A carrier for wafer spin processing

Abstract

This application discloses a carrier for wafer rotation processing, comprising a first end plate, a second end plate, and a connecting plate. The first and second end plates are spaced apart. The driving end of a rotation drive is connected to the first end plate. A feed port is provided on the second end plate, and a wafer cassette has multiple insertion slots. The connecting plates are spaced apart on the same circumference, with their two ends connected to the inner walls of the first and second end plates, respectively. The first, second, and connecting plates form a positioning cavity corresponding to the opening. A limiting component is provided within the positioning cavity, configured to limit the circumferential movement of the wafer cassette within the positioning cavity. A limiting element is provided at the location corresponding to the opening of the insertion slot within the positioning cavity, with a preset gap between the limiting element and the wafer in the wafer cassette. The carrier restricts the circumferential displacement of the wafer cassette through the limiting component and, in conjunction with the limiting element, limits the wafer, preventing damage to the outer edge of the wafer from colliding with the inner wall of the positioning cavity during rotation.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a carrier for wafer rotation processing. Background Technology

[0002] In semiconductor manufacturing, wet processing is an important technology used to clean, etch, and remove impurities from the wafer surface. Compared to dry processes, wet processing offers advantages such as lower cost and easier operation.

[0003] Wet processing refers to the process of spraying liquid chemical reagents onto the surface of a wafer using wafer processing equipment. These processes typically involve steps such as cleaning, etching, stripping, and spin drying to remove contaminants, form specific structures, or remove unwanted materials.

[0004] Wafer processing equipment typically includes a processing cylinder and a carrier. The carrier is rotatably mounted inside the processing cylinder. The processing cylinder is equipped with a spray assembly, and the carrier has a positioning cavity for positioning wafer cassettes. The wafer cassettes hold multiple wafers. The spray assembly sprays chemicals or cleaning water into the processing cylinder, and the corresponding wet processing steps are performed on the wafers in the wafer cassettes in conjunction with the rotation of the carrier. However, although existing carriers can position the wafer cassettes, they do not have a design to position the wafers inside the wafer cassettes. This results in a large gap between the wafers inside the wafer cassettes and the carrier. When the carrier rotates at high speed, it generates a large centrifugal force, which may cause the wafers inside the wafer cassettes to come into contact with the inner wall of the positioning cavity with a large force, easily causing damage to the outer edge of the wafers. Utility Model Content

[0005] To address the related technical problems, the purpose of this utility model is to provide a carrier for wafer rotation processing, thereby solving the aforementioned issues.

[0006] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:

[0007] A carrier for wafer rotation processing includes a first end plate, a second end plate, and a plurality of connecting plates, wherein:

[0008] The first end plate and the second end plate are spaced apart along the first horizontal direction. The driving end of the rotary drive is connected to the first end plate. The second end plate is provided with a feed port for pushing in or taking out the wafer box. The wafer box is provided with multiple insertion slots spaced apart along the first horizontal direction, and a wafer is inserted into each insertion slot.

[0009] Several connecting plates extend along a first horizontal direction and are spaced apart on the same circumference. The first end of the connecting plate is connected to the inner wall of the first end plate, and the second end of the connecting plate is connected to the inner wall of the second end plate. The first end plate, the second end plate, and the several connecting plates form a positioning cavity corresponding to the feed port. A limiting component is provided in the positioning cavity. The limiting component is configured to limit the wafer cassette in the positioning cavity in the circumferential direction.

[0010] At least one limiting member is provided in the positioning cavity at the location corresponding to the opening of the insertion slot. The limiting member extends along the first horizontal direction and has a preset gap with the wafer in the wafer cassette.

[0011] Optionally, two limiting members are provided, which are spaced apart along the circumferential direction. The side of the limiting member closest to the center of the positioning cavity serves as the limiting surface, and the limiting surface is set to be flexible.

[0012] Optionally, each limiting component corresponds to a connecting plate, and the limiting component is fixedly installed on the corresponding connecting plate.

[0013] Optionally, the limiting component is made of polyvinylidene fluoride.

[0014] Optionally, the limiting surface is a convex circular arc structure.

