Positioning and Adjustment Carrier Plate System

Abstract

This utility model relates to the field of chip manufacturing technology and discloses a positioning and adjustment carrier system. The chip carrier has at least three sets of positioning feature holes. The chip carrier is fixed to an adjustment mechanism, which moves the chip carrier to the monitoring and illumination range of a camera lens. The camera lens is used to photograph the positioning feature holes on the chip carrier to identify the position of the chip carrier. The image captured by the camera lens is analyzed by the host computer to calculate the tilt angle of the chip carrier. The adjustment mechanism is communicatively connected to the camera lens and can receive the tilt angle of the chip carrier to adjust and flatten the chip carrier accordingly, assisting the chip carrier to better transfer the chip, improve alignment accuracy and detection accuracy, and ensure packaging quality. The positioning feature holes, which occupy a small area, serve as alignment marks on the chip carrier. They work in conjunction with the camera lens and adjustment mechanism to perform alignment operations, avoiding electrical connection failures caused by misalignment.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a carrier board system for positioning and adjustment. Background Technology

[0002] As the integration level of integrated circuit chips gradually increases and their size gradually decreases, semiconductor chips are constantly developing towards miniaturization, high density, and high integration, which in turn increases the difficulty of alignment.

[0003] In chip inspection, it is required to identify the defect features of different chips and mark the defective chips. This places requirements on vision inspection systems such as rapid dynamic detection and variable distance detection. In addition, in the packaging alignment process, in order to ensure chip transfer and packaging quality, high requirements are placed on the alignment accuracy of the chips.

[0004] Misalignment can lead to electrical connection failures. For example, before packaging semiconductors for new displays such as QLED (Quantum Dot Light-Emitting Diode), OLED (Organic Light-Emitting Diode), MiniLED (Sub-millimeter Light-Emitting Diode), and MicroLED (Micro Light-Emitting Diode), high-precision defect and orientation detection and multi-degree-of-freedom precise alignment of the chips and other workpieces must be performed to ensure the final product quality, thereby improving semiconductor product yield and production efficiency.

[0005] Existing chip alignment systems can use overlay marks for alignment, but these marks are large and occupy a significant amount of chip area, reducing the usable chip area. Utility Model Content

[0006] The purpose of this invention is to provide a carrier plate system for positioning and adjustment.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] The positioning and adjustment carrier board system includes:

[0009] A chip carrier board, wherein the chip carrier board is provided with at least three sets of positioning feature holes;

[0010] A camera lens, used to photograph the positioning feature hole to calculate the tilt angle of the chip carrier;

[0011] An adjustment mechanism is communicatively connected to the camera lens. The chip carrier is fixed to the adjustment mechanism, which can receive the tilt angle of the chip carrier to adjust and flatten the chip carrier.

[0012] As an optional technical solution for the positioning adjustment carrier board system, the chip carrier board is provided with three sets of positioning feature holes, and the three sets of positioning feature holes are not arranged in the same line.

[0013] As an optional technical solution for the positioning and adjustment carrier board system, the chip carrier board is provided with four sets of positioning feature holes, and the four sets of positioning feature holes are not arranged in the same line.

[0014] As an optional technical solution for the carrier plate system for positioning and adjustment, the four sets of positioning feature holes are divided into three sets of forming holes and one set of preparatory holes.

[0015] As an optional technical solution for the positioning and adjustment carrier board system, the positioning feature holes are set one-to-one with the edges of the chip carrier board.

[0016] As an optional technical solution for the positioning and adjustment carrier board system, the positioning feature hole is set at a preset distance from the edge of the chip carrier board.

[0017] As an optional technical solution for the positioning and adjustment carrier plate system, the positioning feature holes have a feature orientation, and the feature orientations of two adjacent sets of positioning feature holes are opposite.

[0018] As an optional technical solution for the carrier plate system for positioning and adjustment, each group of positioning feature holes includes multiple single holes.

[0019] As an optional technical solution for the positioning and adjustment carrier board system, the adjustment mechanism is equipped with at least four adjustment platforms so that the chip carrier board has at least four degrees of freedom on the adjustment mechanism.

