodiment, the drive motor 11 can drive the belt 14 to rotate through the cooperation of the roller 13 and the driven wheel 12.

[0038] like Figure 1 and Figure 2 As shown, in an optional embodiment, the belt 14 is connected to two opposite sides of a side plate 15, and two clamps 21 in a straightening assembly 2 are connected to the top surfaces of different side plates 15.

[0039] In this embodiment, for example, the left clamping plate 21 of all the straightening components 2 is disposed on one side plate 15, and the right clamping plate 21 is disposed on another side plate 15.

[0040] like Figure 1 and Figure 2 As shown, in one optional embodiment, the bracket 3 is provided with a guide rail 17, and the bottom of the side plate 15 is connected to a slider 16, which is slidably connected to the guide rail 17; the guide rail 17 is located below the belt 14.

[0041] In this embodiment, when the belt 14 rotates, the two side plates 15 move in opposite directions, causing the two clamping plates 21 in the same straightening assembly 2 to move in opposite directions, and the two plates move closer to each other or further away from each other.

[0042] In this embodiment, when the side plate 15 moves, the slider 16 moves along the guide rail 17 to guide and limit the movement of the side plate 15, preventing the side plate 15 from shifting and causing the clamping plate 21 to shift, thus ensuring the alignment effect.

[0043] like Figure 1 and Figure 2 As shown, in an optional embodiment, the bracket 3 is provided with a slide rail 18, the slide rail 18 is located above the belt 14, and the portion of the clamping plate 21 extending from the corresponding side plate 15 contacts the top surface of the slide rail 18.

[0044] In this embodiment, the clamping plate 21 contacts the slide rail 18, and the slide rail 18 supports and limits the movement of the clamping plate 21 to prevent the clamping plate 21 from shifting.

[0045] At least one other disclosed embodiment also provides a silicon wafer loading device, including: a loading device, a conveying device, and the aforementioned silicon wafer alignment mechanism; the silicon wafer alignment mechanism is disposed at the conveying device, and the loading device is configured to load silicon wafers onto the conveying device and then align the silicon wafers on the conveying device via the silicon wafer alignment mechanism.

[0046] In one optional embodiment, the silicon wafer alignment mechanism includes: a driving component 1 and a plurality of alignment components 2; the driving component 1 is connected to the alignment components 2 to drive the alignment components 2 to move and align the corresponding silicon wafers; the alignment components 2 include: a pair of opposing clamping plates 21; the clamping plates 21 are connected to the driving component 1; the driving component 1 is adapted to drive the two clamping plates 21 to move closer or further apart, so as to align the silicon wafer between them when the two plates are close together; adjacent alignment components 2 form a group. In the two alignment components 2 in the same group, the adjacent clamping plates 21 of the different alignment components 2 are adapted in shape, that is, the protrusion 22 provided on the side wall of one clamping plate 21 is adapted to the recess 23 provided on the side wall of the other clamping plate 21, so that when the two clamping plates 21 are close together, the protrusion 22 is embedded in the corresponding recess 23; at least two screw holes 24 are provided on the protrusion 22 of the clamping plate 21, and when the two clamping plates 21 are close together and the protrusion 22 is embedded in the corresponding recess 23, all the screw holes 24 on the two clamping plates 21 are in the same straight line.

[0047] In summary, this silicon wafer alignment mechanism includes: a driving component 1 and several alignment components 2; the driving component 1 is connected to the alignment components 2 to drive the alignment components 2 to move and align the corresponding silicon wafers; the alignment components 2 include: a pair of opposing clamping plates 21; the clamping plates 21 are connected to the driving component 1; the driving component 1 is adapted to drive the two clamping plates 21 to move closer or further apart, so as to align the silicon wafer between them when the two plates are close together, thereby realizing that the alignment components 2 can align multiple silicon wafers simultaneously.