[0015] Optionally, the first end plate, the second end plate, and several connecting plates are integrated into one structure, and the first end plate, the second end plate, and several connecting plates are all made of polytetrafluoroethylene.

[0016] Optionally, the bottom of the wafer cassette is provided with a first limiting boss extending along a first horizontal direction, and the top of the wafer cassette is provided with second limiting bosses on both sides extending along the first horizontal direction. The second limiting bosses extend along the first horizontal direction. The limiting component includes two first limiting steps and two second limiting steps. The two first limiting steps are provided at the bottom of the positioning cavity and are configured to support the bottom of the wafer cassette and limit the bottom of the wafer cassette in the circumferential direction. The two second limiting steps are provided at the top of the positioning cavity and are configured to support the top of the wafer cassette and limit the top of the wafer cassette in the circumferential direction.

[0017] Optionally, each first limiting step corresponds to a connector, and the first limiting step is formed on the side wall of the corresponding connector near the center of the positioning cavity. Each second limiting step corresponds to a connector, and the second limiting step is formed on the side wall of the corresponding connector near the center of the positioning cavity.

[0018] Optionally, a handle is provided on the outer end of the wafer cassette.

[0019] The beneficial effects of this utility model are as follows: Compared with the prior art, the carrier for wafer rotation processing provided by this utility model has the following beneficial effects:

[0020] 1. The carrier is connected to the rotary drive unit through the first end plate, which can drive the wafer box to rotate synchronously. The positioning cavity restricts the circumferential displacement of the wafer box through the limiting component. The limiting component is used to limit the wafer and prevent the wafer from colliding with the inner wall of the positioning cavity during rotation, thus avoiding damage to the outer edge of the wafer.

[0021] 2. Two limiting components are set at intervals along the circumference to provide auxiliary limiting for the wafer cassette from different directions, which improves the stability of wafer limiting. The limiting surface adopts a flexible design to avoid wafer cassette deformation or wafer damage caused by rigid collisions.

[0022] 3. The limiting component is fixed to the connecting plate, eliminating the need for additional mounting brackets. This simplifies the internal structure of the vehicle, ensures the stability of the limiting component installation, prevents limiting failure caused by loosening of the limiting component during rotation, and improves the overall structural reliability. Attached Figure Description

[0023] To more clearly illustrate and understand the technical solutions in the embodiments of this utility model, the accompanying drawings used in the background technology and embodiment description of this utility model will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a carrier for wafer rotation processing provided in an embodiment of this utility model;

[0025] Figure 2 This is a front view of a carrier for wafer rotation processing provided in an embodiment of this utility model;

[0026] Figure 3 This is a top view of a carrier for wafer rotation processing provided in an embodiment of the present invention. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings.

[0028] To facilitate understanding of this utility model, a more complete description of it will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of this utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Please see Figures 1 to 3 As shown, this embodiment provides a carrier for wafer rotation processing, which includes a first end plate 10, a second end plate 20, and a plurality of connecting plates 30. The first end plate 10 and the second end plate 20 are aligned along a first horizontal direction ( Figure 1 The wafer cassette 40 is provided with a drive end connected to the first end plate 10 in the x-direction. The second end plate 20 has a feed port for pushing or taking out the wafer cassette 40. The wafer cassette 40 is provided with a plurality of insertion slots 41 spaced apart in the first horizontal direction, and a wafer is inserted into each insertion slot 41. A plurality of connecting plates 30 extend in the first horizontal direction and are spaced apart on the same circumference. The first end of the connecting plate 30 is connected to the inner wall of the first end plate 10, and the second end of the connecting plate 30 is connected to the inner wall of the second end plate 20. The first end plate 10, the second end plate 20 and the plurality of connecting plates 30 form a positioning cavity corresponding to the feed port. A limiting component 50 is provided in the positioning cavity. The limiting component 50 is configured to limit the wafer cassette 40 in the positioning cavity in the circumferential direction. At least one limiting member 60 is provided in the positioning cavity corresponding to the opening of the insertion slot 41. The limiting member 60 extends in the first horizontal direction and has a preset gap with the wafer in the wafer cassette 40.