[0020] The beneficial effects of this utility model are:

[0021] The positioning and adjustment carrier system provided by this utility model includes a chip carrier, a camera lens, and an adjustment mechanism. The chip carrier has at least three sets of positioning feature holes. The chip carrier is fixed to the adjustment mechanism, which moves the chip carrier within the monitoring range of the camera lens. The camera lens can be used to photograph the positioning feature holes on the chip carrier to identify its position. The images captured by the camera lens are analyzed by the host computer to calculate the center and tilt angle of the chip carrier. The adjustment mechanism is communicatively connected to the camera lens and can receive data such as the tilt angle of the chip carrier to adjust and level it accordingly. This assists the chip carrier in better transferring the chip, improving alignment and detection accuracy, and ensuring packaging quality. The positioning feature holes, which occupy a small area, serve as alignment marks on the chip carrier and are only placed in necessary positions. Working in conjunction with the camera lens and adjustment mechanism, they facilitate alignment operations and prevent electrical connection failures caused by misalignment. Attached Figure Description

[0022] Figure 1 This is a structural schematic diagram of the positioning and adjustment carrier plate system provided in a specific embodiment of this utility model.

[0023] In the picture:

[0024] 100, Chip carrier board; 110, Molding hole; 120, Preparing hole; 200, Camera lens. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0026] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0029] like Figure 1 As shown, this utility model discloses a positioning and adjustment carrier system, including a chip carrier 100, a camera lens 200, and an adjustment mechanism. The chip carrier 100 has at least three sets of positioning feature holes. The chip carrier 100 is fixed to the adjustment mechanism, which moves the chip carrier within the monitoring illumination range of the camera lens 200. The camera lens 200 can be used to photograph the positioning feature holes on the chip carrier 100 to identify its position. The images captured by the camera lens 200 are analyzed and calculated by the host computer to determine the center and tilt angle of the chip carrier 100. The adjustment mechanism is communicatively connected to the camera lens 200 and can receive data such as the tilt angle of the chip carrier 100 to adjust and flatten the chip carrier 100 accordingly. This assists the chip carrier 100 in better transferring chips, improving alignment and detection accuracy, and ensuring packaging quality. The positioning feature holes occupying a small area are used as alignment marks on the chip carrier board 100, and are only placed in necessary positions. They are used in conjunction with the camera lens 200 and the adjustment mechanism to perform alignment operations, so as to avoid electrical connection failure caused by misalignment.

[0030] For example, the principle by which the host of the camera lens 200 can determine the center and tilt angle of the chip carrier 100 is based on the technical principle of monocular vision. Monocular vision systems achieve environmental perception based on the geometric transformation from three-dimensional space to two-dimensional images. It is a well-known and mature technology in the field of computer vision (referring to machine vision that uses cameras and computers to replace human eyes for target recognition, tracking, and measurement). Its core principle is to establish an imaging model through three-dimensional spatial transformation of the world coordinate system, camera coordinate system, and pixel coordinate system, and combine it with the pinhole imaging principle to complete the depth estimation and localization of the target object. The camera lens 200 can adopt various machine vision technologies and cameras existing in the art, and those skilled in the art can choose based on their knowledge and capabilities.

[0031] In one embodiment, the chip carrier 100 is provided with three sets of positioning feature holes, and the three sets of positioning feature holes are not arranged in a coaxial line. The two adjacent sets of positioning feature holes are respectively arranged on opposite sides of the chip carrier 100. Therefore, at least three sets of positioning feature holes are sufficient to determine the position information of the entire chip carrier 100. The camera lens 200 also pre-records the size and shape of the positioning feature holes for easy shooting and calculation.

[0032] In another embodiment, the chip carrier 100 is provided with four sets of positioning feature holes, and the four sets of positioning feature holes are not arranged in the same line. The positioning feature holes are arranged one-to-one with the edges of the chip carrier 100. The four sets of positioning feature holes are respectively opened at the four top corners of the chip carrier 100. The camera lens 200 can quickly analyze and verify the specific position of the chip carrier 100, transmit data to the adjustment mechanism in a timely manner, and output adjustment commands. The adjustment mechanism can control the chip carrier 100 to quickly adjust to the accurate alignment position.

