Wafer transfer carrier

CN224775389UActive Publication Date: 2026-09-18ANHUI RUINA SEMICONDUCTOR TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202522139174.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-10
Publication Date
2026-09-18
Estimated Expiration
2035-10-10

AI Technical Summary

Technical Problem

[0002]晶圆在进入烤箱前需用吸笔将晶圆从普通PP卡塞移载至金属卡塞,目前均使用25槽标准槽宽或13槽加宽卡塞,部分减薄后的晶圆受到薄片(脆性增加)因素,或晶圆本体翘曲或材质较脆的影响,在移载或烘烤制程中常发生晶圆破裂现象

Benefits of technology

1.本实用新型设置的载物箱包括多个可以承载不同尺寸晶圆的托盘,而托盘底部有凸点,可对薄片晶圆以及翘曲晶圆等起到支撑作用,防止晶圆因烘烤退火受热后产生的自然向下应力而增加翘曲度或破裂风险。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224775389U_ABST
    Figure CN224775389U_ABST
Patent Text Reader

Abstract

The utility model discloses a wafer transfer carrier relates to the field of semiconductor, including the object box, the object box is provided with respectively: a plurality of tray, a plurality of tray along the vertical direction equidistance distribution, protection structure, protection structure is used for with a plurality of tray detachably fixed in the inside of object box, the tray includes the placement groove, the placement groove is provided with the different diameter round groove, is used for the placement of different diameter wafer, the both sides of the placement groove are all seted up the groove that penetrates its corresponding one side inner wall, the middle part of placement groove is provided with a plurality of for supporting the convex point of wafer middle part. The convex point of the present application is set up on the tray can guarantee the air circulation of the tray during baking, the even heating, avoid the quality of wafer and be damaged due to the single face overheating, and there is the lock catch device simultaneously in the object box both sides, avoids the tray and slides out or falls in the process of moving and loading.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor technology, and in particular relates to a wafer transfer carrier. Background Technology

[0002] Before entering the oven, wafers need to be transferred from ordinary PP cassettes to metal cassettes using a suction pen. Currently, 25-slot standard cassettes or 13-slot widened cassettes are used. Some thinned wafers are affected by the thinner sheet (increased brittleness), or the wafer body is warped or the material is more brittle, which often causes wafer breakage during the transfer or baking process.

[0003] During baking, multiple wafers need to be stacked in rows and stored in a carrier. However, the carriers used are usually sealed, which affects the gas flow inside the wafers. In particular, uneven heating occurs on the top and bottom sides of the wafers during baking, affecting the baking quality. If the carrier is designed with an opening, the wafers are prone to falling out of the opening, resulting in economic losses. Therefore, to solve the above problems, this invention designs a wafer transfer carrier. Utility Model Content The purpose of this utility model is to solve the problems in the prior art, and to propose a wafer transfer carrier and device.

[0004] This utility model first discloses a wafer transfer carrier, comprising: The cargo box is provided with the following: Multiple pallets, wherein the multiple pallets are distributed at equal intervals along the vertical direction; A protective structure for detachably securing multiple trays inside the container; The tray includes: The placement groove has multiple annular frustums of different diameters extending from its top for placing wafers of different diameters. The front and rear sides of the placement groove are provided with grooves penetrating the inner wall of their respective sides. The middle of the placement groove is provided with multiple protrusions for supporting the middle of the wafer.

[0005] In the aforementioned vehicle, the cargo box has openings on both the front and rear sides, and a portion of the protective structure is provided on both sides of each opening.

[0006] In the aforementioned vehicle, the top of the cargo box is provided with a connecting seat for handling by a robotic arm.

[0007] In the aforementioned vehicle, handrails are provided on both sides of the cargo box for manual transfer of the cargo box.

[0008] In the aforementioned carrier, the number of placement slots is set to at least three, and includes at least 4, 6, and 8-inch wafer loading and matching.

[0009] In the aforementioned vehicle, a plurality of the aforementioned protrusions are arranged in a ring.

[0010] In the aforementioned carrier, the portion includes multiple limiting parts, each of the trays corresponds to one limiting part, the limiting part is located on the rear side of the cargo box, and the front side of the cargo box is provided with multiple blocking parts, each of the blocking parts being detachably connected to the front side of a corresponding tray.