[0030] Specifically, the rotation drive component is a motor, and the drive end of the motor is connected to the first end plate 10.

[0031] As can be seen, the carrier is connected to the rotation drive through the first end plate 10, which can drive the wafer box 40 to rotate synchronously. The positioning cavity restricts the circumferential displacement of the wafer box 40 through the limiting component 50, and works with the limiting component 60 to limit the wafer, so as to avoid the wafer from colliding with the inner wall of the positioning cavity during rotation and causing damage to the outer edge of the wafer.

[0032] In one implementation, two limiting members 60 are provided, and the two limiting members 60 are spaced apart along the circumferential direction. The side of the limiting member 60 near the center of the positioning cavity serves as the limiting surface, and the limiting surface is set to be flexible.

[0033] As can be seen, the two limiting members 60 are set at intervals along the circumference to provide auxiliary limiting for the wafer box 40 from different directions, which improves the stability of wafer limiting. The limiting surface adopts a flexible design to avoid deformation of the wafer box 40 or wafer damage caused by rigid collision.

[0034] In one implementation, each limiting member 60 corresponds to a connecting plate 30, and the limiting member 60 is fixedly installed on the corresponding connecting plate 30.

[0035] As can be seen, the limiting component 60 is fixed to the connecting plate 30, eliminating the need for additional mounting brackets, simplifying the internal structure of the vehicle, ensuring the stability of the installation of the limiting component 60, avoiding the limiting failure caused by the loosening of the limiting component 60 during rotation, and improving the overall structural reliability.

[0036] In one implementation method, the limiting member 60 is made of polyvinylidene fluoride.

[0037] It is evident that polyvinylidene fluoride (PVDF) possesses characteristics such as chemical corrosion resistance, high temperature resistance, and low surface adsorption, making it suitable for wafer processing environments. At the same time, its certain flexibility can meet the protection requirements of the limiting surface, thus balancing functionality and durability.

[0038] As one implementation method, the limiting surface has a convex circular arc structure.

[0039] As can be seen, the limiting surface of the convex arc structure can disperse the concentrated stress at the contact point into surface contact stress. Even if the wafer cell 40 contacts the limiting member 60, it can avoid the wafer cell 40 from being dented or the wafer from being damaged by stress due to excessive local pressure.

[0040] In one implementation, the first end plate 10, the second end plate 20, and a plurality of connecting plates 30 are an integral structure, and the first end plate 10, the second end plate 20, and the plurality of connecting plates 30 are all made of polytetrafluoroethylene.

[0041] As can be seen, the integrated structure avoids splicing gaps, reduces the risk of impurity accumulation or chemical seepage into the vehicle, and ensures the cleanliness of the treatment environment. At the same time, the integrated structure is more rigid and can withstand higher rotational torque, preventing the splicing points from loosening due to vibration. Polytetrafluoroethylene (PTFE) has excellent chemical corrosion resistance, high temperature resistance and low coefficient of friction, which extends the service life of the vehicle.

[0042] In one embodiment, the bottom of the wafer cassette 40 is provided with a first limiting protrusion 42 extending along a first horizontal direction, and the top of the wafer cassette 40 is provided with second limiting protrusions 43 on both sides extending along the first horizontal direction. The second limiting protrusions 43 extend along the first horizontal direction. The limiting component 50 includes two first limiting steps 51 and two second limiting steps 52. The two first limiting steps 51 are provided at the bottom of the positioning cavity and are configured to support the bottom of the wafer cassette 40 and limit the bottom of the wafer cassette 40 in the circumferential direction. The two second limiting steps 52 are provided at the top of the positioning cavity and are configured to support the top of the wafer cassette 40 and limit the top of the wafer cassette 40 in the circumferential direction.

[0043] As can be seen, the bottom first limiting step 51 supports the wafer box 40 and restricts the bottom offset, while the top second limiting step 52 assists in supporting and restricting the top offset, so as to prevent the wafer box 40 from shifting in the vertical direction during rotation and ensure overall stability.