[0048] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0049] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0050] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0051] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon wafer alignment mechanism, characterized in that, include: The driving component (1) and several correction components (2); The driving component (1) is connected to the correction component (2) to drive the correction component (2) to move in order to correct the corresponding silicon wafer; The correction component (2) includes: a pair of opposing clamps (21); The drive assembly (1) is adapted to move the two clamping plates (21) closer or further apart to align the silicon wafer between them when the two plates are close together.

2. The silicon wafer alignment mechanism as described in claim 1, characterized in that, Two adjacent straightening components (2) form a group. In the two straightening components (2) in the same group, the adjacent clamps (21) of different straightening components (2) are adapted in shape. That is, the protrusion (22) provided on the side wall of one clamp (21) is adapted to the recess (23) provided on the side wall of the other clamp (21) so that when the two clamps (21) are close, the protrusion (22) is embedded in the corresponding recess (23).

3. The silicon wafer alignment mechanism as described in claim 2, characterized in that, At least two screw holes (24) are provided on the protrusion (22) of the clamping plate (21). When the two clamping plates (21) are close to the protrusion (22) and embedded in the corresponding recess (23), all the screw holes (24) on the two clamping plates (21) are in the same straight line.

4. The silicon wafer alignment mechanism as described in claim 1, characterized in that, The top surface of the clamp (21) is provided with a plurality of ejector pins (25), and the top of the ejector pins (25) is provided with silicone (26).

5. The silicon wafer alignment mechanism as described in claim 1, characterized in that, The drive assembly (1) includes: a drive motor (11); The drive motor (11) is mounted on the bracket (3), and a driven wheel (12) is rotatably mounted on the bracket (3). The output end of the drive motor (11) is connected to a roller (13), and a belt (14) is provided between the roller (13) and the driven wheel (12).

6. The silicon wafer alignment mechanism as described in claim 5, characterized in that, The belt (14) is connected to two side plates (15) on opposite sides, and two clamps (21) in a correction assembly (2) are connected to the top surfaces of different side plates (15).

7. The silicon wafer alignment mechanism as described in claim 5, characterized in that, The bracket (3) is provided with a guide rail (17), and the bottom of the side plate (15) is connected to a slider (16), which is slidably connected to the guide rail (17). The guide rail (17) is located below the belt (14).

8. The silicon wafer alignment mechanism as described in claim 5, characterized in that, The bracket (3) is provided with a slide rail (18), which is located above the belt (14). The part of the clamp (21) extending from the corresponding side plate (15) contacts the top surface of the slide rail (18).

9. A silicon wafer feeding device, characterized in that, include: The feeding device, the conveying device, and the silicon wafer alignment mechanism as described in any one of claims 1-8; The feeding device is configured to feed silicon wafers to the conveying device, and then straighten the silicon wafers on the conveying device by a silicon wafer straightening mechanism.

10. The silicon wafer feeding equipment as described in claim 9, characterized in that, The silicon wafer alignment mechanism includes: The driving component (1) and several correction components (2); The driving component (1) is connected to the correction component (2) to drive the correction component (2) to move in order to correct the corresponding silicon wafer; The correction component (2) includes: a pair of opposing clamps (21); The drive assembly (1) is adapted to drive the two clamping plates (21) to move closer or further apart, so as to align the silicon wafer between the two plates when they are close together; Two adjacent straightening components (2) form a group. In the two straightening components (2) in the same group, the adjacent clamps (21) of different straightening components (2) are adapted in shape. That is, the protrusion (22) provided on the side wall of one clamp (21) is adapted to the recess (23) provided on the side wall of the other clamp (21) so that when the two clamps (21) are close, the protrusion (22) is embedded into the corresponding recess (23). At least two screw holes (24) are provided on the protrusion (22) of the clamping plate (21). When the two clamping plates (21) are close to the protrusion (22) and embedded in the corresponding recess (23), all the screw holes (24) on the two clamping plates (21) are in the same straight line.

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