[0011] In the aforementioned vehicle, the blocking part includes a blocking plate, which is vertically slidably connected to a slide rail provided on the front side of the cargo box. The blocking plate has multiple limiting channels, each of which can allow a tray to be moved out of the cargo box. The slide rail has a connecting channel that is offset from the limiting channels and has the same height as the limiting channels.

[0012] In the aforementioned vehicle, the blocking portion may include a limiting rod, which is rotatably connected to the side of the cargo box.

[0013] The beneficial effects of this utility model are as follows: 1. The container of this utility model includes multiple trays that can hold wafers of different sizes. The bottom of the trays has protrusions that can support thin wafers and warped wafers, preventing the wafers from increasing warping or cracking due to the natural downward stress generated after baking and annealing.

[0014] 2. The tray has openings on both the front and back sides, and the grooves in the placement slot ensure that the bottom of the wafer does not directly contact the bottom of the placement slot. This ensures air circulation and uniform heating of the tray during baking, preventing the wafer from being damaged due to overheating on one side.

[0015] 3. Protective structures are provided on both sides of the opening of the cargo box to ensure air circulation while preventing the tray from sliding out, and to facilitate the disassembly and assembly of the tray for easy operation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a wafer transfer carrier disclosed in this utility model.

[0017] Figure 2 This is a schematic diagram of the structure of a tray in a wafer transfer carrier disclosed in this utility model.

[0018] Figure 3 This is a schematic diagram of the protective structure in a wafer transfer carrier disclosed in this utility model.

[0019] Figure 4 This is a schematic diagram of another protective structure in a wafer transfer carrier disclosed in this utility model.

[0020] In the diagram: 1. Carrying box, 2. Tray, 21. Placement slot, 22. Circular frustum, 23. Groove, 24. Protrusion, 3. Protective structure, 31. Limiting part, 32. Blocking part, 321. Blocking plate, 322. Slide, 323. Limiting channel, 324. Connecting channel, 325. Limiting rod, 4. Handrail, 5. Connecting seat. Detailed Implementation

[0021] To facilitate understanding of this application and to make the aforementioned objectives, features, and advantages of this application more apparent, a detailed description of specific embodiments of this application is provided below in conjunction with the accompanying drawings. Numerous specific details are set forth in the following description to provide a thorough understanding of this application, and preferred embodiments are shown in the accompanying drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application. This application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of this application, "several" means at least one, such as one, two, etc., unless otherwise explicitly specified. It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is only for describing particular implementations and is not intended to limit the scope of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] Reference Figures 1-4 A wafer transfer carrier includes a loading box 1, in which multiple trays 2 and a protective structure 3 are respectively provided. The multiple trays 2 are distributed at equal distances along the vertical direction. The trays 2 are used for loading wafers, which facilitates the overall handling of multiple wafers and can be used in the wafer baking process. The top of the container 1 is equipped with a connecting seat 5 for robotic arm handling, which can automatically move the container 1 to the baking oven for baking. The side of the container 1 is also equipped with a handrail 4, which can be used for manual handling.

[0023] The tray 2 includes a placement slot 21, and the top of the placement slot 21 extends with multiple annular frustums 22 of different diameters. Each annular frustum 22 is used to fix wafers of different diameters. The wafers include at least standard sizes of 4, 6, and 8 inches in diameter. Therefore, this device can match and load wafers of different standard sizes. The placement slot 21 has grooves 23 on both the front and rear sides that penetrate the inner wall of the corresponding side. The grooves 23 are used to expose the bottom of the wafer, so that the bottom of the wafer can communicate with the outside. At the same time, the front and rear sides of the container 1 are designed with openings.

[0024] The placement groove 21 has multiple bumps 24 in the middle to support the middle of the wafer. The bumps 24 are arranged in a ring and their height does not exceed the height of the innermost annular frustum 22. The bumps 24 are used to support thin wafers and warped wafers to prevent their warping from increasing. Especially in the baking process, the bumps 24 can prevent the wafer from increasing the risk of warping or cracking due to the natural downward stress generated after baking and annealing. At the same time, the bumps 24 can ensure that the bottom of the wafer does not completely contact the bottom of the placement groove 21, ensuring air circulation and uniform heating of the tray during baking, and avoiding the problem of quality damage caused by overheating on one side of the wafer.