[0044] In one implementation, each first limiting step 51 corresponds to a connector, and the first limiting step 51 is formed on the side wall of the corresponding connector near the center of the positioning cavity. Each second limiting step 52 corresponds to a connector, and the second limiting step 52 is formed on the side wall of the corresponding connector near the center of the positioning cavity.

[0045] As can be seen, the first limiting step 51 and the second limiting step 52 are directly formed on the connecting plate 30, which simplifies the internal structure, avoids the misalignment of the limiting steps caused by additional installation components, ensures that the wafer box 40 is coaxial with the carrier after installation, improves the concentricity during rotation, and reduces the shaking caused by centrifugal force.

[0046] In one embodiment, a handle 44 is provided on the outer end of the wafer cassette 40.

[0047] As can be seen, the handle at the outer end of the wafer cassette 40 provides a gripping point for the operator or robotic arm, making it easy to accurately push the wafer cassette 40 into or out of the positioning cavity, reducing the operator's direct contact with the main body of the wafer cassette 40, and improving loading and unloading efficiency.

[0048] In the embodiments disclosed in this utility model, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments disclosed in this utility model according to the specific circumstances.

[0049] The above embodiments merely illustrate the basic principles and characteristics of this utility model. This utility model is not limited to the above examples. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A carrier for wafer spin processing, comprising: The carrier for wafer rotation processing includes a first end plate, a second end plate, and several connecting plates, wherein: The first end plate and the second end plate are spaced apart along the first horizontal direction. The driving end of the rotation drive is connected to the first end plate. The second end plate is provided with a feed port for pushing in or taking out the wafer box. The wafer box is provided with a plurality of insertion slots spaced apart along the first horizontal direction. A wafer is inserted into each insertion slot. The plurality of connecting plates extend along the first horizontal direction and are spaced apart on the same circumference. The first end of the connecting plate is connected to the inner wall of the first end plate, and the second end of the connecting plate is connected to the inner wall of the second end plate. The first end plate, the second end plate, and the plurality of connecting plates form a positioning cavity corresponding to the feed port. A limiting component is provided in the positioning cavity. The limiting component is configured to limit the wafer cassette in the positioning cavity in the circumferential direction. At least one limiting member is provided in the positioning cavity at the location corresponding to the opening of the insertion slot. The limiting member extends along the first horizontal direction and has a preset gap with the wafer in the wafer cassette.

2. The carrier for wafer spin processing according to claim 1, wherein Two limiting members are provided, and the two limiting members are spaced apart along the circumferential direction. The side of the limiting member near the center of the positioning cavity serves as the limiting surface, and the limiting surface is made flexible.

3. The carrier for wafer spin processing according to claim 2, wherein Each of the limiting members corresponds to one of the connecting plates, and the limiting members are fixedly installed on the corresponding connecting plates.

4. The carrier for wafer spin processing according to claim 2, wherein The limiting component is made of polyvinylidene fluoride.

5. The carrier for wafer spin processing according to claim 2, wherein The limiting surface has a convex circular arc structure.

6. The carrier for wafer spin processing according to claim 1, wherein The first end plate, the second end plate, and several connecting plates are an integral structure, and the first end plate, the second end plate, and several connecting plates are all made of polytetrafluoroethylene.

7. A carrier for wafer rotation processing according to claim 1, characterized in that, The wafer cassette has a first limiting boss extending along the first horizontal direction at its bottom. The wafer cassette also has second limiting bosses extending along both sides of its top along the first horizontal direction. The limiting components include two first limiting steps and two second limiting steps. The two first limiting steps are located at the bottom of the positioning cavity and are configured to support the bottom of the wafer cassette and limit its circumferential position. The two second limiting steps are located at the top of the positioning cavity and are configured to support the top of the wafer cassette and limit its circumferential position.

8. The carrier for wafer spin processing according to claim 7, wherein Each of the first limiting steps corresponds to one of the connecting members, and the first limiting step is formed on the side wall of the corresponding connecting member near the center of the positioning cavity. Each of the second limiting steps corresponds to one of the connecting members, and the second limiting step is formed on the side wall of the corresponding connecting member near the center of the positioning cavity.

9. The carrier for wafer spin processing according to claim 1, wherein A handle is provided on the outer end of the wafer box.

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