[0033] Furthermore, the four sets of positioning feature holes are divided into three sets of forming holes 110 and one set of pre-positioning holes 120. When the three sets of forming holes 110 are able to determine the position information of the chip carrier board 100, the set of pre-positioning holes 120 is reserved to block them from being captured by the camera lens 200. When one of the forming holes 110 is deformed or damaged, the pre-positioning hole 120 can be quickly opened to reduce scrap and save production costs.

[0034] Specifically, to ensure the strength of the positioning feature hole, a preset distance is set between the positioning feature hole and the edge of the chip carrier 100. This preset distance is determined by the actual size of the chip carrier 100, and needs to take into account both the edge thickness of the chip carrier 100 and the width of the positioning feature hole from the edge of the chip carrier 100 to prevent the positioning feature hole from easily deforming. Furthermore, the position of the positioning feature hole will not excessively occupy the area of ​​the chip-bearing area on the chip carrier 100. At the same time, quantifying the specific position of the positioning feature hole makes the data calculated by the camera lens 200 more accurate.

[0035] In this embodiment, the positioning feature holes have a characteristic orientation, and the characteristic orientations of two adjacent sets of positioning feature holes are opposite, which can quickly distinguish the placement angle of the same chip carrier 100 on the plane. In order to more clearly identify the placement angle of the chip carrier 100 on the plane, each set of positioning feature holes includes multiple single holes, and the arrangement and combination of single holes are used to distinguish the positioning feature holes at different positions; it can also be used to distinguish different models of chip carriers 100.

[0036] Understandably, the adjustment mechanism is equipped with at least four adjustment platforms to give the chip carrier 100 at least four degrees of freedom on the adjustment mechanism, which can correspondingly adjust the installation angle of the chip carrier 100. Three of the adjustment platforms can slide back and forth relative to each other along the X-axis, Y-axis and Z-axis respectively, which can correspondingly adjust the installation position of the chip carrier 100 in the corresponding axial direction to quickly adjust the center error between the chip carrier 100 and the alignment position; the remaining adjustment platforms can rotate the chip carrier 100 about one or more of the X-axis, Y-axis and Z-axis to adjust the angle of the chip carrier 100 and eliminate the parallelism error with the alignment position.

[0037] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A positioning adjustment carrier plate system, characterized by, include: A chip carrier board (100) is provided with at least three sets of positioning feature holes; A camera lens (200) is used to photograph the positioning feature hole to calculate the tilt angle of the chip carrier (100); An adjustment mechanism is communicatively connected to the camera lens (200), and the chip carrier (100) is fixed to the adjustment mechanism. The adjustment mechanism can receive the tilt angle of the chip carrier (100) to adjust and flatten the chip carrier (100).

2. The positioning and adjustment carrier plate system according to claim 1, characterized in that, The chip carrier board (100) is provided with three sets of positioning feature holes, and the three sets of positioning feature holes are not arranged in the same line.

3. The positioning and adjustment carrier plate system according to claim 1, characterized in that, The chip carrier board (100) is provided with four sets of positioning feature holes, and the four sets of positioning feature holes are not arranged in the same line.

4. The positioning and adjustment carrier plate system according to claim 3, characterized in that, The four sets of positioning feature holes are divided into three sets of forming holes (110) and one set of preparatory holes (120).

5. The positioning and adjustment carrier plate system according to claim 3, characterized in that, The positioning feature holes are set one-to-one with the edges of the chip carrier board (100).

6. The positioning and adjustment carrier plate system according to claim 1, characterized in that, The positioning feature hole is set at a preset distance from the edge of the chip carrier (100).

7. The positioning and adjustment carrier plate system according to claim 1, characterized in that, The positioning feature holes have a feature orientation, and the feature orientations of two adjacent sets of positioning feature holes are opposite.

8. The positioning and adjustment carrier plate system according to claim 1, characterized in that, Each group of positioning feature holes includes multiple single holes.

9. The positioning and adjustment carrier plate system according to claim 1, characterized in that, The adjustment mechanism is equipped with at least four adjustment platforms so that the chip carrier (100) has at least four degrees of freedom on the adjustment mechanism.

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