[0025] The protective structure 3 is used to detachably fix multiple trays 2 inside the container 1, which can ensure that the trays 2 and the container 1 will not slide when fixed and can be easily disassembled. A portion of the protective structure 3 can be provided on both sides of each opening of the container 1. The section includes a limiting point located at the rear of the container 1 to restrict the movement limit of the tray 2. The front of the section has a blocking portion 32, which can be a movable blocking plate 321. The blocking plate 321 is vertically slidably connected to a slide rail 322 located at the front of the container 1. The blocking plate 321 has multiple limiting channels 323, each of which allows a tray 2 to be moved out of the container 1. The slide rail 322 has a connecting channel 324 offset from the limiting channels 323 and at the same height. Whether the connecting channel 324 overlaps with the limiting channel 323 determines whether the tray 2 can slide.

[0026] The blocking portion 32 can also be configured as a rotatable limit rod 325, and the limit rod 325 adopts a "匚"-shaped structure. In this way, the upper and lower sides of the limit rod 325 are respectively rotatably connected to the side surface of the luggage carrier 1, so as to realize the function of rotatably blocking the tray 2 from slipping out, which is convenient for use.

[0027] It is known from common technical knowledge that the present utility model can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the above disclosed embodiments are merely illustrative in all aspects and not exhaustive. All alterations within the scope of the present utility model or within the scope equivalent to the present utility model are encompassed by the present utility model.

Claims

1. A wafer transfer carrier, comprising: Comprising: a carrier box (1), wherein the carrier box (1) is respectively provided with: a plurality of trays (2), the plurality of trays (2) are equally spaced along a vertical direction; a protection structure (3), wherein the protection structure (3) is configured to detachably fix the plurality of trays (2) inside the carrier box (1); the tray (2) comprises: a placement groove (21), a plurality of annular circular truncated cones (22) with different diameters are extendedly arranged at the top of the placement groove (21) for placing wafers with different diameters, a groove (23) penetrating through an inner wall of a corresponding side of the placement groove (21) is formed on a front side of the placement groove (21), and a plurality of protruding points (24) for supporting a middle portion of a wafer are arranged in a middle part of the placement groove (21).

2. The wafer transfer carrier of claim 1, wherein, front and rear sides of the carrier box (1) are respectively provided with openings, and two sides of the opening on each side are each provided with one part of the protection structure (3).

3. The wafer transfer carrier of claim 1, wherein, a connecting seat (5) for carrying by a mechanical arm is arranged on a top of the carrier box (1).

4. The wafer transfer carrier according to claim 1, characterized in that, handrails (4) for manually transferring the carrier box (1) are arranged on two sides of the carrier box (1).

5. The wafer transfer carrier of claim 1, wherein, the number of the placement grooves (21) is set to at least three, and the placement grooves at least comprise matching for loading 4-inch, 6-inch and 8-inch wafers respectively.

6. The wafer transfer carrier of claim 2, wherein, the plurality of protruding points (24) are arranged in an annular shape.

7. The wafer transfer carrier according to claim 2, characterized in that, said part comprises a plurality of limiting portions (31), each of the trays (2) corresponds to one limiting portion (31), the limiting portions (31) are located at a rear side of the carrier box (1), a plurality of blocking portions (32) are arranged at a front side of the carrier box (1), and each of the blocking portions (32) is detachably connected to a front side of a corresponding one of the trays (2).

8. The wafer transfer carrier of claim 7, wherein, the blocking portion (32) comprises a blocking plate (321), the blocking plate (321) is vertically slidably connected to a slide way (322) arranged on the front side of the carrier box (1), the blocking plate (321) is provided with a plurality of limiting channels (323), each of the limiting channels (323) can allow one tray (2) to move out of the carrier box (1), the slide way (322) is provided with a connecting channel (324) staggered from the limiting channels (323) and having the same height as the limiting channels (323).

9. The wafer transfer carrier of claim 7, wherein, the blocking portion (32) comprises a limiting rod (325), the limiting rod (325) adopts a "匚"-shaped structure, and the limiting rod (325) is rotatably connected to a side of the carrier box (1).